65results about "Mechanical/acoustic circuit processing" patented technology

The invention relates to the technical field of PCB (Printed Circuit Board) processing, and discloses a method for removing lead warped copper by deep drilling in a gold finger gold plating process, which comprises the following steps of: optimizing the position and the shape of a gold-plated lead: changing the gold-plated lead from a short side of a gold finger to a side wall of the gold finger, and optimizing the shape of the gold-plated lead to be elliptical; the widest part R of the center of the ellipse satisfies Rlt by taking mil as a unit; x-R is larger than or equal to 4 mil, and X is the diameter of a deep drilling point; according to high-precision photosensitive wet film protection, before a gold-plated lead is removed through deep drilling, a photosensitive wet film is adopted to cover a gold finger lead area, the wet film is accurately positioned and printed through drilling positioning holes in the four corners, the protective area covers the gold finger lead and extends outwards by Y mil, and Y is larger than or equal to 4 mil. The method for removing the warped copper of the lead through deep drilling in the gold-plating process of the golden finger aims at solving the problem that the copper is prone to being warped when the gold-plated lead is removed through deep drilling in the gold-plating process of the golden finger.

The invention relates to the technical field of PCB drilling positioning, and particularly provides a PCB drilling positioning method and system.The method comprises the steps that structured light pattern images corresponding to different reference mark points are obtained, and the structured light pattern images comprise preset structured light patterns with projection areas covering the reference mark points; for each reference mark point, actual Z-axis height information is obtained according to the structured light pattern image, and then the focusing depth of the laser scanning system is adjusted according to the actual Z-axis height information; for each reference mark point, acquiring original two-dimensional coordinate information of the reference mark point by using a laser scanning system, and then correcting the original two-dimensional coordinate information according to the actual Z-axis height information and preset optical geometric parameters of the laser scanning system to obtain corrected two-dimensional coordinate information; correcting a preset drilling target point position according to all the corrected two-dimensional coordinate information to obtain a final drilling position of the drilling target point; according to the method, the problems of defocusing and projection errors caused by unevenness of the PCB can be effectively solved.

The invention provides a circuit board with a special cavity structure and a manufacturing method thereof. The circuit board with the special cavity structure comprises a core board with a cavity, a stand column is arranged in the middle of the cavity, and the hollow-square-shaped cavity is formed in the periphery of the stand column. The structural design that the stand column is arranged in the middle of the cavity is adopted, the continuous structure without internal blocking parts in a traditional cavity is broken through, conventional simple materials easy to obtain in industrial production are used for processing and manufacturing the interrupted cavity structure with the complex structure, the cavity does not collapse, the interlayer bonding force is good, and the structure is stable. And industrial operations such as PCB lamination, mechanical drilling of through holes, copper plating and the like can be normally carried out in the upright post area in the middle of the cavity.

The invention discloses a manufacturing method of a large-size flexible circuit board capable of replacing a wire harness. The manufacturing method comprises the following steps: manufacturing a covering film core board through previous procedures; manufacturing a punching die, performing alignment punching on the covering film core plate to form a groove body, forming a flexible plate connecting bridge in the groove body, forming a punching plate on the whole plate, windowing a reinforcing sheet corresponding to the groove body to form a reinforcing groove body, arranging a plurality of reinforcing connecting bridges on the reinforcing groove body, and forming a reinforcing plate on the whole plate; the reinforcing connecting bridges and the flexible plate connecting bridges are distributed in a staggered manner; attaching a reinforcing plate to the punching plate, and forming the circuit board; the cover film is attached in a jointed board structure mode, and a punching grinding tool is matched for punching, so that the problems that cover films attached in batches are easy to scatter and difficult to attach are solved; through the staggered design of the flexible plate connecting bridge and the reinforcing plate connecting bridge, selective machining can be carried out during final forming, and the problems that materials are prone to being rolled in during milling, chips are difficult to discharge smoothly, milling burrs and wiredrawing are generated and the like are solved; effective cooperation is formed before and after the whole processing flow.

