Test apparatus for semiconductor packages

Abstract

The present invention relates to a testing device for a semiconductor package, which eliminates a second detecting circuit substrate provided in an upper socket assembly for forming a conventional vacuum line, and instead, provides a vacuum guide device composed of two parts between the upper socket and the upper package, a conductive guide member formed of a non-elastic insulating material in a conductive area portion to prevent electrical short-circuit, and a peripheral guide member formed of a metal material having rigidity in a peripheral area portion to prevent deformation of the vacuum line, whereby the length of a signal transmission path is greatly reduced to enable high-speed signal transmission, and at the same time, a stable vacuum line in the upper socket assembly is ensured, so that vacuum pressure from a vacuum generating device is smoothly applied to a vacuum pickup.

Description

Technical Field

[0001] This invention relates to a testing apparatus for semiconductor packages, and more specifically, to a testing apparatus for detecting whether a stacked package (POP) semiconductor package, which is composed of a lower package and a upper package stacked on top of each other, is functioning properly. Background Technology

[0002] Typically, semiconductor packages are formed by high-density integration of microcircuits, and the manufacturing process involves testing each circuit to ensure its proper functioning. The testing process is used to select qualified and unqualified products by verifying that the semiconductor package is operating correctly.

[0003] In semiconductor packaging testing, a test apparatus is used to electrically connect the terminals of the semiconductor package to a tester that applies test signals. The test apparatus has various structures depending on the type of semiconductor package being tested.

[0004] Recently, with the increasing use of stacked package (POP) semiconductor packages that minimize component size and enable rapid signal transmission, the demand for test equipment for testing such semiconductor packages has also continued to grow.

[0005] Stacked packaging is formed by stacking other packages with different functions on top of one package (a stacked form).

[0006] Stacked packaging can minimize the length of connection wiring, thus minimizing losses such as signal delay and impedance mismatch that occur when arranged in two dimensions. By utilizing the vertical direction in space, it maximizes the mounting area per unit area, which has the advantage of realizing high-capacity, miniaturized components.

[0007] Figure 1 This diagram illustrates an existing test setup for testing semiconductor packages with stacked package configurations. Figure 2 This diagram illustrates the operation of an existing testing setup.

[0008] like Figure 1 and Figure 2 As shown, the existing test device 1 is composed of a thruster 50 that receives power from the drive unit 90 (DP) and can move up and down, having a vacuum hole 51, an upper package 40 installed in the chamber 52 of the thruster 50, a second detection circuit board 20 on which the upper package 40 is attached, an upper socket 70 attached to the lower part of the second detection circuit board 20, a vacuum pickup 80 disposed in the lower part of the upper socket 70 to vacuum adsorb the lower package 10, and a lower socket 60 placed in the first detection circuit board (tester) 30 (the first detection circuit board may also be referred to as the tester in this specification).

[0009] The upper socket assembly TSA is configured to include: a pusher 50, an upper package 40 attached to the pusher 50, a second detection circuit board 20 on which the upper package 40 is mounted, an upper socket 70 connected to the lower part of the second detection circuit board 20, and a vacuum pickup 80 disposed at the lower part of the upper socket 70.

[0010] The upper package 40 has a terminal 41 at the lower part and is constructed as a so-called Golden Device. The Golden Device is constructed as a package that has been pre-selected as a qualified product and can be used to detect whether the lower package 10 is operating normally. The lower package 10 can be a device under test with a lower terminal 11 and an upper terminal 12.

[0011] The upper socket 70 and the lower socket 60 each have a second conductive part 71 and a first conductive part 61, respectively, which are formed by multiple conductive particles arranged along the thickness direction within an elastic insulating material.

[0012] The lower socket 60 is mounted on the first detection circuit board (tester) 30. A lower package 10 is mounted on top of the lower socket 60, and an upper socket 70 is connected to the upper part of the lower package 10. The detection current applied from the tester 30 passes through the lower package 10 and is applied to the upper package 40 via the second detection circuit board 20 for electrical testing. Figure 1 , Figure 2 The reference numeral 65 in the attached diagram indicates the guide shell.

[0013] In the existing test apparatus 1, since the vacuum pressure generated from the vacuum generator VG is transmitted to the vacuum pickup 80, the pusher 50 should pressurize the lower socket 60 while the lower encapsulation 10 is adsorbed. Therefore, the internal space of the pusher 50 needs to maintain a vacuum, and a vacuum pipeline VL needs to be formed between the vacuum generator VG and the vacuum pickup 80.

[0014] However, when the upper package 40 and the upper socket 70 are directly connected, in order to form an electrical path between the lower terminal 41 of the upper package and the second conductive portion 71 of the upper socket, the lower terminal 41 of the upper package compresses the second conductive portion 71 of the upper socket while forming a connection. Therefore, a vacuum channel VL is not sufficiently formed between the upper package 40 and the upper socket 70.

[0015] Therefore, in the existing test apparatus 1, in order to form a vacuum channel between the upper package 40 and the upper socket 70, a second detection circuit board 20 is arranged between the upper package 40 and the upper socket 70.

[0016] Since the lower terminal 41 of the upper package 40 is soldered to the terminal (not shown) of the second detection circuit board 20, the upper package 40 is mounted on the second detection circuit board 20, and a space of the height of the lower terminal 41 of the upper package is formed between the lower terminal 41 of the upper package and the second detection circuit board 20. A vacuum pipeline is formed through the space to transmit the vacuum pressure generated by the vacuum generator VG to the vacuum pickup 80.

[0017] Figure 2 The diagram illustrates a vacuum line VL that transmits the vacuum pressure generated from the vacuum generator VG through the space between the upper package 40 and the second detection circuit board 20 to the vacuum pickup 80.

