A power management power drive protection chip production equipment

Abstract

The application relates to a power management power drive protection chip production device, which comprises a rack, a mechanical arm and a workbench arranged on the rack, a point gluing mechanism arranged above the workbench, the point gluing mechanism being connected with the mechanical arm, and a cleaning mechanism arranged on the rack; the point gluing mechanism comprises a point gluing base connected with the mechanical arm, a cavity arranged in the point gluing base, a first mounting pipe vertically arranged at the bottom of the point gluing base, and a second mounting pipe arranged on the point gluing base. Air discharged from the cleaning pipe can blow away impurities on the substrate, prevent the impurities from blocking the point gluing head, improve the point gluing reliability, and avoid the influence of the impurities on the point gluing effect. During the process that the point gluing head applies glue to the substrate, the substrate can be pressed by a pressing plate, so that the point gluing position of the substrate is flat, the abnormal point gluing caused by the warping of the substrate is avoided, and the point gluing effect is improved.

Description

Technical Field

[0001] This invention relates to a power management power drive protection chip manufacturing equipment, belonging to the field of chip manufacturing. Background Technology

[0002] Power management integrated circuits (PMICs) are chips in electronic equipment systems that are responsible for the conversion, distribution, detection, and other power management of electrical energy. They are mainly responsible for identifying the CPU power supply amplitude, generating corresponding short-wave pulses, and driving the subsequent circuits to output power. Power management power drive protection chips drive electronic devices to operate normally and control the operation by adjusting signals such as voltage and current, and protect the circuit from overvoltage and overcurrent.

[0003] In the production process of power management power drive protection chips, the wafer (a silicon wafer used to make silicon semiconductor integrated circuits, which is called a wafer because of its circular shape) is cut into multiple wafers. The wafers are chip semi-finished products. After being packaged, the wafers become chip finished products.

[0004] During the packaging process, the wafer needs to be mounted on the substrate. When adhesive bonding is used, adhesive is first applied to the substrate surface using a dispensing device. The adhesive then bonds the wafer to the substrate, and the adhesive is cured after baking. Utility model patent application number CN202123293278.7 discloses a dispensing device for semiconductor chip production, including a base plate, a worktable on the base plate, a dispensing mechanism on the worktable, a dispensing gun on the dispensing mechanism, and a lifting mechanism between the worktable and the base plate. The lifting mechanism includes a cam, a slide, and a buffer spring. In this invention, the lifting mechanism allows the first servo motor to control the rotation of a cam, which in turn drives a protrusion to rotate synchronously. The protrusion slides within a groove, and simultaneously, the protrusion drives a movable seat to move vertically via the groove. The movable seat, through a support base and a worktable, moves the device vertically, enabling height adjustment of the dispensing device for easier operation. The second servo motor controls the rotation of a lead screw, which in turn drives a second cylinder and a dispensing gun to move, allowing adjustment of the dispensing position and reducing manual labor intensity. However, in existing technologies, impurities on the substrate can easily clog the dispensing gun, leading to dispensing failures and affecting dispensing reliability. Furthermore, these impurities can cause glue type deviations, affecting dispensing effectiveness and consequently chip mounting results. Additionally, after prolonged use, residual glue at the dispensing nozzle can also cause abnormal glue type, further impacting dispensing performance.

[0005] Therefore, there is a need for power management power drive protection chip manufacturing equipment to improve dispensing reliability and enhance dispensing effect. Summary of the Invention

[0006] The technical problem to be solved by this invention is to overcome the shortcomings of the prior art and provide a power management power drive protection chip production equipment that improves dispensing reliability and dispensing effect.

