A substrate tray conveying device for semiconductor equipment

Abstract

The present invention discloses a substrate disc conveying device for semiconductor equipment, comprising: a push rod frame, a double connecting rod assembly, a slide rail, a connection lock and a driving assembly; the connection lock is arranged at the front end of the push rod frame, and the connection lock is used to connect the substrate disc in the cavity of the semiconductor equipment; the double connecting rod assembly is located inside the push rod frame, one end of the double connecting rod assembly is connected to the output end of the driving assembly, the other end of the double connecting rod assembly is connected to the rear end of the push rod frame, and both sides of the push rod frame are respectively connected to the slide rail for sliding; under the drive of the driving assembly, the double connecting rod assembly is first folded and then stretched, so as to drive the push rod frame to perform linear motion along the slide rail, thereby realizing the substrate disc to send the substrate into or out of the exposure chamber. The present invention has the advantages of compact structure, simple operation, high transmission efficiency, etc., solves the problem that the existing substrate disc conveying device needs to occupy a large amount of length space and has poor aesthetics, and realizes the long-distance transmission of the substrate disc in a narrow space.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor vacuum equipment, and in particular relates to a substrate disk conveying device for semiconductor equipment. Background Art

[0002] The mechanism movement of semiconductor vacuum equipment is mainly used for wafer transfer and wafer retrieval, so as to realize the position switching of wafers and their substrate discs between different cavities. Under vacuum state, the space of the wafer transfer cavity should be designed to be as small as possible, but there needs to be enough substrate buffer in the cavity. At the same time, the distance between the cavities is relatively far, and the aesthetics of the design must also be taken into account. Therefore, it is necessary to realize long-distance substrate disc transmission within a narrow space. At present, the substrate disc transmission mechanism mainly adopts the form of electric cylinder push rod. This structure takes up a large length of space to realize long-distance transmission. The structure protrudes a long rod, which greatly increases the overall space of the structure and is not conducive to the aesthetics of the design. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a substrate disc conveying device for semiconductor equipment which has a compact structure, simple operation, high transmission efficiency and can realize long-distance transmission of substrate discs in a narrow space, in view of the problem that the existing substrate disc conveying device needs to occupy a large length of space and has poor aesthetics.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] A substrate disk conveying device for semiconductor equipment comprises: a push rod frame, a double-link rod assembly, a slide rail, a connection lock and a drive assembly; the connection lock is arranged at the front end of the push rod frame, and is used to connect the substrate disk in the cavity of the semiconductor equipment; the double-link rod assembly is located on the inner side of the push rod frame, one end of the double-link rod assembly is connected to the output end of the drive assembly, and the other end of the double-link rod assembly is connected to the rear end of the push rod frame, and the two sides of the push rod frame are respectively connected to the slide rail for sliding; under the drive of the drive assembly, the double-link rod assembly is first folded and then stretched, so as to drive the push rod frame to move linearly along the slide rail, thereby realizing that the substrate disk sends the substrate into or pulls out of the exposure chamber.

[0006] As a further improvement of the present invention, the double-link assembly includes a first link and a second link, and the drive assembly includes a gear drive assembly and a synchronous belt assembly; the upper end of the first link is hinged to the gear drive assembly, the lower end of the first link is hinged to the upper end of the second link, and the lower end of the second link is hinged to the rear end of the push rod frame; the hinge between the first link and the second link is connected to the gear drive assembly through a synchronous belt assembly to achieve synchronous movement of the first link and the second link.

[0007] As a further improvement of the present invention, the gear drive assembly includes a gear assembly and a drive motor, the output end of the drive motor is connected to the gear assembly, and the hinge between the first connecting rod and the second connecting rod is connected to the gear assembly through a synchronous belt assembly.

[0008] As a further improvement of the present invention, the gear assembly includes a first gear, a second gear and a third gear, the second gear and the third gear are arranged side by side on the inner side of the first gear, the outer side of the third gear is meshed with the outer side of the second gear, the outer side of the second gear is meshed with the inner side of the first gear, and the outer side of the first gear is connected to the synchronous belt assembly; the third gear is respectively connected to the upper end of the first connecting rod and the output end of the driving motor, and the rotation direction of the third gear is opposite to the rotation direction of the first gear, so as to realize synchronous reverse movement of the first connecting rod and the second connecting rod.

[0009] As a further improvement of the present invention, the synchronous belt assembly includes a driven wheel and a synchronous belt, the driven wheel is located at the hinge of the first connecting rod and the second connecting rod, and the synchronous belt is used to connect the driven wheel and the first gear.

[0010] As a further improvement of the present invention, the synchronous belt assembly further includes a tensioning wheel, which is located between the driven wheel and the first gear and is used to achieve tensioning of the synchronous belt.

