An ACF double-sided attaching device and an ACF double-sided attaching method

Abstract

This invention relates to an ACF double-sided bonding apparatus and method, comprising: a mounting base, an upper bonding mechanism and a lower bonding mechanism connected to the mounting base, and a drive assembly connected to the upper bonding mechanism. The upper bonding mechanism includes a mounting plate connected to the mounting base, an upper back plate connected to the mounting plate via a slide rail assembly, an upper bonding CCD vision component connected to the mounting plate, an upper bonding pressure head assembly connected to the upper back plate, and a lower bonding back support assembly. The lower bonding mechanism includes a lower back plate connected to the mounting base, a lower bonding pressure head assembly connected to the lower back plate, a lower bonding CCD vision component, and an upper bonding back support assembly. The upper bonding pressure head assembly, in conjunction with the lower bonding back support assembly, bonds ACF to the upper surface of the glass substrate, and the lower bonding pressure head assembly, in conjunction with the upper bonding back support assembly, bonds ACF to the lower surface of the glass substrate. This invention achieves the effect of bonding ACF to both the upper and lower surfaces of the glass substrate without flipping the glass substrate.

Description

Technical Field

[0001] This invention relates to the field of liquid crystal module bonding technology, and in particular to an ACF double-sided bonding apparatus and a ACF double-sided bonding method. Background Technology

[0002] With the advancement of technology, electronic products are constantly evolving towards smaller, stronger, and thinner designs, placing increasingly higher demands on their screens. Traditional display methods, such as CRT monitors and LED displays, are no longer sufficient to meet market demands due to their high power consumption and large size. Consequently, low-power, small-sized, and zero-radiation LCD screens are gaining a significant market share. The market demand for LCD screens (LCDs) increases annually, leading to ever-increasing demands on LCD manufacturing efficiency. LCD production requires bonding equipment to attach the LCD modules, with ACF (Anisotropic Conductive Film) attachment being a crucial component. Currently, most ACF attachment devices on the market first attach ACF to the upper bonding area of ​​the glass substrate, then flip the substrate and attach ACF to the lower bonding area, resulting in a long production time for the entire LCD module. Therefore, improving ACF attachment efficiency has become a key factor in enhancing LCD production efficiency.

[0003] Utility model publication CN213987101U discloses an automatic ACF (Anti-Frost Compound) attaching mechanism. The mechanism places materials at the top of two conveyor belts, turns on the motor, and drives the two conveyor belts via two transmission shafts, transporting the material from right to left to the top plate. Multiple hydraulic cylinders extend, lifting the material from the top plate. A vacuum pump is then activated, and multiple vacuum suction cups, connected by a third suction pipe, a first suction pipe, and multiple second suction pipes, hold the material. The material is then assembled by the ACF attaching machine. Finally, multiple hydraulic cylinders retract, returning the material to the top of the two conveyor belts, which then transport the assembled material out. During production, the material is transported to the ACF attaching machine for ACF attachment, and then transported out. The ACF is attached to the upper surface of the material during transport; attaching ACF to the other side of the material requires repeating this process, resulting in a long overall production cycle.

[0004] Chinese patent application CN110001179A discloses an ACF (Anoxical Concrete) bonding and pressing device, including a frame, a feeding mechanism, and a strip feeding mechanism, both of which are fixedly connected to the frame. The feeding mechanism includes a servo feeding module and a clamping platform. The strip feeding mechanism includes a support plate, a feeding tray, and a receiving tray, which are fixedly connected to the support plate on the side near the feeding mechanism. The frame also includes a pressing mechanism, a shearing mechanism, a peeling mechanism, and a detection mechanism. The pressing mechanism includes a pressing cylinder, a pressing head mounting plate, a heating block, and a pressing head. Hooks are connected to both sides of the pressing head mounting plate. The shearing mechanism includes a front and rear clearance cylinder, a manual fine-tuning slide, a shearing cylinder, and a cutter. After the material is bonded with ACF on this device, other processes are required to help flip the material over for ACF bonding on the other side. The ACF bonding process involves multiple steps and takes a long time. Summary of the Invention

[0005] The main objective of this invention is to provide an ACF double-sided bonding device to improve ACF bonding efficiency. Specifically, by setting up upper and lower bonding mechanisms in the ACF bonding device, ACF can be bonded to the upper and lower sides of the product at the same workstation, reducing production steps and improving ACF efficiency.