The present application provides a high-order high-density interconnection board and a preparation method thereof. The method comprises obtaining the copper thickness of the connected board of the high-order high-density interconnection board; performing copper average differential processing on the copper thickness of the connected board and the preset copper thickness to obtain the average difference of the copper thickness; and sending a hole alignment signal to the board making monitoring system according to the average difference of the copper thickness to adjust the ratio of the opening and the bottom of the hole of the hole. By obtaining the copper thickness of the connected board, it is convenient to collect the copper layer thickness of the current hole-opening board of the high-order high-density interconnection board, and then the difference between the copper thickness of the connected board and the preset copper thickness is compared to obtain the difference between the copper layer thickness of the current hole-opening board and the standard copper layer thickness. Finally, according to the above copper thickness difference, the ratio of the opening and the bottom of the hole of the high-order high-density interconnection board is adjusted during the hole-opening, so that the ratio of the opening and the bottom of the hole of the hole is within the optimal ratio range, which effectively improves the hole-opening quality, thereby improving the probability of good products of the high-order high-density interconnection board.

The invention discloses a circuit board manufacturing method and a circuit board, and the method comprises the following steps: manufacturing a multi-layer board which comprises at least two overlapped substrate layers, and arranging conductor layers on the two sides of each substrate layer; processing an accommodating hole in the board surface of the multilayer board, wherein part of the hole wall of the accommodating hole is the conductor layer; copper paste is poured into the containing holes and solidified, so that the copper paste forms a conductive heat dissipation body, and the conductive heat dissipation body is communicated with the different conductor layers. The hole walls of part of the accommodating holes are the conductor layers, so that the conductive heat dissipation body not only can efficiently dissipate heat in the multilayer board, but also has a structure for conducting different conductor layers and forming an interlayer conductive network, copper blocks do not need to be processed according to the shapes of the accommodating holes, and the accommodating holes do not need to be electroplated to manufacture metalized hole walls, so that the manufacturing process is simplified, and the manufacturing cost is reduced. And the production cost is saved.

The invention discloses a circuit board reworking processing method, which comprises the steps of processing a first hole in a target position of a circuit board, and obtaining an actual position of the first hole; concentrically machining a second hole in the actual position of the first hole, and detecting the actual position of the second hole; the deviation between the first hole and the second hole is determined according to the actual position of the first hole and the actual position of the second hole, and the deviation is compared with a preset first threshold value; when the deviation is greater than or equal to a first threshold value, the third hole is concentrically complementarily machined at the actual position of the first hole. The invention further discloses circuit board processing equipment. According to the circuit board reworking processing method and the circuit board processing equipment, the yield of circuit board processing can be improved, and the cost is reduced.

The application discloses a combined die for flexible circuit board processing and a use method thereof, and relates to the field of combined dies.The combined die comprises a bottom plate, a sealing cover is arranged on the top of the bottom plate to prevent impurities from entering, an insertion notch is arranged on the sealing cover, and a module storage bin is arranged on the outer surface of the sealing cover.The combined die further comprises a forming bottom die unit, which is used for limiting FPC material parts and providing basic support and positioning for the processing of the flexible circuit board;a shaping module, which is used for extruding the flexible circuit board material parts in a plastic state;and an adjusting module, which is used for adjusting the properties of the extruded flexible circuit board material parts.Firstly, the flexible circuit board is positioned and limited in the forming bottom die unit, then the shaping module is arranged on the access plate, then the flexible circuit board is pressed by starting the telescopic rod to move downwards, a bending part is formed, and then the adjusting module is replaced to adjust and reinforce the bending part.

The application relates to the technical field of circuit board drilling, and discloses a circuit board drilling device, which comprises a workbench, a groove is formed in the tabletop of the workbench, the groove is located below a circuit board when the circuit board is installed on the workbench, a sliding seat and a supporting pipe are installed in the groove, the supporting pipe is installed on the sliding seat, and the side of the sliding seat, which is away from the supporting pipe, slides on the bottom wall of the groove; a gas conveying device is installed on the workbench, the gas conveying device comprises a gas supply source and a gas outlet pipe connected with the gas supply source, the sliding seat is provided with an inner cavity, the inner cavity of the sliding seat is communicated with the gas outlet pipe, the supporting pipe is made of hollow elastic material, and one end of the supporting pipe is communicated with the inner cavity of the sliding seat. The application can improve the flatness of the inner wall of the milled groove of the circuit board.

