A quartz wafer cutting apparatus

Abstract

The application relates to the field of quartz wafers, in particular to a quartz wafer cutting device which comprises a base, a transfer unit is arranged on the base and used for circumferential transfer of a quartz wafer, a feeding unit is arranged on one side of the transfer unit and used for feeding of the quartz wafer, a cutting unit is arranged above the transfer unit and used for cutting of the quartz wafer, a discharging unit is arranged on the other side of the transfer unit and used for discharging of the cut quartz wafer, compared with laser device cutting, the quartz wafer cutting device can reduce the cost, compared with the existing mechanical cutting device, the quartz wafer cutting device can reduce the participation of manual work, reduce labor, and the setting of the transfer unit can realize cutting of multiple quartz wafers, and the efficiency is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the field of quartz wafers, and particularly relates to a quartz wafer cutting device. BACKGROUND

[0002] The quartz wafer is a special industrial technology glass made of silicon dioxide and is a very excellent basic material. The quartz wafer has excellent resonance characteristics, and therefore, is widely applied in the electronic field, such as resonators, oscillators, filters and the like.

[0003] The quartz column is cut into multiple pieces, at this time, the quartz wafer is a blank, and needs to be cut in shape and polished on the surface according to requirements, so as to become a quartz wafer for use. When the quartz wafer is cut in shape, the quartz waer is cut according to the shape of the installation position, for example, a straight line needs to be cut on the edge of the quartz wafer, such as the shape shown in the accompanying drawings, four straight edges are cut. Figure 4

[0004] At present, the cutting mode is generally mechanical sawing and laser cutting. The laser cutting mode has high cost, the laser cutting equipment itself has high cost, and the maintenance cost is also high in the later period, and some manufacturers prefer to choose the mechanical sawing mode. However, the mechanical sawing mode also has disadvantages, and is highly dependent on manual work, and the participation of manual work is high. At present, the design of the mechanical sawing structure is limited to cutting of the quartz wafers one by one, and the efficiency needs to be improved.

[0005] Therefore, the quartz wafer cutting device is provided for the above problems. SUMMARY

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem in the background art.

[0007] The technical scheme adopted by the application to solve the technical problems is that the quartz wafer cutting device comprises a base, a transfer unit is arranged on the base, the transfer unit is used for circumferential transfer of the quartz wafer, one side of the transfer unit is provided with a feeding unit, the feeding unit is used for feeding of the quartz wafer, an upper portion of the transfer unit is provided with a cutting unit, the cutting unit is used for cutting of the quartz wafer, and the other side of the transfer unit is provided with a discharging unit, the discharging unit is used for discharging of the cut quartz wafer.

[0008] Preferably, the transfer unit comprises a rotating shaft, both ends of the rotating shaft are rotationally connected to the base, a plurality of groups of extension rods are vertically and fixedly connected to the upper portion of the rotating shaft, the plurality of groups of extension rods are circumferentially arranged around the axis of the rotating shaft, and the end portions of the two extension rods in each group are provided with an adsorption assembly.

[0009] ​Each of the adsorption assemblies comprises two electric push rods, the two electric push rods are fixed at one side of the end of the two extension rods in the same group respectively, the output end of the electric push rod penetrates through the extension rod and is rotationally connected with a connecting rod, the end of the connecting rod is fixed with a suction cup, the two adjacent suction cups are oppositely arranged, and the quartz wafer is adsorbed between the two suction cups; a driven gear is fixed on the outer ring of the connecting rod, an driving gear is engaged with the outer part of the driven gear, the output end of the driving gear is fixed with a servo motor, and the servo motor is fixed at one side of the end of the extension rod.

[0010] Preferably, the feeding unit comprises a plurality of feeding plates, each of which is arranged vertically to the ground, and each of which is arranged opposite to each of the adsorption assemblies; a guide groove is formed on the upper edge of each of the feeding plates, and a to-be-cut quartz wafer is vertically and rollingly connected in the guide groove; a notch is formed at the end of the feeding plate, and the suction cup can rotate into the notch and adsorb the quartz wafer at the position of the notch.

[0011] Preferably, the cutting unit comprises a truss, the truss is symmetrically arranged above the transfer unit, a sliding block is slidably connected in the truss, and a lead screw is movably connected on the sliding block; a connecting plate is fixed between the two sliding blocks, a plurality of cutting motors are fixed on the lower surface of the connecting plate, each of the cutting motors corresponds to each of the adsorption assemblies, and the output end of each of the cutting motors is fixed with a cutting disc.

