Gold wire spiral inductor composite model parameter extraction method and device and storable medium

Abstract

The application discloses a kind of gold wire spiral inductance composite model parameter extraction method, device and storable medium, it is related to integrated circuit technology field, wherein method includes the following steps: S1: to be extracted gold wire and to be extracted spiral inductance are bonded, obtain corresponding composite structure and equivalent circuit model;S2: the composite structure is simulated, obtains corresponding S parameter, and obtains corresponding equivalent circuit element extraction parameter according to the S parameter;S3: change the bonding position of the to-be-extracted gold wire and the to-be-extracted spiral inductance, based on different bonding positions to obtain multiple new composite structures and equivalent circuit models, after repeating S2, obtain the equivalent circuit element parameter extraction result corresponding to each key position step;The present application considers the discontinuity of spiral inductance and gold wire cascade, and the overall simulation accuracy of gold wire-inductor composite structure can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuits, and more particularly to a gold wire spiral inductor composite model parameter extraction method, device and storage medium. BACKGROUND

[0002] At present, planar spiral inductors have been widely used in radio frequency circuits, such as power amplifiers, mixers, voltage-controlled oscillators and filters, due to their low cost and easy integration. For a substrate radio frequency circuit, the interconnection between components often adopts a gold wire bonding method. With the advent of the 5G era, various types of radio frequency devices are constantly developing towards miniaturization, high frequency and low cost, which poses greater challenges to electronic integration technology. However, the traditional gold wire inductor discrete model parameter extraction method ignores the discontinuity at the connection, resulting in insufficient simulation accuracy after cascading. Moreover, due to the lack of the ability to represent the influence of the gold wire bonding point position on the output characteristics, it is difficult to provide guidance for the subsequent substrate circuit performance debugging, and it is difficult to meet the actual engineering application requirements. Therefore, developing a gold wire-spiral inductor composite model parameter extraction method that relates to the gold wire bonding point position information, and then improving the simulation accuracy of the gold wire inductor integration, is a problem that needs to be solved in the design of the substrate radio frequency circuit.

[0003] However, a large number of studies have been conducted on spiral inductors and gold wire models in the prior art, and the model theory is becoming more and more complete. However, in actual design, when the two types of models are cascaded, the parameter extraction method does not consider the discontinuity at the connection, and cannot represent the output characteristics of the structure under different gold wire bonding point positions, making it difficult to meet the engineering application requirements. Therefore, the method of three-dimensional finite element electromagnetic field simulation is currently used to accurately analyze the electrical characteristics.

[0004] Therefore, it is urgent to develop a gold wire-spiral inductor composite model parameter extraction method that relates to the gold wire bonding point position information, in order to improve the simulation accuracy of the gold wire inductor integration, and then meet the application requirements of the substrate radio frequency circuit design. SUMMARY

[0005] Therefore, the present application provides a gold wire spiral inductor composite model parameter extraction method, device and storage medium, which considers the discontinuity of the spiral inductor and the gold wire cascade, and can improve the overall simulation accuracy of the gold wire-inductor composite structure.

[0006] In order to achieve the above purpose, the present application adopts the following technical solutions:

[0007] A gold wire spiral inductor composite model parameter extraction method, comprising the following steps:

[0008] S1: bonding the gold wire to be extracted and the spiral inductor to be extracted, to obtain a corresponding composite structure and an equivalent circuit model;

[0009] S2: performing field simulation on the composite structure to obtain corresponding S parameters, and obtaining corresponding equivalent circuit element extraction parameters according to the S parameters;

[0010] S3: changing the bonding position of the gold wire to be extracted and the spiral inductor to be extracted, obtaining a plurality of new composite structures and equivalent circuit models based on different bonding positions, repeating S2 to obtain the equivalent circuit element parameter extraction result corresponding to each bonding position, and extracting information model parameters for the equivalent circuit element parameter extraction results of different bonding positions;

[0011] S4: comparing the information model parameters with the field simulation results obtained in S2 to verify the accuracy of the equivalent simulation model.

[0012] Preferably, the specific processing process of S1 includes:

[0013] S11: setting the structure parameters of the composite structure;

[0014] S12: constructing the composite structure using the structure parameters.

[0015] Preferably, the equivalent circuit element extraction parameters in S2 include resistance element parameters, inductance element parameters and capacitance element parameters.

