A heat dissipation module and an electronic device

Abstract

The application discloses a heat dissipation module and an electronic device. The heat dissipation module comprises a heat pipe module, a wind cooling module and a liquid cooling module. The heat pipe module comprises a hollow and sealed pipe body, a capillary structure arranged on the inner wall surface of the pipe body and a liquid working medium implanted in the pipe body. The heat pipe module defines an evaporation section and a condensation section. The wind cooling module comprises a fin group and a fan cooperating with the fin group to dissipate heat of the fin group. The condensation section of the heat pipe module cooperates with the fin group to form heat exchange. The liquid cooling module comprises a hollow box body. The local position of the heat pipe module cooperates with the liquid cooling module to form heat exchange. At least two interface parts are formed on the box body to communicate the hollow interior of the box body with the outside, so that different use scene requirements can be realized.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat dissipation module and an electronic device. BACKGROUND

[0002] The chip in the computer is the largest heat source when the computer processes operation. In order to quickly eliminate the heat generated by various chips during high-speed operation, so that the chip can maintain normal operation for a long time, most of the existing heat dissipation methods are mainly air-cooled. The air-cooled heat dissipation module uses a heat sink directly attached to the upper surface of the chip to facilitate the conduction of the heat of the chip to the heat sink, and then the cooling air flow provided by the cooling fan arranged in the notebook computer makes the heat absorbed by the heat sink through the cooling air flow to the outlet and to the outside, so as to achieve the air-cooled heat dissipation effect.

[0003] In addition, in some larger computers, or in notebook computers with sufficient internal space, a water-cooled heat dissipation module is also used, which uses a thermal contact device (thermal contact) to contact the upper surface of the chip (commonly known as water cooling head), and the cooling pipe (coolant pipe) is connected to the internal pipe of the heat exchanger (heat transfer) (commonly known as water cooling row) to make the heat conducted to the heat exchanger through the cooling liquid in the cooling pipe, so as to form a water-cooled heat dissipation structure. But the heat exchanger must pass through a large area of heat dissipation fins and cooling air flow of the fan to improve the cooling effect of the water flow.

[0004] From the heat dissipation capacity, the water-cooled heat dissipation module is superior to the air-cooled heat dissipation module, but the water-cooled heat dissipation module also has the defects of large volume and high energy consumption. When people use notebook computers, the chip will not always generate high heat, which depends on the user's use scene, so the efficiency requirement of the notebook computer for heat dissipation is different at different time stages. How to design a high-efficiency heat dissipation module suitable for different use scenes in the small internal space of the notebook computer has become the urgent goal of those engaged in this industry. SUMMARY

[0005] The purpose of the present application is to provide a new heat dissipation module and electronic device which can be applied to different use scenes.

[0006] To achieve the purpose, the present application provides the following technical solutions:

[0007] A heat dissipation module, comprising:

[0008] A heat pipe module includes a hollow and sealed pipe body, a capillary structure arranged on an inner wall surface of the pipe body, and a liquid working substance implanted in an interior of the pipe body, the heat pipe module defining an evaporation section and a condensation section;

[0009] An air cooling module includes a fin group and a fan cooperating with the fin group to dissipate heat from the fin group, the condensation section of the heat pipe module cooperating with the fin group to form heat exchange;

[0010] A liquid cooling module includes a hollow box body, a partial position of the heat pipe module cooperating with the liquid cooling module to form heat exchange;

[0011] At least two interface portions are formed on the box body to communicate the hollow interior of the box body with the outside.

[0012] Further, two ends of the heat pipe module are each provided with an air cooling module, and the liquid cooling module is combined at a middle position of an extension path of the heat pipe module.

[0013] Further, at least the evaporation section of the heat pipe module cooperates with the liquid cooling module to form heat exchange.

[0014] Further, the box body includes oppositely arranged upper and lower plate bodies, an assembly hole is formed through the upper and lower plate bodies along a thickness direction of the box body, and a heat conduction block is assembled and combined in the assembly hole, a lower surface of the heat conduction block is exposed to the lower plate body, and an upper surface of the heat conduction block is exposed to the upper plate body and is in contact with the pipe body of the heat pipe module.

[0015] Further, an assembly groove is recessed in the upper surface of the upper plate body to the lower plate body side, the pipe body of the heat pipe module is assembled and contacted in the assembly groove, the assembly hole of the upper plate body is formed through a bottom surface of the assembly groove, and the upper surface of the heat conduction block is exposed to and flush with the bottom surface of the assembly groove.

