Thermal conduction plate manufacturing method and thermal conduction plate manufacturing apparatus

Abstract

The application discloses a heat conducting plate manufacturing method, comprising: preparing a heat conducting plate semi-product with a liquid injection port and a gas extraction port; injecting a working fluid into a chamber of the heat conducting plate semi-product; performing a sealing operation on the heat conducting plate semi-product to make the liquid injection port in a sealed state; performing a temperature feedback pressure adjustment operation on the heat conducting plate semi-product to adjust the pressure in the chamber to ensure that the instantaneous temperature difference between two temperature measurement points of the heat conducting plate semi-product is lower than a threshold value, wherein the temperature feedback pressure adjustment operation comprises heating the heat conducting plate semi-product, extracting gas from the chamber through the gas extraction port to adjust the pressure in the chamber, and fixing the pressure in the chamber when the instantaneous temperature difference is lower than the threshold value; and performing a sealing operation on the gas extraction port of the heat conducting plate semi-product to form a heat conducting plate. The application can ensure that the performance of the heat conducting plate meets the specifications in an automatic manner, thereby improving the manufacturing yield of the heat conducting plate.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a heat-conducting plate, and more particularly to an automated method for manufacturing a heat-conducting plate that ensures its thermal conductivity. Background Technology

[0002] The principle of a heat-conducting plate is to form a cavity inside the plate, fill the cavity with a working fluid (such as water), and then seal the cavity. The working fluid continuously evaporates and condenses within the cavity, thereby achieving rapid heat conduction.

[0003] To ensure good flow efficiency of the working fluid during evaporation and condensation, the pressure inside the heat-conducting plate and the amount of working fluid must be well matched.

[0004] However, in the traditional manufacturing process of heat-conducting plates, the thermal conductivity of the heat-conducting plate is often greatly reduced due to incorrect pressure inside the cavity, such as air leakage during plate encapsulation or incorrect amount of working fluid injected, thereby reducing the manufacturing yield of the heat-conducting plate.

[0005] Therefore, there is an urgent need in this field for a novel method for manufacturing thermal conductive plates. Summary of the Invention

[0006] One objective of this invention is to disclose a method for manufacturing a heat-conducting plate, which can ensure that the performance of the heat-conducting plate meets specifications by adjusting the injection volume of the working fluid and the air pressure in the heat-conducting plate chamber, while measuring the heat conduction effect of the heat-conducting plate, thereby greatly improving the manufacturing yield of the heat-conducting plate.

[0007] Another objective of this invention is to disclose a method for manufacturing a heat-conducting plate, which can be implemented using an automated device to solve the problem that existing heat-conducting plate manufacturing technologies cannot produce heat-conducting plates in large quantities and continuously through an automated production line.

[0008] To achieve the aforementioned objective, a method for manufacturing a heat-conducting plate has been proposed, comprising the following steps:

[0009] A heat-conducting plate semi-finished product having an injection port and an extraction port is prepared in a first workstation; a working fluid is injected into a chamber of the heat-conducting plate semi-finished product in a second workstation; a sealing operation is performed on the heat-conducting plate semi-finished product in a third workstation to seal the injection port; and a temperature-feedback pressure adjustment operation is performed on the heat-conducting plate semi-finished product in a fourth workstation to ensure that the instantaneous temperature difference between two temperature measurement points of the heat-conducting plate semi-finished product is lower than a threshold value, and the extraction port of the heat-conducting plate semi-finished product is sealed to form a heat-conducting plate; wherein the temperature-feedback pressure adjustment operation includes heating the heat-conducting plate semi-finished product, evacuating the chamber through the extraction port to adjust the pressure in the chamber, and fixing the pressure in the chamber when the instantaneous temperature difference is lower than the threshold value.

[0010] In one embodiment, the method for manufacturing the heat-conducting plate further includes real-time detection of the injection volume of the working fluid in the second workstation.

[0011] In one embodiment, the method for manufacturing the heat-conducting plate further includes, in the fourth workstation, performing an airtightness measurement on the heat-conducting plate after the sealing operation is completed.

[0012] In one embodiment, the device used for the sealing operation may be an ultrasonic heating device, a laser heating device, or a resistance welding device.

[0013] In one embodiment, the heat-conducting plate has one or more liquid injection ports and one or more air extraction ports, and the liquid injection ports and the air extraction ports exist independently.