[0006] The second main objective of this invention is to provide a method for double-sided ACF bonding, so as to achieve ACF bonding on both sides of a product in one workstation.

[0007] The main objective of this invention is achieved through the following technical solution:

[0008] A double-sided ACF bonding device is proposed, comprising:

[0009] Mounting base;

[0010] The upper attachment mechanism is located on the upper part of the mounting base. The upper attachment mechanism includes an upper back plate that can be raised and lowered relative to the mounting base and corresponds to the same work station, an upper attachment pressure head assembly that is linked to the upper back plate, and a lower back support abutment block that is not linked to the upper attachment pressure head assembly and corresponds to the lower part of the upper attachment pressure head assembly.

[0011] The lower attachment mechanism is located at the lower part of the mounting base in a staggered manner. The lower attachment mechanism includes an upper back support abutment block that is linked to the upper back plate, a lower back plate, and a lower attachment pressure head assembly that is disposed on the lower back plate and corresponds to the lower part of the upper back support abutment block.

[0012] The upper back support abutment block has a lower clearance notch and a lower protrusion forming the lower clearance notch. The upper back support abutment block and the upper attachment pressure head assembly are linked and lifted based on the upper back plate. The lower back support abutment block is disposed on the lower back plate.

[0013] By adopting the above technical solution, the mounting base supports the upper attachment mechanism and the lower attachment mechanism, connecting the two to the same workstation. The upper attachment pressure head assembly, in conjunction with the lower back support, abuts against the ACF on the upper surface of the glass substrate, and the lower attachment pressure head assembly, in conjunction with the upper back support, abuts against the ACF on the lower surface of the glass substrate.

[0014] In a preferred embodiment, the present invention may be further configured such that: the mounting base includes two upright plates for connecting the upper attachment mechanism and the lower attachment mechanism, two base plates respectively connected to the lower ends of the upright plates, and a connecting plate located between the two upright plates for connecting the two upright plates.

[0015] By employing the aforementioned preferred technical features, the upper attachment mechanism and the lower attachment mechanism are fixedly connected by the two upright plates, and the connecting plate connects the two upright plates to improve the stability of the mounting base. The base plate supports the mounting base and fixes the mounting base to the ground or other device.

[0016] In a preferred embodiment, the present invention may be further configured such that: an upper CCD vision component is mounted above the upper attachment pressure head assembly and fixedly connected to the mounting plate, and a lower CCD vision component is mounted below the lower attachment pressure head assembly and fixedly connected to the lower back plate.

[0017] By employing the aforementioned preferred technical features, the upper attached CCD vision component is fixedly connected using the mounting plate, preventing it from moving with the upper backplate and providing a stable shooting alignment environment. The upper attached CCD vision component and the lower attached CCD vision component are used for alignment before ACF is attached to the glass substrate surface, ensuring that the ACF can be attached to the designated position.

[0018] In a preferred embodiment, the present invention may be further configured such that: the upper attachment pressure head assembly includes an upper attachment pressure head and an upper pressure head cylinder, the upper pressure head cylinder is fixedly connected to the lower end of the upper back plate, the upper attachment pressure head has a heating function to melt ACF, the upper attachment pressure head is connected to the lower end of the upper pressure head cylinder, and the upper pressure head cylinder drives the upper attachment pressure head to move along the Z-axis direction.