[0007] The technical solution adopted by the present invention to solve the above problems is as follows: a power management power drive protection chip production equipment, including a frame, a robotic arm and a worktable are arranged on the frame, a dispensing mechanism is arranged above the worktable, the dispensing mechanism is connected to the robotic arm, and a cleaning mechanism is arranged on the frame;

[0008] The dispensing mechanism includes a dispensing base connected to a robotic arm. The dispensing base has an internal cavity. A first mounting tube is vertically arranged at the bottom of the dispensing base, and a second mounting tube is also arranged on the dispensing base. The cavity inside the second mounting tube, the cavity inside the dispensing base, and the cavity inside the first mounting tube form a dispensing channel. A cleaning tube is vertically fixed at the bottom of the dispensing base. The first mounting tube is located inside the cavity of the cleaning tube. A gap is provided between the first mounting tube and the cleaning tube. An air inlet is provided on one side of the cleaning tube.

[0009] The cleaning mechanism includes a vertically arranged rotating tube with bristles on its inner wall and a rotating assembly on the rotating tube for driving the rotating tube to rotate.

[0010] Preferably, the dispensing mechanism further includes a sealing ring, and the sealing ring and the cleaning tube are coaxially arranged with the first mounting tube. The sealing ring is fixedly and sealingly fitted onto the outer wall of the bottom end of the first mounting tube. The sealing ring is sealed and fixedly connected to the inner wall of the cleaning tube. The sealing ring is located below the air inlet tube. The sealing ring is provided with an air hole that penetrates the bottom and top of the sealing ring. The cleaning tube is provided with a pressing component.

[0011] Preferably, the pressing assembly includes a fixing block, which is fixedly disposed on the inner wall of the cleaning tube and located below the sealing ring. A lifting rod is vertically inserted through the fixing block, and a pressing plate is fixedly disposed at the bottom end of the lifting rod. The top end of the lifting rod is fixedly disposed on the sealing rod, and the sealing rod is coaxially disposed with the air hole.

[0012] Preferably, the lifting rod and the sealing rod are integrally formed.

[0013] Preferably, the top end of the lifting rod is chamfered.

[0014] Preferably, the diameter of the sealing rod is equal to the diameter of the air hole, and the diameter of the sealing rod is greater than the diameter of the lifting rod.

[0015] Preferably, the number of air holes and the number of pressing components are both four. The four air holes are evenly distributed circumferentially around the axis of the first mounting tube, and the four pressing components correspond one-to-one with the four air holes.

[0016] Preferably, the four pressing plates are arranged together to form an annular pressing element that is coaxial with the first mounting tube.

[0017] Preferably, the cleaning mechanism further includes a collection trough, which is fixedly mounted on the frame with its opening facing upwards, and the bottom end of the rotating tube is inserted into the collection trough.

[0018] Preferably, the rotating assembly includes a rotating shaft, which is coaxially arranged with the rotating tube. A fan blade is installed at the top of the rotating shaft and is located inside the rotating tube. The fan blade is positioned below the bristles. The rotating shaft is fixedly connected to the rotating tube, and the bottom end of the rotating tube is rotatably connected to the frame through a bearing.

[0019] Compared with the prior art, the advantages of the present invention are as follows:

[0020] 1. By applying the air discharged from the cleaning tube to the substrate, impurities on the substrate can be blown away, preventing impurities from clogging the dispensing head, improving dispensing reliability, and also avoiding impurities from affecting the dispensing effect.

[0021] 2. During the dispensing process, the dispensing head applies adhesive to the substrate. Pressing the substrate with the pressing plate can make the dispensing position on the substrate flat, avoiding abnormal dispensing patterns caused by substrate warping and improving the dispensing effect. In addition, the bottom of the cleaning tube stops venting air at this time, which can prevent the adhesive pattern from deviating due to airflow.

[0022] 3. By rotating the tube to drive the brush bristles to brush off any residual adhesive from the dispensing head, the residual adhesive can be prevented from affecting the dispensing effect. Attached Figure Description

[0023] Figure 1 This is a perspective view of a power management power drive protection chip manufacturing equipment according to the present invention.

[0024] Figure 2 This is a front view of a power management power drive protection chip manufacturing equipment according to the present invention.

[0025] Figure 3 This is a right view of a power management power drive protection chip manufacturing equipment according to the present invention.