[0014] To achieve the aforementioned objectives, the present invention further proposes a heat-conducting plate manufacturing apparatus, comprising a semi-finished product manufacturing station, a liquid injection station, a liquid injection port sealing station, and a pressure adjustment station, for performing a heat-conducting plate manufacturing method, the manufacturing method comprising the following steps:

[0015] In the semi-finished product manufacturing station, a heat-conducting plate semi-finished product having an injection port and an extraction port is prepared; in the injection station, a working fluid is injected into a chamber of the heat-conducting plate semi-finished product; in the injection port sealing station, a sealing operation is performed on the heat-conducting plate semi-finished product to make the injection port sealed; and in the pressure adjustment station, a temperature feedback pressure adjustment operation is performed on the heat-conducting plate semi-finished product to ensure that the instantaneous temperature difference between two temperature measurement points of the heat-conducting plate semi-finished product is lower than a threshold, and the extraction port of the heat-conducting plate semi-finished product is sealed to form a heat-conducting plate; wherein, the temperature feedback pressure adjustment operation includes heating the heat-conducting plate semi-finished product, evacuating the chamber through the extraction port to adjust the pressure in the chamber, and fixing the pressure in the chamber when the instantaneous temperature difference is lower than the threshold.

[0016] In one embodiment, the manufacturing method further includes real-time detection of the injection volume of the working fluid in the injection workstation.

[0017] In one embodiment, the manufacturing method further includes performing an air tightness measurement on the heat-conducting plate in the pressure adjustment workstation after the sealing operation is completed.

[0018] In one embodiment, the device used for the sealing operation may be an ultrasonic heating device, a laser heating device, or a resistance welding device.

[0019] In one embodiment, the heat-conducting plate has one or more liquid injection ports and one or more air extraction ports, and the liquid injection ports and the air extraction ports each exist independently.

[0020] To enable those skilled in the art to further understand the structure, features, purpose, and advantages of the present invention, detailed descriptions of the accompanying drawings and optional specific embodiments are provided below. Attached Figure Description

[0021] Figure 1 This is a flowchart of an embodiment of the method for manufacturing a thermally conductive plate according to the present invention;

[0022] Figure 2 This is a top view of a semi-finished heat-conducting plate according to the present invention;

[0023] Figure 3 for Figure 2 A cross-sectional schematic diagram of a semi-finished heat-conducting plate;

[0024] Figure 4 for Figure 1 A flowchart illustrating the manufacturing process of a heat-conducting plate;

[0025] Figure 5 for Figure 1 A schematic diagram of heat conduction measurement in the manufacturing method of a heat-conducting plate;

[0026] Figure 6 for Figure 1 A block diagram of equipment for manufacturing heat-conducting plates. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0028] Please refer to the above as well. Figures 1 to 4 ,in, Figure 1 The flowchart shows an embodiment of the thermal conductive plate manufacturing method of the present invention, which is implemented using an automated assembly line manufacturing device; Figure 2 This is a top view of a semi-finished heat-conducting plate according to the present invention; Figure 3 for Figure 2 A schematic cross-sectional view of the heat-conducting plate along section line II; and Figure 4 for Figure 1 A schematic diagram of a process for manufacturing a heat-conducting plate, wherein a heat-conducting plate semi-finished product 20 includes a first shell 21, a second shell 30, a capillary structure 40, a vapor chamber 50 and a plurality of support columns 35.

[0029] like Figure 1 As shown, the method for manufacturing a heat-conducting plate according to the present invention includes the following steps: preparing a heat-conducting plate semi-finished product having a liquid injection port and a venting port in a first workstation (step a); injecting a working fluid into a chamber of the heat-conducting plate semi-finished product in a second workstation (step b); performing a sealing operation on the heat-conducting plate semi-finished product in a third workstation to seal the liquid injection port (step c); and performing a temperature feedback pressure adjustment operation on the heat-conducting plate semi-finished product in a fourth workstation to ensure that the instantaneous temperature difference between two temperature measurement points of the heat-conducting plate semi-finished product is lower than a threshold value, and sealing the venting port of the heat-conducting plate semi-finished product to form a heat-conducting plate; wherein the temperature feedback pressure adjustment operation includes heating the heat-conducting plate semi-finished product, venting air from the chamber through the venting port to adjust the pressure in the chamber, and fixing the pressure in the chamber when the instantaneous temperature difference is lower than the threshold value (step d). Furthermore, the automated production line equipment can utilize a conveyor belt to connect these workstations.

[0030] In step a, the first workstation uses a robotic arm (not shown) to merge and weld the first housing 21 and the second housing 30 to prepare a heat-conducting plate semi-finished product 20 having a liquid injection port 51 and a gas extraction port 39. The heat-conducting plate semi-finished product 20 has a housing formed by merging the first housing 21 and the second housing 30. The housing has a chamber inside to accommodate the capillary structure 40. The second housing 30 has a plurality of support columns 35 to join with the capillary structure 40 to define a vapor chamber 50.