[0016] Preferably, the specific processing process of S2 includes:

[0017] S21: converting the S parameters into Y parameters;

[0018] S22: extracting the resistance element parameters, the inductance element parameters and the capacitance element parameters using the Y parameters.

[0019] Preferably, the specific processing process of extracting information model parameters in S3 includes:

[0020] S31: for different bonding positions, extracting inductance parameters from a plurality of inductance element parameters using the least square method according to different key-in lengths and gold wire spans of the gold wire to be extracted;

[0021] S32: extracting resistance parameters from a plurality of resistance element parameters using the least square method according to different key-in lengths and gold wire spans of the gold wire to be extracted;

[0022] S33: for different bonding positions, taking the average of the extracted capacitance element parameters.

[0023] Preferably, the structure parameters in S11 include any one or any combination of gold wire key-in length, gold wire span, gold wire arch height, gold wire diameter and spiral inductance width.

[0024] The application also provides an extraction device using the gold wire spiral inductance composite model parameter extraction method.

[0025] The construction module is configured to bond the gold wire to be extracted and the spiral inductance to be extracted to obtain a corresponding composite structure and an equivalent circuit model.

[0026] The first extraction module is configured to perform field simulation on the composite structure to obtain corresponding S parameters, and obtain corresponding equivalent circuit element extraction parameters according to the S parameters.

[0027] The second extraction module is configured to change the bonding position of the gold wire to be extracted and the spiral inductance to be extracted, obtain a plurality of new composite structures and equivalent circuit models based on different bonding positions, obtain the equivalent circuit element parameter extraction result corresponding to each key-in position, and extract the information model parameters for the equivalent circuit element parameter extraction results of different bonding positions.

[0028] The verification module is configured to compare the information model parameters with the field simulation result obtained by S2 to verify the accuracy of the equivalent simulation model.

[0029] The application also provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the composite model parameter extraction method.

[0030] Compared with the prior art, the gold wire spiral inductance composite model parameter extraction method, device and storage medium provided by the application can improve the overall simulation accuracy of the gold wire-inductance composite structure by considering the discontinuity of the spiral inductance and the gold wire cascade, and can provide effective guidance for the design and later debugging of the carrier board radio frequency circuit by considering the influence of different key-in positions of the gold wire. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only embodiments of the application, and those skilled in the art can obtain other drawings according to the provided drawings without creative labor.

[0032] Figure 1The overall flow chart of the gold wire spiral inductor composite model parameter extraction method provided by the present application is shown in the figure.

[0033] Figure 2 The structure principle block diagram of the gold wire spiral inductor composite model parameter extraction device provided by the present application is shown in the figure.

[0034] Figure 3 The specific flow chart of the gold wire spiral inductor composite model parameter extraction method provided by the embodiment 2 of the present application is shown in the figure.

[0035] Figure 4 The gold wire-spiral inductor composite structure schematic diagram provided by the embodiment 2 of the present application is shown in the figure.

[0036] Figure 5 The gold wire-spiral inductor composite structure equivalent circuit model diagram provided by the embodiment 2 of the present application is shown in the figure.

[0037] Figures 6-7 The gold wire-spiral inductor composite model S parameter comparison result diagram under the typical key-in length provided by the embodiment 2 of the present application is shown in the figure. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0039] Embodiment 1

[0040] Referring to the drawings shown in the figure, Figure 1 The embodiment 1 of the present application discloses a gold wire spiral inductor composite model parameter extraction method, which comprises the following steps:

[0041] S1: bond the gold wire to be extracted and the spiral inductor to be extracted to obtain the corresponding composite structure and equivalent circuit model;

[0042] S2: perform field simulation on the composite structure to obtain the corresponding S parameter, and obtain the corresponding equivalent circuit element extraction parameter according to the S parameter;

[0043] S3: change the bonding position of the gold wire to be extracted and the spiral inductor to be extracted, obtain a plurality of new composite structures and equivalent circuit models based on different bonding positions, repeat S2 to obtain the equivalent circuit element parameter extraction result corresponding to each key-in position, and extract the information model parameter according to the equivalent circuit element parameter extraction result of different bonding positions.

[0044] S4: comparing the information model parameters with the field simulation results obtained in S2 to verify the accuracy of the equivalent simulation model.

[0045] In one specific embodiment, the specific process of S1 includes:

[0046] S11: setting the structure parameters of the composite structure;

[0047] S12: constructing the composite structure by using the structure parameters.

