Spacecraft active mounting plate and composite method thereof, multifunctional mounting plate manufacturing method

Abstract

The application provides a spacecraft active mounting plate, which comprises a multifunctional mounting plate and an axial channel heat pipe; the multifunctional mounting plate is integrally formed, and the multifunctional mounting plate and the axial channel heat pipe are mechanically connected. Through the cooperation of the multifunctional mounting plate and the axial channel heat pipe, the spacecraft active mounting plate with the integrated design of lightweight structure, mechanical bearing, heat collection and electrical channel can be obtained.

Description

Technical Field

[0001] This invention relates to the field of mechanical manufacturing technology, specifically to an active mounting plate for spacecraft, a composite method thereof, and a method for manufacturing a multifunctional mounting plate. Background Technology

[0002] With the development of high-thrust launch vehicles and high-capacity satellite platform technologies, spacecraft payloads are evolving towards multi-functionality and high power consumption, placing more stringent demands on the heat dissipation capacity and lightweight structure of spacecraft. Active mounting plates are developing into functional structural components that integrate structure, electrical, thermal control, and mechanical functions, and are being used more and more widely on spacecraft.

[0003] Traditional spacecraft active mounting plates are mostly made using a composite molding method of "aluminum honeycomb + aluminum skin + pre-embedded heat pipes", such as the one published in CN111182774. Prior art document A discloses a space radiant heat sink based on an aluminum honeycomb panel, comprising a honeycomb interlayer, a heat dissipation panel bonded to the honeycomb interlayer, an internal heat source heat pipe arranged on the outside of the heat dissipation panel, and a reinforcing panel bonded to the honeycomb interlayer; a heat spreader heat pipe arranged in the honeycomb interlayer, perpendicular to the internal heat source heat pipe, thermally connected to the heat dissipation panel, and bonded to the reinforcing panel; and an insert arranged in the honeycomb interlayer, bonded to both the heat dissipation panel and the reinforcing panel. This molding process is relatively complex, and this design method requires limiting the number of channels and the size of openings on the active mounting plate to ensure the rigidity and strength of the active mounting plate as a load-bearing structure. It is not suitable for high-density, multi-channel phased array loads, limiting the realization of the multi-functional integrated design capability of the active mounting plate and restricting its application environment. Furthermore, in this design method, the internal heat source does not directly exchange or transfer heat with the heat spreader heat pipe; instead, it passes through multiple layers of low thermal conductivity media such as the heat dissipation panel and adhesive layer, increasing contact thermal resistance and limiting heat transfer efficiency.

[0004] Another type of active mounting plate for spacecraft is made using a composite molding method of "aluminum honeycomb + carbon skin + pre-embedded heat pipe". Since the interlayer thermal conductivity of carbon fiber is low, it cannot be used directly as a thermal control functional component. When this active mounting plate is used as a heat collection plate, the design and manufacturing process will be more complex. Moreover, while maintaining the overall strength and rigidity of the active mounting plate, the surface roughness and flatness of the carbon skin are worse than those of the aluminum skin, which is not conducive to the high-precision installation of the back-end modules.

[0005] Composite active mounting plate technology, which relies on assembly, is not suitable for the multi-channel, high-rigidity, and high-precision requirements of highly integrated spacecraft. Furthermore, composite active mounting plates often cannot guarantee low thermocouples and heat dissipation continuity for high-density heat flow in spacecraft. Summary of the Invention

[0006] The technical problem to be solved by this invention is how to produce a spacecraft active mounting plate with a lightweight structure, mechanical load-bearing capacity, heat collection, and integrated electrical channel design.

[0007] The present invention solves the above-mentioned technical problems through the following technical means:

[0008] An active mounting plate for spacecraft includes a multifunctional mounting plate and an axial channel heat pipe; the multifunctional mounting plate is integrally formed, and the multifunctional mounting plate and the axial channel heat pipe are mechanically connected.

