A multi-channel fiber filament electroplating production line and electroplating process

Abstract

The application provides a multi-channel fiber filament electroplating production line and an electroplating process, which comprises an electroplating device, an unwinding device, a chemical plating sealing device and the like. A plurality of fiber filaments are synchronously unwound in parallel through the unwinding device, firstly pass through the chemical plating sealing device to perform chemical copper plating processing on the surface, and after the chemical copper plating processing is completed, the surface of the fiber filament subjected to the copper plating processing can be continuously subjected to silver plating processing through the electroplating device, so as to improve the conductive effect of the surface of the fiber filament. Meanwhile, in the process of chemical copper plating on the surface of the fiber filament, the double-layer sealing device is in a closed state, and the double-layer ventilation system is started at the same time, so that the pressure inside the chemical plating sealing chamber is less than the pressure outside, and the unwinding device is constantly in a negative pressure state. The application can realize continuous copper plating and silver plating processing on the multi-channel fiber filament, improve the production efficiency, and ensure the safety of the production process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of conductive fiber preparation, and particularly relates to a multi-channel fiber filament electroplating production line and an electroplating process. BACKGROUND

[0002] Plating a conductive metal on the surface of a fiber filament can greatly improve the conductivity of the fiber filament surface to meet the conductive requirements in a specific environment.

[0003] The surface of the fiber filament needs to pass through chemical copper plating and silver electroplating operations in sequence to ensure that the surface conductivity meets the requirements; formaldehyde, as a common reducing agent for chemical copper plating, can precipitate copper ions on the surface of the fiber filament during chemical copper plating to meet the subsequent silver plating operation.

[0004] Since formaldehyde is toxic to the human body, the chemical copper plating operation needs to be effectively isolated from the external environment to prevent formaldehyde from overflowing; however, the sealing device currently used has a simple sealing structure, a small sealing space, and a limited control range of the fresh air system, and in the case of chemical copper plating of multi-channel fiber filaments, the width and height of the chemical copper plating chamber increase, and the single-layer sealing and fresh air system cannot effectively and orderly discharge formaldehyde, which causes the problem of formaldehyde overflow and dead angles in the chemical plating chamber, affecting the continuous copper plating operation of multi-channel fiber filaments. SUMMARY

[0005] To solve the above problems, the present application provides a multi-channel fiber filament electroplating production line and an electroplating process, which can realize continuous copper plating and silver plating processing of multi-channel fiber filaments, improve production efficiency, and ensure the safety of the production process.

[0006] To solve the above problems, the technical scheme adopted by the present application is as follows:

[0007] A multi-channel fiber filament electroplating production line, comprising:

[0008] An electroplating device, which is provided with a plurality of parallel arranged conductive components on the surface, for a plurality of fiber filaments to pass through and realize surface continuous electroplating;

[0009] An unwinding device, comprising a plurality of unwinding rollers with fiber filaments wound thereon, for simultaneously and parallelly unwinding a plurality of fiber filaments;

[0010] A chemical plating sealing device, which is arranged between the electroplating device and the unwinding device, comprises a chemical plating sealing chamber, the first side of the chemical plating sealing chamber is provided with a first chemical plating opening, the second side is provided with a second chemical plating opening, a chemical plating channel for the fiber filaments to pass through is formed between the first chemical plating opening and the second chemical plating opening, and the chemical plating sealing chamber is internally provided with a double-layer sealing device and a double-layer ventilation system located outside the chemical plating channel.

[0011] In the process of electroless copper plating on the surface of the fiber filament, the double-layer sealing device is in a closed state, and the double-layer ventilation system is started to make the pressure inside the electroless plating sealing chamber smaller than the pressure outside.

[0012] Preferably, the electroplating device comprises an electroplating tank, the conductive assembly comprises a first conductive seat on the first side of the electroplating tank and a second conductive seat on the second side, a pressing rod is arranged between the first conductive seat and the second conductive seat, a liquid circulating assembly is arranged on one side of the first conductive seat, and a sub-tank circulating assembly is arranged at the bottom.

