15results about "Mechanical/acoustic circuit processing" patented technology

The invention discloses a circuit board reworking processing method, which comprises the steps of processing a first hole in a target position of a circuit board, and obtaining an actual position of the first hole; concentrically machining a second hole in the actual position of the first hole, and detecting the actual position of the second hole; the deviation between the first hole and the second hole is determined according to the actual position of the first hole and the actual position of the second hole, and the deviation is compared with a preset first threshold value; when the deviation is greater than or equal to a first threshold value, the third hole is concentrically complementarily machined at the actual position of the first hole. The invention further discloses circuit board processing equipment. According to the circuit board reworking processing method and the circuit board processing equipment, the yield of circuit board processing can be improved, and the cost is reduced.

The application discloses a combined die for flexible circuit board processing and a use method thereof, and relates to the field of combined dies.The combined die comprises a bottom plate, a sealing cover is arranged on the top of the bottom plate to prevent impurities from entering, an insertion notch is arranged on the sealing cover, and a module storage bin is arranged on the outer surface of the sealing cover.The combined die further comprises a forming bottom die unit, which is used for limiting FPC material parts and providing basic support and positioning for the processing of the flexible circuit board;a shaping module, which is used for extruding the flexible circuit board material parts in a plastic state;and an adjusting module, which is used for adjusting the properties of the extruded flexible circuit board material parts.Firstly, the flexible circuit board is positioned and limited in the forming bottom die unit, then the shaping module is arranged on the access plate, then the flexible circuit board is pressed by starting the telescopic rod to move downwards, a bending part is formed, and then the adjusting module is replaced to adjust and reinforce the bending part.

The application relates to the technical field of circuit board drilling, and discloses a circuit board drilling device, which comprises a workbench, a groove is formed in the tabletop of the workbench, the groove is located below a circuit board when the circuit board is installed on the workbench, a sliding seat and a supporting pipe are installed in the groove, the supporting pipe is installed on the sliding seat, and the side of the sliding seat, which is away from the supporting pipe, slides on the bottom wall of the groove; a gas conveying device is installed on the workbench, the gas conveying device comprises a gas supply source and a gas outlet pipe connected with the gas supply source, the sliding seat is provided with an inner cavity, the inner cavity of the sliding seat is communicated with the gas outlet pipe, the supporting pipe is made of hollow elastic material, and one end of the supporting pipe is communicated with the inner cavity of the sliding seat. The application can improve the flatness of the inner wall of the milled groove of the circuit board.

The invention relates to an automatic turning mechanism for removing an electrophoresis layer through laser etching, which comprises a base, a rotating frame, a laser etching device and a laser etching device, the rotating frame is rotationally connected with the base; the rotating end of the driving part is fixedly connected with the rotating frame, and the driving part is used for controlling and driving the rotating frame to rotate; the clamp is fixedly connected to the rotating frame, the side, making contact with a product, of the clamp is provided with a positioning groove and a lever piece, the side, making contact with the product, of the positioning groove is in profile modeling with the structure of the product and is used for positioning the product, and the lever piece is used for locking and attaching the product into the clamp. And then the product on the rotating frame is driven to rotate to be vertically upward to be subjected to laser etching to remove an electrophoresis layer, the product can be clamped only once, but different planes can be rotated to be vertically upward, laser etching of the electrophoresis layers of the different planes of the product is facilitated, and the laser etching efficiency of the product is improved.

Disclosed are semiconductor modules with hybrid deep trench capacitor (DTC) substrate. The semiconductor modules are hybrid in that they include both ajinomoto build-up film (ABF) and PrePreG (PPG). The ABF avoids or at least mitigates resin void risks. The PPG avoids or at least mitigates delamination and via crack risks.

Disclosed are semiconductor modules with hybrid deep trench capacitor (DTC) substrate. The semiconductor modules are hybrid in that they include both ajinomoto build-up film (ABF) and PrePreG (PPG). The ABF avoids or at least mitigates resin void risks. The PPG avoids or at least mitigates delamination and via crack risks.

An electric heating device includes an electronics housing with a partition wall which separates a connection chamber from a heating chamber for emitting heat to a medium to be heated, and a fluid housing which delimits the heating chamber. At least one PTC heating device is connected to the heating chamber in a thermally conductive manner and is electrically connected in the connection chamber. A control device is located, at least in part, in the connection chamber and includes a circuit breaker that bears against a channel base. The channel base is located outside the heating chamber and is formed by the partition wall. The channel base, together with a channel top, forms a channel through which the medium can flow. This eliminates the need for complex heat sinks or the like, and the waste heat from the circuit breaker can be used to heat the medium.

This disclosure relates to a PCB processing equipment and control method. The PCB processing equipment includes a worktable, at least one temporary storage mechanism, and a lifting mechanism. The worktable has at least one tool disc placement area for placing a tool disc. The worktable is configured to place a PCB and to drive the tool disc to move in the Y-axis direction. The temporary storage mechanism includes a temporary storage rack configured to temporarily store the tool disc. The worktable is configured to drive the tool disc placement area in the Y-axis direction to a position where it docks with the temporary storage rack. The lifting mechanism is configured to drive at least one of the temporary storage rack and the tool disc to move in the height direction, so as to place the tool disc located on the temporary storage rack into the tool disc placement area, or to transfer the tool disc located in the tool disc placement area to the temporary storage rack. The PCB processing equipment of this disclosure achieves automated tool disc replacement through the cooperation between the lifting mechanism, the temporary storage rack, and the worktable, thereby improving the utilization rate of the PCB processing equipment.

