36results about "Mechanical/acoustic circuit processing" patented technology

The invention relates to the technical field of PCB drilling positioning, and particularly provides a PCB drilling positioning method and system.The method comprises the steps that structured light pattern images corresponding to different reference mark points are obtained, and the structured light pattern images comprise preset structured light patterns with projection areas covering the reference mark points; for each reference mark point, actual Z-axis height information is obtained according to the structured light pattern image, and then the focusing depth of the laser scanning system is adjusted according to the actual Z-axis height information; for each reference mark point, acquiring original two-dimensional coordinate information of the reference mark point by using a laser scanning system, and then correcting the original two-dimensional coordinate information according to the actual Z-axis height information and preset optical geometric parameters of the laser scanning system to obtain corrected two-dimensional coordinate information; correcting a preset drilling target point position according to all the corrected two-dimensional coordinate information to obtain a final drilling position of the drilling target point; according to the method, the problems of defocusing and projection errors caused by unevenness of the PCB can be effectively solved.

The invention discloses a circuit board reworking processing method, which comprises the steps of processing a first hole in a target position of a circuit board, and obtaining an actual position of the first hole; concentrically machining a second hole in the actual position of the first hole, and detecting the actual position of the second hole; the deviation between the first hole and the second hole is determined according to the actual position of the first hole and the actual position of the second hole, and the deviation is compared with a preset first threshold value; when the deviation is greater than or equal to a first threshold value, the third hole is concentrically complementarily machined at the actual position of the first hole. The invention further discloses circuit board processing equipment. According to the circuit board reworking processing method and the circuit board processing equipment, the yield of circuit board processing can be improved, and the cost is reduced.

The application discloses a combined die for flexible circuit board processing and a use method thereof, and relates to the field of combined dies.The combined die comprises a bottom plate, a sealing cover is arranged on the top of the bottom plate to prevent impurities from entering, an insertion notch is arranged on the sealing cover, and a module storage bin is arranged on the outer surface of the sealing cover.The combined die further comprises a forming bottom die unit, which is used for limiting FPC material parts and providing basic support and positioning for the processing of the flexible circuit board;a shaping module, which is used for extruding the flexible circuit board material parts in a plastic state;and an adjusting module, which is used for adjusting the properties of the extruded flexible circuit board material parts.Firstly, the flexible circuit board is positioned and limited in the forming bottom die unit, then the shaping module is arranged on the access plate, then the flexible circuit board is pressed by starting the telescopic rod to move downwards, a bending part is formed, and then the adjusting module is replaced to adjust and reinforce the bending part.

The application relates to the technical field of circuit board drilling, and discloses a circuit board drilling device, which comprises a workbench, a groove is formed in the tabletop of the workbench, the groove is located below a circuit board when the circuit board is installed on the workbench, a sliding seat and a supporting pipe are installed in the groove, the supporting pipe is installed on the sliding seat, and the side of the sliding seat, which is away from the supporting pipe, slides on the bottom wall of the groove; a gas conveying device is installed on the workbench, the gas conveying device comprises a gas supply source and a gas outlet pipe connected with the gas supply source, the sliding seat is provided with an inner cavity, the inner cavity of the sliding seat is communicated with the gas outlet pipe, the supporting pipe is made of hollow elastic material, and one end of the supporting pipe is communicated with the inner cavity of the sliding seat. The application can improve the flatness of the inner wall of the milled groove of the circuit board.

The application provides a high-efficiency bending method applied to a flexible circuit board, which is realized by a bending device and comprises the following specific steps: (1) placing a first circuit board on a first workbench, with a connecting terminal of the first circuit board extending out of the placing table; (2) placing a second circuit board on a second workbench; (3) driving a turnover device to turn over the second circuit board to the first workbench, so that the first circuit board and the second circuit board correspond to each other; (4) fixing the front ends of the first circuit board and the second circuit board by a fixing assembly; (5) resetting the turnover device, so that the second circuit board is located above the first circuit board; (6) moving a bending limiting device downward and limiting the rear ends of the first circuit board and the second circuit board; and (7) moving a bending device upward through a bending interval to bend the first circuit board and the second circuit board, so that the bending consistency is good and the bending efficiency is high.

The invention provides a circuit board forming processing method which comprises the following steps: detecting a first height of a circuit board at a forming position; the first depth of the forming position is obtained, and a blind groove is machined in the forming position based on the first depth; detecting a second height of the bottom of the blind groove; determining a second depth of the blind groove according to the first height and the second height; and according to a comparison result of the first depth and the second depth, controlling the molded circuit board. The invention further provides circuit board forming equipment. According to the circuit board forming processing method and the circuit board forming equipment, the forming processing precision and the detection efficiency can be improved.

