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Surface-mounted 5G communication loading sheet and preparation method thereof

A surface-mounted, load chip technology, applied in the direction of electrical components, circuits, waveguide devices, etc., can solve problems such as difficult matching of software and hardware, and achieve the effect of improving radio frequency performance and increasing capacitance

Active Publication Date: 2020-04-10
苏州市新诚氏通讯电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Before and at present, most end customers mostly use foreign power absorbing loads on power amplifier boards, some of which are difficult to match with the software and hardware of domestic 5G communication systems; and currently domestic load chips are still relatively small in terms of miniaturization and high-frequency loads. big lack

Method used

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  • Surface-mounted 5G communication loading sheet and preparation method thereof
  • Surface-mounted 5G communication loading sheet and preparation method thereof
  • Surface-mounted 5G communication loading sheet and preparation method thereof

Examples

Experimental program
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Effect test

specific Embodiment 1

[0084] The preparation method of the load sheet 1 for 5G communication comprises the following steps:

[0085] S1, cleaning the substrate: select an aluminum nitride ceramic substrate with a size of 1.5×3.0×0.385mm, and use more than 95vol.% alcohol to clean the surface of the aluminum nitride ceramic substrate. printing;

[0086] S2, printing the front circuit and grounding wire: adopt the thick film printing process, use the silver paste 1 to carry out screen printing through the screen plate with a tension of 25±1N at 25±2°C, and use nitrogen after the treatment of step S1 The front side of the aluminum ceramic substrate is printed with the front circuit and the ground wire. After the printing is completed, it is left to stand for 15 minutes, pre-baked at 165°C for 20 minutes, and high-temperature sintered at 850°C for 15 minutes to form a cured front circuit and ground wire;

[0087] S3, printed resistors: use screen printing process, select 400 mesh steel screen, use res...

specific Embodiment 2

[0096] The preparation steps of the carrier sheet 2 for 5G communication are as described in the specific example 1. The difference is:

[0097] Silver paste 2 is used in step S2 and step S8, and the process after printing is as follows: after printing, stand for 20 minutes, pre-bake at 170°C for 15 minutes, and high-temperature sintering at 860°C for 17 minutes.

[0098] In step S3, resistive paste 2 is used, and the selected steel screen is 420 mesh, and the process after printing is as follows: after the printing is completed, stand for 10 minutes, pre-bake at 175°C for 15 minutes, and high-temperature sintering at 800°C for 20 minutes.

[0099] In step S5, step S6 and step S7, the process after printing is as follows: after printing, place it for 23 minutes, then pre-bake it at 105°C for 20 minutes until the surface is dry, and then bake it at 210°C for 60 minutes until it is completely dry .

[0100] The size of the 5G communication load sheet 2 prepared above is 1.5×3....

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Abstract

The invention discloses a surface-mounted 5G communication load sheet and a preparation method thereof, and belongs to the technical field of 5G communication aluminum nitride ceramic substrate load sheets. A front circuit, a resistor and a ground wire are printed on the front surface of the aluminum nitride ceramic substrate of the load sheet; a first black protective film, a second black protective film and identification points are printed on the front circuit, the resistor and the grounding wire for three times; the second black protective film has an inward contraction distance relative to the front and rear ends of the first black protective film and is provided with holes to expose the identification points, the back surface of the aluminum nitride ceramic substrate is pasted with aback surface grounding conductor in an SMT pasting mode, and the front and rear ends respectively form end grounding through a double-sided vacuum sputtering process. The load sheet can meet the application requirements of 5G communication and can meet the requirements on flatness, vacuum sputtering consistency and good appearance in the production process on the basis of realizing miniaturization and high-frequency load, the yield of products can be improved, and the automatic production requirements of customers can be met.

Description

technical field [0001] The invention relates to an aluminum nitride ceramic substrate load sheet and a preparation method thereof, in particular to a surface-mounted 5G communication load sheet and a preparation method thereof, belonging to the technical field of 5G communication components. Background technique [0002] The aluminum nitride ceramic substrate load chip is mainly used in the communication base station to absorb the reverse input power of the communication components. If it cannot withstand the required power, the load will be burnt out, resulting in the burnout of the entire device. At present, most communication base stations use high-power ceramic load chips to absorb the reverse input power of communication components, which requires the basic size to be smaller and smaller, while the power to be absorbed is larger and larger, and the characteristics of the product such as the standing wave ratio are also increasing. The smaller the requirements, the bette...

Claims

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Application Information

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IPC IPC(8): H01P1/26H01P11/00
CPCH01P1/26H01P11/00
Inventor 陈建良
Owner 苏州市新诚氏通讯电子股份有限公司
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