[0019] By adopting the above-mentioned preferred technical features, the upper attachment pressure head first melts the ACF, and then the upper pressure head cylinder drives the upper attachment pressure head to descend and press against the upper surface of the glass substrate to cooperate with the lower back support block to attach the ACF to the upper surface of the glass substrate.

[0020] In a preferred embodiment, the present invention may be further configured such that: the upper back support abutment block is connected to the upper back support fixing block and is fixedly connected to the upper back plate through the upper back support fixing block; the lower protrusion at the lower end of the upper back support abutment block presses against the upper surface of the glass substrate; the first ACF film attached to the upper surface of the glass substrate is located at the lower clearance notch at the lower end of the upper back support abutment block and the first ACF film does not contact the lower clearance notch.

[0021] By adopting the above-mentioned preferred technical features, the upper surface of the glass substrate is pressed against the protrusion at the lower end of the upper back support block, which can effectively prevent the first ACF film on the upper surface of the glass substrate from being damaged when ACF is attached to the lower surface of the glass substrate.

[0022] In a preferred embodiment, the present invention may be further configured such that: the upper back plate is connected to the mounting plate via a slide rail assembly, the slide rail assembly including a slider and a guide rail, the guide rail being connected to the mounting plate, one end of the slider being snapped onto the guide rail and the other end being connected to the upper back plate.

[0023] By employing the aforementioned preferred technical features, the upper back plate is connected to the slider so that the upper back plate can only move along the track direction of the guide rail, preventing the upper back plate from shaking or shifting during the movement.

[0024] In a preferred embodiment, the present invention may be further configured such that: the mounting plate is fixedly connected to the upper part of the mounting base; the drive assembly includes a lead screw assembly and a motor; one end of the lead screw assembly is connected to the upper back plate and the other end is connected to the motor; and the motor is fixedly connected to the mounting plate to provide rotational power for the lead screw assembly.

[0025] By employing the aforementioned preferred technical features, the motor drives the lead screw assembly to rotate, thereby causing the upper back plate connected to the lead screw assembly to move along the Z-axis. When the upper back plate descends, the lower end of the upper back support block protrudes and abuts against the upper surface of the glass substrate. When the upper back plate rises, a safe movement space is provided for the glass substrate between the upper attachment mechanism and the lower attachment mechanism.

[0026] In a preferred embodiment, the present invention may be further configured such that: the lower attachment pressure head assembly includes a lower pressure head cylinder and a lower attachment pressure head, the lower pressure head cylinder is connected to the lower back plate, the lower attachment pressure head has a heating function to melt ACF, the lower attachment pressure head is connected to the upper end of the lower pressure head cylinder, and the lower pressure head cylinder drives the lower attachment pressure head to move along the Z-axis.

[0027] By employing the aforementioned preferred technical features, the lower pressing head is driven by the lower pressing head cylinder to rise and press against the lower surface of the glass substrate, thereby cooperating with the upper back support block to perform ACF attachment on the lower surface of the glass substrate.

[0028] In a preferred embodiment, the present invention may be further configured as follows: the upper end of the lower back support abutment block is provided with an upper clearance notch and an upper protrusion constituting the upper clearance notch; the lower back support abutment block is connected to the lower back support fixing block and fixedly connected to the lower back plate through the lower back support fixing block; the upper protrusion abuts against the lower surface of the glass substrate; and the position where the second ACF film is attached to the lower surface of the glass substrate is located at the upper clearance notch at the upper end of the lower back support abutment block.

[0029] By adopting the above-mentioned preferred technical features, the upper protrusion at the upper end of the lower back support abutment block abuts against the lower surface of the glass substrate, and the ACF attachment position on the lower surface of the glass substrate is located at the upper clearance notch. When attaching ACF to the upper surface of the glass substrate, the ACF attachment position on the lower surface of the glass substrate can be avoided from getting dirty.

