In-process measurement method and system based on double-turntable machine tool and triggered by turntable rotation

Abstract

The application provides a method and system for in-machine measurement based on a double-turntable machine tool and triggered by rotation of a turntable, which comprises the following steps: determining a generatrix height of a workpiece to be measured based on a workpiece size on a 2D drawing of the workpiece to be measured, and setting a measurement parameter according to the generatrix height; calculating positions of each theoretical measurement point according to the measurement parameter, and obtaining a distribution of each theoretical measurement point of the workpiece to be measured in a 3D space; generating an in-machine measurement path according to the distribution of each theoretical measurement point, processing the in-machine measurement path into an executable measurement program; and measuring the workpiece to be measured by using rotation of a fifth axis of the machine tool according to the measurement program, and obtaining measured data of each measurement point of the workpiece to be measured. The application does not need a 3D model of the workpiece to be measured, only needs some necessary parameter settings of a user according to a size on a 2D drawing, and can realize in-machine measurement by relying on rotation of the fifth axis of the machine tool, so that more applicable scenarios are added for in-machine measurement.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of on-machine measurement technology of numerical control machine tools, and in particular to an on-machine measurement method and system based on a double-turntable machine tool and triggered by rotation of a turntable. BACKGROUND

[0002] On-machine measurement is a very common measurement method in the manufacturing industry. Existing on-machine measurement technology first needs to plan a plurality of measurement points according to a 3D model of a measured workpiece, then reversely calculates a measurement path according to a normal direction of the measurement points and a safety distance given by a user, and finally completes measurement according to the path. Figure 1 As shown in the figure, P is one of a plurality of measurement points planned on the surface of the workpiece model. When the measurement point P is measured, the probe first moves from the starting position to the safety point S, then moves to the approach point A at a fast feed rate, and then approaches the workpiece at a probe feed rate until the probe is triggered. After the probe contacts the workpiece, it returns to the safety point S along the original path, i.e. the movement route S->A->P->A->S is the complete measurement path for single-point measurement.

[0003] The current on-machine measurement method often needs to plan measurement points according to the 3D model of the measured workpiece to obtain the measurement path. However, there are many measurement scenarios in actual production processes that only have 2D drawings without 3D models. The current measurement method cannot complete measurement point planning in such scenarios, and its use is greatly limited. At the same time, the current on-machine measurement method is relatively cumbersome when planning measurement points, resulting in low test efficiency.

[0004] Therefore, there is an urgent need for a new on-machine measurement method to achieve efficient measurement in different scenarios. SUMMARY

[0005] To this end, the embodiments of the present application provide an on-machine measurement method and system based on a double-turntable machine tool and triggered by rotation of a turntable, for solving the problems of being unable to plan measurement points and low test efficiency in the prior art when there is no 3D model of a measured workpiece.

[0006] To solve the above problems, the embodiments of the present application provide an on-machine measurement method based on a double-turntable machine tool and triggered by rotation of a turntable, which comprises:

[0007] S1: determining a generatrix height of a workpiece to be measured based on a workpiece size on a 2D drawing of the workpiece to be measured, and setting measurement parameters according to the generatrix height;

[0008] S2: calculating positions of each theoretical measurement point according to the measurement parameters to obtain a distribution of each theoretical measurement point of the workpiece to be measured in a 3D space;

[0009] S3: generating an in-machine measurement path according to the distribution of the theoretical measurement points, and processing the in-machine measurement path into an executable measurement program;

[0010] S4: measuring the workpiece to be measured according to the measurement program by rotating the fifth axis of the machine tool, and obtaining the measured data of each measurement point of the workpiece to be measured.

[0011] Preferably, in step S1, based on the 2D drawing of the workpiece to be measured, the height of the generatrix of the workpiece to be measured is determined, and the method for setting the measurement parameters according to the height of the generatrix comprises the following steps:

[0012] First, based on the size of the workpiece on the 2D drawing of the workpiece to be measured, the height H of the generatrix of the workpiece to be measured is determined;

[0013] Then, the measurement parameters are set according to the height H of the generatrix, including the depth h from the upper edge and the distance d from the left edge of the first measurement point in the first row, the row spacing r, and the spiral angle a;

[0014] Finally, the number of measurement points in each row and the total number of rows are adjusted to complete the parameter setting, and a set of false measurement points are obtained at this time.

