Semiconductor measurement process control method and device based on CIM

Abstract

The present application is applicable to the field of semiconductor manufacturing technology, and provides a semiconductor measurement process control method, device, equipment and medium based on CIM. Among them, one of the methods, applied to the first end, includes: determining the target component, measurement path and measurement parameters according to the measurement recipe information, and generating a first instruction; sending the first instruction to one or more specified second ends; the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameters through the measurement path. The above method solves the problem that the existing process control software cannot be universal due to different equipment configurations by generating a first instruction that can be executed based on any one of at least two groups of execution devices according to the recipe information.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor manufacturing technology, and in particular, relates to a semiconductor measurement process control method, device, equipment and medium based on CIM. Background Art

[0002] Computer Integrated Manufacturing (CIM) is a manufacturing method that uses computers to control the entire manufacturing process. It organically integrates various automated subsystems scattered in the product design process through computers to achieve integrated and intelligent overall benefits.

[0003] However, for some manufacturing fields, especially semiconductor manufacturing, the manufacturing process is very complex and involves many steps, which can reach thousands. The equipment involved in each link is also very different, and the equipment in the same link also has different models for different process specifications. In the process of controlling the equipment, the existing computer integrated manufacturing method often writes a set of control codes for a device, which is highly customized. When the controlled equipment is replaced, the original code or software will not be compatible with the replaced equipment, which becomes an obstacle to the mass production and operation of the equipment.

[0004] Therefore, there is an urgent need to propose a CIM-based semiconductor measurement process control method that is compatible with devices of different configurations. Summary of the invention

[0005] The embodiments of the present application provide a semiconductor measurement process control method, device, equipment and medium based on CIM, which can solve the problem that the existing process control software cannot be universal due to different equipment configurations.

[0006] In a first aspect, an embodiment of the present application provides a semiconductor measurement process control method based on CIM, which is applied to a first end and includes:

[0007] Determine the target component, the measurement path, and the measurement parameters according to the measurement recipe information, and generate a first instruction;

[0008] sending the first instruction to one or more designated second terminals;

[0009] The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path.

[0010] The above method determines the target component, measurement path and measurement parameters according to the measurement recipe information, and generates a first instruction, so that when the generated first instruction is executed, the execution device can determine the target component, measurement path and measurement parameters according to the first instruction to achieve the measurement path.

[0011] Among them, since the generated first instruction can be executed based on at least two groups of devices, the generated first instruction is common to at least two groups of devices. By generating a first instruction that can be common to at least two groups of devices, and then controlling the local device to complete the above-mentioned measurement path, the process of "controlling the local device to execute according to the measurement formula information" in the existing control method is decoupled to generate an indirect, measurement path-related, and universal instruction, without the need to write a complete set of codes for a group of devices, thereby reducing the degree of customization of the software code. And for the same type of measurement formula information, only one code editing is required for the process from this type of measurement parameters to the first instruction. No matter what execution device is used to complete this type of measurement parameters in the future, the edited first instruction can be directly called for parsing to control the execution to complete the above-mentioned measurement parameters. It solves the problem in the prior art that when the same measurement parameters are achieved but the specific equipment is replaced, the code needs to be re-edited as a whole.

[0012] At the same time, the first instruction is sent to the second end, and the second end control device controls the local device to perform processing and manufacturing. The second end achieves compatibility with different devices, which can improve the versatility of the method during implementation.

[0013] In a possible implementation manner of the first aspect, the measurement recipe information includes a target component and a measurement parameter, and the step of determining the target component, the measurement path, and the measurement parameter according to the measurement recipe information includes:

[0014] Based on a preset rule, the measurement path is determined according to the target component and the measurement parameter, and the measurement path includes a plurality of processes that are determined in a preset process set and have a certain order.

[0015] The above method determines multiple processes in a preset process set through preset rules, and determines the order of multiple processes to obtain a measurement path, so that when the obtained measurement recipe information only includes the target component and the measurement parameter, the measurement path can be determined based on the preset rules and the first instruction can be generated. In addition, since the measurement path is determined by multiple processes with a sequence, the measurement path can be split into multiple processes according to the recipe information, rather than determining the measurement path based on a specific execution device, so that when the execution device executes the first instruction, it can be executed based on the process, which can maximize compatibility with different hardware devices.

[0016] In a possible implementation manner of the first aspect, the measurement recipe information includes a selection instruction; the selection instruction includes a target component, a plurality of selected processes, and a selection order of the plurality of selected processes;

[0017] The step of determining the target component, the measurement path and the measurement parameters according to the measurement recipe information includes:

[0018] Determine the measurement path according to the plurality of selected processes and the selected order;

[0019] The measurement parameters are determined according to one or more selected processes, or the measurement parameters are determined according to the measurement path.

[0020] In the above method, selection instructions based on user operations are introduced, and then a method for generating target components, measurement paths and measurement parameters by selecting target components and measurement information (i.e., process steps or measurement parameters) is provided. From the user's perspective, it can simplify the operation difficulty while providing a semiconductor measurement process control method with better compatibility.

[0021] In a second aspect, an embodiment of the present application provides a semiconductor measurement process control method based on CIM, which is applied to a second end and includes:

[0022] Obtain configuration information and a first instruction of a local device;

[0023] Parsing the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains a preset measurement parameter through a preset measurement path; and the second instruction can be executed based on the local device;

[0024] The local device is controlled according to the second instruction so that the target component obtains the measurement parameter through the measurement path.

[0025] The above method parses the first instruction according to the configuration information, and parses the first instruction that can be used in at least two groups of devices into a second instruction that can be executed by the local device according to the different local configurations, thereby achieving compatibility with different devices. At the same time, the method obtains the first instruction that can be used in at least two groups of execution devices and parses the first instruction, rather than directly controlling the local device to execute according to the measurement recipe information, so that when the first instruction is parsed into the second instruction, the parsing logic is the same, so that the method can also be used in at least two groups of devices.

[0026] In a possible implementation manner of the second aspect, the step of parsing the first instruction into the second instruction according to the configuration information includes:

[0027] Determining a rule applied to the local device in a preset rule set according to the configuration information; wherein the preset rule set includes preset rules applied to any one of at least two groups of execution devices;

[0028] The first instruction is parsed according to the rule applied to the local device to obtain the second instruction.

[0029] The above method determines the rules applied to the local device in the preset rule set according to the configuration information, so that when generating the second instruction, the first instruction can be parsed according to the different configurations of the local device, so that the obtained second instruction can be compatible with different local devices. At the same time, since the above parsing rules are selected from the preset rule set, multiple parsing rules corresponding to the execution device are pre-configured, so that when the specific hardware components are changed and the execution parameters of the device are changed, the corresponding parsing rules can be selected from multiple sets of preset rule sets to achieve compatibility with execution devices with different execution modes.