[0030] The second main objective of this invention is achieved through the following technical solution:

[0031] This invention provides an ACF double-sided bonding method based on an ACF double-sided bonding device, the ACF double-sided bonding method comprising:

[0032] S1, The glass substrate is mounted on the ACF double-sided bonding device;

[0033] S2, perform upper ACF attachment, wherein the glass substrate is located in the upper pressing area of ​​the same station, and the upper back plate drives the upper attachment pressure head to press down, forming a first ACF film on the upper surface of the glass substrate.

[0034] S3, perform lower ACF attachment, wherein the glass substrate is located in the lower pressing area of ​​the same station. The upper back plate drives the relative downward pressing of the upper back support abutment block and the upward pressing of the lower attachment pressure head to form a second ACF film on the lower surface of the glass substrate. The upper back support abutment block has a lower clearance notch and a lower protrusion constituting the lower clearance notch. During the formation of the second ACF film, the lower protrusion presses against the upper surface of the glass substrate without contacting the first ACF film. The upper back support abutment block and the upper attachment pressure head move up and down in a linked manner.

[0035] By adopting the above technical solution, the glass substrate is subjected to ACF bonding of its upper and lower surfaces sequentially at the same station of the ACF double-sided bonding device, and the glass substrate does not need to be flipped during ACF bonding, which simplifies the ACF bonding process of the glass substrate and reduces the ACF bonding time of the glass substrate.

[0036] In a preferred embodiment, the present invention may be further configured such that the glass substrate is vacuum adsorbed onto the transfer platform and the ACF attachment position of the glass substrate extends out of the transfer platform.

[0037] By employing the aforementioned preferred technical features, the glass substrate can be vacuum-adsorbed and fixed using the transfer platform, providing a support point for attaching ACF to the glass substrate. The ACF attachment position on the glass substrate extends beyond the transfer platform, effectively avoiding interference from the transfer platform during ACF attachment.

[0038] In summary, the present invention has at least one of the following beneficial technical effects:

[0039] 1. Glass substrates can be double-sided bonded with ACF in an ACF double-sided bonding device, reducing ACF bonding time and processes and improving ACF bonding efficiency.

[0040] 2. The raised design of the upper and lower back support blocks ensures that there is no issue with the order of attachment of the upper and lower parts of the glass substrate when ACF is applied, and the attachment order does not affect the ACF application quality. Attached Figure Description

[0041] Figure 1 A schematic diagram illustrating the structure of the ACF double-sided bonding device according to a preferred embodiment of the present invention is shown.

[0042] Figure 2 A schematic diagram illustrating the structure of the mounting base in the ACF double-sided bonding device according to a preferred embodiment of the present invention;

[0043] Figure 3 An exploded view of the upper part of the ACF double-sided bonding device according to a preferred embodiment of the present invention is shown.

[0044] Figure 4 A schematic diagram illustrating the lower part of the ACF double-sided bonding device according to a preferred embodiment of the present invention;

[0045] Figure 5 A side view illustrating the attachment principle of the lower attachment mechanism in the ACF double-sided attachment method of a preferred embodiment of the present invention;

[0046] Figure 6 A side view illustrating the attachment principle of the upper attachment mechanism in the ACF double-sided attachment method of a preferred embodiment of the present invention is shown.

[0047] Reference numerals: 10. Mounting base; 11. Vertical plate; 111. Left vertical plate; 112. Right vertical plate; 12. Base plate; 121. Left base plate; 122. Right base plate; 13. Connecting plate; 20. Upper attachment mechanism; 21. Upper attachment pressure head assembly; 211. Upper attachment pressure head; 212. Upper pressure head cylinder; 22. Upper attachment CCD vision assembly; 221. Upper CCD camera; 222. Upper camera fixing block; 23. Lower attachment back support assembly; 231. Lower back support fixing block; 232. Lower back support abutment block; 24. Upper back plate; 25. Mounting plate; 26. Slide rail assembly ; 261, slider; 262, guide rail; 30, lower attachment mechanism; 31, lower attachment pressure head assembly; 311, lower attachment pressure head; 312, lower pressure head cylinder; 32, lower attachment CCD vision assembly; 321, lower CCD camera; 322, lower camera fixing block; 33, upper attachment back support assembly; 331, upper back support fixing block; 332, upper back support abutment block; 34, lower back plate; 40, drive assembly; 41, lead screw assembly; 42, motor; 50, transplanting platform; 51, air hole; 60, glass substrate; 71, first ACF film; 72, second ACF film. Detailed Implementation