The invention relates to an automatic turning mechanism for removing an electrophoresis layer through laser etching, which comprises a base, a rotating frame, a laser etching device and a laser etching device, the rotating frame is rotationally connected with the base; the rotating end of the driving part is fixedly connected with the rotating frame, and the driving part is used for controlling and driving the rotating frame to rotate; the clamp is fixedly connected to the rotating frame, the side, making contact with a product, of the clamp is provided with a positioning groove and a lever piece, the side, making contact with the product, of the positioning groove is in profile modeling with the structure of the product and is used for positioning the product, and the lever piece is used for locking and attaching the product into the clamp. And then the product on the rotating frame is driven to rotate to be vertically upward to be subjected to laser etching to remove an electrophoresis layer, the product can be clamped only once, but different planes can be rotated to be vertically upward, laser etching of the electrophoresis layers of the different planes of the product is facilitated, and the laser etching efficiency of the product is improved.

The invention discloses an asymmetrically stacked PCB, a construction method, a single-side electroplating method and a PCB, and relates to the technical field of symmetrically stacked PCBs. The method comprises the following steps: preparing two daughter boards; carrying out back-to-back bonding on the two sub-boards through a bonding piece to form a first substrate; pressing a plurality of stacked structures on the upper surface and the lower surface of the first substrate to form a second substrate; the stacked structure comprises prepregs and copper foils which are arranged in a stacked manner; carrying out board milling on the second substrate, removing the region provided with the bonding piece, separating the two sub-boards, and obtaining two PCBs (Printed Circuit Board); the two PCBs are both of an asymmetric stacked structure. According to the method provided by the embodiment of the invention, the two sub-boards are bonded back to back through the bonding piece to form the first substrate, so that single-sided lamination can be simultaneously carried out on the two sub-boards on the upper and lower surfaces of the first substrate, the warping problem caused by single-sided lamination on a single sub-board is avoided, and the production efficiency can be improved.

Disclosed are semiconductor modules with hybrid deep trench capacitor (DTC) substrate. The semiconductor modules are hybrid in that they include both ajinomoto build-up film (ABF) and PrePreG (PPG). The ABF avoids or at least mitigates resin void risks. The PPG avoids or at least mitigates delamination and via crack risks.

A carrier assembly may include a first carrier sub-assembly, said first carrier sub-assembly having an elongated shape and comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure extending up to a first area provided on one of two extremities of the elongated shape, wherein a first plurality of conductive nanowires is provided on said first area, and a second carrier sub-assembly, said second carrier sub-assembly comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, said at least one electrically conductive layer structure comprising a second area, wherein a second plurality of conductive nanowires is provided on that second area.

Disclosed are semiconductor modules with hybrid deep trench capacitor (DTC) substrate. The semiconductor modules are hybrid in that they include both ajinomoto build-up film (ABF) and PrePreG (PPG). The ABF avoids or at least mitigates resin void risks. The PPG avoids or at least mitigates delamination and via crack risks.

An electric heating device includes an electronics housing with a partition wall which separates a connection chamber from a heating chamber for emitting heat to a medium to be heated, and a fluid housing which delimits the heating chamber. At least one PTC heating device is connected to the heating chamber in a thermally conductive manner and is electrically connected in the connection chamber. A control device is located, at least in part, in the connection chamber and includes a circuit breaker that bears against a channel base. The channel base is located outside the heating chamber and is formed by the partition wall. The channel base, together with a channel top, forms a channel through which the medium can flow. This eliminates the need for complex heat sinks or the like, and the waste heat from the circuit breaker can be used to heat the medium.

This disclosure relates to a PCB processing equipment and control method. The PCB processing equipment includes a worktable, at least one temporary storage mechanism, and a lifting mechanism. The worktable has at least one tool disc placement area for placing a tool disc. The worktable is configured to place a PCB and to drive the tool disc to move in the Y-axis direction. The temporary storage mechanism includes a temporary storage rack configured to temporarily store the tool disc. The worktable is configured to drive the tool disc placement area in the Y-axis direction to a position where it docks with the temporary storage rack. The lifting mechanism is configured to drive at least one of the temporary storage rack and the tool disc to move in the height direction, so as to place the tool disc located on the temporary storage rack into the tool disc placement area, or to transfer the tool disc located in the tool disc placement area to the temporary storage rack. The PCB processing equipment of this disclosure achieves automated tool disc replacement through the cooperation between the lifting mechanism, the temporary storage rack, and the worktable, thereby improving the utilization rate of the PCB processing equipment.