[0013] Preferably, the unwinding device comprises an unwinding mounting frame, a tensioning device is arranged at the bottom of the unwinding mounting frame, a first guide assembly is arranged at the top of the two sides of the unwinding mounting frame, a second guide assembly is arranged at the middle of the top of the unwinding mounting frame, the tensioning device comprises a tensioning mounting seat arranged in an inclined surface, tensioning sliding rails are arranged in parallel on the inclined surface of the tensioning mounting seat, a tensioning assembly is arranged on the surface of the tensioning sliding rails, the tensioning assembly comprises a tensioning sliding seat and a tensioning roller, a pressure sensing element is arranged between the tensioning roller and the tensioning sliding seat, and position sensing elements are arranged on the upper and lower sides of the tensioning sliding rails.

[0014] Preferably, the double-layer sealing device comprises a first sealing device and a second sealing device, the second sealing device is sleeved outside the first sealing device, a first sealing chamber is formed between the first sealing device and the electroless plating channel, a second sealing chamber is formed between the outside of the first sealing device and the inside of the second sealing device, and a third sealing chamber is formed between the outside of the second sealing device and the electroless plating sealing chamber.

[0015] Preferably, the double-layer ventilation system comprises a first ventilation device arranged on the two sides of the first sealing chamber and a second ventilation device arranged at the top of the electroless plating sealing chamber, and the first ventilation device and the second ventilation device are respectively connected with ventilation equipment.

[0016] Preferably, a electroless plating tank is arranged at the middle of the first sealing device, a sealing cover plate is movably arranged at the upper end of the electroless plating tank, buffer areas are arranged on the two sides of the electroless plating tank, the first ventilation device is arranged in the buffer areas, the first ventilation device comprises an air supply assembly and a negative pressure air exhaust assembly, the negative pressure air exhaust assembly is arranged obliquely above the inside of the air supply assembly, and the air supply assembly and the negative pressure air exhaust assembly are respectively arranged at the upper and lower sides of the electroless plating channel.

[0017] Preferably, the second sealing device comprises a sealing mounting frame, a viewing window is opened on the sidewall of the sealing mounting frame, a sealing sliding plate is sealingly arranged outside the viewing window, the top of the sealing mounting frame is sealingly connected with the chemical plating sealing chamber, the second ventilation device comprises a first ventilation pipeline in the third sealing chamber and a second ventilation pipeline in the second sealing chamber, and when the viewing window is in the open state, the first ventilation pipeline is in the air supply state.

[0018] Preferably, a touch control device for controlling the ventilation state of the first ventilation pipeline is arranged outside the second sealing device, the touch control device comprises a control valve and a touch control assembly above the control valve, the touch control assembly is fixedly connected with the control rod of the control valve, and the touch control assembly is located on the moving path of the sealing sliding plate, when the sealing sliding plate moves to be staggered with the viewing window, the touch control assembly is pressed to be in the lifting state.

[0019] Preferably, a surface treatment device is further arranged between the unwinding device and the chemical plating sealing device, and a surface treatment groove is formed at the upper end of the surface treatment device, and the surface treatment groove is located on the same horizontal plane as the chemical plating channel.

[0020] A multi-channel fiber filament electroplating process comprises the following steps:

[0021] S1, a plurality of fiber filaments are individually unwound at the front end of the production line, and the plurality of fiber filaments are wound at the rear end of the production line;

[0022] S2, the surface of the fiber filament is pretreated to facilitate subsequent chemical copper deposition;

[0023] S3, the fiber filament after surface pretreatment is passed through a chemical plating sealing device to perform chemical copper deposition by chemical reagents; the chemical copper deposition temperature is 40-60 DEG C, the time is 8 minutes, intermittent ultrasonic oscillation is accompanied, 20 cm ultrasonic oscillation is arranged at intervals of 50 cm;

[0024] S4, the fiber filament after surface chemical copper deposition is passed through an electroplating device, the electroplating metal temperature is 50-75 DEG C, the current density is 0.3-2 A / dm2, the time is 0.5-2 minutes, and a stainless steel conductive column is used for conduction; fiber tows are metallized.