[0011] As a further improvement of the present invention, the first connecting rod is an isosceles triangle structure, the two vertices at the bottom of the first connecting rod are respectively hinged to the driven wheel and the third gear, a slide groove is provided on the top of the first connecting rod, and the mounting shaft of the tensioning wheel is passed through the slide groove to achieve auxiliary limiting of the movement of the first connecting rod.

[0012] As a further improvement of the present invention, the gear drive assembly further includes a magnetic fluid, and the magnetic fluid is arranged at the connection between the drive motor and the semiconductor device cavity to achieve vacuum environment isolation of the semiconductor device cavity.

[0013] As a further improvement of the present invention, a steel column spring is provided in the connecting lock.

[0014] Compared with the prior art, the advantages of the present invention are:

[0015] The substrate disk conveying device of the semiconductor equipment of the present invention realizes a flat structure as a whole by arranging a double-link rod assembly on the inner side of a push rod frame, connecting one end of the double-link rod assembly to the output end of a driving assembly, connecting the other end of the double-link rod assembly to the rear end of the push rod frame, and slidingly connecting the two sides of the push rod frame to the slide rails respectively; under the drive of the driving assembly, the double-link rod assembly is first folded and then extended, thereby driving the push rod frame to move linearly along the slide rail, and connecting the substrate disk in the semiconductor equipment cavity by means of a connecting lock arranged at the front end of the push rod frame, finally realizing that the substrate disk delivers the substrate into or out of the exposure chamber; the substrate disk conveying device of the present invention realizes long-distance transmission under short space conditions, and the transmission distance is much longer than its own structural length, thereby greatly optimizing the structural design space of the semiconductor equipment and reducing the equipment footprint; at the same time, compared with the existing substrate disk conveying device, the long rod structure of the electric cylinder is omitted, thereby improving the aesthetics of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structural principle of the substrate disk conveying device of the semiconductor equipment of the present invention.

[0017] Figure 2 It is a schematic diagram of the partial structural principle of the substrate disk conveying device of the semiconductor equipment of the present invention.

[0018] Figure 3 It is a schematic diagram of the partial structural principle of the substrate disk conveying device of the semiconductor equipment of the present invention in another state.

[0019] Legend: 1. Push rod frame; 2. Gear assembly; 21. First gear; 22. Second gear; 23. Third gear; 3. First connecting rod; 31. Slide groove; 4. Tensioning wheel; 5. Driven wheel; 6. Second connecting rod; 7. Synchronous belt; 8. Slide rail; 9. Connecting lock; 10. Driving motor; 11. Magnetic fluid. DETAILED DESCRIPTION

[0020] The present invention is further described below in conjunction with the accompanying drawings and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0021] Example

[0022] like Figures 1 to 3As shown, the substrate disk conveying device of the semiconductor device of the present invention comprises: a push rod frame 1, a double connecting rod assembly, a slide rail 8, a connecting lock 9 and a driving assembly. The connecting lock 9 is arranged at the front end of the push rod frame 1, and the connecting lock 9 is used to connect the substrate disk in the cavity of the semiconductor device. The double connecting rod assembly is located on the inner side of the push rod frame 1, one end of the double connecting rod assembly is connected to the output end of the driving assembly, and the other end of the double connecting rod assembly is connected to the rear end of the push rod frame 1. The two sides of the push rod frame 1 are respectively slidably connected to the slide rail 8, and the slide rail 8 is used to limit the displacement of the push rod frame 1. Under the drive of the driving assembly, the double connecting rod assembly is first folded and then stretched to drive the push rod frame 1 to move linearly along the slide rail 8, thereby realizing that the substrate disk delivers the substrate into the exposure chamber for exposure. After the exposure process is completed, the substrate disk is pulled out of the exposure chamber by reverse action, and the process enters the next cycle.

[0023] In this embodiment, a steel column spring is provided in the connecting lock 9, and the steel ball spring is used in conjunction with the hook on the substrate disk to realize a flexible connection between the push rod frame 1 and the substrate disk, thereby quickly and smoothly connecting and separating the substrate disk conveying device and the substrate disk. The push rod frame 1 pushes the substrate disk to send the substrate into the exposure chamber for exposure.

[0024] In this embodiment, by setting the double connecting rod assembly inside the push rod frame 1, one end of the double connecting rod assembly is connected to the output end of the driving assembly, the other end of the double connecting rod assembly is connected to the rear end of the push rod frame 1, and the two sides of the push rod frame 1 are respectively connected to the slide rail 8 for sliding, so that the substrate disc conveying device as a whole presents a flat structure. Under the drive of the driving assembly, the double connecting rod assembly is first folded and then stretched, thereby driving the push rod frame to move linearly along the slide rail, and the substrate disc in the semiconductor device cavity is connected by the connection lock set at the front end of the push rod frame, and finally the substrate disc is used to send the substrate into or out of the exposure chamber. The substrate disc conveying device of the present invention realizes long-distance transmission under short space conditions, and the transmission distance is much longer than its own structural length, which greatly optimizes the structural design space of the semiconductor device and reduces the equipment footprint. At the same time, compared with the existing substrate disc conveying device, the long rod structure of the electric cylinder is omitted, which improves the aesthetics of the equipment.