[0030] In a possible implementation manner of the second aspect, the measurement path includes multiple processes, and the step of controlling the local device according to the second instruction includes:

[0031] A driver of a designated local device is called based on the second instruction to control the designated local device to complete a designated process.

[0032] In the above method, the driver encapsulation setting of the specific hardware components at the bottom of the local device is used to call the corresponding driver to enable the hardware components to complete the specified process. When the local device is controlled by the second instruction, only the call information of the corresponding hardware components needs to be determined, which reduces the difficulty of rule setting and simplifies the code complexity.

[0033] In a possible implementation manner of the second aspect, the step of calling a driver of a specified local device based on the second instruction to control the specified local device to perform a specified process includes:

[0034] If it is determined that the specified process is a combined action process, the combined action layer is run based on the second instruction to call the drivers of multiple specified local devices to control the multiple specified local devices to complete the combined action process; the combined action process is completed by the cooperation of multiple hardware components in the local device.

[0035] After determining that a process is a combined action process, the above method only needs to determine the corresponding combined action layer without paying attention to the coordination relationship between multiple hardware components. The corresponding driver of the local device is called through the combined action layer, and the combined action is split through the combined action layer. The combined action layer is equivalent to an encapsulated module that can call multiple local device drivers. For different execution devices, some combined actions are universal. Therefore, by calling multiple hardware components for execution through the combined action module, the versatility of this method can be further improved.

[0036] In a possible implementation manner of the second aspect, the step of controlling the local device according to the second instruction further includes:

[0037] Based on the second instruction, a preset algorithm is called to calculate a specified result according to an output result of the first preset process.

[0038] In the above method, by calling the preset algorithm, the requirements of different devices for algorithm calculation are met.

[0039] In the process of achieving the measurement parameters, it may be necessary to calculate the results of the previous process to achieve the measurement parameters. However, for specific execution devices, the software algorithms therein may be different due to different device configurations. Therefore, the above method improves the execution efficiency of the local device by encapsulating the algorithm module of a specific device for calling by a specific task.

[0040] In a third aspect, an embodiment of the present application provides a semiconductor measurement process control method based on CIM, comprising:

[0041] Determine a target component, a measurement path, and a measurement parameter according to the measurement recipe information, and generate a first instruction; the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path;

[0042] Get the configuration information of the local device;

[0043] Parsing the first instruction into a second instruction according to the configuration information, where the second instruction can be executed based on the local device;

[0044] The local device is controlled according to the second instruction so that the target component obtains the measurement parameter through the measurement path.

[0045] In the above method, by generating a first instruction that can be executed based on at least two groups of devices according to the recipe information, when generating the first instruction, only the measurement path and measurement parameters of the target component need to be determined, and the implementation details of the hardware components and logic do not need to be determined. At the same time, by parsing the first instruction into a second instruction according to the local configuration information, compatibility with different software is achieved. After extracting the business logic, further execution is performed according to the configuration information to achieve compatibility with the hardware.

[0046] In a fourth aspect, an embodiment of the present application provides a semiconductor measurement process control device based on CIM, comprising:

[0047] A generating module, used for determining a target component, a measuring path and a measuring parameter according to the measuring recipe information, and generating a first instruction;

[0048] A sending module, used for sending the first instruction to one or more designated second ends;

[0049] The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path.

[0050] In a fifth aspect, an embodiment of the present application provides a semiconductor measurement process control device based on CIM, comprising:

[0051] An acquisition module, used to acquire configuration information and a first instruction of a local device;

[0052] a parsing module, configured to parse the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two groups of execution devices so that the target component obtains a preset measurement parameter via a preset measurement path; and the second instruction can be executed based on the local device;

[0053] A control module is used to control the local device according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

[0054] In a sixth aspect, an embodiment of the present application provides a semiconductor measurement process control device based on CIM, comprising:

[0055] An instruction generation module is used to determine a target component, a measurement path and a measurement parameter according to the measurement recipe information, and generate a first instruction; the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path;

[0056] A configuration information acquisition module is used to obtain the configuration information of the local device;

[0057] an instruction parsing module, configured to parse the first instruction into a second instruction according to the configuration information, wherein the second instruction can be executed based on the local device;

[0058] A device control module is used to control the local device according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

[0059] In the seventh aspect, an embodiment of the present application provides a terminal device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the CIM-based semiconductor measurement process control method described in any one of the first to third aspects above is implemented.

[0060] In an eighth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the CIM-based semiconductor measurement process control method described in any one of the first to third aspects above is implemented.

[0061] In a ninth aspect, an embodiment of the present application provides a computer program product. When the computer program product is executed on a terminal device, the terminal device executes the CIM-based semiconductor measurement process control method described in any one of the first to third aspects above.

[0062] It can be understood that the beneficial effects of the fourth to ninth aspects mentioned above can be found in the relevant descriptions of the first to third aspects mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0064] Figure 1 It is a flow chart of a semiconductor measurement process control method based on CIM provided in an embodiment corresponding to the first aspect of the present application;

[0065] Figure 2 It is a schematic diagram of the software architecture provided by the embodiment of the present application;

[0066] Figure 3 It is a flow chart of a semiconductor measurement process control method based on CIM provided in an embodiment corresponding to the second aspect of the present application;

[0067] Figure 4 It is a flow chart of a semiconductor measurement process control method based on CIM provided in an embodiment corresponding to the second aspect of the present application;

[0068] Figure 5 is a structural schematic diagram of a semiconductor measurement process control device based on CIM provided in an embodiment corresponding to the first aspect of the present application;

[0069] Figure 6 is a structural schematic diagram of a semiconductor measurement process control device based on CIM provided in an embodiment corresponding to the second aspect of the present application;

[0070] Figure 7 is a schematic structural diagram of a semiconductor measurement process control device based on CIM provided in an embodiment corresponding to the third aspect of the present application;

[0071] Figure 8 It is a schematic diagram of the structure of the terminal device provided in an embodiment of the present application.

[0072] Reference numerals:

[0073] Generating module 501, sending module 502;

[0074] Acquisition module 601, parsing module 602, control module 603;

[0075] Instruction generation module 701, configuration information acquisition module 702, instruction parsing module 703, device control module 704;

[0076] Terminal device 80 , processor 801 , memory 802 , computer program 803 . DETAILED DESCRIPTION

[0077] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0078] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0079] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0080] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0081] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0082] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0083] In the existing semiconductor manufacturing field, the semiconductor process technology is very complex, with many steps, and the equipment involved in each link is different. Especially for the wafer measurement (it is worth noting that the wafer should be considered as an uncut wafer that may have a sample of a specific material or material combination grown on it in this application and some common understandings in the industry), wafer measurement needs to be completed with the help of measurement equipment, and different measurement equipment corresponds to different hardware platforms and the execution methods of the hardware platforms. This poses great challenges to the versatility, compatibility, scalability, and standardization of CIM (Computer Integrated Manufacturing) software. The process modules in the current domestic CIM software are usually a whole. If a device with a different configuration is replaced or a component with different parameters is replaced, the code in the business process needs to be changed, which easily leads to a situation where one device has one set of codes, limiting the versatility and compatibility of the CIM software.