[0016] Further, the assembly groove is formed by punching / extruding / pressure casting / processing by a CNC cutting and milling process from the upper surface of the upper plate body downward, and a downward protrusion is formed in the lower surface of the upper plate body corresponding to the position of the assembly groove.

[0017] Further, a raised portion is formed on the lower plate body to protrude upward to the upper plate body side at the edge of the assembly hole, the raised portion is contacted on an inner surface of the assembly groove, and a gap is formed between a partial position of the inner surface of the assembly groove and the inner surface of the lower plate body.

[0018] Further, the raised portion surrounds the assembly hole of the lower plate body.

[0019] Further, a ring wall portion is further formed on the raised portion to protrude upward to the upper plate body side, the ring wall portion surrounds the assembly hole of the lower plate body, the ring wall portion is inserted and contacted in the assembly hole of the upper plate body, and an upper edge of the ring wall portion is flush with the bottom surface of the assembly groove.

[0020] To achieve the aforementioned objective, this application also provides the following technical solution:

[0021] An electronic device includes an electronic device body comprising a housing and at least one heating element installed inside the housing; it further includes a heat dissipation module as described in any of the above claims, the heat dissipation module being installed inside the housing and attached to the at least one heating element; the two interface portions are exposed outside the housing.

[0022] Compared with the prior art, the beneficial effects of this application are: the heat dissipation module can be applied to different usage scenarios, has strong heat dissipation performance, and is conducive to energy saving of electronic devices. Attached Figure Description

[0023] Figure 1 This is a three-dimensional schematic diagram of the heat dissipation module of this application.

[0024] Figure 2 yes Figure 1 A three-dimensional schematic diagram of the heat dissipation module from another angle.

[0025] Figure 3 yes Figure 1 The image shows a partial disassembly of the heat dissipation module, specifically showing the separation of the heat pipe module.

[0026] Figure 4 yes Figure 1 The disassembly diagram shows a portion of the heat dissipation module, specifically separating the heat pipe module and the heat conduction block.

[0027] Figure 5 yes Figure 1 The disassembly diagram shows a portion of the heat dissipation module, specifically separating the heat pipe module, the upper plate, and the heat conduction block.

[0028] Figure 6 yes Figure 2 The disassembly diagram shows a portion of the heat dissipation module, specifically the separation of the heat-conducting block.

[0029] Figure 7 yes Figure 1 Top view of the heat dissipation module.

[0030] Figure 8 yes Figure 7 The image shows a partial disassembly of the heat dissipation module, specifically showing the separation of the housing.

[0031] Figure 9 It is self Figure 7 A cross-sectional view along line AA in the middle.

[0032] Figure 10 It is self Figure 7 A cross-sectional view along the BB line. Detailed Implementation

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0034] Please refer to Figures 1 to 10 As shown in the figure, the heat dissipation module disclosed by the present application comprises a heat pipe module 1, an air cooling module 2 and a liquid cooling module 3 which cooperate with each other. The heat dissipation module is used to be assembled into an electronic device for dissipating heat from a heat source inside the electronic device. The electronic device can be a notebook computer or the like.

[0035] The heat pipe module 1 mainly comprises two parallel heat pipes, each of which comprises a hollow pipe body 11, a capillary structure (such as a metal layer formed by sintering metal powder or a metal mesh implanted) arranged on the inner wall surface of the pipe body 11, and a liquid working medium (such as water) implanted in the inside of the pipe body 11. The heat pipe module 1 defines an evaporation section 101 and a condensation section 102. During operation, the heat is transferred by the state change of the liquid working medium in the pipe. Specifically, when the evaporation section 101 of the heat pipe is heated (absorbs heat from the heat source), the liquid working medium in the pipe vaporizes, the vapor flows quickly to the condensation section 102 after vaporization, and the condensed vapor releases latent heat to the heat dissipation area (i.e. the condensation section 102). The condensed vapor returns to the evaporation section 101 under the action of capillary force and gravity, continues to be heated and vaporized, and the cycle continues. The heat pipe module 1 is mainly used for rapid heat transfer.

[0036] Please refer to Figures 3 to 6 As shown in the figure, the air cooling module 2 comprises a fin group 21 for heat dissipation and a fan 22 cooperating with the fin group 21 to dissipate heat from the fin group 21. The condensation section 102 of the heat pipe module 1 cooperates with the fin group 21 to form heat exchange. The fin group 21 is used to exaggerate the heat dissipation area, and the fan 22 is used to form air flow to accelerate the heat dissipation of the fin group 21.