[0031] In step b, a working fluid 60 (e.g., water) is injected into the capillary structure 40 of the heat-conducting plate semi-finished product 20. Specifically, the working fluid 60 first enters the capillary structure 40 through the injection port 51, and then seeps out from the capillary structure 40 into the vapor chamber 50. Furthermore, the second workstation can use a flow sensing device (not shown) to detect the injection volume of the working fluid in real time. Since the flow sensing device is existing technology, it will not be described in detail here.

[0032] In step c, the sealing operation may employ an ultrasonic heating device, a laser heating device, or a resistance welding device to form a weld seal 51a at the injection port 51 and seal the injection port 51.

[0033] In step d, the pressure adjustment operation based on temperature feedback includes heating the heat-conducting plate semi-finished product 20 and evacuating the chamber using the evacuation port 39 to adjust the pressure in the chamber. Evacuation of the chamber is stopped when the temperature difference between two temperature measurement points on the heat-conducting plate semi-finished product 20 falls below a threshold value, thereby fixing the current pressure value in the chamber. Please refer to... Figure 5 , it is Figure 1 A schematic diagram illustrating the measurement of heat conduction effect in the fabrication method of a heat-conducting plate. (See diagram for example.) Figure 5 As shown, a heater 70 is used to heat the heat-conducting plate semi-finished product 20. A first temperature sensor 80 and a second temperature sensor 90 are respectively placed at two temperature measurement points on the heat-conducting plate semi-finished product 20 to measure the temperature difference between the two temperature measurement points. In this step, the present invention adjusts the pressure in the chamber using a vacuum device (not shown) until the temperature difference between the two temperature measurement points is lower than a threshold. That is, when the temperature difference between the two temperature measurement points is lower than a threshold, the present invention determines that the thermal conductivity of the heat-conducting plate 20 meets the specifications, and therefore the pressure value in the chamber can be fixed.

[0034] Additionally, in step d, an ultrasonic heating device, a laser heating device, or a resistance welding device can be used to form a weld seal 39a at the vent 39 to seal the vent 39, thereby completing a heat-conducting plate. Furthermore, after sealing the vent 39, an airtightness test can be performed on the heat-conducting plate to prevent leakage. If leakage is found, the vent 39 can be repaired by welding. Since the ultrasonic heating device, laser heating device, and resistance welding device are all existing technologies, they will not be described in detail here.

[0035] Figure 6 This is a block diagram of an embodiment of the thermal conductivity plate manufacturing equipment of the present invention. Figure 6 As shown, a heat-conducting plate manufacturing equipment 100 includes a semi-finished product manufacturing station 101, a liquid injection station 102, a liquid injection port sealing station 103, and a pressure adjustment station 104 to perform the aforementioned heat-conducting plate manufacturing method. Specifically, the heat-conducting plate manufacturing equipment 100 performs the following steps:

[0036] (a) A heat-conducting plate semi-finished product having a liquid injection port and a gas extraction port is prepared in a semi-finished product manufacturing station 101, which includes using a robotic arm to merge and weld two shells together.

[0037] (ii) A working fluid is injected into a chamber of the semi-finished heat-conducting plate in the injection workstation 102;

[0038] (iii) A sealing operation is performed on the semi-finished heat-conducting plate in the injection port sealing workstation 103 to seal the injection port; and

[0039] (iv) A temperature feedback pressure adjustment operation is performed on the heat conduction plate semi-finished product in the pressure adjustment workstation 104 to ensure that the instantaneous temperature difference between the two temperature measurement points of the heat conduction plate semi-finished product is lower than a threshold, and the air extraction port of the heat conduction plate semi-finished product is sealed to form a heat conduction plate; wherein, the temperature feedback pressure adjustment operation includes heating the heat conduction plate semi-finished product, evacuating the chamber through the air extraction port to adjust the pressure in the chamber, and fixing the pressure in the chamber when the instantaneous temperature difference is lower than the threshold.

[0040] In addition, the heat-conducting plate manufacturing equipment 100 can use a flow sensing device (not shown) of the injection workstation 102 to detect the injection volume of the working fluid in real time. Since the flow sensing device is existing technology, it will not be described in detail here.

[0041] Furthermore, the sealing operation can be performed using an ultrasonic heating device, a laser heating device, or a resistance welding device; the heat-conducting plate has one or more injection ports and one or more extraction ports, and these injection ports and extraction ports are each independent; and the injection ports and extraction ports can be sealed by heating a solder placed therein, or by being directly heated. Since ultrasonic heating devices, laser heating devices, and resistance welding devices are all existing technologies, they will not be described in detail here.

[0042] In addition, the heat-conducting plate manufacturing equipment 100 may have a conveyor belt to automatically transport multiple heat-conducting plate semi-finished products.