[0084] In order to solve the problem that the existing control software is not compatible with the replaced equipment due to equipment replacement, one technical idea is to decouple the operation process and hardware components in the software development process, effectively separate the upper-level business logic and the underlying component differentiation, and improve the versatility of the developed process control software.

[0085] According to the above technical ideas, refer to the attached manual Figure 1 In a first aspect, an embodiment of the present application proposes a semiconductor measurement process control method based on CIM, which is applied to a first end and includes:

[0086] Step S102: determining a target component, a measurement path, and measurement parameters according to the measurement recipe information, and generating a first instruction;

[0087] Step S104: sending the first instruction to one or more designated second terminals;

[0088] The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path.

[0089] The process control method proposed in the embodiment of the present application can be applied to semiconductor manufacturing fields such as integrated circuit manufacturing, semiconductor chip manufacturing industry, wafer process technology, etc., and can be particularly applied to the process link of wafer measurement, so as to achieve wafer measurement by controlling different measurement equipment through a set of codes. Among them, the first end can be understood as an independent process control device, such as a process control processor, or as a software module in a certain device, such as a computer program stored in a memory, which can be executed by a processor to implement steps 102 and 104.

[0090] Specifically, the semiconductor measurement process control method based on CIM proposed in this embodiment can be implemented by a software architecture including an application layer. It can be considered to use a rule engine, a job task scheduler, or a timing and process control engine, such as Drools or Quartz, to build the application layer, and write it in C# language (of course, in some optional implementations, other architectures and other languages ​​can also be used).

[0091] The measurement recipe information may be a measurement recipe for photolithography, etching, etc., or it may be an execution step of the wafer measurement process. For example, "loading the wafer, finding the number of the area to be measured, finding the coordinates of the area to be measured through the visual system, performing a Z-direction scan, performing Z-direction height compensation, spectrum acquisition, calculation results, and unloading the wafer" is a recipe information.

[0092] The measurement recipe information can be in natural language form. For example, in the wafer measurement process, the sentence "X-ray measurement of film lattice parameters" input by the user can be used as measurement recipe information. After obtaining the measurement recipe information in natural language form, the target component, measurement parameters and measurement path are determined by decoding the measurement recipe information in natural language form.

[0093] Alternatively, the measurement recipe information may be in the form of instructions. For example, when the first end includes a user interface, the user may edit the recipe information through the user interface, or by selecting a corresponding selection module in the user interface, the first end determines the target component, the measurement path, and the measurement parameters according to the user's selection instruction or editing instruction.

[0094] Regarding the generation of the first instruction in step S102, after obtaining the measurement recipe information, the first end determines the measurement path and measurement parameters of the target component, parses the measurement path, the target component, and the measurement parameters based on preset rules, extracts the business logic of the measurement recipe information, and obtains a first instruction that is executed based on any one of at least two groups of execution devices so that the target component obtains the measurement parameters through the measurement path.

[0095] Among them, the preset rules can be formulated according to the business logic of this field, or they can be formulated according to the execution logic shared by multiple groups of different execution devices when completing the corresponding processes. Specifically, in the wafer measurement link, the second instruction can be obtained according to the execution logic of a variety of measurement equipment. For example, there are many types of measurement equipment, such as optical thin film measurement, optical key dimension measurement, X-ray thin film measurement, X-ray film layer component doping rate measurement, X-ray film stress and lattice parameter measurement, etc. When generating the first instruction and extracting the first pair of business logic or execution logic, it only focuses on the abstract expression of the business logic, and does not focus on the specific hardware components and logic implementation details. By extracting the execution logic of a variety of measurement equipment, these devices can be controlled together through the first end.

[0096] After the first instruction is generated, the first end sends the first instruction to the second end. After receiving the first instruction, the second end controls the local device according to the first instruction so that the target component obtains the measurement parameter through the measurement path.

[0097] It should be noted that regarding the interaction between the first end and the second end, the first end and the second end may be the same device or different devices. The computer program or software capable of implementing the method mentioned in the above embodiment and the program for controlling the execution device may be two different programs or software on the same device or the same program or software.

[0098] See the instruction manual Figure 2 , wherein the first end can be implemented based on such a software architecture, including:

[0099] The presentation layer and the application layer, the presentation layer can be a user interface, providing users with an operation view for operations such as formula editing and task management, or showing users relevant data in process production. The application layer obtains the measurement formula statement input by the user, or the user selects through the editing module, and then obtains the selection instruction to obtain the measurement formula information.

[0100] The application layer determines the target component, the measurement path and the measurement parameters according to the measurement recipe information obtained from the presentation layer, determines the business logic for executing the recipe, generates a first instruction, and sends the first instruction to the second end. The extracted business logic is the business logic shared by at least two groups of devices.

[0101] The above method can be implemented by computer software and program code. By adopting the above technical ideas to develop or write computer software, the computer can execute the CIM-based semiconductor measurement process control method proposed in this embodiment, so that the written software can be compatible with a variety of different devices, thereby improving the compatibility and versatility of the above computer software.

[0102] The beneficial effects of this embodiment are:

[0103] This embodiment determines the target component, measurement path and measurement parameters according to the measurement recipe information and generates a first instruction, so that when the generated first instruction is executed, the execution device can determine the target component, measurement path and measurement parameters according to the first instruction to achieve the measurement path.

[0104] Among them, since the generated first instruction can be executed based on at least two groups of devices, the generated first instruction is common to at least two groups of devices. By generating a first instruction that can be common to at least two groups of devices, and then controlling the local device to complete the above-mentioned measurement path, the original control method of controlling the local device to execute according to the measurement formula information is decoupled to generate an indirect, measurement path-related, and universal instruction, without the need to write a complete set of codes for a group of devices, thereby reducing the degree of customization of the software code. And for the same type of measurement formula information, only one code editing is required for the process from this type of measurement parameters to the first instruction. No matter what execution device is used to complete this type of measurement parameters in the future, the edited first instruction can be directly called for parsing to control the execution to complete the above-mentioned measurement parameters. This solves the problem in the prior art that when the same measurement parameters are achieved but the specific equipment is replaced, the code needs to be re-edited as a whole.

[0105] At the same time, the first instruction is sent to the second end, and the second end control device controls the local device to perform processing and manufacturing. The second end achieves compatibility with different devices, which can improve the versatility of the method during implementation.

