Defoaming device and process for electronic component glue-filling production line

Abstract

The application discloses an electronic component glue-filling production line defoaming device, which comprises a sliding table conveying track, an electrical component tool sliding table is arranged on the sliding table conveying track, a plurality of electrical components are arrayed and placed on the electrical component tool sliding table, and the glue-filling cavities of the electrical components placed on the electrical component tool sliding table are upwardly opened; the defoaming and solidifying station is further arranged; the electrical component tool sliding table can be translated and conveyed to the defoaming and solidifying station, and the defoaming and solidifying station is provided with a shaking and exciting unit; and the consistency of the defoaming process is improved.

Description

Technical Field

[0001] This invention belongs to the field of defoaming in electronic component potting. Background Technology

[0002] The potting process for electrical components involves using equipment or manual methods to inject polyurethane potting compound, silicone potting compound, or epoxy resin potting compound into devices containing electronic components and circuits (such as capacitors, triggers, power supplies, and circuit boards). The mixture is then cured at room temperature or under heating conditions to form a high-performance thermosetting polymer insulating material, thereby achieving the purposes of bonding, sealing, potting, and protection.

[0003] To improve the efficiency of glue dispensing, in the glue dispensing production line, such as Figures 1 to 3 As shown, a large number of electrical components to be glued are arranged in an array on an electrical component tooling slide. Since air bubbles may remain during the glue dispensing process, negative pressure and vibration can be used to float the uncured glue to the surface, thus achieving defoaming. In existing solutions, a high-frequency vibration source is typically placed on the electrical component tooling slide to achieve defoaming. However, if the power of the high-frequency vibration source is too high, it can cause excessive vibration of the electrical components near the source, leading to the uncured glue on the components sloshing out.

[0004] If a high-frequency oscillation source of normal intensity is used, the oscillation intensity of the high-frequency oscillation will decrease as the distance from the oscillation source increases. This will cause the electrical components on the tooling slide to be subjected to inconsistent oscillation intensity, resulting in a problem of inconsistent defoaming process. Summary of the Invention

[0005] Purpose of the invention: In order to overcome the shortcomings of the existing technology, the present invention provides a defoaming device and process for an electronic component potting production line, which improves the consistency of the defoaming process.

[0006] Technical solution: To achieve the above objectives, the defoaming device of the electronic component potting production line of the present invention includes a slide conveyor track, on which an electrical component tooling slide is conveyed, and several electrical components are arranged in an array on the electrical component tooling slide, with the potting cavity opening of each electrical component on the electrical component tooling slide facing upward; it also includes a defoaming curing station; the electrical component tooling slide can be moved horizontally to the defoaming curing station, and the defoaming curing station is provided with an vibration excitation unit.

[0007] Furthermore, when the electrical component tooling slide is moved to the defoaming and curing station, the vibration excitation unit can make horizontal movement at the bottom of the electrical component tooling slide.

[0008] Furthermore, the bottom surface of the electrical component tooling slide is provided with a oscillation excitation unit wandering labyrinth groove, which is composed of a straight through groove and a looped zigzag groove.

[0009] Furthermore, the straight through groove extends along the length of the slide rail to the bottom of the electrical component tooling slide.

[0010] Furthermore, the loop-shaped groove is formed by connecting several straight grooves end to end in a vertical broken line. The first end of the loop-shaped groove is vertically connected to the straight through groove at the bottom edge of the electrical component tooling slide, and the last end of the loop-shaped groove is located at the geometric center of the bottom surface of the electrical component tooling slide. The path of the loop-shaped groove gradually approaches the geometric center of the bottom surface of the electrical component tooling slide from the first end to the last end.

[0011] Furthermore, the oscillation excitation unit includes a base parallel to the slide table conveyor track. A pair of telescopic devices parallel to the slide table conveyor track are fixedly installed on the base. The telescopic rods of the telescopic devices are vertically fixedly connected to a slide rail. A slider that can move along the length of the slide rail is provided on the slide rail. A vertical motor is fixedly installed on the slider. An oscillation excitation column is coaxially fixedly connected to the upper end of the motor's output shaft. The oscillation excitation column moves horizontally under the combined drive of the telescopic movement of the telescopic devices and the movement of the slider along the slide rail.