[0026] Figure 4This is a top view of a power management power drive protection chip manufacturing equipment according to the present invention;

[0027] Figure 5 This is a 3D view of the dispensing mechanism;

[0028] Figure 6 This is an exploded view of the dispensing mechanism;

[0029] Figure 7 A schematic diagram of the first state of the dispensing mechanism during dispensing;

[0030] Figure 8 A schematic diagram of the second state of the dispensing mechanism during dispensing;

[0031] Figure 9 This is a schematic diagram of the sealing ring structure;

[0032] Figure 10 This is a schematic diagram of the pressing component;

[0033] Figure 11 A 3D view of the cleaning facility;

[0034] Figure 12 An exploded view of the cleaning facility;

[0035] Figure 13 A schematic diagram of the connection structure between the dispensing mechanism and the cleaning mechanism during the cleaning of the dispensing head.

[0036] in:

[0037] Frame 1, robotic arm 2, worktable 3, dispensing mechanism 4, cleaning mechanism 5, dispensing head 6;

[0038] 41. Dispensing base; 42. First mounting tube; 43. Second mounting tube; 44. Cleaning tube; 45. Air inlet tube; 46. Sealing ring; 47. Air hole; 48. Pressing assembly.

[0039] Fixed block 48.1, lifting rod 48.2, pressing plate 48.3, sealing rod 48.4, pressing component 48.5;

[0040] Rotating tube 51, brush bristles 52, rotating assembly 53, collection trough 54;

[0041] Rotating shaft 53.1, fan blade 53.2, bearing 53.3. Detailed Implementation

[0042] like Figure 1-13As shown, a power management power drive protection chip production equipment in this embodiment includes a frame 1, on which a robotic arm 2 and a worktable 3 are provided. A dispensing mechanism 4 is provided above the worktable 3 and is connected to the robotic arm 2. A cleaning mechanism 5 is provided on the frame 1. After the substrate is placed on the worktable 3, the dispensing mechanism 4 is driven to move by the robotic arm 2 and performs dispensing action on the substrate.

[0043] The dispensing mechanism 4 includes a dispensing base 41 connected to a robotic arm 2. The dispensing base 41 has an internal cavity. A first mounting tube 42 is vertically mounted at the bottom of the dispensing base 41, and a second mounting tube 43 is also mounted on the dispensing base 41. The first mounting tube 42 is used to mount a vertically mounted dispensing head 6, and the second mounting tube 43 is used to mount a glue tube containing glue. The cavities of the second mounting tube 43, the dispensing base 41, and the first mounting tube 42 form a glue flow channel. A cleaning tube 44 is vertically fixed at the bottom of the dispensing base 41, and the first mounting tube 42 is located within the cavity of the cleaning tube 44. A gap is provided between the first mounting tube 42 and the cleaning tube 44. An air inlet pipe 45 is provided on one side of the pipe 44. The air inlet pipe 45 is connected to an air supply device, which can be an air pump. The air supply device delivers air from the air inlet pipe 45 to the cleaning pipe 44. The air in the cleaning pipe 44 is discharged from the bottom end of the cleaning pipe 44 and acts on the substrate. Under the action of the airflow, impurities on the substrate are blown away, preventing impurities from clogging the dispensing head 6, improving dispensing reliability, and also avoiding impurities from affecting the dispensing effect. When the dispensing head 6 moves to the dispensing position, the glue tube is actually connected to the extrusion device, which can be an air pump. The extrusion device increases the pressure in the glue tube, thereby delivering the glue in the glue tube from the glue flow channel to the dispensing head 6. The dispensing head 6 discharges the glue and acts on the substrate, completing the dispensing action.