[0015] Preferably, the set of false measurement points are distributed in a rectangular shape.

[0016] Preferably, in step S2, the positions of the theoretical measurement points are calculated according to the measurement parameters, and the method for obtaining the distribution of the theoretical measurement points of the workpiece to be measured in the 3D space comprises:

[0017] In each row, the first measurement point is kept stationary, and each subsequent measurement point is rotated around the fifth axis by a certain angle starting from the second measurement point, thereby obtaining the distribution of the theoretical measurement points of the workpiece to be measured in the 3D space.

[0018] Preferably, the rotation angles of the measurement points in the same row increase incrementally.

[0019] Preferably, the angle between the positions of each measurement point before and after rotation and the first measurement point in the row is close to but does not exceed the set spiral angle a.

[0020] Preferably, the method for measuring the workpiece to be measured according to the measurement program by rotating the fifth axis of the machine tool, and obtaining the measured data of each measurement point of the workpiece to be measured comprises:

[0021] When measuring a certain theoretical measurement point on the workpiece to be measured, the fifth axis of the machine tool rotates slowly at a detection rotation rate until the probe is triggered by contacting the workpiece, and after the probe contacts the workpiece, the fifth axis reverses to the original position, while the probe is lifted and moved to the next measurement position, and the operation is repeated to obtain the measured data of each measurement point of the workpiece to be measured, wherein the measured data of each measurement point is obtained according to the rotation angle of the fifth axis of the machine tool when the probe is triggered.

[0022] Preferably, in step S4, the measured data includes three-dimensional coordinates of the measurement point.

[0023] The embodiment of the present application provides a machine measurement system based on a double-turntable machine tool and triggered by rotation of a turntable, which comprises:

[0024] A parameter setting module is configured to determine a generatrix height of the workpiece to be measured based on the workpiece size on the 2D drawing of the workpiece to be measured, and set a measurement parameter according to the generatrix height.

[0025] A theoretical test point calculation module is configured to calculate the positions of each theoretical measurement point according to the measurement parameter, and obtain the distribution of each theoretical measurement point of the workpiece to be measured in a 3D space.

[0026] An in-machine test path generation module is configured to generate an in-machine measurement path according to the distribution of each theoretical measurement point, and process the in-machine measurement path into an executable measurement program.

[0027] A measured data output module is configured to measure the workpiece to be measured by using the rotation of the fifth axis of the machine tool according to the measurement program, and obtain the measured data of each measurement point of the workpiece to be measured.

[0028] The embodiment of the present application also provides an electronic device, which is characterized by comprising a processor, a memory and a bus system, the processor and the memory are connected through the bus system, the memory is used for storing instructions, and the processor is used for executing the instructions stored in the memory to realize the in-machine measurement method based on the double-turntable machine tool and triggered by the rotation of the turntable.

[0029] As can be seen from the above technical solutions, the present application has the following advantages:

[0030] The embodiment of the present application provides an in-machine measurement method and system based on a double-turntable machine tool and triggered by rotation of a turntable, the present application sets parameters based on a 2D drawing of a workpiece to be measured, calculates theoretical measurement points according to the set parameters, solves the problem that the existing measurement method cannot plan measurement points in the absence of a 3D model, and adds more applicable scenarios for in-machine measurement; the present application completes measurement by using the rotation of the fifth axis of the machine tool, and compared with the existing measurement method, the test efficiency is higher. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly described below. The features and advantages of the present application can be more clearly understood by referring to the drawings. The drawings are schematic and should not be construed as any limitation to the present application. For those skilled in the art, other drawings can be obtained without creative effort based on these drawings. Among them:

[0032] Figure 1 A schematic diagram of a measurement process of an existing on-machine measurement method;