The application provides a high-efficiency bending method applied to a flexible circuit board, which is realized by a bending device and comprises the following specific steps: (1) placing a first circuit board on a first workbench, with a connecting terminal of the first circuit board extending out of the placing table; (2) placing a second circuit board on a second workbench; (3) driving a turnover device to turn over the second circuit board to the first workbench, so that the first circuit board and the second circuit board correspond to each other; (4) fixing the front ends of the first circuit board and the second circuit board by a fixing assembly; (5) resetting the turnover device, so that the second circuit board is located above the first circuit board; (6) moving a bending limiting device downward and limiting the rear ends of the first circuit board and the second circuit board; and (7) moving a bending device upward through a bending interval to bend the first circuit board and the second circuit board, so that the bending consistency is good and the bending efficiency is high.

The invention provides a circuit board forming processing method which comprises the following steps: detecting a first height of a circuit board at a forming position; the first depth of the forming position is obtained, and a blind groove is machined in the forming position based on the first depth; detecting a second height of the bottom of the blind groove; determining a second depth of the blind groove according to the first height and the second height; and according to a comparison result of the first depth and the second depth, controlling the molded circuit board. The invention further provides circuit board forming equipment. According to the circuit board forming processing method and the circuit board forming equipment, the forming processing precision and the detection efficiency can be improved.

The invention relates to an automatic turning mechanism for removing an electrophoresis layer through laser etching, which comprises a base, a rotating frame, a laser etching device and a laser etching device, the rotating frame is rotationally connected with the base; the rotating end of the driving part is fixedly connected with the rotating frame, and the driving part is used for controlling and driving the rotating frame to rotate; the clamp is fixedly connected to the rotating frame, the side, making contact with a product, of the clamp is provided with a positioning groove and a lever piece, the side, making contact with the product, of the positioning groove is in profile modeling with the structure of the product and is used for positioning the product, and the lever piece is used for locking and attaching the product into the clamp. And then the product on the rotating frame is driven to rotate to be vertically upward to be subjected to laser etching to remove an electrophoresis layer, the product can be clamped only once, but different planes can be rotated to be vertically upward, laser etching of the electrophoresis layers of the different planes of the product is facilitated, and the laser etching efficiency of the product is improved.

Various implementations include a force element for an electronic device. In some aspects, the force element includes: an outer ring surrounding a central axis and having a first diameter; an inner ring surrounding the central axis and having a second diameter less than the first diameter; an outer wall connecting a radially inner portion of the outer ring with a radially outer portion of the inner ring; an inner wall extending from the radially inner portion of the inner ring and located radially inward of the outer wall; and a central platform extending from the inner wall around the central axis.

The invention discloses an asymmetrically stacked PCB, a construction method, a single-side electroplating method and a PCB, and relates to the technical field of symmetrically stacked PCBs. The method comprises the following steps: preparing two daughter boards; carrying out back-to-back bonding on the two sub-boards through a bonding piece to form a first substrate; pressing a plurality of stacked structures on the upper surface and the lower surface of the first substrate to form a second substrate; the stacked structure comprises prepregs and copper foils which are arranged in a stacked manner; carrying out board milling on the second substrate, removing the region provided with the bonding piece, separating the two sub-boards, and obtaining two PCBs (Printed Circuit Board); the two PCBs are both of an asymmetric stacked structure. According to the method provided by the embodiment of the invention, the two sub-boards are bonded back to back through the bonding piece to form the first substrate, so that single-sided lamination can be simultaneously carried out on the two sub-boards on the upper and lower surfaces of the first substrate, the warping problem caused by single-sided lamination on a single sub-board is avoided, and the production efficiency can be improved.