[0106] According to the above embodiment, in yet another embodiment:

[0107] The measurement recipe information includes a target component and a measurement parameter, and the step of determining the target component, the measurement path and the measurement parameter according to the measurement recipe information includes:

[0108] Based on a preset rule, the measurement path is determined according to the target component and the measurement parameter, and the measurement path includes a plurality of processes that are determined in a preset process set and have a certain order.

[0109] For example, for the measurement recipe information of "optical measurement of film thickness", it can be determined that the target component is the chip, and the measurement parameter is the film thickness. At this time, the following measurement path can be determined based on the business logic of the optical film thickness measurement equipment: loading the chip, numbering the area to be measured, finding the coordinates of the area to be measured through the visual system, performing Z-direction scanning, performing Z-direction height compensation, spectrum acquisition, calculation results, and unloading the chip.

[0110] The preset rules can be obtained by extracting the logic of executing services on various devices based on experience. Optionally, when determining the measurement path, corresponding adjustments can be made according to different measurement parameters. For example, when the measurement parameter is to measure the lattice parameters of the film layer by X-ray, the determined process is X-ray energy spectrum acquisition, not spectrum acquisition.

[0111] When determining the process set, we can consider the various different types of machines that have been put into use in actual production, and we can also consider the equipment that is not currently in use but may be introduced. According to the process flow of the above equipment during process production or processing and manufacturing, we can determine the processes in the process set.

[0112] By adopting the above method, the determined measurement path can be universal, the generated first instruction can be compatible with as many groups of execution devices as possible, and the application layer software program can be kept consistent during specific implementation to achieve the maximum degree of compatibility.

[0113] In an optional embodiment, when determining the measurement path, it can be obtained by matching the measurement parameters and the target components in a preset process set, or by selecting the measurement parameters and the target components. By selecting or matching the measurement path according to the measurement parameters, the obtained measurement path is universal and can be executed by multiple groups of equipment that can complete the measurement parameters.

[0114] The beneficial effects of this embodiment are:

[0115] This embodiment determines multiple processes in a preset process set through preset rules, and determines the order of multiple processes to obtain a measurement path, so that when the obtained measurement formula information only includes the target component and the measurement parameter, the measurement path can be determined based on the preset rules and the first instruction can be generated. In addition, since the measurement path is determined by multiple processes with a sequence, the measurement path can be split into multiple processes according to the measurement formula information, rather than determining the measurement path based on a specific execution device, so that when the execution device executes the first instruction, it can be executed based on the process, which can maximize compatibility with different hardware devices.

[0116] According to the above embodiment, in yet another embodiment:

[0117] The measurement recipe information includes a selection instruction; the selection instruction includes a target component, a plurality of selected processes, and a selection order of the plurality of selected processes;

[0118] The step of determining the target component, the measurement path and the measurement parameters according to the measurement recipe information includes:

[0119] Determine the measurement path according to the plurality of selected processes and the selected order;

[0120] The measurement parameters are determined according to one or more selected processes, or the measurement parameters are determined according to the measurement path.

[0121] Exemplarily, the measurement recipe information may be in the form of "loading the film, finding the coordinates of the area to be measured, finding the coordinates of the area to be measured through the visual system, performing a Z-direction scan, performing a Z-direction height compensation, collecting spectra, calculating the results, and unloading the film", wherein processes such as "loading the film" and "finding the coordinates of the area to be measured" are obtained based on the selection instructions.

[0122] The user can select the corresponding process in a certain order through the user interface in the presentation layer, or when the order of the process has been determined, the user can directly select the process. The presentation layer generates a selection instruction based on the process selected by the user and the order of the process. The application layer determines the measurement path based on the process selected in the selection instruction and the order in which the process is selected.

[0123] When determining the measurement parameters, the measurement parameters can be determined according to the measurement path, or according to one or more processes. For example, the measurement parameter can be determined to be optical measurement of film thickness according to the process of "spectral acquisition".

[0124] In a possible implementation, the method provided in this embodiment may be implemented based on a user interface. The user interface may be obtained by a developer according to the business logic setting of the corresponding measurement parameters, and the user generates a selection instruction by comparing and selecting.

[0125] After obtaining the measurement recipe information in the form of a selection instruction, the first end may parse the selection instruction according to the process and the selection order in the selection instruction, determine the measurement parameters, and generate a first instruction.

[0126] The beneficial effects of this embodiment are:

[0127] By determining the measurement path according to the selected process and the selection order in the selection instruction, it is determined that when the measurement formula information is a selection instruction, the measurement formula information formed by the selection is parsed to determine the measurement path and the measurement parameter rules, and the rule of generating the first instruction according to the formula information in the form of the selection instruction. When the first end executes the above method, it can support the user to select and edit the user to form the measurement formula information, and different measurement formulas can also be parsed, which improves the versatility of the method.

[0128] At the same time, this embodiment introduces selection instructions based on user operations, and further provides a method for generating target components, measurement paths and measurement parameters by selecting target components and measurement information (i.e., process steps or measurement parameters). From the user's perspective, it can simplify the operation difficulty while providing a semiconductor measurement process control method with better compatibility.

[0129] Second, refer to the attached manual Figure 3 The embodiment of the present application provides a semiconductor measurement process control method based on CIM, which is applied to the second end and includes:

[0130] Step S302: Obtain configuration information and a first instruction of a local device;

[0131] Step S304: parsing the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains a preset measurement parameter through a preset measurement path; and the second instruction can be executed based on the local device;

[0132] Step S306: Control the local device according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

[0133] In this embodiment, the second end is mainly used for the device control end, which may be an industrial control system, or a computer network device or a computer cluster that is communicatively connected to the device, but is not limited thereto.

[0134] When the second end obtains the configuration information of the local device, it can obtain the configuration information of the local device by reading the configuration file of the local device, or after connecting to the corresponding device, it can obtain the configuration information of the local device by adding it to the configuration file of the first end. At the same time, the method obtains the first instruction that can be used in at least two groups of execution devices and parses the first instruction, rather than directly controlling the local device to execute according to the measurement recipe information, so that when the first instruction is parsed into the second instruction, the parsing logic is the same, so that the method can also be used in at least two groups of devices.

[0135] The configuration information may include the model information of the local device and the included hardware component information. For example, when the local device is an optical thin film measuring device, the configuration information may include the type, model, and corresponding parameter type of the motion platform, the type of the ranging sensor, etc. After acquiring the configuration information, the second end may generate a second instruction according to the configuration information and the first instruction, and control the local device to reach the measurement path through a preset measurement path through the second instruction.

[0136] Among them, the first instruction can be sent by the first end in the above embodiment, or it can be generated locally by the second end. For step S304, when parsing the first instruction into the second instruction, the hardware components of the local device corresponding to the measurement path can be determined according to the first instruction and the configuration information, as well as the action information to be executed by the local device brush, to generate the second instruction. Or the hardware drivers corresponding to different components in the local settings are determined according to the configuration information of the local device, the calling information of the hardware driver is determined, and the second instruction is generated. For example, for the "loading" process in the first instruction, the second end can determine that the hardware components that need to be called for "loading" include a motion platform, a vacuum switch, etc. according to the configuration information, parse the "loading" process into the coordination information of multiple hardware components, and generate the second instruction.