[0009] Beneficial effects: Through the cooperation of the multi-functional mounting plate and the axial channel heat pipe, the multi-functional mounting plate is integrally molded, which can achieve a spacecraft active mounting plate with integrated design of lightweight structure, mechanical load-bearing capacity, heat collection and electrical channel.

[0010] Furthermore, the multifunctional mounting plate includes a structural body, a waveguide channel, a heat collection channel, a force coupling interface, and a weight reduction groove; the structural body is a high-strength metal structural component; the waveguide channel is a spacecraft electrical channel, which is set on the structural body according to the electrical layout; the heat collection channel is set on the structural body according to the heat dissipation requirements of the spacecraft's active devices; the force coupling interface is set around the structural body; and the weight reduction groove is set at any position on the structural body other than the waveguide channel, the heat collection channel, and the force coupling interface.

[0011] Beneficial effects: Through the arrangement of the structural body, waveguide channel, heat collection channel, force coupling interface, and weight reduction groove; the structural body is used to support the spacecraft payload structure; the waveguide channel provides a channel for spacecraft electrical signals to transmit spacecraft payload radio frequency signals; the heat collection channel is used to install axial channel heat pipes to form a channel for collecting heat from the spacecraft payload and to uniformly distribute the heat of the payload; the force coupling interface is used to connect with the main load-bearing structure of the spacecraft; and the weight reduction groove is used for the lightweight structural design of the spacecraft.

[0012] Furthermore, the heat collection channel is located in the middle of the waveguide channel.

[0013] Furthermore, the axial channel heat pipe includes a uniform temperature heat pipe and a balancing heat pipe. The uniform temperature heat pipe is fixed inside the heat collection channel, and two sets of balancing heat pipes are installed on both sides of the structure body. The balancing heat pipes are attached to the uniform temperature heat pipe and are orthogonal and perpendicular to the uniform temperature heat pipe.

[0014] Beneficial effects: By setting up uniform heat pipes and balanced heat pipes, the uniform heat pipes are used to collect heat from the spacecraft payload; the balanced heat pipes are used to even out the heat distribution of all uniform heat pipes, ensuring the temperature consistency of active devices in the spacecraft.

[0015] Furthermore, both sides of the uniform temperature heat pipe serve as thermal contact interfaces. One side of the fin is installed inside the heat collection channel by several fasteners. The mounting surface of the fin and the heat collection channel is coated with a high thermal conductivity filler. The balance heat pipe is attached to the other side of the uniform temperature heat pipe.

[0016] Furthermore, the surface of the heat pipe is higher than that of the structural body.

[0017] Beneficial effects: By setting the heat pipe above the structure body, the heat pipe is effectively connected to the upper surface of the heat pipe before the structure body, thus improving the heat transfer effect.

[0018] Furthermore, the multifunctional mounting plate is formed by integrated machining of high-strength lightweight aluminum alloy plate 7A04-T6, and retains the T6 state after machining.

[0019] This invention also discloses a method for manufacturing a multi-functional mounting plate in an active mounting plate for spacecraft as described in any of the above technical solutions, comprising the following steps:

[0020] S200: Material preparation;

[0021] S201: Clamping; The online high-precision tooling plate clamping technology is used to process the high-precision large flat surface of the front waveguide channel, heat collection channel, force coupling interface, weight reduction groove and the back structure body of the multi-functional mounting plate.

[0022] S202: Rough machining; Rough machining of the groove structure on both sides of the multi-functional mounting plate, leaving a machining allowance of 3mm on each side; Discontinuous process ribs are left around the steps on the reverse side and in the middle of the large groove, flush with the highest surface, to ensure the rigidity of the multi-functional mounting plate during machining; Rough machining is performed by using a Φ8 milling cutter to mill the large surfaces at low speed to determine the initial machining datum.