[0048] In one specific embodiment, the extracted parameters of the equivalent circuit elements in S2 include the resistance element parameters, the inductance element parameters and the capacitance element parameters.

[0049] In one specific embodiment, the specific process of S2 includes:

[0050] S21: converting the S parameters into Y parameters;

[0051] S22: extracting the resistance element parameters, the inductance element parameters and the capacitance element parameters by using the Y parameters.

[0052] S31: for different bonding positions, extracting the inductance parameters by using the least square method on the multiple inductance element parameters according to different bonding lengths of the to-be-extracted gold wires and the gold wire spans;

[0053] S32: extracting the resistance parameters by using the least square method on the multiple resistance element parameters according to different bonding lengths of the to-be-extracted gold wires and the gold wire spans;

[0054] S33: for different bonding positions, taking the average of the extracted capacitance element parameters.

[0055] In one specific embodiment, the structure parameters in S11 include any one or any combination of the bonding length of the gold wire, the gold wire span, the arch height of the gold wire, the diameter of the gold wire and the width of the spiral inductance.

[0056] Referring to FIG. 1, Figure 2 The embodiment 1 of the present application also provides an extraction device for extracting the composite model parameters of the gold wire spiral inductance by using the gold wire spiral inductance composite model parameter extraction method according to any one of the above embodiments, which includes:

[0057] a construction module, configured to bond the to-be-extracted gold wire and the to-be-extracted spiral inductance to obtain a corresponding composite structure and an equivalent circuit model;

[0058] a first extraction module, configured to perform field simulation on the composite structure to obtain corresponding S parameters, and obtain corresponding equivalent circuit element extraction parameters according to the S parameters;

[0059] The second extraction module is configured to change the bonding position of the gold wire to be extracted and the spiral inductor to be extracted, obtain a plurality of new composite structures and equivalent circuit models based on different bonding positions, obtain an equivalent circuit element parameter extraction result corresponding to each bonding position, and extract an information model parameter based on the equivalent circuit element parameter extraction results of different bonding positions.

[0060] The verification module is configured to compare the information model parameter with the field simulation result obtained by S2 to verify the accuracy of the equivalent simulation model.

[0061] Embodiment 1 also provides a computer readable storage medium, and the computer readable storage medium stores a computer program. When the computer program is executed by a processor, the computer program implements the composite model parameter extraction method of any one of the above embodiments.

[0062] Embodiment 2

[0063] The detailed application embodiment 1 method of the specific process can be seen from the accompanying drawings Figure 3 , and the method comprises the following steps:

[0064] Step 1: Gold wire-spiral inductor composite structure simulation

[0065] The field simulation is performed on the gold wire-spiral inductor composite structure which needs to extract parameters. First, the structure parameters such as metal thickness, substrate thickness, dielectric constant, spiral inductor width, gold wire arch height and diameter are set, and the S parameters at different bonding positions are obtained by simulation, wherein the frequency range of the S parameters is 0.01-5GHz, and in order to facilitate parameter extraction, an auxiliary port is added at the end of the spiral inductor; and the S parameters are scattering parameters, and the Y parameters are admittance parameters, which can be directly simulated by full-wave field simulation software.

[0066] The gold wire-spiral inductor composite structure is constructed for the gold wire to be processed and the spiral inductor to be processed. The specific composite structure diagram is shown in the accompanying drawings Figure 4 , the bonding point divides the spiral inductor into two sections of the access part and the non-access part, and the position of the bonding point determines the length of the two sections, thereby realizing different access inductors, wherein the gold part is the access part, and the blue part is the non-access part; the gold wire-spiral inductor composite structure equivalent circuit model is shown in the accompanying drawings Figure 5 , which comprises a gold wire part equivalent circuit and an inductor part equivalent circuit connected in sequence, wherein the inside of the green box is the gold wire part equivalent circuit, and the outside is the inductor part equivalent circuit, the inductor part equivalent circuit comprises a capacitor C sub1 , an inductor L acc , a resistor R acc , an inductor L stub , a resistor R stub and a capacitor C sub2The equivalent circuit of the gold wire section includes inductors L connected in series. bw Resistance R bw and capacitor C pad Inductance L bw One end is connected to resistor R acc and inductor L stub One end is connected, L acc R acc Indicates the inductance and resistance of the circuit section (gold), L stub R stub L represents the inductance and resistance of the portion not connected to the circuit (blue). bw R bw C represents the inductance and resistance of the gold wire section. sub1 C sub2 For the dielectric capacitance of each segment, C pad This is the output pad's capacitance to ground.