Disclosed are semiconductor modules with hybrid deep trench capacitor (DTC) substrate. The semiconductor modules are hybrid in that they include both ajinomoto build-up film (ABF) and PrePreG (PPG). The ABF avoids or at least mitigates resin void risks. The PPG avoids or at least mitigates delamination and via crack risks.

The invention provides an efficient bending method applied to a flexible circuit board, which is realized through bending equipment and comprises the following specific steps: (1) a first circuit board is placed on a first workbench, and a connecting terminal of the first circuit board extends out of a placing table; (2) placing a second circuit board on a second workbench; (3) the turnover device drives the second circuit board to turn over to the first workbench, so that the first circuit board corresponds to the second circuit board; (4) fixing the front ends of the first circuit board and the second circuit board by a fixing assembly; (5) resetting the turnover device; the second circuit board is located above the first circuit board; (6) the bending limiting device moves downwards and limits the rear ends of the first circuit board and the second circuit board; and (7) the bending device penetrates through the bending section to move upwards to bend the first circuit board and the second circuit board, the bending consistency is good, and the bending efficiency is high.

The present application relates to a numbering marking method and numbering collection device for circuit board electroplating, which relates to the technical field of circuit board production, and includes the following steps: S1, regular arrangement; S2, making marking grooves, aligning the two ends of the engraved jig with digital scales with the reference plane on the basket, finding the digital scale lines corresponding to the basket numbers on the engraved jig, and the engraved device engraves marking grooves at the corresponding digital scale lines, and the marking grooves extend to each circuit board; S3, surface cleaning; S4, electroplating; S5, post-processing; S6, return inspection, aligning the two ends of the indicating device with the reference plane on the basket of the electroplated circuit board, and reading the corresponding number of the circuit board according to the numbers on the engraved jig corresponding to each marking groove, and comparing it with the number on the basket. The present application has the effect of clear markings on the circuit board after electroplating, and being able to accurately read the corresponding number of the circuit board according to the markings, so that the accuracy of matching the circuit board with the basket is higher.

A carrier assembly may include a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending up to a first area provided on one of two extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area, and a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on that second area.

The invention discloses a PCB stepped groove preparation technology. The technology comprises the steps of laminated plate pressing, primary mechanical depth-controlled groove milling, secondary mechanical depth-controlled groove milling, final mechanical depth-controlled groove finishing and the like. By adopting step-by-step milling, on one hand, the machining precision can be effectively improved, and on the other hand, the laminated stress can be released step by step; 0.1-0.5 mm fine trimming allowance is reserved in an initial groove so as to buffer machining errors, an S-shaped path is adopted in the fine trimming stage, a radius turning offset strategy is combined, stress sudden change of traditional right-angle turning is eliminated, frequent tool changing calibration is not needed in the process, and the working time is shortened to 2 / 3 of the original working time; through the combination of various means, the groove depth precision and the position precision of the stepped groove can be greatly improved, the surface roughness of the stepped groove is reduced, the burr occurrence rate is reduced, the high-quality groove body surface is achieved, and the strict requirements of high-speed signal transmission and the like for the groove body precision and the surface quality are met.

The present disclosure provides a printed circuit board and a wire arrangement method thereof. The printed circuit board includes a packaged chip and at least two connectors, wires of the packaged chip that are connected to different connectors are distributed on different board layers; and when the packaged chip is connected to one of the connectors, a via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out. The wires of the packaged chip that are connected to different connectors are distributed on different board layers. When the packaged chip is connected to one of the connectors, according to backdrilling of different depths, the via is backdrilled to form a high-speed path from the packaged chip to the connector, and copper walls of board layers corresponding to other connectors are drilled out.

Disclosed are semiconductor modules with hybrid deep trench capacitor (DTC) substrate. The semiconductor modules are hybrid in that they include both ajinomoto build-up film (ABF) and PrePreG (PPG). The ABF avoids or at least mitigates resin void risks. The PPG avoids or at least mitigates delamination and via crack risks.