[0023] S203: Heat treatment; Low-temperature stress-relief annealing is adopted as the heat treatment method, mainly to reduce the internal stress of cutting during the rough machining process of the workpiece and the internal stress of the material itself;

[0024] S204: Semi-finishing; Semi-finishing of the groove structure on both sides of the multi-functional mounting plate, with a machining allowance of 1.5mm on each side; The process ribs of the reverse step and the large groove in the middle are retained, and φ3.3 and φ5.5 holes are pre-drilled at some φ4 and φ6.5 hole positions for online clamping during subsequent finishing.

[0025] S205: Heat treatment; Low-temperature stress-relieving annealing heat treatment is adopted to further reduce the internal cutting stress during the workpiece machining process;

[0026] S206: Finishing; Before finishing, both front and back planes are machined uniformly to control the flatness of both surfaces within 0.05mm. Finishing removes 0.05mm of machining allowance to ensure the shape and position accuracy of the waveguide channel and heat collection channel. The finishing process uses a Φ4 milling cutter to high-speed mill the large surface to ensure a flatness of 0.05mm, a flatness of 0.02mm in the online clamping state, and a surface roughness of Ra1.6.

[0027] S207: Heat treatment; Low-temperature stress-relief annealing heat treatment is adopted to completely eliminate cutting internal stress and material internal stress during the machining process of the workpiece;

[0028] S208: Fitter; A separate fitter process is set up to remove sharp edges and burrs from waveguide channels and heat collection channels, and the edges are flat to ensure that there are no protruding burrs or sticky excess materials on both sides;

[0029] S209: Surface treatment; surface treatment using conductive oxidation.

[0030] Beneficial effects: Through the process settings of the multi-functional mounting plate, steps S202, S204, and S206 gradually reduce and correct the deformation of the multi-functional mounting plate during machining by adopting a roughing, semi-finishing, and finishing method to eliminate machining allowances step by step; the three heat treatments in steps S203, S205, and S207 all adopt low-temperature stress-relief annealing, with the heat treatment temperature not exceeding 175℃±10℃. It is necessary to strictly control parameters such as furnace temperature curve and heating rate to effectively ensure that the T6 state of the material remains unchanged. Moreover, stress-relief annealing eliminates the internal stress of the part material and the machining process, reducing the deformation of the multi-functional mounting plate during machining; the alternation of the three milling processes and the three heat treatment processes can better and more promptly eliminate the processing stress of the aluminum alloy material, ensuring the planar accuracy, structural rigidity, and strength of the large-area, thin-walled, deep-cavity, multi-groove multi-functional plate.

[0031] Furthermore, the online high-precision tooling plate clamping technology in S201 is as follows: First, a large-area high-rigidity, high-precision clamping plate tooling is machined, and M3 and M5 threaded mounting holes are machined on the plate tooling. Screw clamping points are arranged using through holes such as φ4 and φ6.5 on the multi-functional mounting plate to be machined. Then, a distributed, multi-point method is adopted in the machining process.

[0032] Beneficial effects: By setting up clamping technology, it is possible to correct and eliminate part deformation caused by vibration and other factors during the machining of large-area thin-walled multi-functional mounting plates to the greatest extent.

[0033] This invention also discloses a composite method for a spacecraft active mounting plate according to any of the above technical solutions, comprising the following steps:

[0034] S100: Aerospace thermal grease is uniformly applied to the fins of the heat pipe that is mounted with the multi-functional mounting plate.

[0035] S101: The uniform temperature heat pipes are sequentially placed into the heat collection channel of the multi-functional mounting plate, and the straightness of the uniform temperature heat pipes is calibrated with tooling to be better than 0.2mm.

[0036] S102: Use M2.5 cross-groove pan head screws to tightly install the heat transfer fins on the lower end face of the heat pipe onto the bottom surface of the heat collection channel of the multi-functional mounting plate, and control the screw tightening torque to be 0.7±0.1Nm;

[0037] S103: Use M2.5 cross-groove pan head screws to vertically and orthogonally attach the heat transfer fins of the balanced heat pipe to the upper end fins of the heat pipe at both ends of the multi-functional mounting plate, and control the screw tightening torque to be 0.7±0.1Nm.

