Method for improving wire dropping of punching dielectric layer of light bar plate

Abstract

The invention discloses a method for improving the wire dropping of a punching dielectric layer of a light bar plate, and the method comprises the steps: A, carrying out circuit film design on the light bar plate, wherein a waste edge is prepared in a mode of copper laying; B, enabling a circuit to be manufactured through miniature etching and washing of the plate, dry film pasting, alignment, exposure and etching; C, carrying out solder mask film design, enabling the waste edge to be covered by solder mask ink, and enabling the waste edge to achieve windowing without soldering resistance; E, manufacturing a solder mask through printing, pre-baking, alignment, exposure, development, and post-baking; F, carrying out the punching of the light bar plate. According to the invention, the circuit waste edge is manufactured in a mode of copper laying, thereby improving the hardness of the waste edge, enabling the wire dropping to be improved greatly, and reducing the risk of crushed scraping caused by that a dielectric layer falls to a desk top.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, and in particular to a method for improving the wire drop of a punching medium layer of a light bar board. Background technique [0002] With the advancement of modern science and technology, LCD TVs are becoming thinner and wider, which means that the size of the light strips will become longer and longer. Due to the long size of the light bar, it is not only time-consuming to form the gong board, but also the size of the finished product is difficult to control. The forming method of punching plate is not only efficient, but also the quality can be well guaranteed. However, during the punching process of the light strip board, the problem of wire drop in the dielectric layer is prone to occur. If it is not cleaned, there is a risk of crushing the circuit surface. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention...

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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a method for improving the wire loss of the medium layer of the lamp strip board, aiming to solve the problem that the light strip board is easy to lose wire during the punching process in the prior art

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