Wafer chuck mechanism cleaning device

Abstract

[Problem] To provide a cleaning device for a wafer chuck mechanism, which can automatically and simply perform cleaning of a chuck surface that holds a wafer and cleaning of a support chuck holding portion. [Solution] The cleaning device is configured to include a squeegee (17) and a brush (18) that press a support chuck holding portion cleaning mechanism (10B) for removing sludge on a support chuck holding portion (11B) against the support chuck holding portion (11B), and a water nozzle (19) for discharging and supplying water on the support chuck holding portion (11B).

Description

Technical Field

[0001] This invention relates to a cleaning apparatus for a wafer adsorption chuck mechanism, and more particularly to a cleaning apparatus for a wafer adsorption chuck mechanism that uses an adhesive film to adsorb and hold a wafer integrated with a ring support. Background Technology

[0002] In the semiconductor manufacturing field, wafers are trending towards larger sizes year by year. Furthermore, to increase mounting density, wafer thinning is being promoted. To achieve wafer thinning, a process known as back grinding is performed, where the back side of the semiconductor wafer (hereinafter referred to as "wafer") is ground to thin its surface (see, for example, Patent Document 1).

[0003] Currently, grinding apparatuses for thinning wafers have the following structure: a chuck stage is used to hold the wafer, which is integrated with an adhesive film and a ring support, in a releasable manner; and the ring support is located in an annular support adsorption and holding section surrounding the chuck, and is held in a releasable manner. In this grinding apparatus, cutting sludge adheres to the chuck surface of the chuck stage for holding the wafer and to the support adsorption and holding section for holding the ring support. Therefore, in this type of grinding apparatus, a mechanism for removing the cutting sludge is required.

[0004] Traditional chuck stages consist of a chuck surface for holding the wafer and a holder holding section for holding the ring holder. In cleaning the chuck surface, a rotating dressing stone is brought into contact with the rotating chuck stage for cleaning. However, if the holder holding section is not cleaned of sludge, the holding of the ring holder will be hindered. Therefore, in cleaning the holder holding section, after wafer grinding, the operator rotates the holder holding section along with the chuck stage while supplying pure water to the holder holding section using a water gun, allowing it to come into contact with a BEMCOT wiping cloth to remove sludge.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: JP 2010-137349 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] In the cleaning apparatus of the wafer chuck mechanism, during the cleaning of the chuck surface that holds the wafer, a rotating dressing stone is pressed against the rotating chuck table for cleaning. During the cleaning of the support holding section, after wafer grinding, the operator rotates the support holding section and the chuck table while simultaneously supplying pure water to the support holding section using a water gun, allowing it to come into contact with a BEMCOT wiping cloth to remove sludge. Therefore, the cleaning of the support holding section is performed manually by the operator, resulting in poor operability.

[0010] Therefore, in order to provide a cleaning apparatus for a wafer adsorption chuck mechanism that can automatically and easily perform cleaning of the chuck surface for adsorption and holding wafers and cleaning of the support adsorption and holding portion, a technical problem has arisen that needs to be solved, and the object of the present invention is to solve this problem.

[0011] Technical solutions for solving the problem

[0012] The present invention is proposed to achieve the above-mentioned objective. Technical solution 1 describes a cleaning apparatus for a wafer chuck mechanism, which relates to a cleaning apparatus for a rotating wafer chuck mechanism. The cleaning apparatus includes: a wafer chuck portion that holds a wafer mounted on a ring support via an adhesive film; and an annular support holding portion that holds the annular support outside the wafer chuck portion. The cleaning apparatus has a support holding portion cleaning mechanism that is movable on the support holding portion to clean it. The support holding portion cleaning mechanism includes a scraper and a brush that can contact the support holding portion, and a water nozzle that sprays water onto the support holding portion. The water nozzle, brush, and scraper are sequentially arranged from the upstream side to the downstream side of the rotation direction of the support holding portion.