[0137] The beneficial effects of this embodiment are:

[0138] This embodiment parses the first instruction according to the configuration information, and parses the first instruction that can be used in at least two groups of devices into a second instruction that can be executed by the local device according to different local configurations, thereby achieving compatibility with different devices.

[0139] According to the above embodiment, in yet another embodiment:

[0140] The step of parsing the first instruction into the second instruction according to the configuration information includes:

[0141] Determining a rule applied to the local device in a preset rule set according to the configuration information; wherein the preset rule set includes preset rules applied to any one of at least two groups of execution devices;

[0142] The first instruction is parsed according to the rule applied to the local device to obtain the second instruction.

[0143] The following is an exemplary description of determining the parsing rule of the first instruction according to the configuration information:

[0144] Different devices have different hardware components. The optical measurement equipment equipped with an ellipsometer (SE) cantilever has different parameter types corresponding to its hardware components. Therefore, there will be a problem that the model of the hardware components of the execution device needs to be changed, resulting in the need to rewrite the corresponding software of the local device. For example, for an optical measurement device equipped with an ellipsometer (SE) cantilever, the stroke of the motion platform is [X_se_min, X_se_max], [Y_se_min, Y_se_max]. If it is an IM machine, the corresponding parameter type of the motion stroke is polar coordinates, and the corresponding parameter type of the motion stroke is Due to the difference in the spatial design of the mechanical structure, the stroke range has changed and the corresponding motion mode is also different. Therefore, when parsing the first instruction, it is necessary to determine the parsing rules for parsing the first instruction into the second instruction according to the different configuration information.

[0145] In this embodiment, the preset rule set is a set of multiple parsing rules related to the device configuration. For example, the preset rule set includes a parsing rule for parsing the motion stroke into polar coordinates and a parsing rule for parsing the motion form into rectangular coordinates. According to different configuration information, the corresponding parsing rule is determined in the preset rule set. For example, when the motion platform carried in the configuration information is read as an IM machine, when the first instruction is parsed into the second instruction, the motion stroke of the motion platform is parsed in the form of polar coordinates.

[0146] Optionally, after determining the rules applied to the local device, when parsing the first instruction, if it is determined that the local device executes a certain process, it is necessary to use parameters as input to control the hardware components to complete the above-mentioned measurement path, and the parameters are not pre-set values, then according to the configuration information, the action parameters are calculated, and a second instruction is generated. For example, in the semiconductor measurement process, for the "loading" process, the X, Y, Z, and T axes of the motion platform need to be moved to the splicing position. At this time, the position of the splicing position is fixed, and the motion stroke of the motion platform is determined, and the corresponding motion distance can be a pre-set value. After determining the coordinates of the area to be measured, the motion platform needs to be called when performing a height scan in the Z direction. At this time, the motion distance in the motion stroke of the motion platform needs to be determined according to the coordinates of the area to be measured. It is not a pre-set value and needs to be calculated based on the configuration information and the coordinates of the area to be measured.

[0147] The beneficial effects of this embodiment are:

[0148] The above method determines the rules applied to the local device in the preset rule set according to the configuration information, so that when the second instruction is generated, the first instruction can be parsed according to the different local device configurations, so that the obtained second instruction can be compatible with different local devices. At the same time, since the above parsing rules are selected from the preset rule set, multiple parsing rules corresponding to the execution device are pre-configured, so that when the specific hardware components are changed and the execution parameters of the device are changed, the corresponding parsing rules can be selected from multiple sets of preset rule sets to achieve compatibility with execution devices with different execution modes.

[0149] According to the above embodiment, in yet another embodiment:

[0150] The measurement path includes a plurality of steps, and the step of controlling the local device according to the second instruction includes:

[0151] A driver of a designated local device is called based on the second instruction to control the designated local device to complete a designated process.

[0152] The driver of the local device is the hardware driver corresponding to a single hardware component. The driver package setting of the local device can enable the corresponding hardware component to complete one or more basic actions by calling the corresponding hardware driver. The drivers of multiple local devices are independent of each other. The specified process can be understood as any specified process in the measurement path. The driver of the local device can be installed at the second end, and compatibility with different device interfaces is achieved through the local driver installed at the second end.

[0153] Exemplarily, when executing the "collecting spectrum" process, it is only necessary to determine the driver corresponding to the spectrometer according to the second instruction and collect through the spectrometer; and for the "Z-direction height scanning" process, after determining according to the second instruction that the platform executing the process includes: a motion platform and a ranging sensor, by calling the driver corresponding to the motion platform, the point to be measured is moved in sequence to directly under the ranging sensor, and then the driver corresponding to the ranging sensor is called to collect readings to complete the process.

[0154] In this embodiment, since the second instruction is obtained according to the configuration information, the hardware component to be called can be determined according to the second instruction, and then the driver of the local device to be called can be determined.

[0155] See the instruction manual Figure 2In a specific software architecture, this can be implemented through a driver layer. The driver layer includes driver libraries for different devices of multiple models and suppliers, as well as hardware components of multiple models and suppliers. After receiving a call instruction from a local execution device, the driver layer calls the corresponding hardware driver to call the hardware component to complete a specified process according to the call instruction, wherein the call instruction is generated according to the second instruction.

[0156] This embodiment can solve the following two situations:

[0157] 1. When the equipment in production is replaced, the interface of the equipment is incompatible with the existing domestic software. By calling the local device driver to call the local device for execution, the compatibility of different devices is delegated to this layer for implementation, rather than requiring a complete set of codes to control and write a complete process.

[0158] 2. For the same device, when one or more hardware components are replaced, resulting in interface incompatibility, you only need to add more comprehensive hardware drivers and basic actions to achieve full-scenario compatibility.

[0159] The beneficial effects of this embodiment are:

[0160] In the above method, the driver encapsulation setting of the specific hardware components at the bottom of the local device is used to call the corresponding driver to enable the hardware components to complete the specified process. When the local device is controlled by the second instruction, only the call information of the corresponding hardware components needs to be determined, which reduces the difficulty of rule setting and simplifies the code complexity.

[0161] According to the above embodiment, in yet another embodiment:

[0162] The step of calling a driver of a designated local device based on the second instruction to control the designated local device to complete a designated process includes:

[0163] If it is determined that the specified process is a combined action process, the combined action layer is run based on the second instruction to call the drivers of multiple specified local devices to control the multiple specified local devices to complete the combined action process; the combined action process is completed by the cooperation of multiple hardware components in the local device.