[0038] S104: Silicone rubber is applied to the screw head to prevent loosening.

[0039] The advantages of this invention are:

[0040] This invention utilizes the combination of a multifunctional mounting plate and an axial channel heat pipe, with the multifunctional mounting plate being integrally molded, to achieve a spacecraft active mounting plate with a lightweight structure, mechanical load-bearing capacity, heat collection, and integrated electrical channel design.

[0041] This invention comprises a structural body, a waveguide channel, a heat collection channel, a force coupling interface, and a weight reduction groove. The structural body supports the spacecraft payload structure. The waveguide channel provides a channel for spacecraft electrical signals, used to transmit radio frequency signals of the spacecraft payload. The heat collection channel is used to install axial channel heat pipes to form a channel for collecting heat from the spacecraft payload and to distribute the heat evenly. The force coupling interface is used to connect to the main load-bearing structure of the spacecraft. The weight reduction groove is used for the lightweight structural design of the spacecraft.

[0042] This invention utilizes the configuration of uniformly heated heat pipes and balanced heat pipes. The uniformly heated heat pipes are used to collect heat from the spacecraft payload, while the balanced heat pipes are used to uniformly distribute the heat across all the uniformly heated heat pipes, ensuring temperature consistency for active devices in the spacecraft.

[0043] This invention improves heat transfer efficiency by setting the uniform-temperature heat pipe higher than the structural body, ensuring that the balance heat pipe effectively overlaps with the upper surface of the uniform-temperature heat pipe before the structural body.

[0044] This invention, through the process design of the multi-functional mounting plate, steps S202, S204, and S206 employ a roughing, semi-finishing, and finishing method to gradually reduce and correct deformation of the multi-functional mounting plate during machining by progressively eliminating machining allowances. Steps S203, S205, and S207 involve three heat treatments, all using low-temperature stress-relief annealing with a heat treatment temperature not exceeding 175℃±10℃. Strict control of parameters such as furnace temperature curves and heating rates is required to effectively ensure the material's T6 state remains unchanged. Furthermore, stress-relief annealing eliminates internal stresses in the part material and during machining, reducing deformation of the multi-functional mounting plate during machining. The alternation of three milling processes and three heat treatment processes better and more promptly eliminates machining stress in the aluminum alloy material, ensuring the planar accuracy, structural rigidity, and strength of the large-area, thin-walled, deep-cavity, multi-groove multi-functional plate.

[0045] This invention, through the setting of clamping technology, can correct and eliminate to the greatest extent possible the deformation of parts caused by vibration and other factors during the machining of large-area thin-walled multifunctional mounting plates. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the structure of the spacecraft active mounting plate according to Embodiment 1 of the present invention;

[0047] Figure 2 This is a perspective view of the spacecraft active mounting plate according to Embodiment 1 of the present invention;

[0048] Figure 3 for Figure 2 A magnified view of a portion of the image;

[0049] Figure 4 This is a manufacturing process diagram of the spacecraft active mounting plate according to Embodiment 1 of the present invention. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Example 1

[0052] like Figure 1 , Figure 2 , Figure 3 As shown, this embodiment provides an active mounting plate for spacecraft, including a multi-functional mounting plate 1 and an axial channel heat pipe 2; the multi-functional mounting plate 1 and the axial channel heat pipe 2 are mechanically connected.

[0053] like Figure 1 , Figure 2 , Figure 3 As shown, the multi-functional mounting plate 1 includes a structural body 11, a waveguide channel 12, a heat collection channel 13, a force coupling interface 14, and a weight reduction groove 15. The structural body 11 is a high-strength metal structural component. The waveguide channel 12 is the electrical channel of the spacecraft and is set on the structural body 11 according to the electrical layout. The heat collection channel 13 is set on the structural body 11 according to the heat dissipation requirements of the spacecraft's active devices, and is generally set in the middle of the waveguide channel 12. The force coupling interface 14 is set around the structural body 11 for hoisting, transportation, and mechanical connection with other structural parts of the spacecraft. The weight reduction groove 15 is set at any position on the structural body 11 other than the waveguide channel 12, the heat collection channel 13, and the force coupling interface 14. The layout of the weight reduction groove 15 is for the purpose of lightweighting, with the goal of ensuring the rigidity and strength of the structural body. Together, they constitute a lightweight, multi-functional integrated mounting plate.