[0018] The vacuum pressure generated by the vacuum generator VG flows in through the hole 21 formed in the center of the upper socket 70 and the second detection circuit board 20, travels through the space between the upper package 40 and the second detection circuit board 20, and then travels through the space between the chamber 52 and the upper package 40 and the vacuum hole 51 to the vacuum generator VG side located outside the thruster 50.

[0019] However, in the existing test apparatus 1, to ensure the vacuum line VL, a second detection circuit board 20 with the upper package 40 mounted on it is required. This necessitates the fabrication of the second detection circuit board 20 and the process of stacking it onto the upper package 40, resulting in significant manufacturing time. Furthermore, the addition of the second detection circuit board 20 increases the overall load, leading to defects such as solder ball terminal cracking. The need for additional testing of the package's solder ball terminals due to these defects further complicates the overall process and increases costs.

[0020] Furthermore, the arrangement of the second detection circuit board 20 increases the length of the signal path between the upper package 40 and the lower package 10, resulting in signal delay and signal distortion, thus making it impossible to perform precise detection of high-speed semiconductor packages.

[0021] like Figure 3 As shown, in order to solve this problem, recently, instead of the second detection circuit board, it has been considered to provide a non-elastic insulating pad 120 between the upper package 40 and the upper socket 70 to ensure the vacuum line VL. Figure 3 (a) shows the top of the inelastic insulating pad, (b) shows the bottom of the inelastic insulating pad, and (c) schematically shows the inelastic insulating pad bonded to the upper socket with adhesive.

[0022] The inelastic insulating pad 120 is formed in the shape of a pad having an upper surface facing the upper package 40 and a lower surface facing the upper socket 70. A plurality of through holes 121 are formed at corresponding positions of the lower terminal 41 of the upper package and the second conductive part 71. The lower terminal 41 of the upper package and the second conductive part 71 of the upper socket 70 are connected in the through holes 121. A vacuum channel 122 is formed on the lower surface of the inelastic insulating pad 120 facing the upper socket 70, thereby ensuring a vacuum passage VL between the upper package 40 and the upper socket 70. The vacuum channel 122 is formed in the shape of an elongated groove or a cross shape of elongated grooves.

[0023] By using a non-elastic insulating pad 120 instead of the second test circuit board 20, the length of the signal transmission path between the upper and lower packages is significantly reduced. This prevents signal delay and distortion during high-speed signal transmission, enabling precise testing of high-speed semiconductor packages. Therefore, it effectively performs electrical characteristic testing while significantly reducing testing costs and time.

[0024] However, the technique of using an inelastic insulating gasket formed from a single component to ensure vacuum lines has the following problems.

[0025] When inelastic insulating gaskets are formed using polyimide film, FR4, or engineering plastics as insulating materials, in order to form a vacuum channel, the depth of the groove processing can cause deformation of the inelastic insulating gasket between the upper package and the upper socket due to insufficient support area. This deformation leads to the erosion of the vacuum channel, making it impossible for the vacuum pressure used to pick up the lower package to be fully transmitted to the vacuum pickup, resulting in pickup errors when the vacuum pickup picks up the lower package.

[0026] Therefore, in order to prevent deformation of the vacuum tubing, a non-elastic insulating gasket is formed from metal. In order to prevent short circuits between the terminals of the upper package and the metal material of the non-elastic insulating gasket, it is advisable to perform an insulating plating treatment at least in the through-hole area. However, it is often impossible to perform the insulating plating treatment well to the depth of the through-hole. Moreover, due to the burrs generated during the processing of the through-hole, the insulating plating is damaged when it comes into repeated contact with the lower terminals of the upper package, which leads to the problem of electrical short circuits between the lower terminals of the upper package and the metal material.

[0027] Moreover, as in Figure 3As shown in (c), in order to prevent vacuum leakage, the upper socket and the inelastic insulating gasket are bonded together by an adhesive such as double-sided tape to achieve a vacuum seal. However, the second conductive part of the upper socket is inserted into the through hole of the inelastic insulating gasket according to the thickness of the adhesive, resulting in a part that cannot be supported. In this part, the second conductive part is prone to deformation, which causes damage to the second conductive part and leads to poor connection with the lower terminal of the upper package.

[0028] Existing technical documents

[0029] Patent documents

[0030] (Patent Document 1) Korean Patent Publication No. 2015-0106848 (Publication Date: September 22, 2015)

[0031] (Patent Document 2) Korean Patent Publication No. 10-1555965 (Grant Date: September 25, 2015) Summary of the Invention

[0032] Technical problems to be solved

[0033] As an invention for solving the above-mentioned problems, the object of the present invention is to provide a test apparatus for semiconductor packaging, so that even if the second test circuit board is removed in the semiconductor test apparatus of the stacked package method, a stable vacuum pipeline can be ensured by a vacuum guide device formed by two parts.

[0034] Problem Solving Methods

[0035] To achieve the above objectives, a semiconductor package testing apparatus of the present invention may include: a lower socket, which is mounted on a tester providing test signals and has a plurality of first conductive portions connected to a lower terminal of a lower package for electrically connecting the lower package to the tester; a pusher, which is coupled to an upper package and has a vacuum port for transmitting vacuum pressure from a vacuum generator, the pusher receiving power from a drive unit to move in a manner that allows it to approach or move away from the lower socket; and an upper socket, which is coupled to the pusher and has an insulating pad formed of a non-elastic insulating material and a plurality of second conductive portions, comprising a conductive region portion surrounding the plurality of second conductive portions and a peripheral region portion surrounding the conductive region portion, the plurality of second conductive portions being supported on the insulating pad and having one end connected to the upper package. The lower terminal is connected to the upper terminal of the lower package, and the other end is connected to the upper terminal of the lower package; a vacuum pickup is attached to the lower part of the upper socket and transmits vacuum pressure through an insulating pad hole formed in the center of the upper socket; and a vacuum guide device is disposed between the upper package and the upper socket. The vacuum guide device is formed as a conductive guide member and a peripheral guide member. The conductive guide member has a region corresponding to the conductive area. Through holes are formed at each corresponding position of the lower terminal of the upper package and the second conductive part, and it is formed with a non-elastic insulating material. The peripheral guide member has an insertion groove for inserting into the conductive guide member and is formed with a metal material. Under the conductive guide member and the peripheral guide member, a first vacuum space and a second vacuum space in the shape of a groove connected to the vacuum hole are formed respectively.