[0048] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments for understanding the inventive concept of the present invention, and cannot represent all embodiments, nor are they interpreted as the only embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art under the premise of understanding the inventive concept of the present invention are within the scope of protection of the present invention.

[0049] It should be noted that if directional indicators (such as up, down, left, right, front, back, etc.) are involved in the embodiments of the present invention, these directional indicators are only used to explain the relative positional relationships and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly. To better understand the technical solution of the present invention, an ACF double-sided attachment device of the present invention will be described and explained in further detail below, but this should not be construed as limiting the scope of protection of the present invention.

[0050] Figure 1 A schematic diagram of an ACF double-sided bonding device is shown. Figure 2 A schematic diagram illustrating the structure of the mounting base in the ACF double-sided bonding device according to a preferred embodiment of the present invention; Figure 3 An exploded view of the upper part of the ACF double-sided bonding device according to a preferred embodiment of the present invention is shown. Figure 4 A schematic diagram illustrating the lower portion structure of the ACF double-sided bonding device according to a preferred embodiment of the present invention is shown. (Refer to...) Figure 1The ACF double-sided bonding device disclosed in this embodiment of the invention includes: a mounting base 10, an upper bonding mechanism 20, a lower bonding mechanism 30, and a driving assembly 40.

[0051] Reference Figure 2 The mounting base 10 includes two vertically placed upright plates 11, two base plates 12 respectively connected to the bottom of the upright plates 11, and a connecting plate 13 placed between and connecting the two upright plates 11. The two upright plates 11 are a left upright plate 111 and a right upright plate 112, both of which are stepped in shape, narrower at the top and wider at the bottom. The upper surfaces of the two base plates 12 are fixedly connected to the bottom of the two upright plates 11 to support them, and the lower surfaces of the two base plates 12 are fixedly connected to the ground or to other devices. The connecting plate 13 is vertically connected between the two upright plates 11 to fix the distance between them, making the overall structure of the mounting base more stable.

[0052] Reference Figure 1 and Figure 3The upper attachment mechanism 20 includes: an upper attachment pressure head assembly 21, an upper attachment CCD vision assembly 22, a lower attachment back support assembly 23, an upper back plate 24, a mounting plate 25, and a slide rail assembly 26. The mounting plate 25 is fixedly connected to the upper ends of the left upright plate 111 and the right upright plate 112. Slide rail assemblies 26 are installed on both the left and right sides of the front of the mounting plate 25. The guide rails 262 of the slide rail assemblies 26 are fixedly connected to the front of the mounting plate 25. The sliders 261 of the slide rail assemblies 26 are slidably snapped onto the guide rails 262. One end of the sliders 261 is fixedly connected to the back of the upper back plate 24, allowing the upper back plate 24 to move up and down along the track of the guide rails 262. The upper attachment pressure head assembly 21 includes an upper pressure head cylinder 212 fixedly connected to the front of the upper back plate 24 and an upper attachment pressure head 211 located below and connected to the upper pressure head cylinder 212. The upper attachment pressure head 211 has a heating function, which is used to melt the ACF during ACF attachment so that the ACF can be better attached to the glass substrate. The upper attachment CCD vision component 22 includes an upper CCD camera 221 for aligning and photographing the upper surface of the glass substrate, and an upper camera fixing block 222 with one end fixedly connected to the upper CCD camera 221 and the other end fixedly connected to the front of the mounting plate 25. The upper attachment CCD vision component 22 is located above the upper attachment pressure head assembly 21. The upper end of the upper back plate 24 has a groove at the position of the upper attachment CCD vision component 22 so that the upper back plate 24 will not touch the upper attachment CCD vision component 22 when moving up and down. The lower back support assembly 23 includes a lower back support fixing block 231 fixedly connected to the front of the lower back panel 34 and a lower back support abutment block 232 fixedly connected to the upper end of the lower back support fixing block 231. A pad can be provided between the lower back support fixing block 231 and the lower back support abutment block 232 to flexibly adjust the positional relationship between the lower back support abutment block 232 and the upper back panel 24.