[0054] like Figure 1 , Figure 2 , Figure 3 As shown, in this embodiment, the flatness of the front and back mounting surfaces of the multifunctional mounting plate 1 is ≤0.1mm within an area of ​​200mm×200mm. Specifically, the external dimensions of the multifunctional mounting plate 1 are 1600mm×1200mm×20mm, which is a typical large-scale, thin-walled, deep-cavity, high-precision integrated mechanical forming structure. It includes a structural body 11, 2816 waveguide channels 12, 24 heat collection channels 13, and force coupling interfaces 14 including the load-bearing interface between the active mounting plate and the spacecraft mounting platform and the mounting interface of the load arranged inside the active mounting plate, with a number exceeding 10,000. The front of the multifunctional mounting plate 1 is designed with more than 2,000 deep cavities and thin-walled weight-reducing grooves 15.

[0055] like Figure 1 , Figure 2 , Figure 3 As shown, the multi-functional mounting plate 1 is formed by integrated machining of high-strength lightweight aluminum alloy plate 7A04-T6, and retains the T6 state after machining; the flatness of the mounting surface of the structural body 11 is better than 0.5mm, used to support the spacecraft payload structure; the waveguide channel 12 provides a channel for spacecraft electrical signals, used to transmit spacecraft payload radio frequency signals; the flatness of the mounting surface of the heat collection channel 13 is better than 0.2mm, used to install the axial channel heat pipe 2, used to form a channel for collecting heat from the spacecraft payload, and to play a role in uniformly distributing the heat from the payload; the force coupling interface 14 is used to connect with the main load-bearing structure of the spacecraft; the weight reduction groove 15 is used for the lightweight structural design of the spacecraft, and a deep cavity, thin wall weight reduction groove 15 structure is formed by machining the structural body 11 next to the waveguide channel 12, the heat collection channel 13, and the force coupling interface 14.

[0056] like Figure 1 , Figure 2 , Figure 3 As shown, the axial channel heat pipe 2 includes a heat pipe 21 for uniform temperature distribution and a heat pipe 22 for balancing. The heat pipe 21 is an "I-shaped" axial channel heat pipe, with fins on both sides serving as thermal contact interfaces. One side of the fins is installed inside the heat collection channel 13 by several fasteners. The mounting surface of the fins and the heat collection channel 13 is coated with a high thermal conductivity filler. The heat pipe 21 is used to collect heat from the spacecraft payload. The heat pipe 22 is "T-shaped" and consists of two sets, installed on both sides of the structural body 11. The heat pipe 22 is attached to the heat pipe 21. On the other side of the fins, perpendicular to the heat pipe 21, it is used to uniformly distribute the heat of all the heat pipes 21 and ensure the temperature consistency of the active devices in the spacecraft. The surface of the heat pipe 21 after installation is 0.1mm higher than the structure body 11. The 0.1mm higher design ensures that the balance heat pipe 22 effectively overlaps the upper surface of the heat pipe 21 before the structure body 11, improving the heat transfer effect. The straightness of the heat pipe 21 after installation is better than 0.2mm, which ensures that the heat pipe can be effectively started during ground testing and overcomes the problem of anti-gravity.

[0057] In this embodiment, the spacecraft active mounting plate weighs only 22 kg and integrates 1408 antenna channels. The active mounting plate has a uniform temperature and heat collection capacity of 2 kW, and can withstand the 12g acceleration mechanical environment during launch.