[0036] The vacuum pressure from the vacuum generating device can be applied to the vacuum pickup through the vacuum hole, the second vacuum space, the first vacuum space, and the insulating pad hole.

[0037] One or more deformation prevention portions that compensate for the height of the groove may be formed in the first vacuum space portion and the second vacuum space portion.

[0038] The conductive guide component may have a thickness that allows the lower terminal of the upper package to be connected to the second conductive portion within the through hole.

[0039] The thickness of the conductive guide component can be greater than the thickness of the peripheral guide component.

[0040] The conductive guide component is installed below the upper enclosure, and the peripheral guide component can be attached to the upper socket.

[0041] The non-elastic insulating material can be any one of polyimide film, FR4, or engineering plastics.

[0042] The upper socket can be vacuum-sealed to the lower part of the thruster.

[0043] Invention Effects

[0044] According to a test apparatus of the present invention, the second detection circuit board disposed in the existing upper socket assembly is removed, and a vacuum guide device having a vacuum space is provided between the upper socket and the upper package to ensure a vacuum pipeline in the upper socket assembly, thereby enabling the vacuum pressure from the vacuum generator to be smoothly applied to the vacuum pickup.

[0045] Furthermore, by forming a vacuum guide device with two parts, a conductive guide component and a peripheral guide component, and by arranging a non-elastic insulating conductive guide component in contact with the lower terminal of the upper package, the possibility of a short circuit between the lower terminal of the upper package and the vacuum guide device can be fundamentally prevented.

[0046] Furthermore, the vacuum guide device is formed by two parts: a conductive guide component and a peripheral guide component. The conductive guide component, which is made of non-elastic insulating material, is arranged at the part that contacts the lower terminal of the upper package. Therefore, compared with the case formed by existing metal materials, damage to the lower terminal of the upper package can be prevented because the lower terminal of the upper package makes soft contact.

[0047] Furthermore, the vacuum guide device is formed by two parts: a conductive guide component and a peripheral guide component. In the part where the vacuum pressure transmitted through the vacuum hole of the pusher is directly applied, a peripheral guide component made of rigid metal material is provided, thereby preventing the vacuum line from deforming or being eaten away. Sufficient vacuum pressure can be transmitted to the vacuum pickup, thus preventing pickup errors when the vacuum pickup picks up the lower package.

[0048] Furthermore, the vacuum guide device can be formed by two parts, a conductive guide component and a peripheral guide component. Therefore, the thickness of the conductive guide component can be greater than that of the peripheral guide component, thereby increasing the thickness of the through hole that supports and guides the second conductive part of the upper socket. The upper protrusion of the second conductive part can be fully accommodated in the through hole, thus preventing deformation of the second conductive part and achieving a stable connection with the lower terminal of the upper package.

[0049] Moreover, by using the vacuum guide device according to the present invention instead of the existing second detection circuit board, the length of the signal transmission path between the upper package and the lower package is greatly reduced, thereby preventing signal delay and signal distortion in high-speed signal transmission, and enabling precise testing of high-speed semiconductor packages. Attached Figure Description

[0050] Figure 1 This diagram illustrates an existing test setup for testing semiconductor packages in a stacked package configuration.

[0051] Figure 2 A diagram illustrating the operation of an existing testing setup.

[0052] Figure 3 As illustrations of existing inelastic insulating pads, (a) shows the upper view, (b) shows the lower view, and (c) is a schematic diagram showing the connection between the inelastic insulating pad and the upper socket.

[0053] Figure 4 This diagram illustrates a test apparatus according to an embodiment of the present invention.

[0054] Figure 5 This is a perspective view of an upper socket according to an embodiment of the present invention.

[0055] Figure 6 As an illustration of a vacuum guiding device formed by a conductive guiding member and a peripheral guiding member according to an embodiment of the present invention, (a) is the upper view and (b) is the lower view.

[0056] Figure 7 As shown in the figures illustrating a conductive guide member according to an embodiment of the present invention, (a) is the upper view and (b) is the lower view and an enlarged view of the lower portion.

[0057] Figure 8 As shown in the figures illustrating a peripheral guide member according to an embodiment of the present invention, (a) is the upper view and (b) is the lower view and an enlarged view of the lower portion.

[0058] Figure 9 This diagram illustrates the connection relationship between the conductive guide member, the peripheral guide member, and the upper socket according to an embodiment of the present invention.

[0059] Figure 10 The diagram illustrates the assembly relationship of the upper package, vacuum guide device, and upper socket according to an embodiment of the present invention.

[0060] Figure 11 This diagram illustrates the operation of a testing apparatus according to an embodiment of the present invention.

[0061] Explanation of reference numerals in the attached figures

[0062] 1. 100: Test device 10: Lower package

[0063] 30: Tester (first test circuit board) 40: Top package

[0064] 50: Thruster 51: Vacuum port

[0065] 52: Chamber 60: Lower socket

[0066] 70: Upper socket; 71: Second conductive part

[0067] 72: Insulating pad 73: Insulating pad hole

[0068] 74: Above the upper socket 80: Vacuum pickup

[0069] 90: Drive unit (DP) 130: Conductive guide component

[0070] 131: Through hole; 132: First vacuum space section

[0071] 133: First deformation prevention part; 140: Peripheral guide component

[0072] 141: Insertion slot; 142: Second vacuum space section

[0073] 143: Second deformation prevention part; 150: Vacuum guide device Detailed Implementation

[0074] The testing apparatus according to an embodiment of the present invention will now be described in detail with reference to the accompanying drawings.