[0033] Figure 2 A flowchart of an on-machine measurement method based on a double-turntable machine tool and triggered by turntable rotation according to an embodiment;

[0034] Figure 3 A schematic diagram of parameter setting on a 2D drawing of a workpiece to be measured;

[0035] Figure 4 A schematic diagram of rotating 2D point distribution of a workpiece to be measured to 3D space;

[0036] Figure 5 Distribution of each theoretical measurement point of a workpiece to be measured in 3D space;

[0037] Figure 6 A schematic diagram of a measurement process of any measurement point P on a workpiece to be measured according to the present application;

[0038] Figure 7 A block diagram of an on-machine measurement system based on a double-turntable machine tool and triggered by turntable rotation according to an embodiment. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are some embodiments of the present application, but not all embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort fall within the scope of protection of the present application.

[0040] As shown in Figure 2 The embodiments of the present application propose an on-machine measurement method based on a double-turntable machine tool and triggered by turntable rotation. The method comprises:

[0041] S1: determining the generatrix height of a workpiece to be measured based on the workpiece size on a 2D drawing of the workpiece to be measured, and setting measurement parameters according to the generatrix height;

[0042] S2: calculating the position of each theoretical measurement point according to the measurement parameter, obtaining the distribution of each theoretical measurement point of the workpiece to be measured in the 3D space;

[0043] S3: generating an in-machine measurement path according to the distribution of each theoretical measurement point, and processing the in-machine measurement path into an executable measurement program;

[0044] S4: measuring the workpiece to be measured according to the measurement program by rotating the fifth axis of the machine tool, and obtaining the measured data of each measurement point of the workpiece to be measured.

[0045] The application provides an in-machine measurement method based on a double-turntable machine tool and triggered by rotation of a turntable. The application sets parameters based on a 2D drawing of a workpiece to be measured, calculates theoretical measurement points according to the set parameters, solves the problem that the existing measurement method cannot plan measurement points without a 3D model, and adds more applicable scenarios for in-machine measurement. The application completes measurement by rotating the fifth axis of the machine tool, and the test efficiency is higher compared with the existing measurement method.

[0046] Further, step S1 includes:

[0047] As shown in Figure 3 , the user determines the generatrix height H according to the workpiece size on the 2D drawing, sets the depth h = 1 mm of the first measurement point in the first row from the upper edge of the workpiece and the distance d = 5 mm from the left edge, the row spacing r = 6 mm, the spiral angle α = 30°, finally adjusts the number of measurement points in each row to 10 and the total number of rows to 2, that is, completes the parameter setting, at this time, a 10 × 2 imaginary measurement point is obtained, which is a rectangular distribution.

[0048] Further, step S2 includes:

[0049] Because there is no 3D model, the positions of each theoretical measurement point must be calculated inversely from the above parameters. On each row, the first measurement point is kept stationary, and each measurement point after the second measurement point is rotated by a certain angle around the fifth axis (the rotation angle of the measurement points in the same row increases, and at the same time, the angle between the position of each measurement point before and after rotation and the first measurement point in the row is close to but does not exceed the spiral angle α set above, as shown in Figure 4 When the measurement point P is rotated, it needs to satisfy ∠PAP' < α, that is, the distribution of each theoretical measurement point in the 3D space is obtained, as shown in Figure 5 two rows of black small dots in the middle.

[0050] The in-machine measurement path is generated according to the distribution of the theoretical measurement points obtained in step S2, and the in-machine measurement path is processed into an executable measurement program.

[0051] Further, step S4 includes:

[0052] When the machine tool performs the above-mentioned measurement program to measure a theoretical measurement point on the workpiece to be measured, the fifth axis of the machine tool rotates slowly at a detection rotation rate until the probe contacts the workpiece is triggered, and after the probe contacts the workpiece, the fifth axis reverses to the original position, while the probe is lifted and moved to the next measurement position, and the operation is repeated to obtain the measured data of each measurement point of the workpiece to be measured, wherein the measured data of each measurement point is obtained according to the rotation angle of the fifth axis of the machine tool when the probe is triggered.