[0025] The beneficial effects of the present application are:

[0026] Through setting electroplating device, unwinding device, chemical plating sealing device and other devices, copper plating and silver plating processing can be carried out on surfaces of multiple fiber filaments in sequence, which greatly improves the processing efficiency of fiber filaments in unit time, and meets the production needs; meanwhile, through setting double sealing devices and double ventilation systems in the chemical plating sealing device, the chemical plating channel can be effectively separated from the environment of the production workshop, effectively avoiding the overflow of formaldehyde gas into the production workshop, protecting the health of other workers in the production workshop, and realizing the continuous copper plating and silver plating industrial production of multiple channels of fiber filaments. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a perspective structural schematic diagram of the present application;

[0028] Figure 2 It is a front view structural schematic diagram of the present application;

[0029] Figure 3 It is an internal structure schematic diagram of the chemical plating sealing device of the present application;

[0030] Figure 4 It is a front view structural schematic diagram of the present application; Figure 3

[0031] It is an A-A line sectional view structural schematic diagram of the present application; Figure 5 Figure 4 It is an enlarged structural schematic diagram of B of the present application;

[0032] Figure 6 Figure 4 It is a first sealing device perspective structural schematic diagram of the present application;

[0033] Figure 7 It is a top view structural schematic diagram of the present application;

[0034] Figure 8 It is a top view structural schematic diagram of the present application; Figure 7

[0035] It is a perspective structural schematic diagram of the electroplating device of the present application; Figure 9

[0036] It is a top view structural schematic diagram of the present application; Figure 10 Figure 9 It is a perspective structural schematic diagram of the unwinding device of the present application.

[0037] Figure 11

[0038] ​​​​In the figure: 100, unwinding device; 110, unwinding mounting frame; 120, tensioning device; 121, tensioning mounting seat; 122, tensioning slide rail; 123, tensioning assembly; 130, second guide assembly; 140, first guide assembly; 200, surface treatment device; 300, chemical plating sealing device; 310, chemical plating sealing chamber; 311, first chemical plating opening; 312, second chemical plating opening; 320, second sealing device; 321, sealing mounting frame; 322, observation window; 323, sealing slide plate; 330, first sealing device; 331, chemical plating tank; 332, buffer area; 333, sealing cover plate; 334, pumping pipeline; 340, second ventilation device; 341, first ventilation pipeline; 342, second ventilation pipeline; 350, touch control device; 351, control valve; 3511, control rod; 3512, control valve core; 3513, control valve body; 352, touch control assembly; 3521, touch control panel; 3522, touch control slope surface; 3523, locking block; 400, electroplating device; 410, electroplating tank; 420, conductive assembly; 420, conductive assembly; 421, first conductive seat; 422, second conductive seat; 430, pressing rod; 440, liquid circulating assembly; 450, primary-secondary tank circulating assembly; 500, fiber filament; 600, first ventilation device; 610, air supply assembly; 620, negative pressure exhaust assembly. DETAILED DESCRIPTION

[0039] The application is further described below in conjunction with the drawings and examples.

[0040] Referring to the drawings Figure 1 - the drawings Figure 11 A multi-channel fiber filament electroplating production line, comprising an electroplating device 400, an unwinding device 100, a chemical plating sealing device 300, and the like, a plurality of fiber filaments are synchronously unwound in parallel through the unwinding device 100, first pass through the chemical plating sealing device 300 to perform chemical copper plating processing on the surface, after the chemical copper plating processing is completed, the fiber filament surface processed by the copper plating processing can be continuously plated with silver through the electroplating device 400 to improve the conductivity of the fiber filament surface; at the same time, in the process of chemical copper plating on the fiber filament surface, the double-layer sealing device is in a closed state, and the double-layer ventilation system is started at the same time, so that the inside of the chemical plating sealing chamber 310 has a lower pressure than the outside, so that the unwinding device 100 is constantly in a negative pressure state, avoiding the overflow of formaldehyde generated in the chemical copper plating process, and ensuring the safety of the staff in the workshop during the inspection.

[0041] The electroplating device 400 is provided with a plurality of parallel arranged conductive assemblies 420 for the plurality of fiber filaments to pass through and realize surface continuous electroplating. The silver plating layer is plated on the fiber filament surface which has been plated with copper metal by electroplating to improve the conductive effect of the fiber filament surface. The unwinding device 100 includes a plurality of unwinding rollers with fiber filaments wound on the surface for simultaneously and parallel unwinding of the plurality of fiber filaments. The multi-channel unwinding mode is adopted by parallel arrangement, and different control motors are used for separate unwinding to ensure that the unwinding rate of the fiber filament is consistent with the electroplating rate, the tension state is ensured, and the continuous plating and electroplating are ensured to proceed normally.