[0075] This invention can be modified in various ways and can have multiple embodiments. For specific embodiments, they are illustrated in the accompanying drawings and described in detail in the description.

[0076] However, this is not intended to limit the invention to a specific implementation, but should be understood to include all modifications, equivalents and substitutes that fall within the scope of the ideas and techniques of the invention.

[0077] When a constituent element is referred to as "connected" or "linked" to other constituent elements, it should be understood that it can be directly connected or linked to the other constituent elements, but there may also be other constituent elements in between. Conversely, when a constituent element is referred to as "directly connected" or "directly linked" to other constituent elements, it should be understood that there are no other constituent elements in between.

[0078] The terminology used in this specification is for illustrative purposes only and is not intended to limit the invention. Unless otherwise expressly indicated, singular expressions include plural expressions.

[0079] In this specification, terms such as “comprising” or “having” should be understood as indicating the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, and do not preclude the existence or additional possibility of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0080] The terms "first," "second," etc., can be used to describe various constituent elements, but the constituent elements are not limited to the terms used. The terms are used only for the purpose of distinguishing one constituent element from another.

[0081] Furthermore, the constituent elements of the embodiments described with reference to the accompanying drawings are not limited to the corresponding embodiments. They can be applied to other embodiments within the scope of maintaining the technical concept of the present invention. Moreover, it should be understood that even if further description is omitted, multiple embodiments can be re-embodied as an integrated embodiment.

[0082] Furthermore, in the description with reference to the accompanying drawings, the same or related reference numerals are assigned to the same constituent elements in a manner unrelated to the reference numerals, and repeated descriptions thereof are omitted. In describing the present invention, detailed descriptions of prior art will be omitted when it is determined that such detailed descriptions may unnecessarily obscure the essence of the invention.

[0083] Figure 4 The diagram illustrates a testing apparatus according to an embodiment of the present invention. Figure 5 To illustrate a perspective view of the upper socket according to an embodiment of the present invention, Figure 6 As an illustration of a vacuum guiding device formed by a conductive guiding member and a peripheral guiding member according to an embodiment of the present invention, (a) is the upper view and (b) is the lower view. Figure 7 As shown in the figures illustrating a conductive guiding member according to an embodiment of the present invention, (a) is the upper view and (b) is the lower view. Figure 8 As shown in the figures illustrating a peripheral guide member according to an embodiment of the present invention, (a) is the upper view and (b) is the lower view. Figure 9 This diagram illustrates the connection relationship between the conductive guide member, the peripheral guide member, and the upper socket according to an embodiment of the present invention. Figure 10 The diagram is intended to schematically illustrate the connection relationship between the upper package, the vacuum guiding device, and the upper socket according to an embodiment of the present invention. Figure 11 This diagram illustrates the operation of a testing apparatus according to an embodiment of the present invention.

[0084] As shown in the attached figures above, the test apparatus 100 according to an embodiment of the present invention serves as an apparatus for testing the lower package 10 using the upper package 40 which has been pre-selected as a qualified product (good product), or for testing a stacked package type (POP) semiconductor package that simultaneously tests the upper package and the lower package. It can electrically connect the tester 30 that generates test signals and the stacked package type (POP) semiconductor package.

[0085] A test apparatus 100 according to an embodiment of the present invention is characterized by comprising: a lower socket 60, which is mounted on a tester 30 that provides test signals and has a plurality of first conductive portions 61 connected to a lower terminal 11 of a lower package 10 for electrically connecting the lower package 10 to the tester 30; a pusher 50, which is coupled to an upper package 40 and has a vacuum port 51 for transmitting the vacuum pressure of a vacuum generator VG, the pusher 50 receiving power from a drive unit 90 (DP) and being movable in a manner that allows it to approach or move away from the lower socket 60; and an upper socket 70, which is coupled to the pusher 50 and has an insulating pad 72 formed of a non-elastic insulating material and a plurality of second conductive portions 71, and is composed of a conductive region portion A surrounding the plurality of second conductive portions 71 and a peripheral region portion B located around the conductive region portion, the plurality of second conductive portions 71 being supported on the insulating pad 72 and having one end connected to a lower terminal of the upper package. 41 is connected, with the other end connected to the upper terminal 12 of the lower package; a vacuum pickup 80 is attached to the lower part of the upper socket 70 and transmits vacuum pressure through an insulating pad hole 73 formed in the center of the upper socket; and a vacuum guide device 150 is disposed between the upper package 40 and the upper socket 70. The vacuum guide device 150 is formed as a conductive guide member 130 and a peripheral guide member 140. The conductive guide member 130 has a region corresponding to the conductive area and a through hole 131 is formed at each corresponding position of the lower terminal 41 of the upper package and the second conductive part 71. It is formed of a non-elastic insulating material. The peripheral guide member 140 has an insertion groove 141 for inserting into the conductive guide member 130 and is formed of a metal material. On the underside of the conductive guide member 130 and the peripheral guide member 140, a first vacuum space 132 and a second vacuum space 142 in the shape of a groove connected to the vacuum hole 51 are formed, respectively.

[0086] The upper socket assembly TSA includes a thruster 50, an upper package 40 mounted on the thruster 50, an upper socket 70 attached to the lower part of the upper package 40, and a vacuum pickup 80 disposed on the lower part of the upper socket 70.

[0087] Specifically observing the constituent elements of the test apparatus 100 according to an embodiment of the present invention, firstly, the lower socket 60 is installed on the tester 30, so that the tester 30 and the lower package 10 form an electrical connection.