[0053] Reference Figure 1 and Figure 4 The lower attachment mechanism 30 includes a lower attachment pressure head assembly 31, a lower attachment CCD vision assembly 32, an upper attachment back support assembly 33, and a lower back plate 34. The lower back plate 34 is fixedly connected to the lower ends of the left upright plate 111 and the right upright plate 112. The upper attachment back support assembly 33 is fixedly connected to the upper back plate 24, and the upper attachment back support assembly 33 corresponds to the lower attachment pressure head 311. The upper attachment back support assembly 33 includes an upper back support fixing block 331 fixedly connected to the lower part of the upper back plate 24 and an upper back support abutment block 332 fixedly connected to the lower end of the upper back support fixing block 331. A pad can be provided between the upper back support fixing block 331 and the upper back support abutment block 332 to flexibly adjust the positional relationship between the upper back support abutment block 332 and the lower back plate 34.

[0054] The implementation principle of this embodiment is as follows: The upper attachment pressure head assembly 21 and the lower attachment back support assembly 23 are positioned opposite each other. The upper pressure head cylinder 212 of the upper attachment pressure head assembly 21 drives the upper attachment pressure head 211 to press down, so as to cooperate with the upper protrusion at the upper end of the lower back support abutment block 232 to press against the upper and lower surfaces of the glass substrate, so that the upper attachment pressure head 211 attaches the ACF to the upper surface of the glass substrate. The lower attachment pressure head assembly 31 and the upper attachment back support assembly 33 are positioned opposite each other. The lower pressure head cylinder 312 of the lower attachment pressure head assembly 31 drives the lower attachment pressure head 311 to rise, so as to cooperate with the lower protrusion at the lower end of the upper back support abutment block 332 to press against the lower and upper surfaces of the glass substrate, so that the lower attachment pressure head 311 attaches the ACF to the lower surface of the glass substrate.

[0055] Figure 5 A side view illustrating the attachment principle of the lower attachment mechanism in the ACF double-sided attachment method of a preferred embodiment of the present invention; Figure 6 A side view illustrating the attachment principle of the upper attachment mechanism in the ACF double-sided attachment method of a preferred embodiment of the present invention is shown. (Refer to...) Figure 5 The upper back support abutment block 332 has a flat lower protrusion at its lower end. When the first ACF film 71 is attached to the lower surface of the glass substrate 60, the transfer platform 50 vacuum-adsorbs part of the lower surface of the glass substrate 60 through the air vent 51. The area of ​​the glass substrate 60 where the first ACF film 71 needs to be attached extends out of the transfer platform 50. The upper surface of the glass substrate 60 abuts against the lower protrusion at the lower end of the upper back support abutment block 332. The first ACF film 71 attached to the upper surface of the glass substrate 60 is located at the lower clearance notch to the right of the lower protrusion, and the first ACF film 71 attached to the upper surface of the glass substrate 60 will not contact the lower clearance notch to protect the first ACF film 71 attached to the upper surface of the glass substrate 60. (Refer to...) Figure 6 When the second ACF film 72 is attached to the upper surface of the glass substrate 60, the transfer platform 50 vacuum adsorbs the lower surface of the glass substrate 60 through the air hole 51. The position on the lower surface of the glass substrate 60 where the second ACF film 72 needs to be attached extends out of the transfer platform 50. The upper protrusion of the lower back support block 232 presses against the lower surface of the glass substrate 60, and the attachment position of the second ACF film 72 is located at the upper clearance notch on the right side of the upper protrusion, so as to avoid contamination of the attachment position of the second ACF film 72.