[0042] The chemical plating sealing device 300 is arranged between the electroplating device 400 and the unwinding device 100, and includes a chemical plating sealing chamber 310. The first side of the chemical plating sealing chamber 310 is provided with a first chemical plating opening 311, and the second side is provided with a second chemical plating opening 312. The first chemical plating opening 311 and the second chemical plating opening 312 form a chemical plating channel for the fiber filaments to pass through and process the surface of the fiber filaments by continuous copper plating. Formaldehyde is an excellent reducing agent for chemical copper plating, which can make the copper ions in the chemical plating agent crystallize on the surface of the fiber filament to form a dense copper plating layer. In order to avoid excessive formaldehyde gas overflow, a double-layer sealing device and a double-layer ventilation system are arranged inside the chemical plating sealing chamber 310 outside the chemical plating channel. The double-layer sealing device can form multiple sealing chambers outside the chemical plating channel to effectively isolate the chemical plating channel from the external environment. At the same time, the double-layer ventilation system is arranged to timely remove the overflow formaldehyde during the chemical copper plating process, avoid the overflow of formaldehyde out of the chemical plating sealing device 300, and ensure the safety of the external production workshop environment.

[0043] It should be noted that during the process of chemical copper plating on the surface of the fiber filament, the double-layer sealing device is in a closed state, and the double-layer ventilation system is started to make the inside pressure of the chemical plating sealing chamber 310 less than the outside pressure, which can effectively prevent the overflow of formaldehyde gas from the first chemical plating opening 311 and the second chemical plating opening 312 on both sides, and ensure the safety of the surrounding environment. At the same time, a bearing panel is arranged in the chemical plating sealing chamber 310, a sealing door is installed outside, and a sealing rubber strip is arranged at the connection to effectively prevent the overflow of formaldehyde gas.

[0044] Specific reference is made to the accompanying drawings Figure 9 , the accompanying drawings Figure 10; Wherein the electroplating device 400 comprises an electroplating tank 410, the conductive assembly 420 comprises a first conductive seat 421 located at the first side of the electroplating tank 410 and a second conductive seat 422 located at the second side, the first conductive seat 421 and the second conductive seat 422 circumscribe the conductive device, the lower pressing rod 430 is arranged between the first conductive seat 421 and the second conductive seat 422, the plurality of fiber filaments can be pressed in the middle position through the lower pressing rod 430, the middle position can be soaked in the reagent containing silver ions, the two ends are conductive through the metal plating layer, so as to ensure that the silver ions can continuously deposit on the surface of the fiber filaments; The first conductive seat 421 is provided with a liquid circulating assembly 440 on one side, and a sub-mother tank circulating assembly 450 is arranged at the bottom. The liquid circulating assembly 440 can form a directional liquid flow circulation around the first conductive seat 421, and can carry away the silver metal elements deposited around the first conductive seat 421 in a directional manner, so as to avoid accumulation on the surface. The sub-mother tank circulating assembly 450 contains a circulating pump inside, which can pump the silver plating reagent to the sub-tank circulating pump at the upper end of the electroplating tank 410 to maintain the metal ion concentration inside, ensure the uniformity of the silver plating layer, and meet the needs of high-quality silver plating processing.

