Flexible board cover plate for processing flexible circuit board and technological process of flexible board cover plate

A flexible circuit board and circuit board technology, which is applied in the fields of printed circuit, printed circuit manufacturing, mechanical/acoustic circuit processing, etc., can solve the problems of high scrap cost of drill pins and plates, high hardness of cold punched plates, broken pins, etc., and achieve The processing is simple and convenient, the cost of scrapping is reduced, and the effect of reducing deflection

Inactive Publication Date: 2019-08-13
SHENZHEN HONGYUHUI TECH CO LTD
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Problems solved by technology

However, when drilling flexible circuit boards in the prior art, the existing traditional cold stamping board is generally used as the

Method used

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  • Flexible board cover plate for processing flexible circuit board and technological process of flexible board cover plate

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Embodiment Construction

[0022] Please refer to figure 1 As shown, a soft board cover for processing flexible circuit boards will be described below with reference to the embodiments, including a base body 1 and a resin board body 2 disposed on the surface of the base body. The flexible board cover plate formed by the base material body 1 and the resin plate body 2 is mainly used for processing and using cover plate consumables when processing micro-drilling holes of 0.075-0.10 mm on a flexible printed circuit board (FPC).

[0023] The resin plate body 2 is a plate body with high hardness, high wear resistance and high scratch resistance after solidification of a plurality of highly fine fine particles. The resin plate body 2 is made of water-soluble or thermosetting or light-setting resin material;

[0024] The resin plate body 2 includes main materials, active monomers, auxiliary agents, photoinitiators, and fillers; the mass ratio of the composition formula is divided into 30%-80% main materials, ...

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Abstract

The invention discloses a flexible board cover plate for processing a flexible circuit board. The flexible board cover plate comprises a base material body and a resin board body, wherein the resin plate body is a plate body formed by curing fine particles, and the base material body comprises a cold punching plate or kraft paper or aluminum. During use, as the resin plate body can enable the small drill points to be stabilized instantly when the small drill points are in contact with the surface of the resin plate body during drilling, the deflection is reduced; and meanwhile, the cutting powder generated after the drill bit is cut by the small drill bit is converted into dust to be sucked away, so that the optimal hole position precision can be provided for drilling in the drilling process, and therefore, on the premise that the hole position precision of drilling is met, the problem of needle breakage happening in the processing of 0.075-0.10 mm micro drill needles is improved on the premise that the hole position precision of drilling is met. In addition, the flexible board cover plate is convenient for processing, is easy and convenient.

Description

[0001] 【Technical field】 [0002] The invention relates to a flexible circuit board processing soft board cover used for circuit board processing consumables and a process flow of the soft board cover. [0003] 【Background technique】 [0004] With the continuous progress and development of society, the requirements for high precision of electronic products are getting higher and higher. The high-precision development of electronic products directly puts forward higher precision requirements for circuit board processing. At the same time, it also makes the positioning accuracy and hole quality requirements of circuit board holes higher and higher. However, when drilling flexible circuit boards in the prior art, the existing traditional cold stamping board is generally used as the flexible board (FPC) cover plate. Due to the high hardness of the cold stamping board, it is very easy to process a small When the needle is drilled, the needle breaks seriously, resulting in a high co...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/02
Inventor 朱三云
Owner SHENZHEN HONGYUHUI TECH CO LTD
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