Method for manufacturing printed circuit board using base material of high thermal conductivity suitable for being inserted into non-surface component

Abstract

The invention relates to a method for producing a printing circuit board by using a high heat conductivity substrate material suitable for inserting in a non-surface component comprising the following steps: molding a metal plate (1) to get a drilling (2) with enough number and position to insert in the surface component, arranging the metal substrate (1) on an aspiration formwork (3) which has an aspiration hole (4) corresponding to the drilling (2) so that an injection head (5) of a conventional printing machine falls on the metal substrate (1), filling an insulation resin (7) by an injection hole (6), simultaneously pumping the air from the drilling (2) by the aspiration hole (4), and molding the obtained component to get an insertion mould (12) with a diameter less than that of the corresponding initial drilling (2).

Description

technical field [0001] The present invention concerns the introduction of technical improvements based on the use of a metallic material (typically aluminum) as a physical support for a thin layer of metal (typically copper) on one of its faces in order to reinforce the use of highly thermally conductive materials (IMS) Functionality and efficacy of printed circuit boards. [0002] Such materials and printed circuit boards have been developed in response to the evolution of the requirements of the electronics industry related to new applications where operating temperatures are an issue due to the use of high heat-generating power components. [0003] The printed circuit boards obtained by the method of the invention can be advantageously used in a wide variety of applications where heat dissipation is a decisive factor, such as: [0004] — Lighting industry (LED circuit) [0005] - Automotive (ignition system, lighting, etc.) [0006] — solid state repeater [0007] - Dis...

AI Technical Summary

Problems solved by technology

[0011] The structure described above guarantees high heat dissipation, but it introduces a major limitation in the type of electronic components suitable for such printed circuits, of which surface mount devices (SMD) must be used, since the assembly of any kind of component that needs to be inserted necessarily causes Loss of insulation due to the electrical connection between the metal of the dissipative substrate and the conductive trace via the actual assembly (insertion pins), or due to the actual soldering process

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