[0045] Specifically refer to the accompanying drawings Figure 11 ; Wherein, the unwinding device 100 comprises an unwinding mounting frame 110, the unwinding mounting frame 110 is provided with a tensioning device 120 at the bottom, first guide assemblies 140 are arranged at the top of both sides, a second guide assembly 130 is arranged at the middle position of the top, the fiber filaments can be guided from both sides through the second guide assembly 130 and the first guide assemblies 140, and the fiber filaments can be individually tensioned through the tensioning device 120, so as to ensure the stability of the tensioning state of each fiber filament and the stability of the subsequent chemical copper plating and electroplated silver state; Wherein, the tensioning device 120 comprises a tensioning mounting seat 121 arranged in an inclined surface, the tensioning mounting seat 121 is arranged with tensioning sliding rails 122 in parallel on the inclined surface, the tensioning sliding rails 122 are installed with tensioning assemblies 123 on the surface, the tensioning assembly 123 comprises a tensioning sliding seat and a tensioning roller, a pressure sensing element is arranged between the tensioning roller and the tensioning sliding seat, position sensing elements are arranged on the upper and lower sides of the tensioning sliding rails 122, the fiber filaments are sequentially wound through the first guide assemblies 140, the tensioning device 120 and the second guide assembly 130, and finally guided out from the other side; The tensioning assembly 123 in the tensioning device 120 can tension the fiber filaments under the action of gravity, so as to ensure the individual tensioning state thereof, the pressure state of the fiber filaments can be detected through the pressure sensing element, so as to control the unwinding speed of the front-end unwinding motor and adjust the unwinding speed of the fiber filaments; At the same time, the position of the fiber filaments can also be judged through the position sensing elements on the upper and lower sides, when the position is too low, the unwinding speed is controlled to decrease, the tensioning assembly 123 can be lifted, when the position is too high, the unwinding speed is controlled to increase, so that the tensioning assembly 123 can be maintained on the track of the tensioning sliding rails 122.

[0046] The pressure sensing element and the position sensing element are electrically connected with the motor, and through cooperation of the two, the tensioning assembly 123 can be ensured to be located on the correct track and continuously tensioned, and in particular, the pressure sensing element can limit the moving speed of the tensioning assembly 123 to avoid sudden pressure increase and avoid affecting the surface of the fiber filament.

[0047] With reference to the accompanying drawings Figure 3 -Appendix Figure 8 ; wherein the double-layer sealing device includes a first sealing device 330 and a second sealing device 320, the second sealing device 320 is sleeved outside the first sealing device 330, a first sealing chamber is formed between the first sealing device 330 and the chemical plating channel, a second sealing chamber is formed between the outside of the first sealing device 330 and the inside of the second sealing device 320, and a third sealing chamber is formed between the outside of the second sealing device 320 and the chemical plating sealing chamber 310. Through the three-layer sealing chamber, the overflow of formaldehyde gas generated in the chemical copper plating process can be effectively avoided to ensure the safety of the external production environment. At the same time, the double-layer ventilation system includes a first ventilation device 600 arranged on both sides of the first sealing chamber and a second ventilation device 340 arranged at the top position of the chemical plating sealing chamber 310. The first ventilation device 600 and the second ventilation device 340 are respectively connected with ventilation equipment. Through the first ventilation device 600, most of the formaldehyde gas on both sides of the first sealing chamber can be extracted and discharged, avoiding the overflow of formaldehyde gas from the source end, especially avoiding the overflow from both sides of the first chemical plating opening 311 and the second chemical plating opening 312 to the external processing environment. Through the second ventilation device 340 arranged at the top, the residual formaldehyde gas in the second sealing chamber and the third sealing chamber can be discharged to avoid the retention of formaldehyde gas therein, ensure the safety of the internal environment of the chemical plating sealing device 300, and enable workers to enter the inside of the chemical plating sealing device 300 to repair the chemical copper plating process.

[0048] With reference to the accompanying drawings Figure 7 , Appendix Figure 8A plating tank 331 is arranged in the middle of the first sealing device 330, and a sealing cover plate 333 is movably arranged at the upper end of the plating tank 331. Buffer areas 332 are arranged on both sides of the plating tank 331, and the first ventilation device 600 is arranged in the buffer areas 332. The first ventilation device 600 includes a blowing assembly 610 and a negative pressure exhaust assembly 620, and the negative pressure exhaust assembly 620 is located obliquely above the inside of the blowing assembly 610. Both the blowing assembly 610 and the negative pressure exhaust assembly 620 are located on the upper and lower sides of the plating channel. The blowing assembly 610 blows gas towards the negative pressure exhaust assembly 620, thereby forming a gas barrier on both sides to prevent the overflow of formaldehyde gas from both sides. The gas flow formed between the blowing assembly 610 and the sealing cover plate 333 is perpendicular to the gas flow formed between the negative pressure exhaust assembly 620 and the sealing cover plate 333. The gas flow velocity on both sides is increased, the formaldehyde gas generated in the middle position can be exhausted, and the collection efficiency of the formaldehyde gas is further improved.