The invention discloses a vertical double-face hole plugging machine tool and a machining method thereof. The vertical double-face hole plugging machine tool comprises a rack, a conveying belt, two sound wave auxiliary printing scraper devices, at least two sound wave curing devices and a curing bin. The sound wave auxiliary printing scraper device, the sound wave curing device and the curing bin are sequentially arranged in the moving direction of the conveying belt, the working procedures of resin hole filling, surface curing and overall curing can be conducted on the PCB, hole plugging of the PCB is achieved efficiently, and the hole plugging quality is improved. The vertical double-face hole plugging machine tool is adopted, the PCB to be plugged is vertically clamped on the machine tool, the sound wave auxiliary printing scraper device, the sound wave curing device and the curing bin are arranged on the two sides to be plugged respectively, resin hole plugging can be conducted on the two faces of the PCB at the same time, hole plugging can be conducted on the multiple PCBs at the same time in cooperation with the conveying belt, assembly line type machining is achieved, and the production efficiency is improved. The production efficiency of the PCB is improved, and the operation process is simplified.

An electric heating device includes an electronics housing with a partition wall which separates a connection chamber from a heating chamber for emitting heat to a medium to be heated, and a fluid housing which delimits the heating chamber. At least one PTC heating device is connected to the heating chamber in a thermally conductive manner and is electrically connected in the connection chamber. A control device is located, at least in part, in the connection chamber and includes a circuit breaker that bears against a channel base. The channel base is located outside the heating chamber and is formed by the partition wall. The channel base, together with a channel top, forms a channel through which the medium can flow. This eliminates the need for complex heat sinks or the like, and the waste heat from the circuit breaker can be used to heat the medium.

The present invention relates to the field of flexible circuit board processing, and discloses an integrated device for bending and pressing flexible circuit boards, including a device body, a control module, a vertical frame, a bending mechanism, a pressing mechanism and a storage rack, which are used for processing the bending and pressing of flexible circuit boards. There are also a segmented temperature control module, a switching and purging module, a heat transfer and flattening module and a release compensation module. The segmented temperature control module switches to exchange the hot and cold temperatures of the flexible circuit board along with the bending action of the bending mechanism. The switching and purging module purifies the operating environment of the bending mechanism. The heat transfer and flattening module makes flexible contact with the pressing surface of the pressing mechanism and compensates for the deformation generated on the pressing surface during heat transfer. The release compensation module realizes omission compensation collection for the transfer of the flexible circuit board; synchronizing with the bending action of the bending mechanism, segmented temperature control adjustment is set for the flexible circuit board substrate, the yield strength of the material is reduced in the preheating and softening stage, and after the bending is completed, the cooling module is switched to give rapid shaping to reduce the bending angle error.

The invention relates to an improved multi-layer FPC with a step structure and a manufacturing method thereof, and the method comprises the steps: manufacturing the core board of each layer of the FPC, and each layer of the core board comprises a circuit layer, a flexible core board layer and a bonding layer; a step area of the FPC is determined, a porous hole-shaped structure is manufactured at the boundary of the step area of the bonding layer, and a protective layer is machined on the layer where the step face of the step area of the FPC is located; injecting a liquid-phase substance into the porous structure; laminating the core plates of each layer of the FPC according to a preset sequence to obtain the FPC; and carrying out subtractive manufacturing on the stepped region of the FPC by adopting a vertical laser controlled depth milling process to form the multi-layer FPC with the stepped structure. In the material reducing treatment process of the vertical laser depth-controlled milling process, the function of gasifying and absorbing heat of the liquid-phase substance is utilized, so that each core layer at the boundary of the non-step area is cooled and protected, the boundary of the non-step area of each core layer is prevented from being burnt, the step structure of the FPC is more complete, and the yield and quality of the FPC are effectively improved.