[0012] Furthermore, the oscillating excitation column has several cylindrical cavities arranged in a circumferential array extending radially. Each cylindrical cavity contains a movable vibrating ball with a diameter adapted to the inner diameter of the cylindrical cavity. Each cylindrical cavity has a vibrating ball probe outlet with an inner diameter smaller than the diameter of the vibrating ball at the end away from the axis of the oscillating excitation column. When the oscillating excitation column rotates along the axis, the vibrating ball in the cylindrical cavity reaches the vibrating ball probe outlet under the action of centrifugal force and protrudes partially from the vibrating ball probe outlet.

[0013] The width of the straight through groove and the loop groove is the same at any position and is not less than the outer diameter of the oscillation excitation column. The inner side wall surface at any position of the straight through groove and the loop groove is referred to as the impact surface.

[0014] Furthermore, when the electrical component tooling slide is in the defoaming and curing station, the oscillation excitation column can be translated into the straight through groove or the loop groove, and translated along the path of the straight through groove or the loop groove. When the oscillation excitation column is in the straight through groove or the loop groove, during the high-speed rotation of the oscillation excitation column, the vibrating balls in the oscillation excitation column are subjected to centrifugal force. Under the action of centrifugal force, each vibrating ball reaches the vibrating ball probe outlet and protrudes. The part of each vibrating ball protruding at the vibrating ball probe outlet periodically collides with the impact surface at the location of the vibrating ball under the high-speed rotation of the oscillation excitation column, thereby generating a local oscillation source in the electrical component tooling slide.

[0015] Furthermore, the oscillation excitation column is equipped with several longitudinal pressure balance holes, and the inner end of each pressure balance hole is connected to the outside through the pressure balance hole.

[0016] Furthermore, the defoaming process of the defoaming device in the electronic component potting production line: during the process of the electrical component tooling slide table being moved and conveyed to the defoaming and curing station, the oscillating excitation column enters the straight through groove through the end of the straight through groove that runs along the slide table conveying track.

[0017] The motor is then started, causing the oscillating excitation column to rotate continuously at a speed exceeding r / min. During the high-speed rotation of the oscillating excitation column, the vibrating balls inside the column are subjected to centrifugal force. Under the action of centrifugal force, each vibrating ball reaches the vibrating ball probe outlet of each column cavity. The part of each vibrating ball protruding from the vibrating ball probe outlet periodically collides with the impact surface at the location of the location under the high-speed rotation of the oscillating excitation column and bounces back. This causes a local high-frequency oscillation source to be generated on the electrical component tooling slide due to the periodic collision impact surface of the vibrating balls. The electrical components on the electrical component tooling slide near this local high-frequency oscillation source undergo strong high-frequency vibration under the excitation of the local oscillation source, thereby achieving a highly efficient defoaming effect. The electrical components not near this local high-frequency oscillation source receive a weaker high-frequency oscillation intensity due to the distance, resulting in a poor defoaming effect.

[0018] At this time, the oscillation excitation column is horizontally displaced under the combined drive of the telescopic movement of the telescoping device and the movement of the slider along the slide rail. This causes the oscillation excitation column to gradually move horizontally from the beginning of the loop groove to the end of the loop groove, and then from the end of the loop groove to the beginning of the loop groove. This process is repeated. The high-speed rotating oscillation excitation column moves back and forth along the loop groove, so that the local high-frequency oscillation source generated by the periodic collision of the vibrating ball on the electrical component tooling slide is always in a moving state. Since the loop groove is evenly distributed on the bottom surface of the electrical component tooling slide, the local high-frequency oscillation source on the electrical component tooling slide will move evenly to all parts of the electrical component tooling slide, so that the electrical components on the electrical component tooling slide will receive high-intensity oscillation periodically, thereby improving the uniformity of the electrical components on the electrical component tooling slide.

[0019] Finally, the oscillation excitation column is repositioned into the straight through slot. Since the straight through slot is open from front to back, the oscillation excitation column will not interfere with the translation of the electrical component tooling slide, thus facilitating the translation of the electrical component tooling slide to other workstations.