[0025] like Figure 1 As shown, in this embodiment, the double connecting rod assembly includes a first connecting rod 3 and a second connecting rod 6, and the driving assembly includes a gear driving assembly and a synchronous belt assembly. The upper end of the first connecting rod 3 is hinged to the gear driving assembly, the lower end of the first connecting rod 3 is hinged to the upper end of the second connecting rod 6, and the lower end of the second connecting rod 6 is hinged to the rear end of the push rod frame 1. The hinge between the first connecting rod 3 and the second connecting rod 6 is connected to the gear driving assembly through the synchronous belt assembly to achieve synchronous movement of the first connecting rod 3 and the second connecting rod 6.

[0026] Further, the gear drive assembly includes a gear assembly 2 and a drive motor 10, the output end of the drive motor 10 is connected to the gear assembly 2, and the hinge between the first connecting rod 3 and the second connecting rod 6 is connected to the gear assembly 2 through a synchronous belt assembly. The drive motor 10 can specifically be a servo motor.

[0027] like Figure 2 As shown, in this embodiment, the gear assembly 2 includes a first gear 21, a second gear 22 and a third gear 23. Two second gears 22 and one third gear 23 are arranged side by side inside the first gear 21. The outer side of the third gear 23 is respectively meshed with the outer sides of the two second gears 22, and the outer sides of the two second gears 22 are meshed with the two inner sides of the first gear 21. The outer side of the first gear 21 is connected to the synchronous belt assembly. The third gear 23 is respectively connected to the upper end of the first connecting rod 3 and the output end of the driving motor 10, and the rotation direction of the third gear 23 is opposite to that of the first gear 21, so as to realize the synchronous reverse movement of the first connecting rod 3 and the second connecting rod 6.

[0028] Through the combination of internal and external meshing gears, the middle third gear 23 is used as a driving gear, the outermost first gear 21 is used as a steering gear, and the third gear 23 rotates in the opposite direction to the first gear 21, thereby achieving reverse rotation of the synchronous belt assembly connected to the first gear 21.

[0029] like Figure 1 As shown, in this embodiment, the synchronous belt assembly includes a driven wheel 5 and a synchronous belt 7. The driven wheel 5 is located at the hinge of the first connecting rod 3 and the second connecting rod 6. The synchronous belt 7 is used to connect the driven wheel 5 and the first gear 21.

[0030] In this embodiment, the upper end of the first connecting rod 3 is rigidly connected to the third gear 23, the lower end of the first connecting rod 3 is hinged to the upper end of the second connecting rod 6, and the upper end of the second connecting rod 6 is rigidly connected to the driven wheel 5 at the same time, and the driven wheel 5 is connected to the outer side of the first gear 21 through the synchronous belt 7, thereby realizing the folding and stretching movement of the first connecting rod 3 and the second connecting rod 6.

[0031] In this embodiment, a mechanical gear reversing mechanism is used to realize the folding and stretching movement of the double connecting rod assembly, and the reliability of transmission is further improved. Specifically, the first connecting rod 3 and the second connecting rod 6 are folded first and then stretched by utilizing the steering effect of the middle third gear 23, thereby realizing long-distance transmission of a small space structure.

[0032] like Figure 2 and Figure 3 As shown, in this embodiment, the synchronous belt assembly further includes a tensioning wheel 4 , which is located between the driven wheel 5 and the first gear 21 and is used to achieve tensioning of the synchronous belt 7 .

[0033] like Figure 2and Figure 3 As shown, in this embodiment, the first connecting rod 3 is an isosceles triangle structure, the two vertices at the bottom of the first connecting rod 3 are respectively hinged to the driven wheel 5 and the third gear 23, a slide groove 31 is provided on the top of the first connecting rod 3, and the mounting shaft of the tensioning wheel 4 is passed through the slide groove 31. During the movement of the first connecting rod 3, the cooperation between the slide groove 31 and the mounting shaft can realize auxiliary limiting of the movement of the first connecting rod 3.

[0034] like Figure 1 As shown, in this embodiment, the gear drive assembly further includes a magnetic fluid 11, and the magnetic fluid 11 is disposed at the connection between the drive motor 10 and the semiconductor device cavity to achieve vacuum environment isolation of the semiconductor device cavity.

