Method for making window on cover film of flexible circuit board

Abstract

The invention discloses a method for making a window on a cover film of a flexible circuit board. The cover film is composed of a cover film layer and a release paper layer, and the cover film layer covers the surface of the release paper layer. Through slots or through holes are arranged on the cover film layer through punching, and the release paper layer has no through slots or through holes in positions corresponding to the through slots or through holes of the cover film layer. Cover film half-cutting making, cover film full-cutting making or cover film half-cutting and full-cutting making can be selected according to the cover film window making requirements of different products in order to increase connecting ribs after cover film window making, improve the tensile ability of coil cover films and enable more products to be imported to automation equipment.

Description

technical field [0001] The invention relates to a manufacturing method of a flexible circuit board, in particular to a method for opening a window of a covering film of a flexible circuit board. Background technique [0002] With the introduction of automation equipment required for the production process of flexible circuit boards, it is hoped that more and more products can be automated on automation equipment, so as to reduce the annual increase in staff costs and improve production efficiency. The window-opening and bonding of the cover film required by the flexible circuit board should also be imported into automatic equipment for production. Flexible circuit boards are arranged as tightly as possible during design to improve the utilization rate of the panel and save the cost of materials, such as figure 1 As shown, the cover film 1 used for flexible circuit boards is composed of a cover film layer 2 and a release paper layer 3. The conventional cover film 1 window op...

AI Technical Summary

Problems solved by technology

Flexible circuit boards are arranged as tightly as possible during design to improve the utilization rate of the panel and save the cost of materials, such as figure 1 As shown, the cover film 1 used for flexible circuit boards is composed of a cover film layer 2 and a release paper layer 3. The conventional cover film 1 window opening method is to completely punch out the cover film layer 2 and the release paper layer in the window opening area with a mold. Paper layer 3, such as figure 2 , 3 As shown, the window 11 of the covering film 1 required by some products is relatively large, and there are few connecting ribs 12 in the B-B direction of the remaining area on the covering film 1 after die cutting. 1. When automatic equipment such as automatic false labeling machine automatically pulls the material, due to the lack of connecting ribs 12, it cannot withstand the pulling force of the machine and the cover film of the roll material breaks. Therefore, this conventional cover film 1 window opening method leads to the automation of the introduction of such products Equipment production failure

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