[0020] Beneficial effects: The high-speed rotating oscillation excitation column of this invention travels back and forth along the path of the loop groove, so that the local high-frequency oscillation source generated by the periodic collision of the vibrating ball on the electrical component tooling slide is always in a traveling state. Since the path of the loop groove is evenly distributed on the bottom surface of the electrical component tooling slide, the local high-frequency oscillation source on the electrical component tooling slide will travel evenly to all parts of the electrical component tooling slide, so that the electrical components at all parts of the electrical component tooling slide will receive high-intensity oscillation periodically, thereby improving the overall uniformity of the electrical components on the electrical component tooling slide and avoiding the problem of inconsistent overall oscillation intensity of the electrical components at different parts of the electrical component tooling slide, which would cause poor consistency in the defoaming process. Attached Figure Description

[0021] Appendix Figure 1 This is a schematic diagram of the entire glue dispensing production line;

[0022] Appendix Figure 2 For the appendix Figure 1 A three-dimensional schematic diagram;

[0023] Appendix Figure 3 For the appendix Figure 2 Enlarged view of mark 3 or mark 5;

[0024] Appendix Figure 4 For the appendix Figure 2 Enlarged view of mark 4 or mark 6;

[0025] Appendix Figure 5 For the appendix Figure 4 An enlarged view of mark 14;

[0026] Appendix Figure 6 This is a schematic diagram of an oscillation-inducing column structure.

[0027] Appendix Figure 7 A three-dimensional view of an electrical component tooling slide table viewed from below;

[0028] Appendix Figure 8 A bottom view of the tooling slide for electrical components;

[0029] Appendix Figure 9 For the appendix Figure 8 An enlarged view of mark 26;

[0030] Appendix Figure 10 For the appendix Figure 9 A sectional view. Detailed Implementation

[0031] The invention will now be further described with reference to the accompanying drawings.

[0032] As attached Figures 1 to 10The defoaming device shown in the electronic component potting production line is as follows: Figure 1 and 2 As shown, it includes a pair of horizontal sliding conveyor tracks 1, on which several electrical component tooling slides 2 are conveyed and transported. The electrical component tooling slides 2 are moved horizontally along the sliding conveyor tracks 1. Several electrical components 9 to be glued are arranged in an array on the upper side of the electrical component tooling slides 2, with the opening of the glue-filling cavity 10 of each electrical component 9 on the upper side of the electrical component tooling slides 2 facing upward. A sealed housing 7 is provided along the length of the outer side of the sliding conveyor tracks 1. Under the action of the negative pressure device, the negative pressure tunnel... A negative pressure is formed inside channel 8. The negative pressure environment causes the air bubbles in the uncured glue in the glue-filling cavity 10 of the electrical component 9 to increase due to the pressure difference, which in turn makes it easier for the air bubbles to float. A negative pressure tunnel 8 is formed inside the sealed shell 7, extending along the length of the slide conveyor track 1. The electrical component tooling slide 2 and the slide conveyor track 1 are both in the negative pressure tunnel 8. Along the extension direction of the slide conveyor track 1, there are sequentially the first glue-filling station 3, the first defoaming and curing station 4, the second glue-filling station 5, and the second defoaming and curing station 6.

[0033] In this scheme, the first defoaming and curing station (4) and the second defoaming and curing station (6) are the same defoaming station;

[0034] Both the first glue injection station 3 and the second glue injection station 5 are equipped with glue dispensing units. When the electrical component tooling slide 2 is moved to the first glue injection station 3 or the second glue injection station 5, the glue dispensing unit can inject a predetermined amount of glue into the glue dispensing cavity 10 of each electrical component 9 placed on the electrical component tooling slide 2.

[0035] like Figure 3 As shown, the dispensing unit includes a dispensing device 12, which is installed on the displacement actuator of the xy horizontal displacement device 1. The lower end of the dispensing device 12 is a dispensing head 13. When the electrical component tooling slide 2 is moved to the first dispensing station 3 or the second dispensing station 5, the xy horizontal displacement device 1 can drive the dispensing head 13 at the lower end of the dispensing device 12 to move horizontally to the top of the dispensing cavity 10 of each electrical component 9 on the electrical component tooling slide 2. When the dispensing head 13 reaches the top of the dispensing cavity 10 of any electrical component 9, it will discharge a certain amount of glue into the dispensing cavity 10 directly below.

[0036] Both the first defoaming and curing station 4 and the second defoaming and curing station 6 are equipped with an oscillation excitation unit 101; when the electrical component tooling slide 2 is transferred to the first defoaming and curing station 4 or the second defoaming and curing station 6, the oscillation excitation unit 101 can make a horizontal wandering motion at the bottom of the electrical component tooling slide 2.