[0044] The dispensing mechanism 4 also includes a sealing ring 46. The sealing ring 46 and the cleaning tube 44 are coaxially arranged with the first mounting tube 42. The sealing ring 46 is fixedly and sealingly fitted onto the outer side wall of the bottom end of the first mounting tube 42. The sealing ring 46 is sealed and fixedly connected to the inner wall of the cleaning tube 44. The sealing ring 46 is located below the air inlet tube 45. The sealing ring 46 is provided with four air holes 47. The air holes 47 penetrate the bottom and top of the sealing ring 46. The four air holes 47 are evenly distributed circumferentially with the axis of the first mounting tube 42 as the center. The cleaning tube 44 is provided with four pressing components 48. The four pressing components 48 correspond one-to-one with the four air holes 47.

[0045] The pressing assembly 48 includes a fixing block 48.1, which is fixedly mounted on the inner wall of the cleaning tube 44. The fixing block 48.1 is located below the sealing ring 46. A lifting rod 48.2 is vertically mounted on the fixing block 48.1. A pressing plate 48.3 is fixedly mounted at the bottom end of the lifting rod 48.2. A sealing rod 48.4 is fixedly mounted at the top end of the lifting rod 48.2. The sealing rod 48.4 is coaxially mounted with the air hole 47. The diameter of the sealing rod 48.4 is equal to the diameter of the air hole 47, and the diameter of the sealing rod 48.4 is larger than the diameter of the lifting rod 48.2.

[0046] The lifting rod 48.2 and the sealing rod 48.4 are integrally formed structures;

[0047] The top end of the lifting rod 48.2 is chamfered;

[0048] Four pressing plates 48.3 surround each other to form an annular pressing member 48.5 coaxially arranged with the first mounting tube 42. During dispensing, the dispensing head 6 acts on the adhesive on the substrate to fill the annular hole of the pressing member 48.5, which facilitates locking the adhesive type.

[0049] The dispensing mechanism 4 has the following two states when dispensing glue:

[0050] In the first state, the sealing rod 48.4 is located below the sealing ring 46, the bottom end of the dispensing head 6 is located between the pressing plate 48.3 and the cleaning tube 44, and the bottom end of the sealing rod 48.4 abuts against the fixing block 48.1;

[0051] In the second state, the bottom of the pressing plate 48.3 is in contact with the substrate, and the sealing rod 48.4 passes through the air hole 47, so that the sealing rod 48.4 blocks the air hole 47.

[0052] The process of the dispensing mechanism 4 transitioning from the first state to the second state involves the dispensing head 6 moving to the dispensing position on the substrate. The final action of this transition is the downward movement of the dispensing base 41. As the dispensing base 41 moves downward, it drives the pressing plate 48.3 and the dispensing head 6 to move downward simultaneously. When the pressing plate 48.3 is in contact with the substrate, the distance between the dispensing head 6 and the substrate decreases as the dispensing base 41 continues to descend. This causes relative movement between the sealing ring 46 and the sealing rod 48.4, allowing the sealing rod 48.4 to insert into the vent 47, thus blocking the vent 47. The dispensing head 6 stops moving after reaching the dispensing position. At this point, the dispensing mechanism 4 is in the second state. During the dispensing action of the dispensing head 6, due to the sealing... Air above ring 46 cannot pass through air hole 47. After air in air in inlet pipe 45 is delivered to cleaning pipe 44, the air pressure in the cavity between sealing ring 46 and dispensing seat 41 in cleaning pipe 44 increases. The air pressure causes sealing rod 48.4 to be subjected to downward force, thereby causing pressing plate 48.3 to press the substrate. Since the substrate is prone to warping during the manufacturing process, pressing can keep the dispensing position of the substrate flat, thereby avoiding abnormal dispensing due to substrate warping. In addition, through calculation, the air pressure is kept within a certain range to avoid damage to the substrate due to excessive pressing. Furthermore, during the dispensing head 6 applying glue to the substrate, the bottom end of cleaning pipe 44 stops venting air, which can prevent the glue shape from deviating due to airflow.