The present invention discloses a method for manufacturing a large-size flexible circuit board that replaces a wiring harness type, comprising: manufacturing a covering film core board through a previous process; then manufacturing a punching die, and performing alignment punching of a slot body on the covering film core board, and forming a flexible board connecting bridge in the slot body, so that the entire board forms a punched plate, taking a reinforcing sheet to open a window corresponding to the slot body to form a reinforced slot body, the reinforced slot body is provided with a plurality of reinforcing connecting bridges, and the entire board forms a reinforced plate; the reinforcing connecting bridges and the flexible board connecting bridges are staggered; the reinforcing plate is attached to the punched plate, and then formed into a circuit board; the covering film is attached by means of a panel structure, and punching is performed with a punching mold, thereby solving the problems of easy scattering and difficulty in attaching the covering film attached in batches; the staggered design of the flexible board connecting bridge and the reinforcing plate connecting bridge allows selective processing during final forming, thereby solving the problems of easy material entanglement, difficulty in smooth chip removal, and generation of milling burrs and wiredrawing during milling; the overall processing flow forms effective coordination.

The invention discloses a riveting device for a multi-layer PCB (Printed Circuit Board), and relates to the technical field of PCB processing equipment. Comprising supporting frames, a transverse frame is fixedly connected to the top ends of the two supporting frames, a connecting plate is fixedly connected to one side of the outer wall of the transverse frame, a third servo motor is fixedly connected to the other side of the outer wall of the transverse frame, and a first transmission gear set is fixedly connected to the output end of the third servo motor; a first threaded rod is fixedly connected to the position, located on one side of the third servo motor, of the outer wall of the first transmission gear set, and a sliding block is in threaded transmission connection with the outer wall of the first threaded rod. The manual riveting efficiency is low; the traditional mechanical riveting equipment is difficult to meet the large-scale production requirement; and the traditional riveting equipment is difficult to adapt to the processing of the PCBs with different specifications.

This invention belongs to the field of through-hole processing technology for substrates, specifically relating to a porous substrate and a multi-through-hole processing method based on dynamic partitioning. The substrate processing area is divided into multiple grid cells, a spatial distribution density map is constructed, and density ridges are obtained based on density gradients as partition boundaries, achieving efficient dynamic partitioning. Multiple rows are merged based on the hole coordinate spacing, and all hole coordinates are connected to form processing paths for sub-processing areas, achieving stroke optimization within the partition. By constructing an objective function, the processing sequence of sub-processing areas is optimized, ensuring that the path length is minimized, further improving processing efficiency and reducing processing costs. This invention optimizes multi-row through-hole processing into a single-row continuous processing path through a dynamic partitioning strategy and a multi-row merging algorithm, significantly reducing laser head idle travel time and the number of inter-row switching, achieving efficient processing of large-scale through-holes on substrates.

The invention provides a circuit board drilling method. The circuit board drilling method comprises the following steps: providing a circuit board for processing; the circuit board is placed on a drilling machine, and the position to be machined on the circuit board corresponds to a drill bit on the drilling machine; a drilling machine switch is turned on, and a drill bit drills the position to be machined; wherein the two sides of the circuit board are fixed through the cover plate and the base plate respectively, the cover plate is a film-coated aluminum sheet, the circuit board is fixed through the cover plate and the base plate, the circuit board can be provided with the two opposite sides, namely the upper side and the lower side, the upper side of the circuit board can be covered with the cover plate, and the lower side of the circuit board is provided with the base plate; therefore, the relative position of the circuit board can be fixed through the cover plate and the base plate, the cover plate is arranged to be a film-coated aluminum sheet, the positioning precision of the drill bit can be improved, and the heat dissipation performance of the circuit board in the machining process can be improved through the film-coated aluminum sheet.

The present invention discloses a circuit board processing method and laser processing equipment. The circuit board processing method is used to form a large blind hole on a circuit board. In the reading step of the circuit board processing method, each processing instruction in the processing file is read one by one, and it is determined whether the current aperture of the currently read processing instruction is larger than the preset aperture; if it is larger than the preset aperture, the conversion step and the processing step are executed. In the conversion step, the corresponding conversion information is found in the conversion database based on the current aperture using the hole-matching instruction conversion program. In the processing step, the laser processing device is controlled to form a combined large blind hole corresponding to the large blind hole on the circuit board based on the conversion information and the center coordinates in the processing instruction. The combined large blind hole is composed of multiple small blind holes.