[0037] like Figure 7 and8 The diagram shows a bottom view of the electrical component tooling slide 2. The bottom surface of the electrical component tooling slide 2 is equipped with a oscillation excitation unit wandering labyrinth groove 100. The oscillation excitation unit wandering labyrinth groove 100 is composed of a straight through groove 25 and a looping zigzag groove 24. The straight through groove 25 runs along the length of the slide conveyor track 1 through the bottom of the electrical component tooling slide 2. The looping zigzag groove 24 is formed by several straight grooves connected end-to-end in a vertical zigzag pattern. The first end 24.1 of the looping zigzag groove 24 is perpendicularly connected to the straight through groove 25 at the edge of the bottom surface of the electrical component tooling slide 2. The last end 24.2 of the looping zigzag groove 24 is located at the geometric center of the bottom surface of the electrical component tooling slide 2. The path of the looping zigzag groove 24 gradually approaches the geometric center of the bottom surface of the electrical component tooling slide 2 from the first end 24.1 to the last end 24.2, thus ensuring that the path of the looping zigzag groove 24 is evenly distributed on the bottom surface of the electrical component tooling slide 2.

[0038] like Figure 4 The oscillation excitation unit 101 includes a base 30 parallel to the bottom of the slide table conveyor track 1. A pair of telescopic devices 31 parallel to the slide table conveyor track 1 are fixedly installed on the base 30. The telescopic rod 32 of the telescopic device 31 is vertically fixedly connected to a slide rail 15. A slider 16 that can move along the length direction of the slide rail 15 is provided on the slide rail 15. A vertical motor 17 is fixedly installed on the slider 16. An oscillation excitation column 19 is coaxially fixedly connected to the upper end of the output shaft 18 of the motor 17.

[0039] The oscillating excitation column 19 moves horizontally under the combined drive of the telescoping motion of the telescoping device 31 and the movement of the slider 16 along the slide rail 15.

[0040] like Figure 10 The oscillation excitation column 19 has several cylindrical cavities 22 arranged in a circular array extending radially. Each cylindrical cavity 22 contains a vibrating ball 20, the diameter of which is adapted to the inner diameter of the cylindrical cavity 22. Each cylindrical cavity 22 has a vibrating ball probe outlet 21 with an inner diameter smaller than that of the vibrating ball 20 at one end away from the axis of the oscillation excitation column 19. When the oscillation excitation column 19 rotates along the axis, the vibrating ball 20 in the cylindrical cavity 22 reaches the vibrating ball probe outlet 21 under the action of centrifugal force and a part of it protrudes from the vibrating ball probe outlet 21.

[0041] The width of the straight through groove 25 and the loop-shaped groove 24 is consistent at any position and is not less than the outer diameter of the oscillation excitation column 19. The inner side wall surface at any position of the straight through groove 25 and the loop-shaped groove 24 is designated as the impact surface 33. Figure 9 and 10 As shown.

[0042] When the electrical component tooling slide 2 is transferred to the first defoaming and curing station 4 or the second defoaming and curing station 6, the vibration excitation column 19 can be transferred into the straight through groove 25 or the loop groove 24 and move along the path of the straight through groove 25 or the loop groove 24. When the vibration excitation column 19 is in the straight through groove 25 or the loop groove 24, during the high-speed rotation of the vibration excitation column 19, the vibrating balls 20 in the vibration excitation column 19 are subjected to centrifugal force. Under the action of centrifugal force, each vibrating ball 20 reaches the vibrating ball probe outlet 21 and protrudes. The part of each vibrating ball 20 protruding at the vibrating ball probe outlet 21 periodically collides with the impact surface 33 at the location of the vibration excitation column 19 under the high-speed rotation of the vibration excitation column 19, thereby generating a local vibration source in the electrical component tooling slide 2.

[0043] The oscillating excitation column 19 is provided with several longitudinal air pressure balance holes 23, and the inner end of each air pressure balance hole 23 is connected to the outside through the air pressure balance hole 23.