[0012] Preferably, the discharging unit comprises a plurality of discharging plates, each of which is arranged vertically to the ground, and each of which is arranged opposite to each of the adsorption assemblies; a rolling groove is formed on the upper edge of each of the discharging plates, and a cut quartz wafer is vertically and rollingly connected in the rolling groove; a notch is formed at the end of the discharging plate, and the suction cup can rotate into the notch.

[0013] Preferably, an air channel is formed in the connecting rod, the air channel communicates with the suction cup, a plurality of air vent holes are formed on the outer ring of the end of the connecting rod close to the electric push rod, and the air vent holes communicate with the air channel; a through hole is formed at the end of each of the extension rods.

[0014] Preferably, a first pipe is arranged on the outer side of each of the feeding plates, a plurality of first air nozzles are communicated with the first pipe, the first air nozzles extend into the guide groove, and the air jet of the first air nozzles is obliquely directed to the edge of the to-be-cut quartz wafer.

[0015] Preferably, a second pipe is arranged on the outer side wall of the discharging plate, a plurality of second air nozzles are communicated with the second pipe, the second air nozzles extend into the rolling groove, and the air jet of the second air nozzles is obliquely directed to the edge of the cut quartz wafer.

[0016] Preferably, the shaft and the extension rod are hollow, and the extension rod communicates with the shaft; a negative pressure pipe is communicated with the end of each of the extension rods, and the suction port of the negative pressure pipe is directed to the suction cup.

[0017] Preferably, a rubber buffer pad is arranged on the vertical inner side wall of each said recess.

[0018] The present application has the advantages of:

[0019] 1. The quartz wafer cutting device can reduce the cost compared with the laser device cutting, and can reduce the labor participation, reduce the labor, and realize the cutting of multiple quartz wafers, improve the efficiency compared with the existing mechanical cutting device.

[0020] 2. The screw rod moves back and forth intermittently, and the servo motor drives the quartz wafer to rotate intermittently, so that the four excess parts of the edge of the quartz wafer are cut off, the cutting process is simple in logic, and there is no redundant action or redundant stroke, so the efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a perspective view of the quartz wafer cutting device in the present application;

[0022] Figure 2 It is a perspective view of the conveying unit in the present application;

[0023] Figure 3 It is Figure 2 It is a local enlarged view of A in the present application;

[0024] Figure 4 It is a cutting schematic view of the quartz wafer in the present application;

[0025] Figure 5 It is a perspective view of the cooperation of the adsorption assembly and the quartz wafer in the present application;

[0026] Figure 6 It is a front view of the conveying unit in the present application;

[0027] Figure 7 It is a perspective view of the feeding unit in the present application;

[0028] Figure 8 It is a perspective view of the discharging unit in the present application;

[0029] Figure 9 It is a schematic view of the quartz wafer feeding process in the present application;

[0030] Figure 10 It is a schematic view of the quartz wafer discharging process in the present application;

[0031] Figure 11 It is a first perspective view of the adsorption assembly in the present application;

[0032] Figure 12 It is a second perspective view of the adsorption assembly in the present application;

[0033] Figure 13 is a sectional view of the adsorption assembly in the application.

[0034] In the figure: 1, base; 101, quartz wafer; 2, rotating shaft; 3, extension rod; 4, electric push rod; 5, connecting rod; 6, suction cup; 7, driven gear; 8, driving gear; 9, servo motor; 10, feeding plate; 11, clearance; 12, truss; 13, connecting plate; 14, cutting motor; 15, cutting disc; 16, discharging plate; 17, notch; 18, air channel; 19, air vent; 20, through hole; 21, No. 1 pipe; 22, No. 1 air nozzle; 23, No. 2 pipe; 24, No. 2 air nozzle; 25, negative pressure pipe. DETAILED DESCRIPTION

[0035] In order to make the technical means, creative features, purposes and effects realized by the application easy to understand, the application will be further described below in combination with specific embodiments.

