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Method for producing rigid-flex PCB lid

A technology of rigid-flex boards and manufacturing methods, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, mechanical/acoustic circuit processing, etc., and can solve the problems of rigid-flex boards infiltrating liquid medicine and reducing production processes, etc.

Inactive Publication Date: 2017-03-22
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to reduce the production process, reduce production costs, and solve the problem of liquid medicine seeping into the rigid-flex board during production, the present invention provides a method for uncovering the rigid-flex board

Method used

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  • Method for producing rigid-flex PCB lid
  • Method for producing rigid-flex PCB lid
  • Method for producing rigid-flex PCB lid

Examples

Experimental program
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Embodiment

[0036] Such as figure 1 Shown, a kind of manufacturing method of rigid-flex board uncovering, it is characterized in that comprising the following steps:

[0037] Cutting: Cut the flexible base material, cover film, rigid base material, pure rubber and copper foil into sheets respectively;

[0038] The processing of flexible substrates includes the following steps:

[0039] Drilling: After cutting the flexible base material, use a drilling machine to drill through holes on the product;

[0040] Copper plating: A layer of copper is plated in the through hole of the flexible substrate to conduct the upper and lower layers of the flexible substrate;

[0041] Inner layer circuit: After copper plating on the flexible substrate, make the required graphics on the flexible substrate;

[0042] AOI: AOI inspection of flexible substrates;

[0043] Cutting: cutting the cover film into the designed shape;

[0044] Bonding: the cut and shaped cover film is bonded or pressed to the unco...

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Abstract

The invention relates to a method for producing a rigid-flex PCB lid. The method comprises material cutting, flexible material treatment, rigid material treatment, integration, a shadow / copper plating, an outer layer, and punching and lid removing. According to the method for producing a rigid-flex PCB lid, an internal-layer circuit is produced in the rigid-flex PCB, anti-etching ink is not required to be printed after a coverage film is pressed. The flexible board, the rigid board and the pure copper foil can be combined at one time to complete the combination. The pure copper foil cannot be cracked when pressed. The method reduces production process and reduces production cost.

Description

technical field [0001] The invention belongs to the field of manufacturing rigid-flexible circuit boards, and in particular relates to a manufacturing method for uncovering rigid-flexible circuit boards. Background technique [0002] Rigid-flex circuit boards are composed of rigid and flexible substrates selectively laminated together, with metallized voids to form conductive connections. This kind of circuit board contains both rigid board and flexible board technology, which provides an excellent method for interconnecting complex electronic systems, reduces product weight and installation man-hours, and greatly reduces costs. [0003] The production of rigid-flex circuit boards is more difficult, because it requires the cooperation of different substrate materials, which involves dimensional stability, the protection of the window area of ​​the inner flexible board, and the maintenance of good positioning of each layer and the reliability of plated through holes. Conten...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4691H05K2203/02
Inventor 陈亮
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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