[0053] The dispensing mechanism 4 transitions from the second state to the first state. After the dispensing action is completed, the dispensing seat 41 rises, causing the cleaning tube 44 and the sealing tube to rise synchronously. Under the gravity and air pressure of the sealing rod 48.4, the sealing ring 46 and the sealing rod 48.4 move relative to each other, and the sealing rod 48.4 separates from the air hole 47. That is, the distance between the cleaning tube 44 and the pressing plate 48.3 increases. When the bottom end of the sealing rod 48.4 abuts against the fixing block 48.1, the rising of the cleaning tube 44 drives the pressing plate 48.3 to rise synchronously through the fixing block 48.1, the sealing rod 48.4 and the lifting rod 48.2. At this time, the dispensing mechanism 4 is in the first state.

[0054] The cleaning mechanism 5 includes a vertically arranged rotating tube 51, with bristles 52 arranged on the inner wall of the rotating tube 51, and a rotating assembly 53 arranged on the rotating tube 51. The rotating assembly 53 is used to drive the rotating tube 51 to rotate.

[0055] The cleaning mechanism 5 also includes a collection tank 54, which is fixedly mounted on the frame 1 with the opening of the collection tank 54 facing upwards, and the bottom end of the rotating tube 51 is inserted into the collection tank 54.

[0056] The rotating assembly 53 includes a rotating shaft 53.1, which is coaxially arranged with the rotating tube 51. A fan blade 53.2 is installed at the top of the rotating shaft 53.1. The fan blade 53.2 is located inside the rotating tube 51 and is positioned below the bristles 52. The rotating shaft 53.1 is fixedly connected to the rotating tube 51, and the bottom end of the rotating tube 51 is rotatably connected to the frame 1 through a bearing 53.3.

[0057] During the cleaning of the dispensing head 6, the dispensing base 41 moves the dispensing head 6 above the rotating tube 51 and inserts it into the rotating tube 51. At the same time, the dispensing head 6 comes into contact with the bristles 52. At this time, the bottom end of the cleaning tube 44 is inserted into the rotating tube 51, and the dispensing mechanism 4 is in the first state. The air discharged from the bottom end of the cleaning tube 44 is transported into the rotating tube 51. The air in the rotating tube 51 is discharged from the bottom end of the rotating tube 51. Through the airflow, the fan blade 53.2 drives the rotating shaft 53.1 to rotate on the bearing 53.3. The rotation of the rotating shaft 53.1 drives the rotating tube 51 to rotate synchronously, thereby driving the bristles 52 to rotate synchronously and brush off the residual glue on the dispensing head 6. The brushed glue falls into the collection tank 54 and is collected through the collection tank 54. In this way, the dispensing head 6 is cleaned. After the dispensing head 6 is cleaned, it can be removed from the rotating tube 51.

[0058] In summary, by applying the air discharged from the cleaning tube 44 to the substrate, impurities on the substrate can be blown away, preventing impurities from clogging the dispensing head 6, improving dispensing reliability, and also avoiding impurities from affecting the dispensing effect.

[0059] Secondly, during the process of applying adhesive to the substrate by the dispensing head 6, the substrate is pressed by the pressing plate 48.3, which can make the dispensing position on the substrate flat, avoid abnormal dispensing pattern due to substrate warping, and improve the dispensing effect. Moreover, at this time, the bottom end of the cleaning tube 44 stops venting air, which can prevent the adhesive pattern from deviating due to airflow.

[0060] In addition, by rotating the tube 51 to drive the brush bristles 52 to rotate, the residual adhesive on the dispensing head 6 is brushed off, so as to avoid the residual adhesive affecting the dispensing effect.

[0061] In addition to the above embodiments, the present invention also includes other embodiments. All technical solutions formed by equivalent transformation or equivalent substitution should fall within the protection scope of the claims of the present invention.