[0013] According to this structure, when removing sludge from the support adsorption and holding section, while the wafer chuck mechanism is rotating, a support adsorption and holding section cleaning mechanism is installed on the support adsorption and holding section. When water is sprayed onto the support adsorption and holding section from a water nozzle, and either a brush or a scraper comes into contact with the support adsorption and holding section, the sludge floats up due to the water, and is scraped off using either the brush or the scraper. Furthermore, the sludge scraped off by either or both of the brush and scraper flows out of the support adsorption and holding section and is discharged using water sprayed from the water nozzle, thereby removing the sludge from the support adsorption and holding section. Therefore, by linking this operation with the cleaning operation of removing sludge from the support adsorption and holding section cleaning member and based on the adsorption chuck cleaning grinding section, the removal of sludge from the wafer adsorption chuck section and the removal of sludge from the support adsorption and holding section can be performed simultaneously.

[0014] The invention described in technical solution 2 provides a cleaning device for a wafer adsorption chuck mechanism, which relates to the structure described in technical solution 1. The cleaning device for the wafer adsorption chuck mechanism further includes an adsorption chuck cleaning abrasive section, which is configured to be movable on the wafer adsorption chuck section to clean the wafer adsorption chuck section. The bracket adsorption holding section cleaning mechanism is configured to be movable integrally with the adsorption chuck cleaning abrasive section.

[0015] According to this structure, when the wafer chuck mechanism is rotated and the dressing abrasive of the chuck cleaning section is brought into contact with the wafer adsorption chuck section, and the support adsorption and holding section cleaning mechanism is positioned on the support adsorption and holding section, sludge on the wafer adsorption chuck section is scraped off by the dressing abrasive, and sludge on the support adsorption and holding section is scraped off by the support adsorption and holding section cleaning mechanism. Thus, sludge removal from both the wafer adsorption chuck section and the support adsorption and holding section can be performed simultaneously.

[0016] The invention described in technical solution 3 provides a cleaning device for a wafer adsorption chuck mechanism, which relates to the structure described in technical solution 1 or 2, wherein the aforementioned support adsorption holding part has a water jet hole for spraying water onto the aforementioned support adsorption holding part.

[0017] According to this structure, when cleaning the suction and holding part of the support, water is sprayed from multiple water spray holes provided on the suction and holding part of the support to wet the entire suction and holding part of the support. Water is also sprayed from the water nozzle to make the brush contact, so the sludge is easier to float up and scraped off by the scraper, thus improving the cleaning effect.

[0018] The invention described in technical solution 4 provides a cleaning device for a wafer adsorption chuck mechanism, which relates to the structure described in technical solution 1 or 2, wherein the cleaning mechanism of the support adsorption holding part has a spring mechanism that elastically absorbs the pressing pressure of the scraper or the brush on the support adsorption holding part.

[0019] According to this structure, when the scraper or brush presses excessively against the holder, the force of the scraper or brush against the holder can be buffered by the spring action of the spring mechanism, so that it remains approximately constant.

[0020] The invention described in technical solution 5 provides a cleaning device for a wafer adsorption chuck mechanism, the structure described in technical solution 1 or 2, wherein it further includes a humidifying nozzle that intermittently supplies water to the adsorption holding part of the support.

[0021] With this structure, when the cleaning device is in standby mode, water is intermittently supplied from the humidifying nozzle to the adsorption holding part of the support, thus preventing sludge from adhering to the adsorption holding part of the support due to dryness.

[0022] Technical effects of the invention

[0023] According to the present invention, cleaning of the wafer adsorption chuck and the holder adsorption and holding section can be performed simultaneously. This automates the cleaning process of both the chuck surface for adsorbing and holding the wafer and the holder adsorption and holding section.

