Gold finger manufacturing method without lead residue

A production method and gold finger technology, which are applied in the manufacturing of printed circuits, reinforcement of conductive patterns, printed circuits, etc., can solve the problems of increasing difficulty in quality control of the production process, affecting product quality, and many hidden dangers, and achieving easy processing quality. Control, reduce hidden dangers of quality, improve the effect of quality

Inactive Publication Date: 2017-12-15
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Obviously, the production process of the two production schemes is long, the difficulty of quality control of the production process increases accordingly, and there are many hidden dangers in quality. In addition, lotions, inks, dry films, etc. are used many times in the production process, which is easy to cause pollution to the board surface. May affect product quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The present invention will be further described below in conjunction with specific examples.

[0014] In the specific implementation, according to the general process of circuit board production, carry out material cutting (cutting, substrate baking) → inner layer (inner layer graphics, inner layer etching) → inner layer AOI → pressing → mechanical drilling → board electrical → outer Layer, and then carry out the drawing process on the circuit board, including graphic copper plating, graphic tin plating, etching the outer layer circuit, half-measurement of impedance, and forming a gold finger guide line when etching the outer layer line, the width of the gold finger guide line and the width of the gold finger The width is the same; after the drawing and electrical process is completed, the outer layer AOI is carried out, that is, the automatic optical inspection is carried out on the outer layer processing quality of the circuit board, and then the anti-soldering and wor...

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PUM

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Abstract

The width of a gold finger lead is enabled to be consistent with that of a gold finger in manufacturing of the gold finger lead. The width of the gold finger lead increases so that the gold finger lead can be directly removed by using a mechanical bevel edge method without using the etching mode, a lot of processes and use of liquid medicine, ink and dry films can be reduced, the manufacturing flow can be shortened, processing quality management and control of each manufacturing process are facilitated, the quality hidden trouble can be reduced, the probability of contamination of the surface of the circuit board can be effectively reduced by reduction of use of the liquid medicine, the ink and the dry films and the product quality of the circuit board can be enhanced.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a gold finger production method without lead wire residue. Background technique [0002] With the continuous advancement of PCB production technology, the requirements for PCB are becoming more and more stringent. For high-end connector boards, the production difficulty is becoming more and more difficult. In addition to the difficulty of stacking and circuit production, the problem of residual gold-plated leads at the finger parts of the connector, It is valued by customers. In order to meet customer requirements, the more common methods are etching after gold-plating the inner lead wire and etching after gold-plating the front-end outer lead wire. Since the gold finger lead is usually thinner and its width is smaller than the width of the gold finger, it is usually The gold fingers are removed by etching. [0003] Inner lead wire process: material cutting (board cutting...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40H05K3/24
CPCH05K3/243H05K3/403H05K2201/09372H05K2203/02
Inventor 李雄杰李波张志洲夏国伟
Owner VICTORY GIANT TECH HUIZHOU CO LTD
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