[0088] The lower socket 60 may be configured to include a first conductive portion 61 and an insulating portion 62. The first conductive portion 61 is formed in an elastic insulating material by a plurality of conductive particles arranged along the thickness direction. The plurality of first conductive portions 61 are spaced apart inside the insulating portion 62 to correspond to the lower terminals 11 of the lower package 10, which are to be connected.

[0089] One end of the first conductive part 61 contacts the signal electrode (not shown) provided in the tester 30, and the other end of the first conductive part 61 is connected to the lower terminal 11 of the lower package 10.

[0090] The first conductive portion 61 may include a first conductive portion bump 61a protruding towards the lower part of the insulating portion 62. During testing, the first conductive portion bump 61a is compressed against the signal electrode provided in the tester 30, enabling stable contact.

[0091] As the elastic insulating material constituting the first conductive part 61, heat-resistant polymers with cross-linked structures can be used, such as silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, nitrile copolymer rubber, styrene-butadiene block copolymer rubber, styrene-isoprene block copolymer rubber, polyurethane rubber, polyester rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, soft liquid epoxy resin rubber, etc.

[0092] The conductive particles constituting the first conductive part 61 can be made of magnetic materials that react through a magnetic field. For example, conductive particles can be particles of metals that exhibit magnetism such as iron, nickel, or cobalt; or alloy particles of these metals or particles containing these metals, or particles of these metals used as magnetic core particles, with the surface of the magnetic core particles plated with metals with good conductivity such as gold, silver, palladium, or radium; or non-magnetic metal particles, inorganic material particles such as glass beads, or polymer particles used as magnetic core particles, with the surface of the magnetic core particles plated with conductive magnets such as nickel and cobalt; or magnetic core particles plated with conductive magnets and metals with good conductivity, etc.

[0093] As an insulating part 62 that insulates the first conductive parts 61 from each other, it forms the appearance of the lower socket 60 and performs a supporting function until the first conductive parts 61 are subjected to contact load. The insulating part 62 can be formed of an elastic insulating material that is the same material constituting the first conductive parts 61.

[0094] In addition to elastic insulating materials, the insulating part 62 can also be made of non-elastic insulating materials, or various insulating materials that can insulate the first conductive parts 61 from each other.

[0095] Furthermore, the guide housing 65 is disposed above the lower socket 60. The guide housing 65 has a receiving groove 66 for accommodating the lower package 10. The receiving groove 66 may be formed in such a way that it extends through the guide housing 65 in the vertical direction. Through the receiving groove 66 of the guide housing 65, the lower package 10 can reach the lower socket 60.

[0096] The guide housing 65 has an inclined surface 67. The inclined surface 67 can guide the pusher 50 as it descends towards the lower socket 60. That is, when the pusher 50 carrying the upper socket 70 moves towards the lower socket 60 in a tilted position, the pusher 50 can contact the inclined surface 67 and be guided along the inclined surface 67. Therefore, the pusher 50 can position the upper package 40 on the lower package 10.

[0097] The thruster 50 receives power from the drive unit 90 (DP) and can move in a manner that allows it to approach or move away from the lower socket 60. It has an inner chamber 52 for accommodating the upper package 40 and a vacuum port 51 for transmitting vacuum pressure.

[0098] The thruster 50 is connected to an external vacuum generator VG through a vacuum port 51. The vacuum pressure generated by the vacuum generator can be transmitted to the vacuum pickup 80 through the chamber 52.

[0099] With the upper socket 70 and upper package 40 engaged, the pusher 50 moves via the drive unit 90, thereby connecting the upper socket 70 to the lower package 10 placed on the lower socket 60, or separating the upper socket 70 from the lower package 10. Furthermore, the pusher 50 can be positioned near or away from the lower socket 60, allowing the lower package 10 to be loaded onto or unloaded from the lower socket 60 using the vacuum pickup 80.

[0100] The upper socket 70 is disposed at the lower part of the thruster 50 and is electrically connected to the upper package 40 placed in the chamber 52 of the thruster 50. The upper package 40 is constructed with a package of pre-selected qualified products and can be equipped with a golden device, which can be used to detect whether the lower package 10 is functioning properly.

[0101] like Figure 5As shown, the upper socket 70 includes an insulating pad 72 covering the chamber 52 and a plurality of second conductive portions 71 supported by the insulating pad 72. This upper socket 70 is formed with a quadrilateral conductive region portion A and a peripheral region portion B surrounding the plurality of second conductive portions 71. The peripheral region portion B includes a portion located around and supporting the conductive region portion A and engaging with the pusher 50.

[0102] The insulating pad 72 can be formed of a non-elastic insulating material. When the upper socket 70 contacts the lower package 10, the non-elastic insulating pad 72 facilitates pressure on the lower package 10 towards the lower socket 60. When the insulating pad 72 stably presses on the lower package 10, the lower terminal 11 of the lower package 10 can be stably connected to the first conductive part 61 of the lower socket 60.

[0103] While the insulating pad 72, made of non-elastic insulating material, is not as prone to elastic deformation as the elastic insulating portion of existing silicone rubber sockets, it preferably possesses the characteristic of being able to bend and deform. This characteristic increases resistance to the inspected equipment exhibiting various forms of warpage and is beneficial for durability and increased lifespan. Such an insulating pad 72 can be made of polyimide (PI), engineering plastics, or various other non-elastic insulating materials.

[0104] The insulating pad 72 has an insulating pad hole 73. The insulating pad hole 73 is formed in the central part of the upper socket 70 and is connected to the chamber 52 to transmit the vacuum pressure of the chamber 52. The lower part of the insulating pad hole 73 of the insulating pad 72 has a vacuum pickup insertion slot 78 into which a vacuum pickup 80 can be inserted, thereby forming a space that allows the vacuum pickup 80 to move.

