Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thick copper foil shape correcting FPC having pierced gold fingers and manufacturing technology thereof

A manufacturing process and golden finger technology, which is applied in the manufacture of printed circuits, the formation of electrical connections of printed components, printed circuits, etc., can solve problems such as solder joints that cannot be connected or poor contact, product failure and scrapping, and affect accuracy, so as to avoid Poor connection, improved product reliability, and cost-saving effects

Pending Publication Date: 2017-09-15
鹤山市中富兴业电路有限公司
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The expansion or contraction of FPC will affect its accuracy, such as solder joints being strained and unable to connect or poor contact, which will lead to product failure and scrapping

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thick copper foil shape correcting FPC having pierced gold fingers and manufacturing technology thereof
  • Thick copper foil shape correcting FPC having pierced gold fingers and manufacturing technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention will be further described below in conjunction with accompanying drawing and example.

[0023] like figure 1 and figure 2 As shown, a thick copper foil orthopedic FPC with hollow 4 gold fingers of the present invention includes a substrate 1, a copper foil circuit 2 printed on the substrate 1 and a gold finger 3, and the copper foil circuit 2 is etched form. The gold fingers 3 are arranged on both sides of the base material 1, the gold fingers 3 have an inner end connected to the circuit and an outer end extending to the edge of the base material 1, and the FPC is provided with a stamping formed in the gold finger 3 area. Concave step 5, to achieve orthopedic effect. The present invention releases the internal stress of the FPC through the concave step 5, so that the thick copper FPC is not easy to expand or shrink and deform, avoiding poor connection caused by the strain of the solder joints of the product during use in different environments,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a thick copper foil shape correcting FPC having pierced gold fingers and a manufacturing technology thereof. The FPC comprises base material and copper foil lines and the gold fingers which are printed on the base material. The gold fingers are arranged at the two sides of the base material. The gold fingers are provided with internal ends which are connected with the lines and external ends which extend to the edge of the base material. The FPC is provided with concave steps which are formed in the gold finger regions through stamping. The internal ends of the gold fingers are partially reserved on the internal side base material of the concave steps. The concave steps are formed on the gold finger regions of the two sides of the FPC through stamping so that the stress of the FPC is released to perform shape correction, the thick copper FPC is enabled not to expand or contract or deform and poor connection caused by welding point spraining of the product in the use process of different environments can be avoided, and the product reliability can be enhanced, the cost can be saved and the customer credit degree can be enhanced.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a thick copper foil orthopedic FPC with hollow gold fingers and a manufacturing process thereof. Background technique [0002] FPC is a printed circuit with high reliability and excellent flexibility, which is made of polyester film or polyimide as the base material and formed on copper foil by etching. One of the main characteristics of FPC is that it can realize circuit connection. Usually, gold fingers are set on both sides of FPC, and FPC is soldered with external devices through gold fingers to achieve the purpose of electrical connection. [0003] The Chinese invention patent with the authorized notification number CN204119655U discloses a multi-layer flexible circuit board with a hollow gold finger. The flexible circuit board has a hollow connection window at the gold finger. When the flexible circuit board is connected to external devices, It is only necessary to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/11H05K3/00H05K3/40
CPCH05K1/118H05K3/0014H05K3/0044H05K3/403H05K2201/09372H05K2203/02H05K2203/0228
Inventor 胡德栋
Owner 鹤山市中富兴业电路有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com