[0067] Step 2: Extracting Resistor Parameters

[0068] The three-port S-parameter data obtained from the field simulation in step 1 are converted into Y-parameters, where Y... ij For the Y parameter of port i to port j, Figure 4 The resistive element R in acc R bw and R stub The parameters are extracted using the following expression:

[0069]

[0070]

[0071] In the formula, real() represents the real part of a specific Y parameter. Finally, the average of the extraction results at different frequencies is taken to obtain the resistor element R. acc R bw and R stub The parameters.

[0072] Step 3: Extraction of inductor component parameters

[0073] for Figure 5 Inductor L acc L bw and L stub The parameters are extracted using the following expression:

[0074]

[0075] In the formula, imag() represents the imaginary part of a specific Y parameter, and the conversion relationship between angular frequency ω and frequency f satisfies ω=2πf.

[0076] Plot the graph with the horizontal axis representing the angular frequency ω and the vertical axis representing imag(1 / Y). j The curves for j = 2, 3, 4 were plotted, and the least squares method was used for linear fitting to extract the slope of each curve, thus obtaining L. acc L bw and L stub .

[0077] Step 4: Extracting capacitor component parameters

[0078] for Figure 5 Capacitor element C in sub1 C sub2 and C pad The parameters are extracted using the following expression:

[0079]

[0080]

[0081] Plot the graph with the horizontal axis representing the angular frequency ω and the vertical axis representing imag(1 / Y). j The curves for j = 1, 5, 6 were plotted, and the least squares method was used for linear fitting to extract the slope of each curve, thus obtaining C. sub1 C sub2 and C pad .

[0082] Step 5: Extraction of model parameters for gold wire bonding position information

[0083] Based on the S-parameters obtained from field simulations corresponding to different bonding positions, by repeating steps 2-4, the parameter extraction results of the equivalent circuit element corresponding to each bonding position can be obtained.

[0084] ① Extraction of inductance parameters related to bonding point location

[0085] Given that different bonding location information includes the key length L and the gold wire span D, Figure 5 The mapping relationship of the equivalent inductance element value can be characterized by a linear function, as shown in equation (6). Based on the inductance parameters extracted from different bonding positions, the least squares method can be used to extract the inductance L of the connected circuit associated with the bonding position. acc and the inductor L in the unconnected part of the circuit stub The slope k corresponding to the linear relationship with the input length L i (i = 1, 2) and intercept b i (i = 1, 2), and gold wire inductor L bw The slope k3 and intercept b3 corresponding to the linear relationship with the gold wire span D.

[0086]

[0087] ② Extraction of resistance parameters related to bonding point location

[0088] Given that different bonding location information includes the key length L and the gold wire span D, Figure 5 The mapping relationship of the equivalent resistance element values ​​can be characterized by a linear function, as shown in equation (7). The resistance parameters obtained from different bonding positions can be extracted using the least squares method to extract the resistance R of the connected circuit part associated with the bonding position. acc and the resistance R of the unconnected part of the circuit stub The slope k corresponding to the linear relationship with the input length L i (i = 4, 5) and intercept b i (i = 4, 5), and gold wire resistor R bw The slope k6 and intercept b6 corresponding to the linear relationship with the gold wire span D.

[0089]

[0090] ③ Extraction of capacitance parameters related to bonding point location

[0091] Since the extracted capacitance values ​​are stable across different bonding sites, the average capacitance values ​​obtained from different bonding sites are taken to obtain C. sub1 C sub2 and C pad The empirical model value.

[0092] Step 6: Model Validation

[0093] according to Figure 6-7 The gold wire-spiral inductor composite model topology shown was used to build an equivalent model in commercial SPICE simulation software. The simulation results of the model were then compared with those of the field simulation. The accuracy of the model in Example 2 is evaluated using the following expression:

[0094]

[0095] In the formula, S f For field simulation data, S simu For model simulation data, attached Figures 6-7 The comparison results are shown when the input length L is 2.3mm, 3.5mm, and 4.5mm, and the corresponding gold wire span is 0.8mm, 1.32mm, and 1.25mm, respectively.

[0096] Based on the above formula, Table 1 shows the accuracy of the model S-parameters for three different input lengths of the gold wire-spiral inductor composite model.