[0105] The second conductive portion 71 is formed by penetrating the insulating pad 72 along the thickness direction and is supported by the insulating pad 72. One end of such the second conductive portion 71 contacts the lower terminal 41 of the upper package 40, and the other end can be connected to the upper terminal 12 of the lower package 10.

[0106] The second conductive portion 71 may also be configured to include a second conductive portion body 71a placed within the insulating pad 72, a second conductive portion lower protrusion 71b, and a second conductive portion upper protrusion 71c. The second conductive portion lower protrusion 71b is connected to the second conductive portion body 71a and protrudes from the lower surface of the insulating pad 72, and the second conductive portion upper protrusion 71c is connected to the second conductive portion body 71a and protrudes from the upper surface of the insulating pad 72. When the upper socket 70 approaches the lower socket 60, the second conductive portion lower protrusion 71b is compressed against the upper terminal 12 of the lower package 10, thereby achieving stable contact with the upper terminal 12. Since the second conductive portion upper protrusion 71c and the lower terminal 41 of the upper package can be combined in a compressed state within the through hole 131 of the conductive guide member 130 (described later), a more stable contact is achieved. For stable contact with the terminal, it is preferable to have such a lower bump 71b and an upper bump 71c of the second conductive portion, but they may not be provided, or only one of the lower bump 71b and the upper bump 71c of the second conductive portion may be formed.

[0107] The second conductive portion 71 can be formed in a manner in which multiple conductive particles are contained within an elastic insulating material. The elastic insulating material and conductive particles constituting the second conductive portion 71 can be the same material or conductive particles as those constituting the first conductive portion 61.

[0108] The upper socket 70 is bonded to the thruster 50 with adhesive. It is preferable to prevent vacuum pressure loss between the upper socket 70 and the thruster 50 by vacuum sealing the bonded portion. The upper enclosure 40 may also be configured such that the chamber 52 is in contact with the adhesive.

[0109] Various adhesives, such as double-sided tape and liquid quick-drying adhesive, can be used. The adhesive strength should be such that it can withstand the vacuum pressure transmitted to the vacuum pickup. Generally, it is preferable to use an adhesive with an adhesive strength in the range of 300 to 2,000 gf / in.

[0110] Thus, the structure in which the components of the upper socket assembly are bonded together by adhesive makes it easy to separate and reassemble the upper encapsulation. It also has the effect of absorbing the impact that occurs when the upper socket assembly comes into contact with the lower encapsulation, thereby mitigating the impact.

[0111] Furthermore, the lower terminal 41 of the upper package 40 or the lower terminal 11 of the lower package 10 uses a conventional solder ball type, but a grounding type with ground solder balls can also be used.

[0112] Furthermore, the vacuum pickup 80 is mounted on the lower part of the upper socket 70 to vacuum-adhere to the lower package 10 and is connected to the insulating pad hole 73 of the upper socket 70. In order for the vacuum pickup 80 to adhere to or pressurize the lower package 10, a vacuum pickup insertion slot 78 is provided in the upper package 40, which can form a space for the vacuum pickup 80 to move.

[0113] like Figure 4 and Figure 11 As shown, the vacuum guide device 150 is disposed between the upper package 40 and the upper socket 70.

[0114] like Figures 6 to 8 As shown, the vacuum guide device 150 is formed of two parts, a conductive guide member 130 and a peripheral guide member 140. The conductive guide member 130 has a region corresponding to the conductive area portion A of the upper socket 70, and a through hole 131 is formed at each position of the lower terminal 41 of the upper encapsulation and the second conductive portion 71 of the upper socket. The peripheral guide member 140 is in the form of surrounding the conductive guide member 130 and has an insertion groove 141 in the center for inserting the conductive guide member 130.

[0115] like Figure 7 As shown, the conductive guide component 130 has a form in which a non-elastic insulating material such as a polyimide (PI) film, FR4 or engineering plastic in the form of a gasket has a plurality of through holes 131.

[0116] Below the conductive guide member 130, which faces the conductive area A of the upper socket 74, a first vacuum space portion 132 is formed in the form of a groove. The first vacuum space portion 132 is formed under the surface of an inelastic insulating material in the form of an etched pad. It can be formed in the form of a groove with an 'H' shape, or in the form of a cross shape formed by the intersection of 'H' shaped grooves. It can also be formed in various other forms as long as it can transmit vacuum pressure.

[0117] Furthermore, a first deformation prevention portion 133, which compensates for the height of the groove, can be formed between the first vacuum space portions 132. The first deformation prevention portion 133 can be the portion that was not etched between the first vacuum space portions 132 during the formation of the first vacuum space portions 132. Such a first deformation prevention portion 133 can improve the durability of the elastic insulating material and prevent deformation.

[0118] Thus, by using an inelastic insulating material to form the conductive guide 130 that contacts the lower terminal 41 of the upper package, the possibility of a short circuit between the lower terminal 41 of the upper package and the conductive guide 130 can be fundamentally prevented.

[0119] Furthermore, since the conductive guide component 130 is formed with an inelastic insulating material, compared with the case where it is formed with existing metal materials, damage to the lower terminal 41 of the upper package can be prevented because the lower terminal 41 of the upper package makes gentle contact.

[0120] like Figure 8 As shown, the peripheral guide member 140 is formed of a flat metal material, and the central part has an insertion groove 141 for inserting the conductive guide member 130, and has a shape that surrounds the conductive guide member 130.

[0121] Below the peripheral guide member 140, which faces the peripheral area B of the upper socket 70, a second vacuum space portion 142 in the form of a groove is formed to transmit vacuum pressure through the vacuum hole 51 of the pusher 50. Multiple second vacuum spaces 142 can be formed by etching the underside of a flat metal material. Although only the left and right sides are shown in the accompanying drawings, they can also be formed on the upper and lower sides. As long as the form can transmit vacuum pressure, various other forms are also possible.