[0044] Working principle:

[0045] Overall work process:

[0046] The electrical component tooling slide 2 is first moved horizontally along the slide conveyor track 1 to the first glue injection station 3. The xy horizontal displacement device 1 at the first glue injection station 3 drives the glue injection head 13 at the lower end of the glue injector 12 to move horizontally to the top of the glue filling cavity 10 of each electrical component 9 on the electrical component tooling slide 2. When the glue injection head 13 reaches the top of the glue filling cavity 10 of any electrical component 9, it will discharge a certain amount of glue into the glue filling cavity 10 directly below, until all the glue filling cavities 10 of all electrical components 9 on the electrical component tooling slide 2 have achieved the first glue injection.

[0047] Subsequently, the electrical component tooling slide 2 continues to move along the slide conveyor track 1 to the first defoaming and curing station 4. The vibration excitation unit 101 at the first defoaming and curing station 4 applies wandering vibration to the electrical component tooling slide 2, thereby causing each electrical component 9 that has just been injected with glue for the first time on the electrical component tooling slide 2 to vibrate. This causes the air bubbles in the glue in the glue cavity 10 of each electrical component 9 to float to the surface under the promoting effect of vibration, thereby playing a defoaming role.

[0048] After the defoaming process, the electrical component tooling slide 2 at the first defoaming and curing station 4 is left to stand and cure for a period of time so that the first injected adhesive in the potting cavity 10 of each electrical component 9 is fully cured.

[0049] Subsequently, the electrical component tooling slide 2 continues to move horizontally along the slide conveyor track 1 to the second glue injection station 5. The xy horizontal displacement device 1 at the second glue injection station 5 drives the glue injection head 13 at the lower end of the glue injector 12 to move horizontally to the top of the glue filling cavity 10 of each electrical component 9 on the electrical component tooling slide 2. When the glue injection head 13 reaches the top of the glue filling cavity 10 of any electrical component 9, it will discharge a certain amount of glue into the glue filling cavity 10 directly below, until all the glue filling cavities 10 of all electrical components 9 on the electrical component tooling slide 2 have achieved the second glue injection.

[0050] Subsequently, the electrical component tooling slide 2 continues to be moved along the slide conveyor track 1 to the second defoaming and curing station 6. The vibration excitation unit 101 at the second defoaming and curing station 6 applies wandering vibration to the electrical component tooling slide 2, thereby causing each electrical component 9 that has just been injected with glue for the second time on the electrical component tooling slide 2 to vibrate. This causes the air bubbles in the glue in the glue cavity 10 of each electrical component 9 to float to the surface under the promoting effect of vibration, thus playing a second defoaming role.

[0051] After the defoaming process, the electrical component tooling slide 2 at the second defoaming and curing station 6 is left to stand and cure for a period of time, so that the second injection of adhesive in the potting cavity 10 of each electrical component 9 is fully cured, thereby completing the defoaming process of the array-distributed electrical components.

[0052] The process by which the oscillation excitation unit 101 applies wandering oscillation to the electrical component tooling slide table 2:

[0053] During the process of the electrical component tooling slide table 2 being moved and conveyed to the first defoaming and curing station 4 or the second defoaming and curing station 6, the vibration excitation column 19 enters the straight through groove 25 through the end of the straight through groove 25 that runs through the slide table conveying track 1.

[0054] Then, the motor 17 is started, causing the oscillating excitation column 19 to rotate continuously at a high speed of over 300 r / min. During the high-speed rotation of the oscillating excitation column 19, the vibrating balls 20 inside the oscillating excitation column 19 are subjected to centrifugal force. Under the action of centrifugal force, each vibrating ball 20 reaches the vibrating ball probe outlet 21 of each column cavity 22 and the part of each vibrating ball 20 protruding from the vibrating ball probe outlet 21 periodically collides with the impact surface 33 at the location of the location and bounces back. As a result, a local high-frequency oscillation source is generated on the electrical component tooling slide table 2 due to the periodic collision impact surface 33 of the vibrating balls 20. The electrical components 9 on the electrical component tooling slide table 2 near the local high-frequency oscillation source are excited by the local oscillation source and undergo strong high-frequency vibration, thereby achieving a highly efficient defoaming effect. The electrical components 9 not near the local high-frequency oscillation source receive a weaker high-frequency oscillation intensity due to the distance, and the defoaming effect is not good.