[0097] Table 1. Accuracy of S-parameters in the gold wire-spiral inductor composite model

[0098]

[0099] The verification result of the S parameter shows that the model based on the gold wire-spiral inductor composite model parameter extraction method provided in the patent has a model precision greater than 92.4% in the frequency range of 0.01GHz-5GHz, which meets the requirements.

[0100] Compared with the prior art, the method provided in Embodiment 2 of the present application has the following obvious advantages:

[0101] 1. The model parameter extraction considers the discontinuity of the spiral inductor and the gold wire, and can improve the overall simulation precision of the gold wire-inductor composite structure.

[0102] 2. The model parameter extraction considers the influence of different bonding positions of the gold wire, and can provide effective guidance for the design and later debugging of the carrier board radio frequency circuit.

[0103] The embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts of each embodiment can be referred to each other. For the device disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple, and the related parts can be referred to the method part.

[0104] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to the embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for extracting parameters of a composite model of a gold wire spiral inductor, characterized in that, Includes the following steps: S1: The gold wire and the spiral inductor to be extracted are bonded together to obtain the corresponding composite structure and equivalent circuit model. The equivalent circuit model of the gold wire-spiral inductor composite structure includes the equivalent circuit of the gold wire part and the equivalent circuit of the inductor part connected in sequence, specifically including: S11: Set the structural parameters of the composite structure, including the spiral inductor width; S12: Construct the composite structure using the structural parameters; S2: Perform field simulation on the composite structure to obtain the corresponding S-parameters, and obtain the corresponding equivalent circuit element extraction parameters based on the S-parameters; S3: Change the bonding positions of the gold wire to be extracted and the spiral inductor to be extracted. Based on different bonding positions, obtain multiple new composite structures and equivalent circuit models. Repeat S2 to obtain the equivalent circuit element parameter extraction results corresponding to each input position. Extract information model parameters for the equivalent circuit element parameter extraction results of different bonding positions. For the composite structure, the bonding point divides the spiral inductor into two segments: the connected part and the unconnected part. The position of the input point determines the length of the two segments, thereby realizing different connected inductors. S4: Compare the information model parameters with the field simulation results obtained in S2 to verify the accuracy of the equivalent simulation model.

2. The method for extracting parameters of a gold wire spiral inductor composite model according to claim 1, characterized in that, The equivalent circuit element extraction parameters described in S2 include resistor element parameters, inductor element parameters, and capacitor element parameters.

3. The method for extracting parameters of a gold wire spiral inductor composite model according to claim 2, characterized in that, The specific processing steps of S2 include: S21: Convert the S-parameters into Y-parameters; S22: Extract the parameters of the resistive element, the inductor element, and the capacitor element using the Y parameter.

4. The method for extracting parameters of a gold wire spiral inductor composite model according to claim 3, characterized in that, The specific processing steps for extracting information model parameters in S3 include: S31: For different bonding positions, based on the different gold wire insertion lengths and gold wire spans to be extracted, the least squares method is used to extract inductance parameters from multiple inductor element parameters; S32: Based on the different input lengths and gold wire spans of the gold wires to be extracted, the least squares method is used to extract the resistance parameters of multiple resistance elements. S33: For different bonding positions, the extracted capacitor element parameters are averaged.

5. An extraction device for extracting parameters of a gold wire spiral inductor composite model according to any one of claims 1-4, characterized in that, include: The building module is used to bond the gold wire to be extracted and the spiral inductor to be extracted to obtain the corresponding composite structure and equivalent circuit model. The first extraction module is used to perform field simulation on the composite structure to obtain the corresponding S-parameters, and to obtain the corresponding equivalent circuit element extraction parameters based on the S-parameters. The second extraction module is used to change the bonding positions of the gold wire to be extracted and the spiral inductor to be extracted, obtain multiple new composite structures and equivalent circuit models based on different bonding positions, obtain the equivalent circuit element parameter extraction results corresponding to each input position, and extract information model parameters for the equivalent circuit element parameter extraction results of different bonding positions. The verification module is used to compare the information model parameters with the field simulation results obtained in S2 to verify the accuracy of the equivalent simulation model.

6. A computer-readable storage medium, characterized in that, A computer program is stored on the computer-readable storage medium, which, when executed by a processor, implements the composite model parameter extraction method as described in any one of claims 1 to 4.

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