[0164] In this embodiment, when calling the corresponding hardware driver in the local device according to the second instruction, the drivers of multiple specified local devices can be indirectly called through the combined action layer to complete the specified process. Optionally, the combined action layer is equivalent to an encapsulated module that can call multiple local device drivers. The calling information of the drivers of multiple local devices required to complete the specified process and the calling order of multiple local information can be pre-stored in the combined action layer. Optionally, after receiving the second instruction, the combined action layer determines the execution actions of multiple hardware components and the execution order between them according to the second instruction, and then calls the drivers of the corresponding local devices in a certain order.

[0165] Optionally, when calling the corresponding hardware driver of the local execution device according to the second instruction, the hardware driver corresponding to the hardware component can be called through the basic action layer. When it is determined that a process is completed by a single hardware, the process is a basic action process, and the hardware driver corresponding to the single component can be called through the basic action layer to complete the specified process.

[0166] In an optional implementation, the step of controlling the local device according to the second instruction further includes:

[0167] Based on the second instruction, a preset algorithm is called to calculate a specified result according to the output result of the first preset process. Exemplarily, the preset algorithm includes an analysis algorithm and a matching algorithm. In the process of "finding the coordinates of the area to be measured", the image information obtained by the fine alignment camera is calculated by calling the matching algorithm to determine the coordinates of the area to be measured.

[0168] In the process of achieving the measurement parameters, it may be necessary to calculate the results of the previous process to achieve the measurement parameters. However, for specific execution devices, the software algorithms may be different due to different device configurations. For example, when the optical film thickness equipment is used for semiconductor measurement, the acquisition instrument used is a spectrometer, so when analyzing the results, the corresponding spectral analysis algorithm is used; and the acquisition instrument corresponding to the XRD measurement equipment is a planar array detector, which corresponds to the energy spectrum analysis algorithm. The corresponding algorithms of the two are different. At this time, by encapsulating the algorithm module of a specific device for specific task calls, the execution efficiency of the local device is improved.

[0169] The beneficial effects of this embodiment are:

[0170] After determining that a process is a combined action process, this embodiment only needs to determine the corresponding combined action layer, without paying attention to the coordination relationship between multiple hardware components. The corresponding driver of the local device is called through the combined action layer, and the combined action is split through the combined action layer. The combined action layer is equivalent to an encapsulated module that can call multiple local device drivers. For different execution devices, some combined actions are universal. Therefore, by calling multiple hardware components for execution through the combined action module, the versatility of this method can be further improved.

[0171] See the instruction manual Figure 4 In a third aspect, an embodiment of the present application provides a semiconductor measurement process control method based on CIM, comprising:

[0172] Step S402: determining a target component, a measurement path, and a measurement parameter according to the measurement recipe information, and generating a first instruction; the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path;

[0173] Step S404: Obtain configuration information of the local device;

[0174] Step S406: parsing the first instruction into a second instruction according to the configuration information, where the second instruction can be executed based on the local device;

[0175] Step S408: Control the local device according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

[0176] See the instruction manual Figure 2 , the above method can be implemented with the help of the following software architecture, including:

[0177] Presentation layer: It can be a user interface that provides users with an operation view for formula editing, task management, and other operations, or displays relevant data in process production to users. The measurement formula statement input by the user or the selection instruction selected by the user through the editing module is obtained through the application layer, and then the measurement formula information is obtained.

[0178] Application layer: after determining the target component, measurement path and measurement parameters based on the measurement recipe information obtained from the presentation layer, the business logic for executing the recipe is determined, and a first instruction is generated, and the first instruction is sent to the control layer. The extracted business logic is the business logic shared by at least two groups of devices.

[0179] Control layer: includes the combined action layer and the basic action layer. The control layer determines whether the specified process is a combined action process or a basic action process according to the first instruction. If it is determined to be a basic action process, the corresponding local device driver is directly called through the basic action layer according to the second instruction. If it is confirmed to be a combined action process, the corresponding combined action layer is determined according to the second instruction, and the corresponding basic action layer is called through the combined action layer, and the corresponding local device driver is indirectly called.

[0180] Driver layer: The driver layer includes driver libraries for different devices of multiple models and suppliers, as well as hardware components of multiple models and suppliers. After receiving the call instruction of the local execution device, the driver layer calls the corresponding hardware driver to call the component to complete the specified process according to the call instruction, wherein the call instruction is generated according to the second instruction. The driver layer is called by the control layer to complete the basic action.

[0181] The above embodiments will be described in detail below with reference to examples.

[0182] When the measurement parameter is optical measurement of film thickness:

[0183] 1. The user edits the measurement recipe information through the presentation layer and issues the job task to the device. The measurement recipe information includes: loading the film, finding the area number to be measured, finding the coordinates of the area to be measured through the visual system, performing Z-direction scanning, performing Z-direction height compensation, spectrum acquisition, calculation results, and ejecting the film.

[0184] 2. The application layer converts the measurement path and measurement parameters in the measurement recipe information obtained from the presentation layer into the first instruction and sends it to the control layer.

[0185] 3. The control layer has loaded the configuration file of the local device (i.e., the optical film thickness device) when the software is started, and interprets the first instruction into the second instruction according to the configuration file. And by calling the driver of the local device in the driver layer, the hardware components of the device are called to act according to the second instruction.

[0186] Specifically, after determining that the "loading" process is a combined action process, through the combined action layer corresponding to the "loading" process, call the X, Y, Z, and T axes of the motion platform corresponding to the equipment to move to the film connection position, control the vacuum switch, and then call the EFEM (equipment front end module) to drive the loading of the film.

[0187] "Find the coordinates of the area to be measured" is also a combined action process. Through the combined action layer corresponding to the "Find the coordinates of the area to be measured" process, the motion platform is called to move to the coarse adjustment position preset when the measurement formula information is made, and then the fine alignment camera equipped with a high-magnification lens is called to take pictures, and the matching algorithm is called to perform calculations based on the image information obtained by the fine alignment camera to determine the coordinates of the area to be measured (accurate to the micron level).

[0188] Determine "Z-direction height scan" as a combined action process, call the motion platform through the combined action layer corresponding to the "Z-direction height scan" process, move the points to be measured in sequence to just below the ranging sensor, and then call the ranging sensor to collect readings.

[0189] The "Z direction compensation" process is also a combined action process. Through the combined action layer corresponding to the "Z direction compensation" process, the motion platform is called to move the point to be measured to the measurement spot position, and then the Z axis of the motion platform is moved to perform height compensation based on the height difference between this point and the first point.

[0190] After the "Z direction compensation" process, the "spectrum acquisition" process is a basic action process, which only needs to call the spectrometer for acquisition through the basic action layer. After acquisition, the corresponding interface of the analysis software is called according to the second instruction for calculation.