[0053] Specifically, taking any measurement point P on the workpiece as an example, Figure 6 The right figure is obtained by cutting the left figure (the cutting surface passes through the measurement point P and is perpendicular to the fifth axis of the machine tool). The probe first moves from the starting position to the safety point S, and then moves to the approach point A at a fast feed rate, and then moves to the position below the generatrix at a depth d, i.e. the waiting point W, at a slow feed rate; Next, the fifth axis starts to rotate slowly at a detection rotation rate until the probe contacts the workpiece is triggered; after the probe contacts the workpiece, the fifth axis reverses to the original position, while the probe is lifted and moved to the next measurement position, and the above-mentioned operation is repeated until the measurement of all measurement points is completed.

[0054] As shown in Table 1, the measured coordinates of 20 measurement points of the workpiece to be measured.

[0055]

[0056]

[0057] As Figure 7 mentioned, the embodiment of the present application provides an on-machine measurement system based on a double-turntable machine tool and triggered by rotation of a turntable, which comprises:

[0058] A parameter setting module 100 is configured to determine the generatrix height of the workpiece to be measured based on the workpiece size on the 2D drawing of the workpiece to be measured, and set the measurement parameters according to the generatrix height;

[0059] A theoretical test point calculation module 200 is configured to calculate the positions of each theoretical measurement point according to the measurement parameters, and obtain the distribution of each theoretical measurement point of the workpiece to be measured in the 3D space;

[0060] An on-machine test path generation module 300 is configured to generate an on-machine measurement path according to the distribution of each theoretical measurement point, and process the on-machine measurement path into an executable measurement program;

[0061] A measured data output module 400 is configured to measure the workpiece to be measured by using the rotation of the fifth axis of the machine tool according to the measurement program, and obtain the measured data of each measurement point of the workpiece to be measured.

[0062] The system is used to realize the above-mentioned in-machine measurement method based on the double-turntable machine tool and triggered by the rotation of the turntable, and in order to avoid redundancy, details are not repeated here.

[0063] The embodiment of the present application also provides an electronic device, including a processor, a memory and a bus system, the processor and the memory are connected through the bus system, the memory is used for storing instructions, and the processor is used for executing the instructions stored in the memory to realize the in-machine measurement method based on the double-turntable machine tool and triggered by the rotation of the turntable.

[0064] It should be noted that the above are only preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and those skilled in the art can make various obvious changes, readjustments and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

[0065] Those skilled in the art will understand that the embodiments of the present application can be provided as a method, a system or a computer program product. Therefore, the present application can adopt a completely hardware embodiment, a completely software embodiment or an embodiment combining software and hardware aspects. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer usable storage media containing computer usable program code (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.).

[0066] The present application is described with reference to flowcharts and / or block diagrams according to the method, device (system) and computer program product of the embodiments of the present application. It should be understood that each flow and / or block in the flowcharts and / or block diagrams, and the combination of the flows and / or blocks in the flowcharts and / or block diagrams can be implemented by computer program instructions. These computer program instructions can be provided to a general-purpose computer, a special-purpose computer, an embedded processor or other programmable data processing device to produce a machine, so that the instructions executed by the computer or other programmable data processing device produce a device for implementing the functions specified in the flowcharts and / or block diagrams. Figure 1 The device for implementing the functions specified in one flow or multiple flows and / or blocks. Figure 1 The device for implementing the functions specified in one flow or multiple flows and / or blocks.