[0035] In this embodiment, when the conveying device is transmitting the film, the driving motor 10 rotates to drive the gear assembly 2 and the synchronous belt assembly to realize the double-link synchronous movement of the first connecting rod 3 and the second connecting rod 6, and the rotational movement is converted into the folding and stretching movement of the double connecting rod, thereby driving the push rod frame 1 to advance and retract a long distance. The double-link synchronous movement mode eliminates the lateral impact of the connecting rod slider mechanism on the slide rail 8 during the movement, which can make the film transmission movement smoother, and the driving motor 10 and the film transmission cavity are isolated from the vacuum environment through the magnetic fluid seal.

[0036] Although the present invention is disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any technician familiar with the art can use the above disclosed methods and technical contents to make many possible changes and modifications to the technical solutions of the present invention without departing from the spirit and technical solutions of the present invention, or modify them into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solutions of the present invention still fall within the scope of protection of the technical solutions of the present invention.

Claims

1. A substrate tray conveying device for semiconductor equipment, characterized in that: include: A push rod frame (1), a double connecting rod assembly, a slide rail (8), a connection lock (9) and a drive assembly; the connection lock (9) is arranged at the front end of the push rod frame (1), and the connection lock (9) is used to connect a substrate disk in a semiconductor device cavity; the double connecting rod assembly is located inside the push rod frame (1), one end of the double connecting rod assembly is connected to the output end of the drive assembly, the other end of the double connecting rod assembly is connected to the rear end of the push rod frame (1), and both sides of the push rod frame (1) are respectively connected to the slide rail (8) in a sliding manner; under the drive of the drive assembly, the double connecting rod assembly is first folded and then stretched, so as to drive the push rod frame (1) to perform linear motion along the slide rail (8), thereby enabling the substrate disk to send the substrate into or pull out of the exposure chamber; The double-link assembly comprises a first link (3) and a second link (6), and the drive assembly comprises a gear drive assembly and a synchronous belt assembly; the upper end of the first link (3) is hinged to the gear drive assembly, the lower end of the first link (3) is hinged to the upper end of the second link (6), and the lower end of the second link (6) is hinged to the rear end of the push rod frame (1); the hinge between the first link (3) and the second link (6) is connected to the gear drive assembly via the synchronous belt assembly, so as to achieve synchronous movement of the first link (3) and the second link (6); The gear drive assembly comprises a gear assembly (2) and a drive motor (10), the output end of the drive motor (10) being connected to the gear assembly (2), and the hinge between the first connecting rod (3) and the second connecting rod (6) being connected to the gear assembly (2) via a synchronous belt assembly; The gear assembly (2) comprises a first gear (21), a second gear (22) and a third gear (23); the second gear (22) and the third gear (23) are arranged side by side on the inner side of the first gear (21); the outer side of the third gear (23) meshes with the outer side of the second gear (22); the outer side of the second gear (22) meshes with the inner side of the first gear (21); and the outer side of the first gear (21) is connected to the synchronous belt assembly; the third gear (23) is respectively connected to the upper end of the first connecting rod (3) and the output end of the driving motor (10); the rotation direction of the third gear (23) is opposite to the rotation direction of the first gear (21), so as to realize synchronous reverse movement of the first connecting rod (3) and the second connecting rod (6).

2. The substrate tray transfer device of semiconductor equipment according to claim 1, characterized in that: The synchronous belt assembly comprises a driven wheel (5) and a synchronous belt (7); the driven wheel (5) is located at the hinge between the first connecting rod (3) and the second connecting rod (6); and the synchronous belt (7) is used to connect the driven wheel (5) and the first gear (21).

3. The substrate tray transfer device of the semiconductor equipment according to claim 2, characterized in that: The synchronous belt assembly further comprises a tensioning wheel (4), wherein the tensioning wheel (4) is located between the driven wheel (5) and the first gear (21) and is used to achieve tensioning of the synchronous belt (7).

4. The substrate tray transfer device of semiconductor equipment according to claim 3, characterized in that: The first connecting rod (3) is in the form of an isosceles triangle structure. The two vertices at the bottom of the first connecting rod (3) are respectively hinged to the driven wheel (5) and the third gear (23). A sliding groove (31) is provided at the top of the first connecting rod (3). The mounting shaft of the tensioning wheel (4) is inserted into the sliding groove (31) to achieve auxiliary limiting of the movement of the first connecting rod (3).

5. The substrate tray transfer device for semiconductor equipment according to any one of claims 1 to 4, characterized in that: The gear drive assembly further comprises a magnetic fluid (11), wherein the magnetic fluid (11) is arranged at the connection between the drive motor (10) and the semiconductor device cavity, so as to achieve vacuum environment isolation of the semiconductor device cavity.

6. The substrate tray transfer device for semiconductor equipment according to any one of claims 1 to 4, characterized in that: A steel column spring is arranged inside the connecting lock (9).

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