[0055] At this time, the oscillating excitation column 19 is horizontally displaced under the combined drive of the telescopic movement of the telescoping device 31 and the movement of the slider 16 along the slide rail 15. This causes the oscillating excitation column 19 to gradually move horizontally from the beginning 24.1 of the loop groove 24 to the end 24.2 of the loop groove 24, and then from the end 24.2 to the beginning 24.1 of the loop groove 24, and so on. This back-and-forth movement causes the high-speed rotating oscillating excitation column 19 to move horizontally along the loop groove 24. The path moves back and forth, so that the local high-frequency oscillation source generated by the periodic collision impact surface 33 of the vibrating ball 20 on the electrical component tooling slide table 2 is always in a moving state. Since the path of the loop groove 24 is evenly distributed on the bottom surface of the electrical component tooling slide table 2, the local high-frequency oscillation source on the electrical component tooling slide table 2 will move evenly to all parts of the electrical component tooling slide table 2, so that the electrical components 9 at all parts of the electrical component tooling slide table 2 will receive high-intensity oscillation periodically, thereby improving the uniformity of each electrical component 9 on the electrical component tooling slide table 2.

[0056] Finally, the oscillation excitation column 19 is moved back into the straight through groove 25. Since the straight through groove 25 is open from front to back, the oscillation excitation column 19 will not interfere with the translation of the electrical component tooling slide 2, thus facilitating the translation of the electrical component tooling slide 2 to other workstations.

[0057] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A defoaming device for an electronic component potting production line, characterized in that: It includes a slide rail (1), on which an electrical component tooling slide (2) is mounted. Several electrical components (9) are arranged in an array on the electrical component tooling slide (2), and the potting cavity (10) of each electrical component (9) on the electrical component tooling slide (2) faces upward. It also includes a defoaming and curing station. The electrical component tooling slide (2) can be moved to the defoaming and curing station, and the defoaming and curing station is equipped with an vibration excitation unit (101). When the electrical component tooling slide (2) is moved to the defoaming and curing station, the vibration excitation unit (101) can make a horizontal movement at the bottom of the electrical component tooling slide (2); The bottom surface of the electrical component tooling slide (2) is provided with an oscillation excitation unit wandering labyrinth groove (100), which is composed of a straight through groove (25) and a loop zigzag groove (24); The oscillation excitation unit (101) includes a base (30) parallel to the slide table conveyor track (1). A pair of telescopic devices (31) parallel to the slide table conveyor track (1) are fixedly installed on the base (30). The telescopic rod (32) of the telescopic device (31) is vertically fixedly connected to a slide rail (15). A slider (16) that can move along the length of the slide rail (15) is provided on the slide rail (15). A vertical motor (17) is fixedly installed on the slider (16). An oscillation excitation column (19) is coaxially fixedly connected to the upper end of the output shaft (18) of the motor (17). The oscillation excitation column (19) moves horizontally under the combined drive of the telescopic movement of the telescopic device (31) and the movement of the slider (16) along the slide rail (15). The oscillating excitation column (19) has several cylindrical cavities (22) arranged in a circular array extending in the radial direction. Each cylindrical cavity (22) is equipped with a vibrating ball (20), the diameter of which is adapted to the inner diameter of the cylindrical cavity (22). Each cylindrical cavity (22) is provided with a vibrating ball probe outlet (21) with an inner diameter smaller than that of the vibrating ball (20) at one end away from the axis of the oscillating excitation column (19). When the oscillating excitation column (19) rotates along the axis, the vibrating ball (20) in the cylindrical cavity (22) reaches the vibrating ball probe outlet (21) under the action of centrifugal force and a part of it is protruded from the vibrating ball probe outlet (21). The width of the straight through groove (25) and the loop groove (24) is the same at any position and is not less than the outer diameter of the oscillation excitation column (19). The inner side wall surface of the straight through groove (25) and the loop groove (24) at any position is called the impact surface (33).

2. The defoaming device for the electronic component potting production line according to claim 1, characterized in that: The straight through groove (25) runs through the bottom of the electrical component tooling slide (2) along the length of the slide conveyor track (1).

3. The defoaming device for the electronic component potting production line according to claim 2, characterized in that: The loop-shaped groove (24) is formed by connecting several straight grooves in a vertical broken line. The first end (24.1) of the loop-shaped groove (24) is vertically connected to the straight through groove (25) at the bottom edge of the electrical component tooling slide (2). The last end (24.2) of the loop-shaped groove (24) is located at the geometric center of the bottom surface of the electrical component tooling slide (2). The path of the loop-shaped groove (24) gradually approaches the geometric center of the bottom surface of the electrical component tooling slide (2) from the first end (24.1) to the last end (24.2).