[0122] Furthermore, a second deformation prevention portion 143, having a height that compensates for the groove, can be formed between the second vacuum spaces 142. This second deformation prevention portion can be the portion remaining between the second vacuum spaces 142 that was not etched during the etching process. Such a second deformation prevention portion 143 can improve the durability of the metallic material and prevent deformation.

[0123] like Figure 11 As indicated by the arrow, a vacuum line VL is formed by the vacuum pressure (intake pressure or release pressure) generated from the vacuum generator VG. The vacuum pressure is transmitted through the vacuum hole 51 of the thruster 50, the chamber 52, the second vacuum space 142 of the peripheral guide member 140, and the first vacuum space 132 of the conductive guide member 130 to the insulating pad hole 73 of the upper socket 70. The vacuum pressure transmitted to the insulating pad hole 73 is then transmitted to the vacuum pickup 80 attached to the lower part of the upper socket 70.

[0124] Thus, the portion directly applied by the vacuum pressure transmitted through the vacuum port 51 of the thruster is formed by a peripheral guide member 140 made of metal material, which makes it rigid, thereby preventing the vacuum line from deforming or being eaten away, thereby enabling sufficient vacuum pressure to be transmitted to the vacuum pickup 80, and preventing pickup errors when the vacuum pickup 80 picks up the lower package 10.

[0125] like Figure 9 and Figure 10As shown, the conductive guide 130 is mounted below the lower terminal on which the upper package 40 is formed, and is configured to contact the conductive area portion A of the upper surface 74 of the upper socket 70. The peripheral guide 140 is attached to the peripheral area portion B of the upper surface of the upper socket 70 with adhesive, and is configured such that the conductive guide 130 can be inserted into the insertion slot 141.

[0126] Thus, if a vacuum guide device 150, formed by two parts—a conductive guide member 130 and a peripheral guide member 140—is provided between the upper package 40 and the upper socket 70, the lower terminal 41 of the upper package and the second conductive portion 71 of the upper socket are connected within the through hole 131 of the conductive guide member 130. Therefore, the conductive guide member 130 should have a thickness sufficient to allow the lower terminal 41 of the upper package and the second conductive portion 71 of the upper socket to be connected within the through hole 131. However, since the lower terminal 41 of the upper package is connected within the through hole 131 in a state that compresses the second conductive portion 71 of the upper socket, this is advantageous on the conductive side, and therefore the thickness of the conductive guide member can be made slightly smaller than the thickness that allows for connection.

[0127] The lower part of the peripheral guide component 140 is attached to the peripheral area B of the upper socket 70 with a first adhesive 171, and the upper part of the peripheral guide component 140 can be attached to the lower edge of the upper package 40 with a second adhesive 172. As the adhesive for bonding the upper package 40, the vacuum guide device 150 and the upper socket 70, various adhesives such as double-sided tape and liquid super glue can be used.

[0128] Therefore, the overall thickness t of the conductive guide member 130 can be formed as the thickness of the peripheral guide member 140 plus the thickness of the first adhesive 171 and the second adhesive 172. Thus, the thickness of the conductive guide member 130 can be greater than the thickness of the peripheral guide member 140, thereby increasing the thickness of the through hole 131 of the second conductive portion 71 that supports and guides the upper socket 70. This allows the upper protrusion 71c of the second conductive portion 71 to be fully accommodated within the through hole 131, preventing deformation of the second conductive portion 71 and achieving a stable connection with the lower terminal 41 of the upper package.

[0129] The operation of a semiconductor packaging test apparatus 100 according to an embodiment of the present invention will be described below.

[0130] like Figure 4 and Figure 11 As shown, the thruster 50 moves via the drive unit 90 (DP), and the vacuum pickup 80 descends to adsorb the lower package 10.

[0131] The lower package 10 of the vacuum pickup 80 is adsorbed by the vacuum pump, and the vacuum line VL is formed by the vacuum pressure generated from the vacuum generator VG. The vacuum pressure from the vacuum generator is transmitted to the vacuum pickup 80 through the vacuum port 51 of the pusher 50, the chamber 52, the second vacuum space 142 of the peripheral guide member 140, the first vacuum space 132 of the conductive guide member 130, and the insulating pad hole 73 of the upper socket 70 to adsorb the lower package 10. Figure 11 In the diagram, the arrow indicates the vacuum line VL formed in the test apparatus 100 of the present invention.

[0132] The vacuum pickup 80 mounted on the upper socket 70 allows the appropriate vacuum area inside the chamber 52 of the lower package 10 to move, preferably within 110 mm. 3 The first vacuum space 132 and the second vacuum space 142 of the vacuum guide device 150 are preferably 9.5 mm in diameter. 3 above.

[0133] Subsequently, the vacuum pickup 80 can transport the adsorbed lower package 10 onto the lower socket 60. That is, the pusher 50 approaches the lower package 10 in the standby position, the vacuum pickup 80 descends and adsorbs the lower package 10, and the pusher 50 moves onto the lower socket 60, thereby positioning the lower package 10 on the lower socket 60. At this time, the lower terminal 11 of the lower package 10 is brought into contact with the first conductive portion 61 of the lower socket 60.

[0134] Subsequently, as the pusher 50 moves towards the lower socket 60, the vacuum pickup 80 further descends, pressurizing the lower package 10. This causes the lower terminal 11 of the lower package 10 to connect with the first conductive portion 61 of the lower socket 60. Through the movement of the pusher 50, the second conductive portion 71 of the upper socket 70 connects to the upper terminal 12 of the lower package 10. At this time, the pressure applied by the pusher 50 is transmitted to the lower package 10 through the upper socket 70, thus forming an electrical connection between the tester 30, the lower socket 60, the lower package 10, the upper socket 70, and the upper package 40.

[0135] At this time, the test signal generated from the tester 30 is transmitted to the upper package 40 through the lower socket 60, the lower package 10, and the upper socket 70, which enables electrical testing of the upper package 40 and the lower package 10.