[0191] The final "wafer ejection" is also a combined action process. Through the combined action layer corresponding to the "wafer ejection" process, the motion platform moves to the wafer connection position, the vacuum is turned off, and the EFEM is called to take the wafer out and put it back, thus completing the complete measurement process of a "wafer".

[0192] When the measurement parameters are X-ray measurements of film lattice parameters:

[0193] 1. The user edits the measurement recipe information through the presentation layer and issues the job task to the device. The measurement recipe information includes: loading the film, finding the area number to be measured, finding the coordinates of the area to be measured through the visual system, performing Z-direction scanning, performing Z-direction height compensation, X-ray spectrum acquisition, calculating results, and ejecting the film.

[0194] 2. The application layer converts the measurement path and measurement parameters in the measurement recipe information obtained from the presentation layer into the first instruction and sends it to the control layer.

[0195] 3. The control layer has loaded the configuration file of the local device (i.e., the XRD measurement device) when the software is started, and generates the second instruction according to the first instruction and the configuration file. And by calling the driver of the local device in the driver layer, the hardware components of the device are called to act according to the second instruction.

[0196] Specifically, after determining that the "film loading" process is a combined action process, through the combined action layer corresponding to the "film loading" process, the X, Y, Z, and T axes of the motion platform corresponding to the device are called to move to the film connection position. The difference from the optical device in the previous example is that the action of opening the X-ray shielding window is added. Then the vacuum switch is controlled, and the EFEM driver is called to load the film.

[0197] "Find the coordinates of the area to be measured", "Z-direction height scanning" and "Z-direction compensation" are all combined action procedures, and the specific execution is the same as the corresponding content in the previous example. "Energy spectrum acquisition" is a combined action procedure. Through the combined action layer corresponding to the "Find the coordinates of the area to be measured" process, the corresponding basic action layer is called to complete the following actions: first open the Shutter of the X-ray tube, move the Goniometer (angle measuring cantilever) to adjust the X-ray incident angle and the receiving angle of the array detector; control the piezoelectric ceramic motor to adjust the distance between the group light knife and the sample (hundreds of microns). Control the rotation axis of the motion platform to the angle corresponding to the element of the sample to be measured, and then call the array detector to collect the X-ray diffraction spectrum. And for the relaxed strain sample, it is necessary to change the angle of the angle measuring cantilever and the rotation axis of the motion platform before performing secondary energy spectrum acquisition.

[0198] Then, the analysis algorithm is called according to the second instruction to calculate the lattice parameters, and finally the film ejection action is executed.

[0199] The beneficial effects of this embodiment are:

[0200] By generating a first instruction that can be executed based on at least two groups of devices according to the recipe information, when generating the first instruction, only the target component measurement path and measurement parameters need to be determined, without determining the implementation details of the hardware components and logic. At the same time, by parsing the first instruction into a second instruction according to the configuration information of the local device, compatibility with different execution devices is achieved.

[0201] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0202] Corresponding to the semiconductor measurement process control method based on CIM described in the above embodiment, Figure 4 A structural block diagram of the device provided in an embodiment of the present application is shown. For the sake of convenience of explanation, only the parts related to the embodiment of the present application are shown.

[0203] Reference Figure 5 The fourth aspect of the present application provides a semiconductor measurement process control device based on CIM, comprising:

[0204] A generating module 501, for determining a target component, a measuring path and a measuring parameter according to the measuring recipe information, and generating a first instruction;

[0205] A sending module 502, configured to send the first instruction to one or more designated second terminals;

[0206] The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path.

[0207] In an optional implementation, the measurement recipe information includes a target component and a measurement parameter, and the generation module 501 includes:

[0208] The first determination submodule is used to determine the measurement path based on a preset rule according to the target component and the measurement parameter, wherein the measurement path includes a plurality of processes determined in a preset process set and having a certain order.

[0209] In an optional embodiment, the measurement recipe information includes a selection instruction, the selection instruction includes a target component, a plurality of selected processes, and a selection order of the plurality of selected processes, and the generation module 501 includes:

[0210] A second determination submodule, configured to determine the measurement path according to the plurality of selected processes and the selected sequence;

[0211] The third determination submodule is used to determine the measurement parameter according to one or more selected processes, or to determine the measurement parameter according to the measurement path.

[0212] Reference Figure 6 The fifth aspect of the present application provides a semiconductor measurement process control device based on CIM, comprising:

[0213] An acquisition module 601 is used to acquire configuration information and a first instruction of a local device;

[0214] A parsing module 602, configured to parse the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two groups of execution devices so that the target component obtains a preset measurement parameter through a preset measurement path; and the second instruction can be executed based on the local device;

[0215] The control module 603 is configured to control the local device according to the second instruction, so that the target component obtains the measurement parameter via the measurement path.

[0216] Further, the parsing module 602 includes:

[0217] A rule determination submodule, configured to determine a rule applied to the local device in a preset rule set according to the configuration information; wherein the preset rule set includes preset rules applied to any one of at least two groups of execution devices;

[0218] The first parsing submodule is configured to parse the first instruction according to the rule applied to the local device to obtain the second instruction.

[0219] In an optional embodiment, the measurement path includes multiple steps, and the control module 603 includes:

[0220] The driver submodule is used to call the driver of the specified local device based on the second instruction to control the specified local device to perform a specified process.

[0221] Furthermore, the driving submodule includes:

[0222] A combined action unit is used to determine that the specified process is a combined action process, and then run the combined action layer based on the second instruction to call the drivers of multiple specified local devices to control the multiple specified local devices to complete the combined action process; the combined action process is completed by the cooperation of multiple hardware components in the local device.

[0223] In an optional implementation, the control module 603 includes:

[0224] The algorithm calling submodule is used to call a preset algorithm based on the second instruction to calculate a specified result according to the output result of the first preset process.

[0225] Reference Figure 7 The sixth aspect of the present application provides a semiconductor measurement process control device based on CIM, comprising:

[0226] The instruction generation module 701 is used to determine the target component, the measurement path and the measurement parameters according to the measurement recipe information, and generate a first instruction; the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameters through the measurement path;

[0227] Configuration information acquisition module 702, used to obtain configuration information of a local device;

[0228] An instruction parsing module 703, configured to parse the first instruction into a second instruction according to the configuration information, where the second instruction can be executed based on the local device;

[0229] The device control module 704 is used to control the local device according to the second instruction, so that the target component obtains the measurement parameter through the measurement path.

[0230] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0231] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0232] The present application also provides a terminal device, such as Figure 8 As shown, the terminal device 80 includes: at least one processor 801, a memory 802, and a computer program 803 stored in the memory and executable on the at least one processor, and the processor implements the steps in any of the above-mentioned method embodiments when executing the computer program.

[0233] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments can be implemented.

