The invention discloses a method for improving the wire dropping of a punching dielectric layer of a light bar plate, and the method comprises the steps: A, carrying out circuit film design on the light bar plate, wherein a waste edge is prepared in a mode of copper laying; B, enabling a circuit to be manufactured through miniature etching and washing of the plate, dry film pasting, alignment, exposure and etching; C, carrying out solder mask film design, enabling the waste edge to be covered by solder mask ink, and enabling the waste edge to achieve windowing without soldering resistance; E, manufacturing a solder mask through printing, pre-baking, alignment, exposure, development, and post-baking; F, carrying out the punching of the light bar plate. According to the invention, the circuit waste edge is manufactured in a mode of copper laying, thereby improving the hardness of the waste edge, enabling the wire dropping to be improved greatly, and reducing the risk of crushed scraping caused by that a dielectric layer falls to a desk top.