[0024] Furthermore, regarding the removal of sludge from the support adsorption and holding section, while the wafer chuck mechanism is rotating, a support adsorption and holding section cleaning mechanism is installed on the support adsorption and holding section. When water is sprayed onto the support adsorption and holding section from a water nozzle, and either a brush or a scraper comes into contact with the support adsorption and holding section, the sludge floats up due to the water. The sludge is then scraped off using either the brush or the scraper, or both. The scraped sludge is then discharged outside the support adsorption and holding section using water sprayed from the water nozzle. Therefore, the sludge on the support adsorption and holding section can be removed simply and cleanly. Attached Figure Description

[0025] Figure 1 A perspective view showing a wafer chuck mechanism and cleaning apparatus as an embodiment of the present invention;

[0026] Figure 2 From Figure 1 A perspective view of the wafer chuck mechanism and cleaning device shown from the front right side;

[0027] Figure 3The figure shows the cleaning mechanism of the adsorption chuck cleaning grinding stone section and the support adsorption holding section with the arm in the cleaning position and some structural components omitted. (a) is a side view and (b) is a top view with some structure in (a) omitted.

[0028] Figure 4 The figure shows the cleaning mechanism of the adsorption chuck cleaning grinding stone section and the support adsorption holding section with the arm in the standby position and some structural components omitted. (a) is a side view and (b) is a top view with some structure in (a) omitted.

[0029] Figure 5 From Figure 1 An enlarged view of the main structural components of the cleaning mechanism in the support adsorption and holding section of the cleaning device, viewed from the AA direction.

[0030] Figure 6 This is a perspective view showing the main structural components of the cleaning mechanism in the support adsorption and holding section of the above-mentioned cleaning device.

[0031] Figure 7 A top view showing an example of a wafer held on a ring support via an adhesive film. Detailed Implementation

[0032] To provide a cleaning apparatus for a wafer adsorption chuck mechanism capable of automatically and easily cleaning the chuck surface of the wafer and the support adsorption holding portion, the present invention relates to a cleaning apparatus for a wafer adsorption chuck mechanism, comprising: a wafer adsorption chuck portion that adsorbs and holds a wafer mounted on a ring support via an adhesive film; and an annular support adsorption holding portion that adsorbs and holds the annular support outside the wafer adsorption chuck portion; the cleaning apparatus for the wafer adsorption chuck mechanism includes a support adsorption holding portion cleaning mechanism that is movable on the support adsorption holding portion to clean the support adsorption holding portion; the support adsorption holding portion cleaning mechanism includes at least one of a scraper and a brush that can contact the support adsorption holding portion, and a water nozzle that sprays water onto the support adsorption holding portion.

[0033] Example

[0034] Hereinafter, an embodiment of the present invention will be described in detail based on the accompanying drawings. Furthermore, in the following embodiments, when referring to the number, value, quantity, range, etc., of the constituent elements, they are not limited to that specific quantity, except where specifically stated or where they are clearly limited in principle to a particular quantity; they may be more than or less than that specific quantity.

[0035] In addition, when referring to the shape and positional relationship of constituent elements, etc., except for cases that are specifically stated or that are obviously not the case in principle, it includes shapes that are substantially similar or analogous to that shape.

[0036] Furthermore, the accompanying drawings may exaggerate characteristic features by enlarging them for easier understanding, and the size ratios of the constituent elements may not be the same as actual dimensions. Additionally, in sectional views, some section lines of the constituent elements are sometimes omitted to facilitate understanding of their cross-sectional structure.

[0037] Furthermore, in the following description, the expressions indicating directions such as up and down, left and right are not absolute. They are appropriate when depicting the postures of the various parts of the cleaning apparatus of the wafer adsorption chuck mechanism of the present invention, but should be interpreted differently depending on the posture. Additionally, throughout the description of the embodiments, the same reference numerals are used to denote the same elements.

[0038] Figures 1-6 The present invention describes a cleaning apparatus 10. The cleaning apparatus 10 removes sludge adhering to a chuck mechanism 11 and includes a chuck cleaning grinding stone section 10A, a support adsorption and holding section cleaning mechanism 10B, and a position moving mechanism 10C. The chuck mechanism 11 has a wafer adsorption chuck section 11A and a support adsorption and holding section 11B disposed around the outer side of the wafer adsorption chuck section 11A. The wafer adsorption chuck section 11A and the support adsorption and holding section 11B are arranged along... Figure 2 The arrow D rotates integrally. Furthermore, during grinding, the wafer W is mounted on the chuck mechanism 11.