[0058] like Figure 4 As shown, the manufacturing method of the multi-functional mounting plate 1 mainly includes the following steps:

[0059] S200: Material preparation; using 7A04-T6 state aluminum alloy material, the use of lightweight, high-strength, and high-hardness aluminum alloy material can ensure structural rigidity under heavy loads;

[0060] S201: Clamping; Utilizing online high-precision tooling plate clamping technology: First, a large-area, high-rigidity, high-precision clamping plate tooling is machined, with M3 and M5 threaded mounting holes machined on the plate tooling. Screw clamping points are arranged using through holes such as φ4 and φ6.5 on the multi-functional mounting plate 1 to be machined. Then, during machining, a distributed, multi-point replacement screw clamping method is used to clamp the multi-functional mounting plate 1 onto the tooling, maximizing the correction and elimination of part deformation caused by vibration and other factors during the machining of the large-area, thin-walled multi-functional mounting plate 1. This clamping method is used for machining the high-precision large flat surfaces of the front waveguide channel 12, heat collection channel 13, force coupling interface 14, weight reduction groove 15, and the reverse structural body 11 of the multi-functional mounting plate 1.

[0061] S202: Rough machining; Rough machining of the groove structure on both sides of the multi-functional mounting plate, leaving a machining allowance of 3mm on each side; Discontinuous process ribs are left around the steps on the reverse side and in the middle of the large groove, flush with the highest surface, to ensure the rigidity of the multi-functional mounting plate during machining; Rough machining is performed by using a Φ8 milling cutter to mill the large surfaces at low speed to determine the initial machining datum.

[0062] S203: Heat treatment; Low-temperature stress-relief annealing is adopted as the heat treatment method, mainly to reduce the internal stress of cutting during the rough machining process of the workpiece and the internal stress of the material itself;

[0063] S204: Semi-finishing; Semi-finishing of the groove structure on both sides of the multi-functional mounting plate, with a machining allowance of 1.5mm on each side; The process ribs of the reverse step and the large groove in the middle are retained, and φ3.3 and φ5.5 holes are pre-drilled at some φ4 and φ6.5 hole positions for online clamping during subsequent finishing.

[0064] S205: Heat treatment; Low-temperature stress-relieving annealing heat treatment is adopted to further reduce the internal cutting stress during the workpiece machining process;

[0065] S206: Finishing; Before finishing, both front and back planes are machined uniformly to control the flatness of both surfaces within 0.05mm. Finishing removes 0.05mm of machining allowance to ensure the shape and position accuracy of the waveguide channel and heat collection channel. The finishing process uses a Φ4 milling cutter to high-speed mill the large surface to ensure a flatness of 0.05mm, a flatness of 0.02mm in the online clamping state, and a surface roughness of Ra1.6.

[0066] S207: Heat treatment; Low-temperature stress-relief annealing heat treatment is adopted to completely eliminate cutting internal stress and material internal stress during the machining process of the workpiece;

[0067] S208: Fitter; The edges of the waveguide channel must not be chamfered. A separate fitter process is set up to remove the sharp edges and burrs of the waveguide channel and the heat collection channel, and the edges must be flat to ensure that there are no protruding burrs or sticky foreign objects on both sides to prevent scratching the front and back of the workpiece. At the same time, sharp edges, burrs and other foreign objects will have an adverse effect on the electrical performance of the waveguide channel.

[0068] S209: Surface treatment; The surface treatment method adopts conductive oxidation, which has a thin conductive oxide film layer and low contact resistance, ensuring the conductivity of the active mounting board and the electrical continuity of the waveguide channel.

[0069] Steps S202, S204, and S206 gradually reduce and correct the deformation of the multi-functional mounting plate 1 during the machining process by adopting roughing, semi-finishing, and finishing methods to eliminate machining allowances step by step.

[0070] The three heat treatments in steps S203, S205 and S207 all adopt low-temperature stress-relief annealing. The heat treatment temperature is not higher than 175℃±10℃. The furnace temperature curve, heating rate and other parameters must be strictly controlled to effectively ensure that the T6 state of the material remains unchanged. Furthermore, stress-relief annealing eliminates the internal stress of the part material and the machining process, reducing the deformation of the multi-functional mounting plate during the machining process.