4. The defoaming device for the electronic component potting production line according to claim 3, characterized in that: When the electrical component tooling slide (2) is in the defoaming and curing station, the vibration excitation column (19) can be translated into the straight through groove (25) or the loop groove (24) and translated along the path of the straight through groove (25) or the loop groove (24); when the vibration excitation column (19) is in the straight through groove (25) or the loop groove (24), during the high-speed rotation of the vibration excitation column (19), the vibrating balls (20) in the vibration excitation column (19) are subjected to centrifugal force. Under the action of centrifugal force, each vibrating ball (20) reaches the vibrating ball probe outlet (21) and protrudes. The part of each vibrating ball (20) protruding at the vibrating ball probe outlet (21) periodically collides with the impact surface (33) at the location of the vibration excitation column (19) under the high-speed rotation of the vibration excitation column (19), thereby generating a local vibration source in the electrical component tooling slide (2).

5. The defoaming device for the electronic component potting production line according to claim 4, characterized in that: The oscillation excitation column (19) is provided with a number of longitudinal air pressure balance holes (23), and the inner end of each air pressure balance hole (23) is connected to the outside through the air pressure balance hole (23).

6. The defoaming process of the defoaming device in the electronic component potting production line according to claim 5, characterized in that: During the process of the electrical component tooling slide (2) being moved to the defoaming and curing station, the vibration excitation column (19) enters the straight through groove (25) through the end of the straight through groove (25) that runs along the slide conveyor track (1). Then the motor (17) is started, causing the oscillating excitation column (19) to rotate continuously at a speed exceeding 300 r / min. During the high-speed rotation of the oscillating excitation column (19), the vibrating balls (20) inside the oscillating excitation column (19) are subjected to centrifugal force. Under the action of centrifugal force, each vibrating ball (20) reaches the vibrating ball probe outlet (21) of each column cavity (22) and the part of each vibrating ball (20) protruding from the vibrating ball probe outlet (21) periodically collides under the high-speed rotation of the oscillating excitation column (19). The impact surface (33) of the position bounces back, thereby generating a local high-frequency oscillation source on the electrical component tooling slide (2) due to the periodic collision impact surface (33) of the vibrating ball (20). The electrical components (9) on the electrical component tooling slide (2) near the local high-frequency oscillation source undergo strong high-frequency vibration under the excitation of the local oscillation source, thereby achieving a highly efficient defoaming effect. The electrical components (9) not near the local high-frequency oscillation source receive a weaker high-frequency oscillation intensity due to the distance, resulting in a poor defoaming effect. At this time, the oscillating excitation column (19) is controlled to move horizontally under the combined drive of the telescopic movement of the telescoping device (31) and the movement of the slider (16) along the slide rail (15). This causes the oscillating excitation column (19) to gradually move horizontally from the beginning (24.1) of the loop groove (24) to the end (24.2) of the loop groove (24). Then, the oscillating excitation column (19) moves horizontally from the end (24.2) of the loop groove (24) to the beginning (24.1) of the loop groove (24), and so on. This back-and-forth movement causes the high-speed rotating oscillating excitation column (19) to move horizontally along the loop groove (24). The path of the loop groove (24) moves back and forth, so that the local high-frequency oscillation source generated on the electrical component tooling slide (2) due to the periodic collision impact surface (33) of the vibrating ball (20) is always in a moving state. Since the path of the loop groove (24) is evenly distributed on the bottom surface of the electrical component tooling slide (2), the local high-frequency oscillation source on the electrical component tooling slide (2) will move evenly to all parts of the electrical component tooling slide (2), so that the electrical components (9) at all parts of the electrical component tooling slide (2) will receive high-intensity oscillation periodically, thereby improving the uniformity of each electrical component (9) on the electrical component tooling slide (2); Finally, the oscillation excitation column (19) is repositioned into the straight through groove (25). Since the straight through groove (25) is open from front to back, the oscillation excitation column (19) will not interfere with the translation of the electrical component tooling slide (2), thus facilitating the translation of the electrical component tooling slide (2) to other work positions.

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