[0234] An embodiment of the present application provides a computer program product. When the computer program product runs on a mobile terminal, the mobile terminal can implement the steps in the above-mentioned method embodiments when executing the computer program product.

[0235] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the camera / terminal device, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, RandomAccess Memory), electric carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0236] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0237] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0238] In the embodiments provided in the present application, it should be understood that the disclosed devices / network equipment and methods can be implemented in other ways. For example, the device / network equipment embodiments described above are merely schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0239] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0240] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A semiconductor measurement process control method based on CIM, characterized in that: Applied to the first end, including: Determine the target component, the measurement path, and the measurement parameters according to the measurement recipe information, and generate a first instruction; sending the first instruction to one or more designated second terminals; The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path; The measurement recipe information includes a target component and a measurement parameter, and the step of determining the target component, the measurement path and the measurement parameter according to the measurement recipe information includes: Based on a preset rule, the measurement path is determined according to the target component and the measurement parameter, and the measurement path includes a plurality of processes that are determined in a preset process set and have a certain order.

2. A semiconductor measurement process control method based on CIM, characterized in that: Applied to the first end, including: Determine the target component, the measurement path, and the measurement parameters according to the measurement recipe information, and generate a first instruction; sending the first instruction to one or more designated second terminals; The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path; The measurement recipe information includes a selection instruction; the selection instruction includes a target component, a plurality of selected processes, and a selection order of the plurality of selected processes; The step of determining the target component, the measurement path and the measurement parameters according to the measurement recipe information includes: Determine the measurement path according to the plurality of selected processes and the selected order; The measurement parameters are determined according to one or more selected processes, or the measurement parameters are determined according to the measurement path.

3. A semiconductor measurement process control method based on CIM, characterized in that: Applied to the second end, including: Obtain configuration information and a first instruction of a local device; Parsing the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains a preset measurement parameter through a preset measurement path; and the second instruction can be executed based on the local device; controlling the local device according to the second instruction so that the target component obtains the measurement parameter through the measurement path; The step of parsing the first instruction into a second instruction according to the configuration information includes: Determining a rule applied to the local device in a preset rule set according to the configuration information; wherein the preset rule set includes preset rules applied to any one of at least two groups of execution devices; The first instruction is parsed according to a rule applied to the local device to obtain the second instruction.

4. The semiconductor measurement process control method based on CIM as claimed in claim 3, characterized in that: The measurement path includes multiple processes; The step of controlling the local device according to the second instruction comprises: A driver of a designated local device is called based on the second instruction to control the designated local device to complete a designated process.

5. The semiconductor measurement process control method based on CIM as claimed in claim 4, characterized in that: The step of calling a driver of a designated local device based on the second instruction to control the designated local device to perform a designated process includes: If it is determined that the specified process is a combined action process, the combined action layer is run based on the second instruction to call the drivers of multiple specified local devices to control the multiple specified local devices to complete the combined action process; the combined action process is completed by the cooperation of multiple hardware components in the local device.

6. The semiconductor measurement process control method based on CIM as claimed in claim 3, characterized in that: The step of controlling the local device according to the second instruction further includes: A preset algorithm is called based on the second instruction to calculate a specified result according to an output result of the first preset process.

7. A semiconductor measurement process control method based on CIM, characterized in that: include: Determine the target component, the measurement path, and the measurement parameters according to the measurement recipe information, and generate a first instruction; The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path; Get the configuration information of the local device; Parsing the first instruction into a second instruction according to the configuration information, where the second instruction can be executed based on the local device; controlling the local device according to the second instruction so that the target component obtains the measurement parameter through the measurement path; The measurement recipe information includes a target component and a measurement parameter, and the step of determining the target component, the measurement path and the measurement parameter according to the measurement recipe information includes: Based on a preset rule, the measurement path is determined according to the target component and the measurement parameter, and the measurement path includes a plurality of processes that are determined in a preset process set and have a certain order.

8. A semiconductor measurement process control device based on CIM, characterized in that: include: A generating module, used for determining a target component, a measuring path and a measuring parameter according to the measuring recipe information, and generating a first instruction; A sending module, used for sending the first instruction to one or more designated second ends; The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path; The measurement recipe information includes target components and measurement parameters, and the generation module includes: The first determination submodule is used to determine the measurement path according to the target component and the measurement parameters based on a preset rule, and the measurement path includes a plurality of processes determined in a preset process set and having a certain order.

9. A semiconductor measurement process control device based on CIM, characterized in that: include: A generating module, used for determining a target component, a measuring path and a measuring parameter according to the measuring recipe information, and generating a first instruction; A sending module, used for sending the first instruction to one or more designated second ends; The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path; The measurement recipe information includes a selection instruction, the selection instruction includes a target component, a plurality of selected processes, and a selection order of the plurality of selected processes, and the generation module includes: A second determination submodule, configured to determine the measurement path according to the plurality of selected processes and the selected sequence; The third determination submodule is used to determine the measurement parameter according to one or more selected processes, or to determine the measurement parameter according to the measurement path.

10. A semiconductor measurement process control device based on CIM, characterized in that: include: An acquisition module, used to acquire configuration information and a first instruction of a local device; a parsing module, configured to parse the first instruction into a second instruction according to the configuration information; wherein the first instruction can be executed based on any one of at least two groups of execution devices so that the target component obtains a preset measurement parameter via a preset measurement path; and the second instruction can be executed based on the local device; a control module, configured to control the local device according to the second instruction, so that the target component obtains the measurement parameter via the measurement path; The parsing modules include: A rule determination submodule, configured to determine a rule applied to the local device in a preset rule set according to the configuration information; wherein the preset rule set includes preset rules applied to any one of at least two groups of execution devices; The first parsing submodule is configured to parse the first instruction according to a rule applied to the local device to obtain the second instruction.

11. A semiconductor measurement process control device based on CIM, characterized in that: include: An instruction generation module, used to determine a target component, a measurement path, and a measurement parameter according to the measurement recipe information, and generate a first instruction; The first instruction can be executed based on any one of at least two groups of execution devices, so that the target component obtains the measurement parameter through the measurement path; A configuration information acquisition module is used to obtain the configuration information of the local device; an instruction parsing module, configured to parse the first instruction into a second instruction according to the configuration information, wherein the second instruction can be executed based on the local device; a device control module, configured to control the local device according to the second instruction, so that the target component obtains the measurement parameter via the measurement path; The measurement recipe information includes a target component and a measurement parameter, and determining the target component, the measurement path, and the measurement parameter according to the measurement recipe information includes: Based on a preset rule, the measurement path is determined according to the target component and the measurement parameter, and the measurement path includes a plurality of processes that are determined in a preset process set and have a certain order.

12. A terminal device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method according to claim 1 or 2 or any one of claims 3 to 6 or claim 7 is implemented.

13. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to claim 1 or 2 or any one of claims 3 to 6 or claim 7 is implemented.

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