This disclosure relates to a PCB processing equipment and control method. The PCB processing equipment includes a worktable, at least one temporary storage mechanism, and a lifting mechanism. The worktable has at least one tool disc placement area for placing a tool disc. The worktable is configured to place a PCB and to drive the tool disc to move in the Y-axis direction. The temporary storage mechanism includes a temporary storage rack configured to temporarily store the tool disc. The worktable is configured to drive the tool disc placement area in the Y-axis direction to a position where it docks with the temporary storage rack. The lifting mechanism is configured to drive at least one of the temporary storage rack and the tool disc to move in the height direction, so as to place the tool disc located on the temporary storage rack into the tool disc placement area, or to transfer the tool disc located in the tool disc placement area to the temporary storage rack. The PCB processing equipment of this disclosure achieves automated tool disc replacement through the cooperation between the lifting mechanism, the temporary storage rack, and the worktable, thereby improving the utilization rate of the PCB processing equipment.

The present invention discloses a method for manufacturing a large-size flexible circuit board that replaces a wiring harness type, comprising: manufacturing a covering film core board through a previous process; then manufacturing a punching die, and performing alignment punching of a slot body on the covering film core board, and forming a flexible board connecting bridge in the slot body, so that the entire board forms a punched plate, taking a reinforcing sheet to open a window corresponding to the slot body to form a reinforced slot body, the reinforced slot body is provided with a plurality of reinforcing connecting bridges, and the entire board forms a reinforced plate; the reinforcing connecting bridges and the flexible board connecting bridges are staggered; the reinforcing plate is attached to the punched plate, and then formed into a circuit board; the covering film is attached by means of a panel structure, and punching is performed with a punching mold, thereby solving the problems of easy scattering and difficulty in attaching the covering film attached in batches; the staggered design of the flexible board connecting bridge and the reinforcing plate connecting bridge allows selective processing during final forming, thereby solving the problems of easy material entanglement, difficulty in smooth chip removal, and generation of milling burrs and wiredrawing during milling; the overall processing flow forms effective coordination.

An electric heating device (2) comprising an electronics housing (9) forming a partition (8) that separates a connection chamber (6) from a heating chamber (4) for transferring heat to a medium to be heated, and a flow housing (38) that delimits the heating chamber (4), wherein at least one PTC heating device (14) is formed which is thermally connected to the heating chamber (4) and which is electrically connected in the connection chamber (6), wherein a control device (20) with at least one power switch (22) is formed in the connection chamber (6), characterized in that the power switch (22) rests on a channel base (32) formed outside the heating chamber (4) by the partition (8), which together with a channel top (36) forms a channel (34) through which the medium flows, spatially separated from the heating chamber (4), and which is fluidically connected to the heating chamber (4).wherein the channel top (36) and the electronics housing (9) are separate components that are fluid-tightly connected to each other.

The invention discloses a riveting device for a multi-layer PCB (Printed Circuit Board), and relates to the technical field of PCB processing equipment. Comprising supporting frames, a transverse frame is fixedly connected to the top ends of the two supporting frames, a connecting plate is fixedly connected to one side of the outer wall of the transverse frame, a third servo motor is fixedly connected to the other side of the outer wall of the transverse frame, and a first transmission gear set is fixedly connected to the output end of the third servo motor; a first threaded rod is fixedly connected to the position, located on one side of the third servo motor, of the outer wall of the first transmission gear set, and a sliding block is in threaded transmission connection with the outer wall of the first threaded rod. The manual riveting efficiency is low; the traditional mechanical riveting equipment is difficult to meet the large-scale production requirement; and the traditional riveting equipment is difficult to adapt to the processing of the PCBs with different specifications.

The invention provides flexible circuit board bending equipment which comprises a rack, a first workbench used for placing a first circuit board is arranged on the rack, a turnover device is arranged on the rack on one side of the first workbench, and a second workbench used for placing a second circuit board is arranged on the turnover device; an ejector pin device is arranged on the rack on the other side of the first workbench; an assembling mechanism is arranged on the rack at the front end of the first workbench; a placing table used for placing a first circuit board is arranged at the front end of the first working table, a connecting terminal of the first circuit board extends out of the placing table, a bending section is arranged between the placing table and the first working table, and a bending device is arranged below the bending section. The bending device penetrates through the bending section to bend the first circuit board and the second circuit board on the first workbench. By means of the structure, the circuit boards can be stably installed on the connector, and meanwhile the bending positions of the two circuit boards are consistent.