[0036] Referring to Figures 1-13 A quartz wafer cutting device, comprising a base 1, the base 1 is provided with a transfer unit, the transfer unit is used for circumferential transfer of a quartz wafer 101, one side of the transfer unit is provided with a feeding unit, the feeding unit is used for feeding of the quartz wafer 101; an upper portion of the transfer unit is provided with a cutting unit, the cutting unit is used for cutting of the quartz wafer 101; the other side of the transfer unit is provided with a discharging unit, the discharging unit is used for discharging of the cut quartz wafer 101;

[0037] In this embodiment, a high-efficiency quartz wafer 101 cutting device is designed, which can also meet the demand of low cost; first, the quartz wafer 101 to be cut is placed on the feeding unit, under the guidance of the feeding unit, it is transferred to the transfer unit, then it is transferred to the cutting unit position by the transfer unit, the cutting unit cuts the quartz wafer 101, then the transfer unit continues to rotate, and the quartz wafer 101 is transferred to the discharging unit position, and the discharging operation of the cut quartz wafer 101 is performed;

[0038] Compared with the laser device cutting, the quartz wafer 101 cutting device can reduce the cost, and compared with the existing mechanical cutting device, the participation of artificial can be reduced, the labor can be reduced, and the setting of the transfer unit can realize cutting of multiple quartz wafers 101, and the efficiency is improved.

[0039] Referring to Figures 1-6 The transfer unit comprises a rotating shaft 2, both ends of the rotating shaft 2 are rotationally connected to the base 1, a plurality of extension rods 3 are vertically fixed to the upper portion of the rotating shaft 2, the plurality of extension rods 3 are circumferentially arranged around the axis of the rotating shaft 2, and the end portions of two extension rods 3 in each group are provided with an adsorption assembly;

[0040] Each of the adsorption assemblies comprises two electric push rods 4, which are respectively fixed at one side of the end of two extension rods 3 in the same group, the output end of the electric push rod 4 penetrates the extension rod 3 and is rotationally connected with a connecting rod 5, the end of the connecting rod 5 is fixed with a suction cup 6, the two adjacent suction cups 6 are oppositely arranged, and the quartz wafer 101 is adsorbed between the two suction cups 6; the outer ring of the connecting rod 5 is fixed with a driven gear 7, the outer part of the driven gear 7 is engaged with a driving gear 8, the output end of the driving gear 8 is fixed with a servo motor 9, and the servo motor 9 is fixed at one side of the end of the extension rod 3; the quartz wafer 101 moves along the feeding unit to the rotating unit position, and then the transfer unit adsorbs the quartz wafer 101; the electric push rod 4 drives the connecting rod 5 to drive the suction cup 6, so that the suction cup 6 is close to and adsorbed on the quartz wafer 101, and then the rotating shaft 2 is driven to rotate, the outer ring of the two ends of the rotating shaft 2 is fixed with a gear ring, the gear ring is engaged with an external speed reducer, the rotating shaft 2 is driven to rotate slowly, the extension rod 3 cooperates with the rotating shaft 2 to transfer the quartz wafer 101 adsorbed by the suction cup 6 to the cutting unit position for cutting; the connecting rod 5 is rotationally connected with the output end of the electric push rod 4, the driving gear 8 is driven by the servo motor 9 to engage the driven gear 7 to rotate, the suction cup 6 drives the quartz wafer 101 to rotate intermittently, and each time the quartz wafer 101 rotates by ninety degrees, the quartz wafer 101 is cut four times.

[0041] With reference to Figures 1-8 The feeding unit comprises a plurality of feeding plates 10, each of which is arranged vertically to the ground, and each of which is oppositely arranged with each of the adsorption assemblies; a guide groove is formed in the upper edge of each of the feeding plates 10, and the to-be-cut quartz wafer 101 is vertically and rollingly connected in the guide groove; a gap 11 is formed in the end of the feeding plate 10, the suction cup 6 can rotate into the gap 11 and adsorb the quartz wafer 101 at the position of the gap 11; the to-be-cut quartz wafer 101 is vertically placed in the guide groove, and then the quartz wafer 101 rolls to the end of the feeding plate 10, i.e. the gap position, and waits for the adsorption assembly to move to the gap 11 position; the rotating shaft 2 also rotates intermittently, and each time the rotating shaft 2 rotates by ninety degrees, the adsorption assembly rotates to the gap 11 position, then the electric push rod 4 is driven, the suction cup 6 adsorbs the quartz wafer 101 at the position of the gap 11, then the rotating shaft 2 rotates by ninety degrees and moves to the position below the cutting unit to cut the quartz wafer 101.