[0067] These computer program instructions can also be stored in a computer readable storage medium capable of guiding the computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable storage medium produce a product including instruction devices, which implement the functions specified in the flowcharts and / or block diagrams.Figure 1 One or more processes and / or boxes Figure 1 The functions specified in one or more boxes. These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable apparatus for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0068] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A method of in-machine measurement based on a dual-rotary table machine tool and triggered by a rotation of a rotary table, characterized in that, The method comprises the following steps: S1: determining the generatrix height of the workpiece to be measured based on the workpiece size on the 2D drawing of the workpiece to be measured, and setting the measurement parameters according to the generatrix height, which comprises: Firstly, the generatrix height H of the workpiece to be measured is determined based on the workpiece size on the 2D drawing of the workpiece to be measured; Then, the measurement parameters are set according to the generatrix height H, and the measurement parameters comprise the depth h and the distance d from the left edge of the first measurement point in the first row to the upper edge of the workpiece to be measured, the row spacing r and the spiral angle a; Finally, the number of measurement points in each row and the total number of rows are adjusted to complete the parameter setting, and a set of false measurement points are obtained at this time; S2: calculating the positions of the theoretical measurement points according to the measurement parameters to obtain the distribution of the theoretical measurement points of the workpiece to be measured in the 3D space, which comprises: In each row, the first measurement point is kept unchanged, and each measurement point after the second measurement point is rotated around the fifth axis by a certain angle to obtain the distribution of the theoretical measurement points of the workpiece to be measured in the 3D space; The rotation angle of the same row of measurement points is increased; The included angle between the positions of each measurement point before and after rotation and the first measurement point of the row is close to but does not exceed the set spiral angle a; S3: generating the in-machine measurement path according to the distribution of the theoretical measurement points, and processing the in-machine measurement path into an executable measurement program; S4: measuring the workpiece to be measured by using the rotation of the fifth axis of the machine tool according to the measurement program to obtain the measured data of each measurement point of the workpiece to be measured.

2. The on-machine measurement method based on a dual-rotary table machine tool and triggered by rotary table rotation according to claim 1, characterized in that, The set of false measurement points are distributed in a rectangular shape.

3. The on-machine measurement method based on a dual-rotary table machine tool and triggered by rotary table rotation according to claim 1, characterized in that, In step S4, the method for measuring the workpiece to be measured by using the rotation of the fifth axis of the machine tool according to the measurement program to obtain the measured data of each measurement point of the workpiece to be measured comprises the following steps: When a certain theoretical measurement point on the workpiece to be measured is measured, the fifth axis of the machine tool is slowly rotated at a detection rotation rate until the probe is triggered by contacting the workpiece, the fifth axis is reversely rotated to the original position after the probe contacts the workpiece, and the probe is lifted and moved to the next measurement position, and the operation is repeated to obtain the measured data of each measurement point of the workpiece to be measured, wherein the measured data of each measurement point is obtained according to the rotation angle of the fifth axis of the machine tool when the probe is triggered.

4. The on-machine measurement method based on a dual-rotary table machine tool and triggered by rotary table rotation according to claim 1, characterized in that, In step S4, the measured data comprises three-dimensional coordinates of the measurement points.

5. An in-machine measurement system based on a dual-rotary table machine tool and triggered by rotary table rotation, characterized in that, The system is used to implement the in-machine measurement method based on the double-turntable machine tool and triggered by the rotation of the turntable according to any one of claims 1 to 4, and comprises: a parameter setting module configured to determine the generatrix height of the workpiece to be measured based on the workpiece size on the 2D drawing of the workpiece to be measured, and set the measurement parameters according to the generatrix height; a theoretical test point calculation module configured to calculate the positions of the theoretical measurement points according to the measurement parameters to obtain the distribution of the theoretical measurement points of the workpiece to be measured in the 3D space; an in-machine test path generation module configured to generate the in-machine measurement path according to the distribution of the theoretical measurement points, and process the in-machine measurement path into an executable measurement program; a measured data output module configured to measure the workpiece to be measured by using the rotation of the fifth axis of the machine tool according to the measurement program to obtain the measured data of each measurement point of the workpiece to be measured.

6. An electronic device, comprising: The application relates to a double-turntable machine tool and a method for measuring a workpiece on the machine tool, wherein the machine tool comprises a processor, a memory and a bus system, the processor and the memory are connected through the bus system, the memory is used for storing instructions, and the processor is used for executing the instructions stored in the memory to realize the method for measuring the workpiece on the machine tool based on the double-turntable machine tool and triggered by the rotation of the turntable according to any one of claims 1 to 4.

Images