[0039] The wafer W here uses, for example Figure 7 The wafer W shown is held on the ring support 102 by means of the adhesive film 101. During grinding, the wafer W and the adhesive film 101 are adsorbed and held together on the chuck surface 11a of the wafer chuck portion 11A, while the ring support 102 is adsorbed and held on the support holding portion 11B. Furthermore, the wafer chuck portion 11A and the support holding portion 11B are independent, and they can move vertically relative to each other. Moreover, with the ring support 102 held by the support holding portion 11B, for example, when the wafer chuck portion 11A moves upward, the adhesive film 101 is stretched as a whole, making it easy to remove the wafer W from the adhesive film 101.

[0040] The chuck surface 11a of the wafer adsorption chuck section 11A is formed of a porous material, which can vacuum and adsorb and hold the wafer W disposed on the chuck surface 11a in a manner that is attached to the adhesive film 101. In addition, when cleaning the chuck surface 11a, cleaning water (pure water) can be sprayed from the entire chuck surface 11a.

[0041] The support adsorption and holding section 11B is provided with a plurality of adsorption holes 12a and a plurality of water jet holes 12b arranged in a generally equidistant row along the circumferential direction. The plurality of adsorption holes 12a evacuate the ring support 102 placed on the support adsorption and holding section 11B to adsorb and hold the ring support 102 on the support adsorption and holding section 11B. The plurality of water jet holes 12b spray cleaning water (pure water) from the upper surface of the support adsorption and holding section 11B when cleaning the support adsorption and holding section 11B. In this embodiment, the adsorption holes 12a and water jet holes 12b are shared as a single hole, but they can also be provided separately. Furthermore, the piping for evacuating the support adsorption and holding section 11B and the piping for evacuating the chuck surface 11a of the wafer adsorption chuck section 11A are different systems. Therefore, the evacuation can be controlled for each system.

[0042] The position moving mechanism 10C of the cleaning device 10 moves the adsorption chuck cleaning abrasive section 10A and the support adsorption holding section cleaning mechanism 10B integrally to the cleaning position and the standby position. The position moving mechanism 10C has a guide rail component 13 and an arm 14. The guide rail component 13 horizontally guides the movement of the adsorption chuck cleaning abrasive section 10A and the support adsorption holding section cleaning mechanism 10B between the cleaning position and the standby position along one side of the wafer adsorption chuck section 11A, and the arm 14 holds the adsorption chuck cleaning abrasive section 10A. That is, the movement of the adsorption chuck cleaning abrasive section 10A and the support adsorption holding section cleaning mechanism 10B between the cleaning position and the standby position is guided by the arm 14 and the guide rail component 13. Furthermore, the guide rail component 13 is mounted on the base component 21. Additionally, an anti-drying nozzle 22 is mounted on the base component 21, which supplies water to the support adsorption holding section 11B to prevent drying during standby.

[0043] The adsorption chuck cleaning abrasive section 10A includes a dressing abrasive 15, which is mounted on the lower end of the arm 14 in a horizontally rotatable manner. The dressing abrasive 15 is driven by a motor (not shown) along... Figure 2 The grinding stone 15 rotates in the direction of arrow E. While rotating horizontally, the arm 14 moves up and down, pressing against the chuck surface 11a of the simultaneously rotating wafer chuck portion 11A, i.e., contacting the chuck surface 11a of the wafer chuck portion 11A, thereby scraping off the sludge adhering to the chuck surface 11a. Additionally, during contact, water is sprayed from the lower surface of the grinding stone 15, causing the sludge on the chuck surface 11a to float to the surface for scraping.