[0037] Please refer to Figures 1 to 10 As shown in the figure, one air cooling module 2 is arranged at each end of the heat pipe module 1, and the liquid cooling module 3 is combined at the middle position of the extension path of the heat pipe module 1. The liquid cooling module 3 comprises a hollow box body 30, and the local position of the heat pipe module 1 cooperates with the liquid cooling module 3 to form heat exchange. Preferably, the evaporation section 101 of the heat pipe module 1 cooperates with the liquid cooling module 3 to form heat exchange.

[0038] The box body 30 comprises an upper plate body 31 and a lower plate body 32 arranged oppositely, and the periphery of the upper plate body 31 and the lower plate body 32 is sealed and combined into one body (for example, by welding). A meandering liquid flow channel (not numbered) is formed between the upper plate body 31 and the lower plate body 32. Two interface parts 301 are formed on one side of the box body 30 to communicate the two ends of the meandering liquid flow channel formed in the hollow interior of the box body 30 with the outside.

[0039] Please refer to Figures 3 to 6 As shown, an assembly hole 302 is formed through the upper plate body 31 and the lower plate body 32 in the thickness direction of the box body 30. A heat-conducting block 4 (preferably a copper block with good heat-conducting performance) is implanted and fixed in the assembly hole 302. The lower surface of the heat-conducting block 4 is exposed outside the lower plate body 32 to contact the heat source to form heat exchange. The upper surface of the heat-conducting block 4 is exposed outside the upper plate body 31 to contact the pipe body 11 of the heat pipe module 1 to form heat exchange. Preferably, the upper surface of the heat-conducting block 4 corresponds to the evaporation section 101 of the pipe body 11.

[0040] The upper surface 311 of the upper plate body 31 is recessed towards the lower plate body 32 to form an assembly groove 310, and the pipe body 11 of the heat pipe module 1 is assembled and attached in the assembly groove 310 and can be fixed by welding. The assembly hole 302 of the upper plate body 31 is formed through the bottom surface 3101 of the assembly groove 310. The upper surface of the heat-conducting block 4 is exposed upwards to the bottom surface 3101 of the assembly groove 310 and is flush with the bottom surface 3101. The assembly groove 310 can be formed by downward cutting and milling of the upper surface of the plate-shaped upper plate body 31. Preferably, the assembly groove 310 is formed by punching, extruding, die casting or CNC milling process of the upper surface 311 of the upper plate body 31, and the lower surface 312 of the upper plate body 31 corresponds to the position of the assembly groove 310 to form a downward protrusion.

[0041] Please refer to Figure 9 , Figure 10 and combine Figures 3 to 6 As shown, the lower plate body 32 has a raised portion 321 protruding towards the upper plate body 31 at the edge of the assembly hole 302, and the raised portion 321 is attached upwards to the inner surface 3102 of the assembly groove 310. A gap 30 (see Figure 10 ) is formed between part of the inner surface 3102 of the assembly groove 310 and the inner surface 322 of the lower plate body 32, and the gap 30 forms part of the meandering liquid flow channel. The raised portion 321 is arranged around the assembly hole 302 of the lower plate body 32.

[0042] Further, the raised portion 321 is further protruded upwardly to the side of the upper plate body 31 and forms a ring wall portion 323, which surrounds the assembly hole 302 of the lower plate body 32, and the ring wall portion 323 is inserted and fitted into the assembly hole 302 of the upper plate body 31, and the upper edge of the ring wall portion 323 is flush with the bottom surface 3101 of the assembly groove 310 and is in contact with the pipe body 11.

[0043] In use, the heat from the heat source can be directly transmitted to the heat pipe module 1 through the heat conduction block 4. The heat from the heat source can also be transmitted to the box body 30 of the liquid cooling module 3 through the heat conduction block 4, or directly to the box body 30 of the liquid cooling module 3.