[0042] With reference to Figures 1-12The cutting unit comprises a truss 12 symmetrically arranged above the transfer unit, a sliding block slidably connected in the truss 12, and a lead screw movably connected on the sliding block; a connecting plate 13 is fixedly connected between the two sliding blocks, a plurality of cutting motors 14 are fixedly connected to the lower surface of the connecting plate 13, each cutting motor 14 corresponds to each adsorption assembly, and the output end of each cutting motor 14 is fixedly connected with a cutting disc 15; the lead screw is driven to rotate by a reversible motor, and the lead screw rotates and drives the sliding block to move back and forth along the truss 12; the cutting motor 14 drives the cutting disc 15 to rotate at a high speed, and cuts off one edge of the quartz wafer 101, then the servo motor 9 drives the connecting rod 5 to rotate by 90 degrees, the quartz wafer 101 rotates by 90 degrees, then the lead screw reverses, drives the cutting motor 14 to move horizontally in the opposite direction, and cuts off the excess part on the quartz wafer 101, and so on, the above-mentioned actions are repeated, the lead screw moves back and forth intermittently, the servo motor 9 drives the quartz wafer 101 to rotate intermittently, and the four excess parts of the quartz wafer 101 are cut off, the cutting process is simple in logic, has no redundant actions or strokes, and is high in efficiency.

[0043] With reference to Figures 1-8 The blanking unit comprises a plurality of blanking plates 16, each of which is arranged vertically to the ground and is arranged opposite to each group of the adsorption assemblies; a rolling groove is formed in the upper edge of each blanking plate 16, and the quartz wafer 101 after cutting is vertically and rolling connected in the rolling groove; a notch 17 is formed in the leading end of the blanking plate 16, and the suction cup 6 can rotate into the notch 17; after the quartz wafer 101 is cut four times by the cutting unit, the rotating shaft 2 drives the adsorption assembly to rotate by 90 degrees, and the adsorption assembly and the quartz wafer 101 are rotated to the position of the blanking unit, the suction cup 6 is rotated to the position of the notch 17, the cut quartz wafer 101 is rotated into the notch 17, at this time, the electric push rod 4 is synchronously withdrawn, the suction cup 6 is pulled away from the quartz wafer 101, then the quartz wafer 101 rolls away from the equipment along the inclination angle of the blanking plate 16, and the blanking of the quartz wafer 101 is realized.

[0044] With reference to Figures 11-13 A gas channel 18 is formed in the connecting rod 5, the gas channel 18 is communicated with the suction cup 6, a plurality of air vent holes 19 are formed in the outer circle of the end of the connecting rod 5 close to the electric push rod 4, and the air vent holes 19 are communicated with the gas channel 18; a through hole 20 is formed in the end of each extension rod 3; during the backward pulling of the suction cup 6 by the electric push rod 4, the suction cup 6 is first deformed, then the suction cup 6 is pulled backward, the connecting rod 5 moves backward, at this time, the air vent holes 19 on the connecting rod 5 are gradually communicated with the through hole 20, external gas flows into the suction cup 6 along the through hole 20, the air vent holes 19 and the gas channel 18, at this time, the suction cup 6 loses the negative pressure environment, the suction cup 6 no longer adsorbs the quartz wafer 101, and the quartz wafer 101 is smoothly separated from the suction cup 6, thereby ensuring the stable blanking of the quartz wafer 101.

[0045] With reference toFigure 1 、 Figure 6 、 Figure 7 and Figure 9 Each of the outer side of the feeding plate 10 is provided with a number of tubes 21, the number of tubes 21 is communicated with a plurality of first gas nozzle 22, the first gas nozzle 22 extends to the guide groove, and the first gas nozzle 22 gas inclined to the edge of the rotating movement over the quartz wafer 101 to be cut; the quartz wafer 101 to be cut is disc-shaped, the quartz wafer 101 will roll along the guide groove, will collide together, resulting in the edge of the quartz wafer 101 broken, for this set a first gas nozzle 22, the gas impact of the first gas nozzle 22 of the rolling quartz wafer 101, slow down the impact of the rolling quartz wafer 101, so that each of the quartz wafer 101 can be smoothly rolled to the position of the gap 11.

[0046] Referring to Figure 1 、 Figure 6 、 Figure 8 and Figure 10 , the outer side wall of the lower plate 16 is provided with a number of tubes 23, the number of tubes 23 is communicated with a plurality of second gas nozzle 24, the second gas nozzle 24 extends to the rolling groove, and the second gas nozzle 24 gas inclined to the edge of the quartz wafer 101 after cutting; the edge of the quartz wafer 101 after cutting will have four straight edges, when rolling or sliding along the lower plate 16, it is more difficult, for this set a second gas nozzle 24, the second gas nozzle 24 impact the quartz wafer 101, for the rolling or sliding of the quartz wafer 101 to provide gas thrust, to promote the quartz wafer 101 quickly leave the lower plate 16, so as to facilitate the subsequent discharge of the quartz wafer 101 to move smoothly to the notch 17 position.