[0044] The bracket adsorption and holding cleaning component 10B is mounted in a unitized manner on the flange-shaped member 14a, which is adjacent to the upper surface of the polishing stone 15 and fixedly mounted to the lower end of the arm 14. That is, the bracket adsorption and holding cleaning mechanism 10B has a unit base 16 that is detachably mounted on the flange-shaped member 14a. On the lower side of the unit base 16, a scraper 17, a brush 18, and a water nozzle 19 are sequentially mounted in the opposite direction of rotation to the bracket adsorption and holding part 11B to form a unit. Furthermore, the bracket adsorption and holding cleaning mechanism 10B, unitized by the unit base 16, is detachably mounted on the flange-shaped member 14a in a unitized manner using bolts, nuts, etc.

[0045] like Figure 1 , Figure 2 , Figure 3 As shown, the bracket adsorption and holding part cleaning mechanism 10B is configured such that, when moved to the cleaning position by the position moving mechanism 10C, a water nozzle 19, a brush 18, and a scraper 17 are sequentially arranged on the bracket adsorption and holding part 11B from the upstream side to the downstream side in the rotation direction of the bracket adsorption and holding part 11B. Furthermore, as... Figure 5 As shown, a spring mechanism 20 is provided between the unit base 16 and the brush 18 and scraper 17. This spring mechanism 20 is used to buffer the contact force (pushing force) between the brush 18 and scraper 17 and the holder 11B, keeping the contact force (pushing force) between them approximately constant. In addition, the brush 18 is mounted at an angle relative to the holder 11B so as to remove sludge from the corner (corner) portion 23a of the base 23 of the holder 11B.

[0046] The operation of the cleaning device 10 is controlled by a control mechanism (not shown in the figure). The control mechanism controls each component of the cleaning device 10. The control mechanism, for example, is a computer, consisting of a CPU, memory, etc. Furthermore, the function of the control mechanism can be implemented using software control or by using hardware operation.

[0047] Next, an example of the operation of the cleaning apparatus 10 will be described. During the grinding process of wafer W in the grinding apparatus, the adsorption chuck cleaning section 10A and the support adsorption holding section cleaning mechanism 10B are moved to the position by the position moving mechanism 10C. Figure 4 The standby position is shown.

[0048] After the grinding process of the grinding device is completed, when the sludge cleaning of the chuck surface 11a of the wafer adsorption chuck section 11A and the sludge cleaning of the support adsorption holding section 11B is performed, the position moving mechanism 10C moves the arm 14 to the cleaning position while the wafer adsorption chuck section 11A and the support adsorption holding section 11B are rotating. As a result, the adsorption chuck cleaning grinding wheel section 10A and the support adsorption holding section cleaning mechanism 10B also move upward together with the arm 14 to the cleaning position.

[0049] Furthermore, before the actual start of sludge cleaning treatment, i.e. during standby, the wafer adsorption chuck section 11A and the support adsorption holding section 11B rotate at a predetermined speed. In order to prevent the sludge adhering to the chuck surface 11a of the wafer adsorption chuck section 11A and the support adsorption holding section 11B from drying out, water is sprayed from the chuck surface 11a in the wafer adsorption chuck section 11A to prevent this, and water from the water spray hole 12b and the anti-drying nozzle 22 is received in the support adsorption holding section 11B to prevent drying out.

[0050] Next, the dressing stone 15 of the adsorption chuck cleaning grinding stone section 10A is rotated, and the arm 14 is lowered. Figure 1 , Figure 2 , Figure 3 This indicates that the device is positioned at the cleaning location and has descended.

[0051] Then, in the adsorption chuck cleaning abrasive section 10A, the rotating dressing abrasive 15 presses (contacts) against the chuck surface 11a of the wafer adsorption chuck section 11A to clean the sludge adhering to the chuck surface 11a. In this sludge cleaning process, cleaning water is sprayed from the abrasive surface of the dressing abrasive 15 and the entire surface of the chuck surface 11a for cleaning, and the cleaned water is discharged to the outside of the chuck surface 11a.