[0044] The heat dissipation module of the present application can be installed inside a notebook computer. The two interface portions 301 are exposed outside the shell of the notebook computer. When the notebook computer generates a small amount of heat in operation, the heat can be transmitted to the air cooling module 2 through the heat pipe module 1 to achieve heat dissipation. When the notebook computer generates a large amount of heat in operation, the liquid cooling module 3 can participate in heat dissipation at the same time. At this time, the liquid cooling module 3 also needs to be externally connected to a liquid cooling external module (not shown) through the two interface portions 301. The liquid cooling external module can include a liquid pump (not shown), a water cooling radiator (not shown), and a delivery pipe (not shown). The delivery pipe connects the two interface portions 301, the liquid pump, and the water cooling radiator in series to form a liquid circulation closed loop. In operation, the liquid pump injects low-temperature liquid into the box body 30 through one interface portion 301, absorbs the heat transmitted from the heat source through the circuitous liquid flow channel, and then flows out through the other interface portion 301. After being cooled by the water cooling radiator, the liquid flows back into the box body 30, and the cycle is repeated to achieve rapid heat dissipation.

[0045] It should be noted that the electronic device in the present application can refer to a notebook computer, a desktop computer (PC), a tablet computer, or a server (SERVER), etc. devices, and is not limited to these devices, but is preferably or more preferably applicable to thinner notebook computers.

[0046] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation module, characterized in that, The application relates to a heat dissipation module, comprising: a heat pipe module, comprising a hollow and sealed pipe body, a capillary structure arranged on the inner wall surface of the pipe body, and a liquid working medium implanted in the interior of the pipe body, wherein the heat pipe module defines an evaporation section and a condensation section; a wind cooling module, comprising a fin group and a fan cooperating with the fin group to dissipate heat from the fin group, wherein the condensation section of the heat pipe module cooperates with the fin group to form heat exchange; a liquid cooling module, comprising a hollow box body, wherein the box body comprises oppositely arranged upper and lower plate bodies, the upper surface of the upper plate body is recessed downward to form an assembly groove, and the pipe body of the heat pipe module is assembled and fitted in the assembly groove; an assembly hole, which is formed through the upper and lower plate bodies along the thickness direction of the box body and is located in the assembly groove; a heat conduction block, which is assembled and combined in the assembly hole, wherein the lower surface of the heat conduction block is exposed to the lower plate body, the upper surface of the heat conduction block is exposed to the bottom surface of the assembly groove and is in contact with the lower surface of the heat pipe module assembled in the assembly groove; and at least two interface parts, which are formed on the box body and are connected between the hollow interior and the outside of the box body. The two ends of the heat pipe module are respectively provided with one wind cooling module, and the liquid cooling module is combined at the middle position of the extension path of the heat pipe module. At least the evaporation section of the heat pipe module cooperates with the liquid cooling module to form heat exchange. The upper surface of the heat conduction block is exposed to the bottom surface of the assembly groove and is flush with the bottom surface. The assembly groove is formed by punching / extruding / pressure casting / processing by a CNC cutting and milling process on the upper surface of the upper plate body, and the lower surface of the upper plate body is provided with a downward protrusion corresponding to the position of the assembly groove. The lower plate body is provided with a raised portion protruding upward to the upper plate body side at the edge of the assembly hole, and the raised portion is fitted on the inner surface of the assembly groove. A gap is formed between the inner surface of the assembly groove and the inner surface of the lower plate body at a part position.

2. The heat dissipating module of claim 1, wherein, The raised portion protrudes further upward to the upper plate body side to form a ring wall portion around the assembly hole of the lower plate body.

3. The heat dissipating module of claim 1 or 2, wherein, The ring wall portion is inserted and fitted in the assembly hole of the upper plate body, and the upper edge of the ring wall portion is flush with the bottom surface of the assembly groove.

4. The heat dissipating module of claim 1, wherein The application further comprises the heat dissipation module as claimed in any one of claims 1 to 9, which is installed in the interior of the shell and is fitted on the at least one heat generating element, and the two interface parts are exposed to the outside of the shell.

5. The heat dissipating module of claim 1, wherein ​ 6. The heat dissipating module of claim 1, wherein the heat dissipating module is configured to be mounted on a surface of a device. ​ 7. The heat dissipating module of claim 1, wherein the heat dissipating module is a heat dissipating module for a notebook computer. ​ 8. The heat dissipating module of claim 6, wherein the heat dissipating module is configured to be mounted on a surface of a device. ​ 9. The heat dissipating module of claim 6 or 8, wherein the heat dissipating module further comprises a plurality of fins disposed on the heat sink. ​ 10. An electronic device, provided with an electronic device body, comprising a housing and at least one heat generating element mounted inside the housing; characterized in that, ​

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