[0049] A pumping pipeline 334 is arranged in the plating tank 331, which can pump the raw materials required for electroless copper plating. The two sides of the pumping pipeline 334 are open, and the pumping pipeline 334 extends along the length direction of the plating tank 331 and is arranged in parallel. The pumping pipeline 334 is suitable for electroless copper plating on the surface of multiple channel fiber filaments. At the same time, the pumped raw materials can disturb the copper powder in the plating tank 331 to maintain the copper ion concentration of the reagent in the plating tank 331 within the rated range, and ensure the uniformity of electroless copper plating on the surface of multiple fiber filaments.

[0050] Specifically refer to the accompanying drawings Figure 3 - the accompanying drawings Figure 6 The second sealing device 320 includes a sealing mounting frame 321, and an observation window 322 is formed in the side wall of the sealing mounting frame 321. A sealing sliding plate 323 is sealingly and slidably arranged outside the observation window 322. The sealing mounting frame 321 is sealingly connected to the plating sealing chamber 310. The second ventilation device 340 includes a first ventilation pipeline 341 located in the third sealing chamber and a second ventilation pipeline 342 located in the second sealing chamber. When the observation window 322 is in an open state, the first ventilation pipeline 341 is in a blowing state. The observation window 322 can facilitate the adjustment and operation of the internal staff. At the same time, the first ventilation pipeline 341 is connected to a negative pressure exhaust device and a blowing device. The connection state of the two is switched according to the open state of the observation window 322. When the observation window 322 is opened, the first ventilation pipeline 341 blows out gas, which can pass through the observation window 322 into the second sealing chamber and is finally exhausted by the second ventilation pipeline 342 at the top. The circulation of the gas is realized, and the overflow of the formaldehyde gas after the observation window 322 is opened is avoided. The staff in the third sealing chamber can be effectively protected, and the protection effect can be further improved by blowing from the top.

[0051] A touch device 350 is arranged outside the second sealing device 320 to control the ventilation state of the first ventilation duct 341. The touch device 350 comprises a control valve 351 and a touch assembly 352 arranged above the control valve 351. The control valve 351 comprises a control rod 3511, a control valve core 3512 and a control valve body 3513. The touch assembly 352 comprises a touch panel 3521, a touch slope 3522 and a locking block 3523. The touch assembly 352 is fixedly connected with the control rod 3511 of the control valve 351, and the touch assembly 352 is arranged on the moving path of the sealing slide plate 323. When the sealing slide plate 323 is moved to be staggered with the observation window 322, the touch assembly 352 is pressed to be in a lifting state. Specifically, in the process that the sealing slide plate 323 moves outward, the locking block 3523 can be abutted and moved along the arc surface of the locking block 3523 to lift the touch panel 3521, so as to adjust the state in the control valve 351 to switch the negative pressure exhaust and the air supply line in the first ventilation duct 341. Meanwhile, the locking block 3523 on the outside can cooperate with the sealing slide plate 323 to complete the locking of the sealing slide plate 323, so that the sealing slide plate 323 is in a stable state after being opened, thereby ensuring the stability of the overall structure. Through the above locking control, the stability of the overall structure can be further ensured, the control structure is simple, the staff can automatically adjust according to the maintenance work, the maintenance requirements are met, and the health of the staff is protected.

[0052] Specifically refer to the accompanying drawings Figure 1 , the accompanying drawings Figure 2 ; the device further comprises a surface treatment device 200 arranged between the unwinding device 100 and the plating sealing device 300. An upper end of the surface treatment device 200 forms a surface treatment tank, and the surface treatment tank is arranged on the same horizontal plane as the plating channel. The surface treatment device 200 can be used to treat the surface of the fiber filament, and sequentially perform oil removal, water washing, phase conversion, surface sensitization, glue bonding and other operations, so as to ensure that the surface properties meet the requirements of subsequent copper plating and silver plating.