[0052] On the other hand, in the bracket adsorption and holding section cleaning mechanism 10B, cleaning water is sprayed from the water nozzle 19 onto the bracket adsorption and holding section 11B, and the scraper 17 and brush 18 abut against the rotating bracket adsorption and holding section 11B to clean the sludge adhering to the bracket adsorption and holding section 11B. During the sludge cleaning process of the bracket adsorption and holding section 11B, water is sprayed from multiple water spray holes 12b provided on the bracket adsorption and holding section 11B. After wetting the entire bracket adsorption and holding section 11B, water is further sprayed from the water nozzle 19 and the brush 18 comes into contact, so the sludge easily floats up. The scraper 17 is then used to scrape off the sludge, thus the scraping is performed smoothly. Therefore, the cleaning process of the chuck surface 11a of the wafer adsorption chuck section 11A and the cleaning process of the bracket adsorption and holding section 11B can be performed simultaneously.

[0053] Furthermore, after the cleaning processes of the chuck surface 11a of the wafer adsorption chuck section 11A and the support adsorption holding section 11B are completed, the supply of cleaning water from the water nozzle 19, the cleaning water from the dressing stone 15, and the cleaning water from the chuck surface 11a is stopped. Then, the rotation of the dressing stone 15 also stops, the arm 14 rises, and the dressing stone 15 leaves the chuck surface 11a. Then, the adsorption chuck cleaning grinding stone section 10A and the support adsorption holding section cleaning mechanism 10B are moved by the position moving mechanism 10C to... Figure 4 The standby position is shown. Thus, one cycle of cleaning the chuck surface 11a of the wafer chuck 11A and the holder adsorption and holding part 11B is completed, and then, it waits for the instruction to perform cleaning of the chuck surface 11a of the wafer chuck 11A and the holder adsorption and holding part 11B again.

[0054] Therefore, in the cleaning apparatus 10 of this embodiment, the cleaning of the wafer adsorption chuck portion 11A and the cleaning of the support adsorption holding portion 11B can be performed simultaneously, thus enabling automatic cleaning of the chuck surface 11a of the adsorption holding wafer W and the support adsorption holding portion 11B.

[0055] In addition, the support adsorption and holding part 11B is provided with a plurality of water spray holes 12b in the circumferential direction. Therefore, when cleaning the support adsorption and holding part 11B, water is sprayed from the water spray holes 12b provided on the support adsorption and holding part 11B. After wetting the entire support adsorption and holding part 11B, water is further sprayed from the water nozzle 19 and the brush 18 comes into contact. Therefore, the sludge is easier to float up and is scraped off by the scraper 17, thus improving the cleaning effect.

[0056] Furthermore, the wafer chuck portion 11A is provided with water jet holes that spray water from the entire chuck surface 11a when cleaning the wafer chuck portion 11A. Therefore, when cleaning the wafer chuck portion 11A, water can be sprayed from the entire chuck surface 11a of the wafer chuck portion 11A. The dressing stone 15 is brought into contact with the wafer chuck portion while the entire wafer chuck portion is wetted. Therefore, the heat generated when in contact with the dressing stone 15 can be suppressed, and the sludge scraped by the dressing stone 15 can be easily discharged outside the wafer chuck portion 11A.

[0057] Furthermore, the cleaning component 10B of the bracket adsorption and holding section is provided with a spring mechanism 20 for buffering the scraper 17 and brush 18 relative to the bracket adsorption and holding section 11B. Therefore, the spring action of the spring mechanism 20 can buffer and keep approximately constant the force (pushing force) of the scraper 17 and brush 18 against the bracket adsorption and holding section 11B, thereby maintaining a constant force to ensure contact between the scraper 17 and brush 18 and the bracket adsorption and holding section 11B. The spring mechanism 20 can be configured with only one scraper 17 and brush 18, or it can be configured with separate spring mechanisms 20 for the scraper 17 and brush 18. With separate configurations, more precise buffering adjustments can be made.

[0058] In addition, a desiccation prevention nozzle (moistening nozzle) 22 is provided to intermittently supply water to the support adsorption and holding part 11B when the cleaning device 10 is in standby mode. When the cleaning device 10 is in standby mode, water is intermittently supplied to the support adsorption and holding part 11B from the desiccation prevention nozzle 22, so as to prevent the sludge in the support adsorption and holding part 11B from adhering due to dryness.