[0136] Furthermore, if the upper package 40 is constructed with gold equipment, it is not only possible to detect whether the lower package 10 is operating normally, but also to detect whether it matches well with the upper package when the packages are stacked in a stacked packaging manner.

[0137] Furthermore, if the upper package 40 is constructed using gold-plated equipment, it has the advantage that if a defect occurs during testing, the lower package 10 can be directly identified as a defective product. Of course, it is also possible to construct the upper package 40 without using gold-plated equipment, and to simultaneously test both the upper package 40 and the lower package 10 by also including the upper package 40 as the test object.

[0138] After the test is completed, the vacuum pickup 80 rises, and the lower package 10 attached to the vacuum pickup 80 is unloaded from the lower socket 60 as the pusher 50 moves, and can be transferred to the loading device (not shown).

[0139] As described above, the test apparatus according to the present invention removes the second detection circuit board disposed in the existing upper socket assembly, and ensures a vacuum pipeline in the upper socket assembly by providing a vacuum guide device having a vacuum space between the upper socket and the upper package, so that the vacuum pressure from the vacuum generator can be smoothly applied to the vacuum pickup.

[0140] Furthermore, by forming a vacuum guide device with two parts, a conductive guide component and a peripheral guide component, and by arranging a non-elastic insulating conductive guide component in contact with the lower terminal of the upper package, the possibility of a short circuit between the lower terminal of the upper package and the vacuum guide device can be fundamentally prevented.

[0141] Furthermore, the vacuum guide device is formed by two parts: a conductive guide component and a peripheral guide component. The conductive guide component, which is made of non-elastic insulating material, is arranged at the part that contacts the lower terminal of the upper package. Therefore, compared with the case formed by existing metal materials, damage to the lower terminal of the upper package can be prevented because the lower terminal of the upper package makes soft contact.

[0142] Furthermore, the vacuum guide device is formed by two parts: a conductive guide component and a peripheral guide component. In the part where the vacuum pressure transmitted through the vacuum hole of the pusher is directly applied, a peripheral guide component made of rigid metal material is provided, thereby preventing the vacuum line from deforming or being eaten away. This allows sufficient vacuum pressure to be transmitted to the vacuum pickup, thus preventing pickup errors when the vacuum pickup picks up the lower package.

[0143] Furthermore, the vacuum guide device can be formed by two parts: a conductive guide component and a peripheral guide component. Therefore, the thickness of the conductive guide component can be greater than that of the peripheral guide component, thereby increasing the thickness of the through hole that supports and guides the second conductive part of the upper socket. The upper protrusion of the second conductive part can be fully accommodated in the through hole, thus preventing deformation of the second conductive part and achieving a stable connection with the lower terminal of the upper package.

[0144] Moreover, by using the vacuum guide device according to the present invention instead of the existing second detection circuit board, the length of the signal transmission path between the upper package and the lower package is greatly reduced, which enables the prevention of signal delay and signal distortion in high-speed signal transmission and enables precise testing of high-speed semiconductor packages.

[0145] The present invention has been described above with reference to preferred embodiments, but the scope of the present invention is not limited to the forms described and illustrated above.

Claims

1. A testing device, characterized in that, include: The lower socket is mounted on a tester that provides test signals and has a plurality of first conductive parts connected to a lower terminal of a lower package for electrically connecting the lower package to the tester. The thruster, which is combined with the upper package, has a vacuum port for transmitting the vacuum pressure of the vacuum generating device. The thruster receives power from the drive unit to move in a manner that allows it to approach or move away from the lower socket side. The upper socket, which is combined with the pusher, has an insulating pad formed of a non-elastic insulating material and a plurality of second conductive parts, and is composed of a conductive area portion surrounding the plurality of second conductive parts and a peripheral area portion located around the conductive area portion. The plurality of second conductive parts are supported on the insulating pad, one end of which is connected to the lower terminal of the upper package, and the other end of which is connected to the upper terminal of the lower package. A vacuum pickup unit, which is attached to the lower part of the upper socket, transmits vacuum pressure through an insulating pad hole formed in the center of the upper socket; and A vacuum guiding device is disposed between the upper package and the upper socket. The vacuum guiding device is formed of a conductive guiding component and a peripheral guiding component. The conductive guiding component has a region corresponding to the conductive area, and a through hole is formed at each corresponding position of the lower terminal of the upper encapsulation and the second conductive part. It is formed of a non-elastic insulating material. The peripheral guiding component has an insertion groove for inserting into the conductive guiding component and is formed of a metallic material. Below the conductive guide component and the peripheral guide component, a first vacuum space portion and a second vacuum space portion with a groove shape connected to the vacuum hole are respectively formed.

2. The testing apparatus according to claim 1, characterized in that, The vacuum pressure from the vacuum generator is applied to the vacuum pickup through the vacuum hole, the second vacuum space, the first vacuum space, and the insulating pad hole.

3. The testing apparatus according to claim 1, characterized in that, One or more deformation prevention portions are formed in the first vacuum space portion and the second vacuum space portion to compensate for the height of the groove.

4. The testing apparatus according to claim 1, characterized in that, The conductive guide component has a thickness that allows the lower terminal of the upper package to be connected to the second conductive portion within the through hole.

5. The testing apparatus according to claim 1, characterized in that, The thickness of the conductive guide component is greater than the thickness of the peripheral guide component.

6. The testing apparatus according to claim 1, characterized in that, The conductive guide component is mounted on the underside of the upper enclosure, and the peripheral guide component is attached to the top of the upper socket.

7. The testing apparatus according to claim 1, characterized in that, The non-elastic insulating material is any one of polyimide film, FR4, or engineering plastic.

8. The testing apparatus according to claim 1, characterized in that, The upper socket is vacuum-sealed to the lower part of the thruster.

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