[0071] The alternating operation of three milling processes and three heat treatment processes can better and more promptly eliminate the processing stress of aluminum alloy materials, ensuring the planar accuracy, structural rigidity, and strength of large-area, thin-walled, deep-cavity, multi-groove multifunctional plates.

[0072] like Figure 1 , Figure 2 , Figure 3 As shown, the composite method for spacecraft active mounting plates mainly includes the following steps:

[0073] S100: Aerospace thermal grease is uniformly applied to the fins of the 24 uniformly heated heat pipes 21 that are related to the installation of the multi-functional mounting plate 1.

[0074] S101: Place 24 uniform temperature heat pipes 21 sequentially into the heat collection channel 13 of the multi-functional mounting plate 1, and use tooling to calibrate the straightness of the uniform temperature heat pipes 21 to be better than 0.2mm.

[0075] S102: Using M2.5 cross-slot pan head screws, the heat transfer fins on the lower end face of the heat pipe 21 are tightly installed on the bottom surface of the heat collection channel 13 of the multi-functional mounting plate 1, and the screw tightening torque is controlled to be 0.7±0.1Nm.

[0076] S103: Using M2.5 Phillips head screws, the heat transfer fins of the balanced heat pipe 22 are vertically and orthogonally attached to the upper end fins of the heat pipe 21 at both ends of the multi-functional mounting plate 1, and the screw tightening torque is controlled to be 0.7±0.1Nm.

[0077] S104: Silicone rubber is applied to the screw head to prevent loosening.

[0078] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A spacecraft active mounting plate, characterized by, It comprises a multifunctional mounting plate (1) and an axial channel heat pipe (2). The multifunctional mounting plate (1) is integrally formed, and the multifunctional mounting plate (1) and the axial channel heat pipe (2) are mechanically connected. The multifunctional mounting plate (1) comprises a structural body (11), a waveguide channel (12) and a heat collecting channel (13). The structural body (11) is a high-strength metal structural member. The waveguide channel (12) is an electrical channel of a spacecraft and is formed on the structural body (11) according to an electrical layout. The heat collecting channel (13) is arranged on the structural body (11) according to the heat dissipation requirement of an active device of the spacecraft. The axial channel heat pipe (2) comprises an isothermal heat pipe (21) and a balance heat pipe (22). The isothermal heat pipe (21) is fixed inside the heat collecting channel (13), and the balance heat pipe (22) is arranged on both sides of the structural body (11) and is attached to the isothermal heat pipe (21) and perpendicular to the isothermal heat pipe (21).

2. A spacecraft active mounting plate according to claim 1, wherein: The multifunctional mounting plate (1) further comprises a force coupling interface (14) and a weight reduction groove (15). The force coupling interface (14) is arranged around the structural body (11), and the weight reduction groove (15) is arranged at any position on the structural body (11) outside the waveguide channel (12), the heat collecting channel (13) and the force coupling interface (14).

3. The spacecraft active mounting panel of claim 1, wherein: The heat collecting channel (13) is arranged at a middle position of the waveguide channel (12).

4. The spacecraft active mounting panel of claim 1, wherein: Both the fins on the front and back surfaces of the isothermal heat pipe (21) serve as a heat contact interface. One fin is mounted inside the heat collecting channel (13) by a plurality of fasteners, and the mounting surface of the one fin and the heat collecting channel (13) are coated with a high-thermal-conductivity filler. The balance heat pipe (22) is attached to the other fin of the isothermal heat pipe (21).

5. The spacecraft active mounting panel of claim 1, wherein: The surface of the isothermal heat pipe (21) is higher than the structural body (11).

6. The spacecraft active mounting panel of claim 1, wherein: The multifunctional mounting plate (1) is integrally machined from a high-strength lightweight aluminum alloy plate 7A04-T6 and remains in the T6 state after machining.