Claims

1. A power management power drive protection chip manufacturing equipment, characterized in that: Includes a frame (1), on which a robotic arm (2) and a worktable (3) are provided, and above the worktable (3) is a dispensing mechanism (4), which is connected to the robotic arm (2), and on the frame (1) is a cleaning mechanism (5). The dispensing mechanism (4) includes a dispensing base (41), which is connected to the robotic arm (2). The dispensing base (41) has a cavity inside. A first mounting tube (42) is vertically arranged at the bottom of the dispensing base (41). A second mounting tube (43) is also arranged on the dispensing base (41). The cavity inside the second mounting tube (43), the cavity inside the dispensing base (41), and the cavity inside the first mounting tube (42) form a dispensing channel. A cleaning tube (44) is vertically fixed at the bottom of the dispensing base (41). The first mounting tube (42) is located inside the cavity of the cleaning tube (44). A gap is provided between the first mounting tube (42) and the cleaning tube (44). An air inlet tube (45) is provided on one side of the cleaning tube (44). The cleaning mechanism (5) includes a vertically arranged rotating tube (51), with bristles (52) provided on the inner wall of the rotating tube (51), and a rotating assembly (53) provided on the rotating tube (51), the rotating assembly (53) being used to drive the rotating tube (51) to rotate. The dispensing mechanism (4) also includes a sealing ring (46). The sealing ring (46) and the cleaning tube (44) are coaxially arranged with the first mounting tube (42). The sealing ring (46) is fixedly and sealed to the outer wall of the bottom end of the first mounting tube (42). The sealing ring (46) is sealed and fixedly connected to the inner wall of the cleaning tube (44). The sealing ring (46) is located below the air inlet tube (45). The sealing ring (46) is provided with an air hole (47). The air hole (47) penetrates the bottom and top of the sealing ring (46). The cleaning tube (44) is provided with a pressing component (48). The pressing assembly (48) includes a fixing block (48.1), which is fixedly installed on the inner wall of the cleaning tube (44). The fixing block (48.1) is located below the sealing ring (46). A lifting rod (48.2) is vertically installed on the fixing block (48.1). A pressing plate (48.3) is fixedly installed at the bottom end of the lifting rod (48.2). The top end of the lifting rod (48.2) is fixedly installed on the sealing rod (48.4). The sealing rod (48.4) is coaxially arranged with the air hole (47). The diameter of the sealing rod (48.4) is equal to the diameter of the air hole (47), and the diameter of the sealing rod (48.4) is greater than the diameter of the lifting rod (48.2); The pressing component (48) corresponds one-to-one with the air hole (47).

2. The power management power drive protection chip manufacturing equipment according to claim 1, characterized in that: The lifting rod (48.2) and the sealing rod (48.4) are integrally formed structures.

3. The power management power drive protection chip manufacturing equipment according to claim 1, characterized in that: The top of the lifting rod (48.2) is chamfered.

4. A power management power drive protection chip manufacturing equipment according to any one of claims 1-3, characterized in that: The number of air holes (47) and the number of pressing components (48) are both four. The four air holes (47) are evenly distributed around the axis of the first mounting tube (42). The four pressing components (48) correspond one-to-one with the four air holes (47).

5. The power management power drive protection chip manufacturing equipment according to claim 4, characterized in that: Four pressing plates (48.3) surround each other to form an annular pressing element (48.5) coaxially arranged with the first mounting tube (42).

6. The power management power drive protection chip manufacturing equipment according to claim 1, characterized in that: The cleaning mechanism (5) also includes a collection trough (54), which is fixedly mounted on the frame (1). The opening of the collection trough (54) faces upward, and the bottom end of the rotating tube (51) is inserted into the collection trough (54).

7. A power management power drive protection chip manufacturing equipment according to claim 1 or 6, characterized in that: The rotating assembly (53) includes a rotating shaft (53.1), which is coaxially arranged with the rotating tube (51). A fan blade (53.2) is installed at the top of the rotating shaft (53.1). The fan blade (53.2) is located inside the rotating tube (51) and is positioned below the bristles (52). The rotating shaft (53.1) is fixedly connected to the rotating tube (51), and the bottom end of the rotating tube (51) is rotatably connected to the frame (1) through a bearing (53.3).

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