[0056] Reference Figure 1 , Figure 5 and Figure 6When the upper attachment mechanism 20 attaches ACF to the upper surface of the glass substrate 60, the upper back plate 24 rises to a safe position under the drive of the drive component 40 to avoid the movement path of the transfer platform 50. When the transfer platform 50 vacuum-adsorbs the glass substrate 60 into the ACF double-sided attachment device, the upper attachment CCD vision component 22 first aligns the glass substrate 60, then the transfer platform 50 moves the lower surface of the glass substrate 60 to the upper protrusion of the lower back support abutment block 232 of the lower attachment back support component 23. The upper back plate 24 is driven by the drive component 40 to descend to the working position of the upper attachment mechanism during attachment. Finally, the upper pressure head cylinder 212 drives the upper attachment pressure head 211 to descend to the upper surface of the glass substrate 60 to attach the first ACF film 71. After the first ACF film 71 is attached to the upper surface of the glass substrate 60, the upper attachment pressure head 211 rises to its original position, the upper back plate 24 moves to the working position of the lower attachment mechanism 30, the transfer platform 50 moves the glass substrate 60 to the right, and after alignment with the lower attachment CCD vision component 32, the transfer platform 50 moves the upper surface of the glass substrate 60 to the lower protrusion of the lower back support abutment block 232 of the upper attachment back support component 33. The lower pressure head cylinder 312 drives the lower attachment pressure head 311 to rise to the lower surface of the glass substrate 60 to attach the second ACF film 72. After the second ACF film 72 is attached, the lower attachment pressure head 311 descends to its original position, and the upper back plate 24 rises to a safe position under the drive of the drive component 40.

[0057] The embodiments described herein are preferred embodiments for facilitating understanding or implementation of the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection claimed by the present invention.

Claims

1. An ACF double-sided bonding device, characterized in that, include: Mounting base (10); The upper attachment mechanism (20) is located on the upper part of the mounting base (10). The upper attachment mechanism (20) includes an upper back plate (24) that can be raised and lowered relative to the mounting base (10) and corresponds to the same work station, an upper attachment pressure head assembly (21) that is connected to the upper back plate (24), and a lower back support abutment block (232) that is not connected to the upper attachment pressure head assembly (21) and corresponds to the lower part of the upper attachment pressure head assembly (21). The lower attachment mechanism (30) is located at the lower part of the mounting base (10) in a staggered manner. The lower attachment mechanism (30) includes an upper back support abutment block (332) connected to the upper back plate (24), a lower back plate (34), and a lower attachment pressure head assembly (31) located on the lower back plate (34) and corresponding to the lower back support abutment block (332). The upper back support abutment block (332) has a lower clearance notch and a lower protrusion forming the lower clearance notch at its lower end. The upper back support abutment block (332) and the upper attachment pressure head assembly (21) are linked to lift based on the upper back plate (24). The lower back support abutment block (232) is disposed on the lower back plate (34). The upper attachment pressure head assembly (21) includes an upper pressure head cylinder (212) connected to the upper back plate (24) and an upper attachment pressure head (211) with a heating function connected to the upper pressure head cylinder (212); the upper pressure head cylinder (212) drives the upper attachment pressure head (211) to move along the Z-axis direction to press against the upper surface of the glass substrate (60) in conjunction with the lower back support abutment block (232) to perform ACF attachment on the upper surface of the glass substrate (60); The upper back support abutment block (332) is fixedly connected to the upper back plate (24) by the upper back support fixing block (331); the lower protrusion at the lower end of the upper back support abutment block (332) presses against the upper surface of the glass substrate (60), and the lower protrusion avoids the first ACF film (71) attached to the upper surface of the glass substrate (60). The upper back plate (24) is connected to the mounting plate (25) via a slide rail assembly (26). The mounting plate (25) is fixedly connected to the upper part of the mounting base (10). The upper back plate (24) is provided with lifting power by a drive assembly (40). When the upper back plate (24) descends, the protrusion at the lower end of the upper back support block (332) presses against the upper surface of the glass substrate (60). When the upper back plate (24) rises, the glass substrate (60) has sufficient safe movement space between the upper attachment mechanism (20) and the lower attachment mechanism (30). The lower attachment pressure head assembly (31) includes a lower pressure head cylinder (312) connected to the lower back plate (34) and a lower attachment pressure head (311) with heating function connected to the lower pressure head cylinder (312); the lower pressure head cylinder (312) drives the lower attachment pressure head (311) to move along the Z-axis direction to press against the lower surface of the glass substrate (60) in conjunction with the upper back support abutment block (332) to perform ACF attachment on the lower surface of the glass substrate (60); The lower back support abutment block (232) is fixedly connected to the upper back plate (24) by the lower back support fixing block (231); the upper end of the lower back support abutment block (232) has an upper clearance notch and an upper protrusion constituting the upper clearance notch, the upper protrusion abuts against the upper surface of the glass substrate (60), and the position of the second ACF film (72) attached to the lower surface of the glass substrate (60) is located at the upper clearance notch at the upper end of the lower back support abutment block (232).