7. A method of manufacturing a multifunctional panel for an active panel of a spacecraft according to any one of claims 1 to 6, characterized in that, The method comprises the following steps: S200: preparing materials; S201: clamping; An online high-precision fixture flat clamping technology is adopted to machine the front waveguide channel (12), the heat collecting channel (13), the force coupling interface (14), the weight reduction groove (15) of the multifunctional mounting plate (1) and the high-precision large plane of the back structural body (11). S202: rough machining; the grooves on the front and back surfaces of the multifunctional mounting plate are rough machined, and a 3mm machining allowance is left on a single side. The step periphery and the middle large groove on the back surface are left with discontinuous process ribs, which are flush with the highest surface to ensure the rigidity of the multifunctional mounting plate during machining. A Φ8 milling cutter is used for low-speed milling of the large surface to determine the initial machining reference. S203: heat treatment; a low-temperature stress relief annealing heat treatment method is adopted to mainly reduce the cutting internal stress in the rough machining process of the workpiece and the internal stress of the material itself. S204: semi-finishing; semi-finishing is performed on the groove structure on the front and back surfaces of the multifunctional mounting plate, with a machining allowance of 1.5 mm on one side; the step on the back surface and the process rib in the middle large groove are reserved, and Φ3.3 and Φ5.5 holes are pre-drilled at the positions of some Φ4 and Φ6.5 holes for subsequent online clamping; S205: heat treatment; low-temperature stress relief annealing heat treatment is adopted to further reduce the cutting internal stress in the machining process of the workpiece; S206: finishing; before finishing, the front and back surfaces are uniformly machined to control the flatness of the two surfaces within 0.05 mm, the machining allowance is removed by 0.05 mm in finishing to ensure the shape and position accuracy of the waveguide channel and the heat collecting channel; Φ4 milling cutter is used for high-speed milling of the large surface in finishing to ensure that the flatness of the large surface is 0.05 mm, the flatness in the online clamping state is 0.02 mm, and the roughness reaches Ra1.6; S207: heat treatment; low-temperature stress relief annealing heat treatment is adopted to completely eliminate the cutting internal stress and material internal stress in the machining process of the workpiece; S208: bench work; a separate bench work process is set up to remove the sharp edges and burrs of the waveguide channel (12) and the heat collecting channel (13), and the edges are smooth to ensure that there is no protruding burr and sticky excess on the two large surfaces; S209: surface treatment; surface treatment is performed by conductive oxidation.

8. The method of claim 7, wherein: The online high-precision tool plate clamping technology in S201 is as follows: a large-area high-rigidity high-precision tool plate is first machined, and M3 and M5 threaded mounting holes are machined on the tool plate; then, the Φ4 and Φ6.5 through holes on the multifunctional mounting plate (1) are used to arrange screw pressing points, and then distributed and multi-point clamping is adopted during the machining process.

9. A method of fabricating a spacecraft active mounting plate as claimed in any one of claims 1 to 6, wherein: The steps include: S100: uniformly applying aerospace heat-conducting silicone grease on the fins of the uniform-temperature heat pipe (21) which has a mounting relationship with the multifunctional mounting plate (1); S101: placing the uniform-temperature heat pipe (21) into the heat collecting channel (13) of the multifunctional mounting plate (1) in sequence, and using a tool to calibrate the straightness of the uniform-temperature heat pipe (21) to be better than 0.2 mm; S102: using M2.5 cross-slot pan head screws to tightly install the heat transfer fins on the lower end surface of the uniform-temperature heat pipe (21) on the bottom surface of the heat collecting channel (13) of the multifunctional mounting plate (1), and controlling the screw tightening torque to be 0.7±0.1 Nm; S103: using M2.5 cross-slot pan head screws to vertically and orthogonally tightly install the heat transfer fins of the balanced heat pipe (22) on the upper end surface fins of the uniform-temperature heat pipe (21) at both ends of the multifunctional mounting plate (1), and controlling the screw tightening torque to be 0.7±0.1 Nm; S104: preventing the screws from loosening by using silicone rubber.

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