[0053] A multi-channel fiber filament electroplating process comprises the following steps:

[0054] S1, a plurality of fiber filaments are individually unwound through 100 at the front end of the production line, and the plurality of fiber filaments are wound at the rear end of the production line;

[0055] S2, the surface of the fiber filament is pretreated to facilitate subsequent chemical copper deposition; wherein the surface pretreatment comprises the following steps:

[0056] (1) alkaline oil removal: the fiber is passed through a sodium hydroxide solution with a mass fraction of 3-10% and ultrasonic oscillation, wherein the time is 2-5 minutes and the temperature is 40-60°C;

[0057] (2) roughening: 60% ~ 80% of concentrated sulfuric acid solution containing 20 ~ 40g / L mass fraction of expanding agent, wherein the temperature is room temperature, and the time is 20 ~ 40 seconds; increase the adhesion of subsequent metal plating layer;

[0058] (3) surface conditioning: through the adsorption of reducing substances on the surface of the filament by the surface conditioner solution, so as to facilitate the adsorption of colloidal palladium in the subsequent process. The temperature is 40 ~ 60℃, and the time is 2 ~ 5 minutes;

[0059] (4) pre-activation: 10 ~ 30mL / L hydrochloric acid, temperature room temperature, time 0.5 ~ 1 minute;

[0060] (5) pre-palladium: 30 ~ 150ppm colloidal palladium solution, temperature 25 ~ 40℃, time 4 ~ 10 minutes, uniform adhesion of colloidal palladium;

[0061] (6) gel breaking: 10% ~ 15% mass fraction of sulfuric acid solution, temperature 30 ~ 50℃, time 0.5 ~ 2 minutes; beneficial to subsequent chemical copper deposition.

[0062] S3, the fiber filament after surface pretreatment is passed through the chemical plating sealing device 300, and the chemical copper deposition is carried out by chemical reagent; the chemical copper deposition temperature is 40 ~ 60℃, the time is 8 minutes, accompanied by intermittent ultrasonic oscillation, 20cm ultrasonic oscillation is arranged at an interval of 50cm;

[0063] S4, the fiber filament after surface chemical copper deposition is passed through the electroplating device 400, the electroplating metal temperature is 50 ~ 75℃, the current density is 0.3 ~ 2A / dm2, the time is 0.5 ~ 2 minutes, and the stainless steel conductive column is used for conduction; realize the metallization of the fiber filament.

[0064] The above only describes the preferred embodiments of the present application, and does not limit the present application, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A multi-channel fiber filament electroplating production line, characterized in that, include: The electroplating apparatus (400) has a number of parallel conductive components (420) on its surface, through which a number of fiber filaments (500) pass and achieve continuous electroplating of the surface; The unwinding device (100) includes several unwinding rollers with fiber filaments (500) wound on their surfaces, for simultaneously unwinding several fiber filaments (500) in parallel. A chemical plating sealing device (300) is disposed between an electroplating device (400) and an unwinding device (100), including a chemical plating sealing chamber (310). The chemical plating sealing chamber (310) has a first chemical plating opening (311) on a first side and a second chemical plating opening (312) on a second side. A chemical plating channel for fiber filaments (500) to pass through is formed between the first chemical plating opening (311) and the second chemical plating opening (312). The chemical plating sealing chamber (310) is provided with a double-layer sealing device and a double-layer ventilation system located outside the chemical plating channel. During the process of chemically plating copper on the surface of the fiber filament (500), the double-layer sealing device is kept in a closed state, and the double-layer ventilation system is activated at the same time to make the pressure inside the chemical plating sealing chamber (310) less than the pressure outside. The double-layer sealing device includes a first sealing device (330) and a second sealing device (320). The second sealing device (320) is sleeved on the outside of the first sealing device (330). A first sealing chamber is formed between the first sealing device (330) and the electroplating channel. A second sealing chamber is formed between the outside of the first sealing device (330) and the inside of the second sealing device (320). A third sealing chamber is formed between the outside of the second sealing device (320) and the electroplating sealing chamber (310). The double-layer ventilation system includes a first ventilation device (600) disposed on both sides of the first sealed chamber and a second ventilation device (340) disposed at the top of the electroplating sealed chamber (310). The first ventilation device (600) and the second ventilation device (340) are respectively connected to external ventilation equipment. The first sealing device (330) is provided with a plating tank (331) in the middle position. A sealing cover plate (333) is movably provided at the upper end of the plating tank (331). Buffer areas (332) are provided on both sides of the plating tank (331). The first ventilation device (600) is provided in the buffer area (332). The first ventilation device (600) includes an air supply component (610) and a negative pressure exhaust component (620). The negative pressure exhaust component (620) is located inside the air supply component (610) at an angle above it, and the two are located on the upper and lower sides of the plating channel, respectively. The second sealing device (320) includes a sealing mounting frame (321), an observation window (322) is opened on the side wall of the sealing mounting frame (321), a sealing slide plate (323) is provided on the outside of the observation window (322), and the top of the sealing mounting frame (321) is sealed to the electroplating sealing chamber (310). The second ventilation device (340) includes a first ventilation duct (341) located in the third sealing chamber and a second ventilation duct (342) located in the second sealing chamber. When the observation window (322) is in the open state, the first ventilation duct (341) is connected to the air supply duct and is in the air supply state. Meanwhile, the first ventilation duct is connected to a negative pressure exhaust device and an air supply duct. The connection status of the two is switched according to the opening status of the observation window. When the observation window is open, the first ventilation duct blows out gas, which passes through the observation window and enters the second sealed chamber, and is finally discharged by the negative pressure of the second ventilation duct at the top.