The present invention discloses a diamond copper block and a method for milling grooves in the diamond copper block in a circuit board. The method comprises the following steps: cutting a core board and a polypropylene sheet according to the size of the panel, and opening windows on the core board and the PP sheet at positions corresponding to the buried copper blocks; stacking the core board and the PP sheet in sequence as required to form a composite board, forming buried copper slots at the corresponding openings on the core board and the PP sheet, and then placing the diamond copper block in the buried copper slots; stacking a prepreg and an outer copper foil on both surfaces of the composite board in sequence, and pressing them together to form a multilayer board; performing controlled-depth milling on the side of the multilayer board adjacent to the copper paste at positions corresponding to the grooves, wherein the size of the milled groove is smaller than the size of the groove so that a copper layer remains on the groove wall and the groove bottom after the groove is milled; and then removing the copper layer on the groove wall and the groove bottom by etching. The method of the present invention solves the problem that groove milling cannot be performed on existing single-material diamonds using a whole block.

The invention relates to a method for manufacturing a printed circuit board with a stepped groove, which comprises the following steps of: (a) providing a laminated structure comprising at least one core board and prepregs arranged on two sides of the core board; (b) forming step grooves in the prepregs and the core plate, wherein the size of each step groove is expanded by a preset margin on a single side; (c) pre-arranging a detachable supporting insert block in the stepped groove before pressing; (d) carrying out pressing operation to enable the prepreg to flow glue and form; and (e) removing the covering layer on the stepped groove through a depth-controlled milling process after pressing, and taking out the supporting insert block. A traditional pure prepreg lamination is replaced by the core plate, the material cost is remarkably reduced, the structure is simplified, the structural reliability, the overflowing glue controllability and the economical efficiency are considered, the method has wide application prospects in the high-added-value fields of communication equipment, intelligent terminals and the like, and a reliable technical path is provided for manufacturing of the precise stepped groove circuit board.

Various implementations include force elements for electronic devices. In some aspects, a force element includes: an outer ring surrounding a central axis and having a first diameter; an inner ring surrounding the central axis and having a second diameter that is smaller than the first diameter; an outer wall connecting a radially inner portion of the outer ring with a radially outer portion of the inner ring; an inner wall extending from a radially inner portion of the inner ring and located radially inboard of the outer wall; and a central platform extending from the inner wall around the central axis.

The present invention discloses a multiple bending machine for a flexible FPC support strip and a bending process thereof, comprising an FPC support platform, a bearing mechanism, and a bending portion. The FPC support platform is erected on a chassis in a straight line, and the flexible FPC is placed on the FPC support platform; the bearing mechanism is vertically connected to the outer side of the FPC support platform; the bending portion is arranged in the installation space of the chassis; the bending portion includes a first bending mechanism, a second bending mechanism, and a third bending mechanism that can move linearly and rotationally in a horizontal plane; the first bending mechanism supports the strip and then flips 180° along the first bending line; the second bending mechanism clamps the strip after the first bending and then flips 180° to complete the second bending; the third bending mechanism clamps the strip after the second bending and then flips 180° to complete the third bending. The present invention realizes multiple automatic bending at different positions and angles on the same strip, avoids local warping during the bending process, improves the accuracy of the bending position, accurately controls the bending thickness and bending curvature, and improves the surface flatness of the strip after bending.

A printed circuit board assembly comprising a plurality of layers. At least one of the plurality of layers is formed of a dielectric material and has an extended portion extending beyond the other layers in the plurality of layers. A first metallic layer is located on at least a portion of the extended portion of the dielectric layer. The first metallic layer and the dielectric layer are configured to form a launch transducer comprising one or more transmission lines and a transducer element coupled to the one or more transmission lines. The transducer element is configured to propagate millimeter wave frequency signals.

The invention belongs to the technical field of substrate through hole machining, and particularly relates to a porous substrate and a multi-through-hole machining method based on dynamic zoning, a substrate machining area is divided into a plurality of grid units, a spatial distribution density map is constructed, a density ridge line is obtained based on density gradient to serve as a zoning boundary, and efficient dynamic zoning is achieved. And multi-row merging is achieved based on the hole coordinate spacing of the hole coordinate rows, all hole coordinates are connected, a machining path of the sub-machining area is formed, and stroke optimization in the subareas is achieved. And the processing sequence optimization of the sub-processing areas is realized by constructing the target function, so that the path length is relatively small, the processing efficiency is further improved, and the processing cost is reduced. According to the method, through a dynamic partitioning strategy and a multi-row merging algorithm, multi-row through holes are optimized into a single-row continuous machining path, the idle stroke time of a laser head and the inter-row switching frequency are remarkably reduced, and efficient machining of large-scale through holes of the substrate is achieved.