2. The ACF double-sided bonding device according to claim 1, characterized in that, The mounting base includes several upright plates (11) connected to the lower back plate (34), several bottom plates (12) respectively connected to the lower ends of the several upright plates (11), and a connecting plate (13) located between the several upright plates (11) for connecting the several upright plates (11).

3. The ACF double-sided bonding device according to claim 1, characterized in that, The upper attachment mechanism (20) further includes an upper attachment CCD vision component (22) located at the upper end of the upper attachment pressure head assembly (21), and the upper attachment CCD vision component (22) is fixedly connected to the mounting plate (25); the lower attachment mechanism (30) further includes a lower attachment CCD vision component (32) located at the lower end of the lower attachment pressure head assembly (31) and fixedly connected to the lower back plate (34), and the upper attachment CCD vision component (22) and the lower attachment CCD vision component (32) are used for alignment before ACF attachment on the surface of the glass substrate (60).

4. A method for double-sided ACF bonding, characterized in that, The ACF double-sided bonding apparatus according to any one of claims 1-3, wherein the ACF double-sided bonding method comprises: S1, a glass substrate (60) is mounted on the ACF double-sided bonding device; S2, perform upper ACF attachment, wherein the glass substrate (60) is located in the upper pressing area of ​​the same station, and the upper back plate (24) drives the upper attachment pressure head (211) to press down, forming a first ACF film (71) on the upper surface of the glass substrate (60). S3, perform lower ACF attachment, wherein the glass substrate (60) is located in the lower pressing area of ​​the same station, and the upper back plate (24) drives the relative downward pressing of the upper back support block (332) and the upward pressing of the lower attachment pressure head (311) to form a second ACF film (72) on the lower surface of the glass substrate (60); wherein the upper back support block (332) has a lower clearance notch and a lower protrusion constituting the lower clearance notch; during the formation of the second ACF film (72), the lower protrusion presses against the upper surface of the glass substrate (60) and does not contact the first ACF film (71), and the upper back support block (332) and the upper attachment pressure head (211) move up and down in a linked manner.

5. The ACF double-sided bonding method according to claim 4, characterized in that, The glass substrate (60) is vacuum-adsorbed onto the transfer platform (50) for movement, and the ACF attachment position of the glass substrate (60) extends out of the transfer platform (50).

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