2. The multi-channel fiber filament electroplating production line according to claim 1, characterized in that, The electroplating apparatus (400) includes an electroplating tank (410), and the conductive component (420) includes a first conductive seat (421) located on the first side of the electroplating tank (410) and a second conductive seat (422) located on the second side. A pressure bar (430) is provided between the first conductive seat (421) and the second conductive seat (422). A liquid circulation component (440) is provided on one side of the first conductive seat (421), and a mother-daughter tank circulation component (450) is provided at the bottom.

3. The multi-channel fiber filament electroplating production line according to claim 1, characterized in that, The unwinding device (100) includes an unwinding mounting frame (110), a tensioning device (120) is provided at the bottom of the unwinding mounting frame (110), a first guide assembly (140) is provided on both sides of the top, and a second guide assembly (130) is provided at the middle of the top. The tensioning device (120) includes a tensioning mounting seat (121) with its surface inclined. Tensioning slide rails (122) are arranged side by side on the inclined surface of the tensioning mounting seat (121). A tensioning assembly (123) is installed on the surface of the tensioning slide rail (122). The tensioning assembly (123) includes a tensioning sliding seat and a tensioning roller. A pressure sensing element is provided between the tensioning roller and the tensioning sliding seat. Position sensing elements are provided on the upper and lower sides of the tensioning slide rail (122).

4. The multi-channel fiber filament electroplating production line according to claim 1, characterized in that, The second sealing device (320) is provided with a touch device (350) for controlling the ventilation state of the first ventilation duct (341) on the outside. The touch device (350) includes a control valve (351) and a touch component (352) located above the control valve (351). The touch component (352) is fixedly connected to the control rod (3511) of the control valve (351), and the touch component (352) is located on the moving path of the sealing slide plate (323). When the sealing slide plate (323) moves to a position that is offset from the observation window (322), the touch component (352) is squeezed into a raised state.

5. The multi-channel fiber filament electroplating production line according to claim 1, characterized in that, It also includes a surface treatment device (200) located between the unwinding device (100) and the electroplating sealing device (300), wherein a surface treatment groove is formed at the upper end of the surface treatment device (200), and the surface treatment groove and the electroplating channel are located on the same horizontal plane.

6. A multi-channel fiber filament electroplating process, characterized in that, The multi-channel fiber filament electroplating production line according to any one of claims 1-5 includes the following steps: S1. At the front end of the production line, multiple fiber filaments are individually unwound by the unwinding device (100), and at the rear end of the production line, the multiple fiber filaments are wound up. S2. Pre-treat the surface of the fiber filaments to facilitate subsequent chemical copper plating; S3. Pass the pre-treated fiber filaments through the electroplating sealing device (300) and perform electroplating copper plating with chemical reagents; the electroplating copper plating temperature is 40 ~ 60℃, the time is 8 minutes, accompanied by intermittent ultrasonic oscillation, with 20cm ultrasonic oscillation set at 50cm intervals. S4. Pass the surface-coated copper fiber filaments through the electroplating apparatus (400), with an electroplating metal temperature of 50 ~ 75℃ and a current density of 0.3 ~ 2A / dm³. 2 The time is 0.5 to 2 minutes, and the stainless steel conductive column is used for conduction; to achieve metallization of fiber bundles.

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