A printed circuit board assembly comprising a plurality of layers. At least one of the plurality of layers is formed of a dielectric material and has an extended portion extending beyond the other layers in the plurality of layers. A first metallic layer is located on at least a portion of the extended portion of the dielectric layer. The first metallic layer and the dielectric layer are configured to form a launch transducer comprising one or more transmission lines and a transducer element coupled to the one or more transmission lines. The transducer element is configured to propagate millimeter wave frequency signals.

The application provides a flexible circuit board bending equipment, which comprises a rack, a first workbench for placing a first circuit board is arranged on the rack, a turnover device is arranged on one side of the rack, a second workbench for placing a second circuit board is arranged on the turnover device, a thimble device is arranged on the other side of the rack, an assembling mechanism is arranged on the front end of the rack, a placing table for placing the first circuit board is arranged on the front end of the first workbench, the connecting terminal of the first circuit board extends out of the placing table, a bending interval is arranged between the placing table and the first workbench, a bending device is arranged below the bending interval, and the bending device passes through the bending interval to bend the first circuit board and the second circuit board on the first workbench.

The present application belongs to the technical field of FPC production, and relates to a composite punch, comprising: a punching platform provided with a double-mover linear module; a lower die movable group is slidingly installed on the double-mover linear module, and is used for bearing a punching lower die and driving the punching lower die to reciprocate between a feeding station and a punching station; a punching plate is located above the punching station, and is used for fixing a punching upper die; the punching plate drives the punching upper die to perform a punching operation through a punching driving mechanism; a receiving movable group is slidingly installed on the double-mover linear module, and is used for bearing a tray and driving the tray to reciprocate between the punching station and a discharging station; a vibration module is installed on the punching plate, and is used for driving the punching plate and the upper die to vibrate, so that a finished product on the upper die is separated from the upper die.

The present application relates to a multilayer FPC with improved stepped structure and a manufacturing method thereof, which comprises: manufacturing core plates of each layer of the FPC, wherein each layer of the core plates comprises a circuit layer, a flexible core layer and an adhesive layer; determining a stepped area of the FPC, manufacturing a porous hole structure at the boundary of the stepped area of the adhesive layer, processing a protective layer on the layer where the stepped surface of the stepped area of the FPC is located; injecting a liquid phase material into the hole structure; pressing the core plates of each layer of the FPC in a preset order to obtain the FPC; and using a vertical laser controlled depth milling process to subtractively manufacture the stepped area of the FPC to form the multilayer FPC with stepped structure. During the subtractive processing of the vertical laser controlled depth milling process, the function of heat absorption by gasification of the liquid phase material is used to cool and protect each core layer at the boundary of the non-stepped area, so as to avoid burning at the boundary of the non-stepped area of each core layer, thereby making the stepped structure of the FPC more complete and effectively improving the yield and quality of the FPC.

The invention relates to the technical field of intelligent electric meters, in particular to a manufacturing method of an electric energy meter and the electric energy meter, the electric energy meter comprises a PCB, the manufacturing method comprises the steps that a light guide groove is formed in the PCB, and the light guide groove is communicated with the back face and the front face of the PCB; a light-emitting diode is attached to the back face of the PCB, and a light-emitting body of the light-emitting diode is arranged in the light guide groove. According to the manufacturing method of the electric energy meter, the light-emitting diodes are attached to the back face of the PCB with the low layout density, structural interference between the light-emitting diodes and other components can be reduced, the light guide grooves form light path guide channels, light interference between the light-emitting diodes is prevented, and the display effect is ensured.

The invention relates to the technical field of circuit boards, in particular to a metal-based circuit board hole machining method and a metal-based circuit board. According to the technical scheme, the protection assembly comprises a base material layer, an insulating layer is fixedly connected to the top end of the base material layer, a circuit layer is fixedly connected to the top end of the insulating layer, a circuit is installed at the top end of the circuit layer, and an installation hole is formed in the top end of the circuit layer. The protection assembly is arranged to prevent fragile edges of the base material layer, the insulation layer and the circuit layer from being damaged, the scraping assembly is arranged to scrape burrs at the edges of the base material layer, the insulation layer and the circuit layer when the protection assembly is installed, the burrs are prevented from being left on the edges of the circuit board, the protection assembly is arranged to scrape the burrs in the installation holes, and the installation efficiency is improved. The fixing nail is prevented from being influenced by residual burrs in the mounting hole, and the problem of residual burrs during cutting and punching of the circuit board is solved.

The invention discloses a method for improving PCB (printed circuit board) molding routing grey, which comprises the following steps: when an inner layer circuit is manufactured on a PCB, a plurality of copper PADs arranged at intervals are formed in a corresponding in-board routing groove area, and the distance between the outermost copper PAD and the edge of a molding line on the periphery of the in-board routing groove area is greater than or equal to 1mm; and when an outer layer circuit is manufactured on the PCB, etching and removing the copper sheet in the outer layer corresponding to the milling groove area in the board. According to the method, by changing the copper laying design of the inner layer and the outer layer, the heat during groove milling is reduced to improve and solve the problem of board ash on the edge of the groove milling.