[0043] In addition, the heat-conducting plate manufacturing equipment 100 is equipped with a buffer storage area in each of the semi-finished product manufacturing station 101, the liquid injection station 102, the liquid injection port sealing station 103, and the pressure adjustment station 104 to hold the semi-finished products sent from the previous station. Thus, the heat-conducting plate manufacturing equipment 100 can manufacture heat-conducting plates using a highly efficient automated production line. Since automated production lines are existing technology, they will not be described in detail here.

[0044] The present invention has the following advantages through the methods disclosed above:

[0045] 1. The method for manufacturing a heat-conducting plate of the present invention can ensure that the performance of the heat-conducting plate meets the specifications by adjusting the injection amount of the working fluid and the air pressure in the heat-conducting plate chamber, while measuring the heat conduction effect of the heat-conducting plate, thereby greatly improving the manufacturing yield of the heat-conducting plate.

[0046] 2. The heat-conducting plate manufacturing method of the present invention can be implemented using an automated equipment, thereby solving the problem that existing heat-conducting plate manufacturing technology cannot produce heat-conducting plates in large quantities and continuously through an automated production line.

[0047] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention that originate from the inventive concept of the present invention and are easily deduced by those skilled in the art should be included within the protection scope of the present invention.

Claims

1. A method for manufacturing a heat-conducting plate, which utilizes an automated assembly line manufacturing device, comprising the following steps: A heat-conducting plate semi-finished product with a liquid injection port and a gas extraction port is prepared in a first workstation. In a second workstation, a working fluid is injected into a chamber of the semi-finished heat-conducting plate. A sealing operation is performed on the semi-finished heat-conducting plate at a third workstation to seal the injection port; and In a fourth workstation, a temperature feedback pressure adjustment operation is performed on the semi-finished heat-conducting plate to ensure that the real-time temperature difference between two temperature measurement points of the semi-finished heat-conducting plate is lower than a threshold, and the air extraction port of the semi-finished heat-conducting plate is sealed to form a heat-conducting plate; wherein, the temperature feedback pressure adjustment operation includes heating the semi-finished heat-conducting plate, evacuating the chamber through the air extraction port to adjust the pressure in the chamber, and fixing the pressure in the chamber when the real-time temperature difference is lower than the threshold.

2. The method for manufacturing a heat-conducting plate as described in claim 1 further includes real-time detection of the injection volume of the working fluid in the second workstation.

3. The method for manufacturing a heat-conducting plate as described in claim 1 further includes performing an air tightness measurement on the heat-conducting plate in the fourth workstation.

4. The method for manufacturing a thermally conductive plate as described in claim 1, wherein, The sealing operation uses a device selected from a group consisting of an ultrasonic heating device, a laser heating device, and a resistance welding device.

5. The method for manufacturing a heat-conducting plate as described in claim 1, wherein the heat-conducting plate has one or more liquid injection ports and one or more air extraction ports, and the liquid injection ports and the air extraction ports each exist independently.

6. A heat-conducting plate manufacturing equipment, comprising a semi-finished product manufacturing station, a liquid injection station, a liquid injection port sealing station, and a pressure adjustment station, for executing an automated assembly line method for manufacturing heat-conducting plates, the heat-conducting plate manufacturing method comprising the following steps: In this semi-finished product manufacturing station, a heat-conducting plate semi-finished product with a liquid injection port and a gas extraction port is prepared. In this injection workstation, a working fluid is injected into a chamber of the semi-finished heat-conducting plate. In this injection port sealing workstation, a sealing operation is performed on the heat conduction plate semi-finished product to make the injection port a sealed state; as well as In this pressure adjustment workstation, a temperature feedback pressure adjustment operation is performed on the heat-conducting plate semi-finished product to ensure that the real-time temperature difference between the two temperature measurement points of the heat-conducting plate semi-finished product is lower than a threshold, and the air extraction port of the heat-conducting plate semi-finished product is sealed to form a heat-conducting plate; wherein, the temperature feedback pressure adjustment operation includes heating the heat-conducting plate semi-finished product, evacuating the chamber through the air extraction port to adjust the pressure in the chamber, and fixing the pressure in the chamber when the real-time temperature difference is lower than the threshold.

7. The thermal conductivity plate manufacturing equipment as described in claim 6, wherein, The manufacturing method also includes using the injection workstation to monitor the injection volume of the working fluid in real time.

8. The thermal conductivity plate manufacturing equipment as described in claim 6, wherein, The manufacturing method also includes using the pressure adjustment workstation to perform an air tightness measurement on the heat-conducting plate.

9. The thermal conductivity plate manufacturing equipment as described in claim 6, wherein, The sealing operation uses a device selected from a group consisting of an ultrasonic heating device, a laser heating device, and a resistance welding device.

10. The heat-conducting plate manufacturing equipment as described in claim 6, having one or more liquid injection ports and one or more air extraction ports, wherein the liquid injection ports and the air extraction ports each exist independently.

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