[0059] Furthermore, in the above embodiments, the following structure is disclosed: when removing sludge from the support adsorption and holding portion 11B, while the wafer adsorption chuck portion 11A is rotated, water is sprayed from the water nozzle 19 onto the support adsorption and holding portion 11B while the brush 18 comes into contact with it, thereby causing the scraper 17 to come into contact with the support adsorption and holding portion 11B and remove the sludge in the order of scraping. However, it is also possible to remove the sludge by having either the brush 18 or the scraper 17 come into contact with it.

[0060] Furthermore, various modifications can be made to this invention as long as they do not depart from its spirit, and this invention naturally includes such modified solutions.

[0061] Explanation of the labels:

[0062] The designation 10 indicates a cleaning device;

[0063] The designation 10A indicates that the adsorption chuck is used to clean the grinding stone section;

[0064] The designation 10B indicates the cleaning mechanism for the holder adsorption and retention section;

[0065] The designation 10C indicates a position movement mechanism;

[0066] The number 11 indicates the chuck mechanism;

[0067] The designation 11A indicates the wafer chuck section;

[0068] The designation 11B indicates the support adsorption and retention section;

[0069] The designation 11a indicates the chuck face;

[0070] The designation 12a indicates an adsorption pore;

[0071] The designation 12b indicates a water jet nozzle;

[0072] The designation 13 indicates the guide rail component;

[0073] The number 14 indicates the arm;

[0074] The designation 14a indicates a flange-shaped component;

[0075] Number 15 indicates a polishing stone;

[0076] The designation 16 indicates the unit base;

[0077] The number 17 indicates a scraper;

[0078] The number 18 indicates a brush;

[0079] The designation 19 indicates a water nozzle;

[0080] The designation 20 indicates a spring mechanism;

[0081] The designation 21 indicates the base component;

[0082] No. 22 indicates a nozzle for preventing drying;

[0083] The number 23 indicates the base;

[0084] The designation 23a indicates the location;

[0085] The designation 101 indicates an adhesive film;

[0086] The designation 102 indicates a ring-shaped support;

[0087] The designation W indicates a wafer.

Claims

1. A cleaning apparatus for a wafer chuck mechanism, the cleaning apparatus comprising: The wafer adsorption chuck section adsorbs and holds the wafer mounted on the ring support via an adhesive film; The device includes an annular support holding portion that holds the annular support on the outside of the wafer chuck portion; the cleaning apparatus for the wafer chuck mechanism includes a support holding portion cleaning mechanism that can move on the support holding portion to clean it; the support holding portion cleaning mechanism includes a scraper and a brush that can contact the support holding portion, and a water nozzle that sprays water onto the support holding portion, wherein the water nozzle, brush, and scraper are arranged sequentially from the upstream side toward the downstream side in the rotation direction of the support holding portion.

2. The cleaning device for the wafer adsorption chuck mechanism according to claim 1, characterized in that, It also includes an adsorption chuck cleaning grinding stone section, which is configured to move on the wafer adsorption chuck section to clean the wafer adsorption chuck section. The bracket adsorption holding section cleaning mechanism is configured to move integrally with the adsorption chuck cleaning grinding stone section.

3. The cleaning apparatus for the wafer adsorption chuck mechanism according to claim 1 or 2, characterized in that, The aforementioned bracket adsorption and holding part has a water jet hole for spraying water onto the bracket adsorption and holding part.

4. The cleaning apparatus for the wafer adsorption chuck mechanism according to claim 1 or 2, characterized in that, The cleaning mechanism for the aforementioned bracket adsorption and holding part has a spring mechanism that elastically absorbs the pushing force exerted by the scraper or the brush on the bracket adsorption and holding part.

5. The cleaning apparatus for the wafer adsorption chuck mechanism according to claim 1 or 2, characterized in that, It also has a humidifying nozzle that intermittently supplies water to the adsorption and holding part of the bracket.

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