Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Integrated circuit board machining device

A technology for integrated circuit boards and processing devices, which is used in printed circuits, printed circuit manufacturing, mechanical/acoustic circuit processing, etc., and can solve problems such as dust removal of circuit boards that cannot be cut.

Inactive Publication Date: 2021-05-07
合肥高地创意科技有限公司
View PDF5 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of integrated circuit board processing device, to solve the technical problem in the prior art that the cut circuit board cannot be dedusted

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated circuit board machining device
  • Integrated circuit board machining device
  • Integrated circuit board machining device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0028] The components of the embodiments of the invention generally described and shown in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0029] Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] In the description of the present invention, it should be noted that the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an integrated circuit board machining device, and belongs to the technical field of integrated circuit boards. The integrated circuit board machining device comprises a moving device, a fixing device, a drilling device, a cutting device, a cleaning device, a polishing device and a dust removal device, the moving device is horizontally arranged on the ground, the fixing device is installed at the top of the moving device, the drilling device is installed at the top of the moving device, the cutting device is installed at the top of the moving device, the cleaning device is installed at the top of the moving device, the cleaning device is installed at the top of the cutting device, the polishing device is installed at the top of the moving device, and the dust removal device is installed at the top of the moving device. A second motor moves to drive a connecting column to rotate, the connecting column rotates to drive a polishing disc to rotate, a cut circuit board is polished, the circuit board can be smoother and more attractive, the cut circuit board has a dust removal function through movement of an air pump and a third motor, and the workload of people is greatly relieved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit boards, in particular to an integrated circuit board processing device. Background technique [0002] An integrated circuit is a tiny electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components required in a circuit are interconnected, and they are fabricated on a small or several small semiconductor wafers or dielectric substrates, and then packaged in a tube. , and become a microstructure with required circuit functions; all the components in it have been structurally integrated, making electronic components a big step towards miniaturization, low power consumption, intelligence and high reliability. It is represented by the letter "IC" in the circuit. [0003] For example, the patent with the publication number CN209407563U relates to an integrated circuit board processing device. The present invention discloses a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/00H05K3/0044H05K3/0052H05K3/0055H05K2203/02H05K2203/0228H05K2203/025H05K2203/081
Inventor 陈圆圆
Owner 合肥高地创意科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com