The application discloses a kind of FPC expansion and contraction management methods, including the selection and processing of copper foil substrate, laser, plasma treatment, copper plating, etching, paste pressure CVL, punching, grinding plate, ink, baking, gold, PI pressure and cutting shape, by each process in the FPC production process is controlled, including the selection of material, the processing of material, parameter control in each process, can effectively improve the expansion and contraction in the FPC production process, avoid due to expansion and contraction and cause FPC's defect, ensure the stability of product, can avoid due to FPC expansion and contraction and need rework or repair, improve the production efficiency of FPC.

The application provides a flexible circuit board bending equipment, which comprises a rack, a first workbench for placing a first circuit board is arranged on the rack, a turnover device is arranged on one side of the rack, a second workbench for placing a second circuit board is arranged on the turnover device, a thimble device is arranged on the other side of the rack, an assembling mechanism is arranged on the front end of the rack, a placing table for placing the first circuit board is arranged on the front end of the first workbench, the connecting terminal of the first circuit board extends out of the placing table, a bending interval is arranged between the placing table and the first workbench, a bending device is arranged below the bending interval, and the bending device passes through the bending interval to bend the first circuit board and the second circuit board on the first workbench.

The present application belongs to the technical field of FPC production, and relates to a composite punch, comprising: a punching platform provided with a double-mover linear module; a lower die movable group is slidingly installed on the double-mover linear module, and is used for bearing a punching lower die and driving the punching lower die to reciprocate between a feeding station and a punching station; a punching plate is located above the punching station, and is used for fixing a punching upper die; the punching plate drives the punching upper die to perform a punching operation through a punching driving mechanism; a receiving movable group is slidingly installed on the double-mover linear module, and is used for bearing a tray and driving the tray to reciprocate between the punching station and a discharging station; a vibration module is installed on the punching plate, and is used for driving the punching plate and the upper die to vibrate, so that a finished product on the upper die is separated from the upper die.

The present application relates to a multilayer FPC with improved stepped structure and a manufacturing method thereof, which comprises: manufacturing core plates of each layer of the FPC, wherein each layer of the core plates comprises a circuit layer, a flexible core layer and an adhesive layer; determining a stepped area of the FPC, manufacturing a porous hole structure at the boundary of the stepped area of the adhesive layer, processing a protective layer on the layer where the stepped surface of the stepped area of the FPC is located; injecting a liquid phase material into the hole structure; pressing the core plates of each layer of the FPC in a preset order to obtain the FPC; and using a vertical laser controlled depth milling process to subtractively manufacture the stepped area of the FPC to form the multilayer FPC with stepped structure. During the subtractive processing of the vertical laser controlled depth milling process, the function of heat absorption by gasification of the liquid phase material is used to cool and protect each core layer at the boundary of the non-stepped area, so as to avoid burning at the boundary of the non-stepped area of each core layer, thereby making the stepped structure of the FPC more complete and effectively improving the yield and quality of the FPC.

The invention relates to the technical field of intelligent electric meters, in particular to a manufacturing method of an electric energy meter and the electric energy meter, the electric energy meter comprises a PCB, the manufacturing method comprises the steps that a light guide groove is formed in the PCB, and the light guide groove is communicated with the back face and the front face of the PCB; a light-emitting diode is attached to the back face of the PCB, and a light-emitting body of the light-emitting diode is arranged in the light guide groove. According to the manufacturing method of the electric energy meter, the light-emitting diodes are attached to the back face of the PCB with the low layout density, structural interference between the light-emitting diodes and other components can be reduced, the light guide grooves form light path guide channels, light interference between the light-emitting diodes is prevented, and the display effect is ensured.

The invention belongs to the technical field of FPC (Flexible Printed Circuit) production, and relates to a composite punching machine which comprises a punching platform provided with a double-rotor linear module; the lower die moving set is installed on the double-rotor linear module in a sliding mode and used for bearing a stamping lower die and driving the stamping lower die to move back and forth between the feeding station and the stamping station. The stamping plate is located above the stamping station, the stamping plate is used for fixing a stamping upper die, and the stamping plate is driven by a stamping driving mechanism to drive the stamping upper die to conduct stamping operation; the material receiving movable set is installed on the double-rotor linear module in a sliding mode and used for bearing a material disc and driving the material disc to move back and forth between a punching station and a discharging station. The vibration module is installed on the stamping plate and used for driving the stamping plate and the upper die to vibrate, so that a finished product on the upper die is separated from the upper die.