[0047] Referring to Figures 1-3 , the shaft 2 and the extension rod 3 is hollow, and the extension rod 3 is communicated with the shaft 2, the end of each extension rod 3 is communicated with a negative pressure pipe 25, and the suction port of the negative pressure pipe 25 points to the suction cup 6; the quartz wafer 101 produces debris when cutting, in order to reduce the flying debris, the negative pressure pipe 25 is provided, the end of the shaft 2 is rotatable and communicated with a hose, the hose is communicated with a negative pressure pump, the negative pressure pipe 25 is in a negative pressure state, the debris generated by cutting is sucked into the extension rod 3 by the negative pressure pipe 25, and then is sucked away along the shaft 2, reducing the pollution of the working environment by the debris.

[0048] Referring to Figure 7 , each of the vertical inner side wall of the gap 11 is provided with a rubber buffer pad; the rubber buffer pad is provided in the gap 11, which reduces the impact of the quartz wafer 101 to be cut when rolling to the position of the gap 11 on the feeding plate 10, and plays a protective role for the quartz wafer 101.

[0049] Working principle: in this embodiment, by designing a high efficiency quartz wafer 101 cutting device, but also to meet the demand of low cost; first to be cut quartz wafer 101 placed on the feeding unit, under the guidance of the feeding unit, to the transfer unit, after the transfer unit to the cutting unit position, cutting unit for cutting quartz wafer 101, after the transfer unit continues to rotate, the quartz wafer 101 is transferred to the discharge unit position, after cutting the discharge operation of quartz wafer 101;

[0050] The quartz wafer 101 cutting device, compared with laser cutting device, in terms of cost can be reduced, at the same time compared with the existing mechanical cutting setting, can reduce the participation of artificial, reduce labor, and the setting of the conveying unit, can realize multiple quartz wafer 101 cutting, efficiency is improved;

[0051] Quartz wafer 101 along the feeding unit to the rotating unit position, and then the transfer unit adsorbs the quartz wafer 101; the electric push rod 4 drives the connecting rod 5 to drive the suction cup 6, so that the suction cup 6 is close to and adsorbed on the quartz wafer 101, and then drives the rotating shaft 2 to rotate, the both ends of the rotating shaft 2 are fixedly connected with the gear ring, the gear ring is engaged with the external reducer, the rotating shaft 2 is driven to rotate slowly, the rotating shaft 2 cooperates with the extension rod 3 to transfer the quartz wafer 101 adsorbed by the suction cup 6 to the cutting unit position for cutting; the connecting rod 5 is rotatably connected to the output end of the electric push rod 4, the suction cup 6 drives the quartz wafer 101 to rotate intermittently, and each time the quartz wafer 101 rotates by ninety degrees, the quartz wafer 101 is cut four times;

[0052] The quartz wafer 101 to be cut is vertically placed in the guide groove, and then the quartz wafer 101 rolls to the end of the feeding plate 10, that is, the position of the clearance hole, waiting for the adsorption assembly to move to the clearance hole 11 position; the rotating shaft 2 also rotates intermittently, and each time the rotating shaft 2 rotates by ninety degrees, the adsorption assembly rotates to the clearance hole 11 position, and then the electric push rod 4 is driven, the suction cup 6 adsorbs the quartz wafer 101 at the clearance hole 11 position, and then the rotating shaft 2 rotates by ninety degrees, moves to below the cutting unit, and cuts the quartz wafer 101;

[0053] The screw rod is driven to rotate by a forward and reverse motor, the screw rod rotates and drives the sliding block to move back and forth along the truss 12; the cutting motor 14 drives the cutting disc 15 to rotate at high speed, and cuts off one edge of the quartz wafer 101, then the servo motor 9 drives the connecting rod 5 to rotate by 90 degrees, the quartz wafer 101 rotates by 90 degrees, then the screw rod reverses, drives the cutting motor 14 to move horizontally in the opposite direction, and cuts off the excess part on the quartz wafer 101, and so on, the above-mentioned actions are repeated, the screw rod moves back and forth intermittently, the servo motor 9 drives the quartz wafer 101 to rotate intermittently, and the four excess parts of the edge of the quartz wafer 101 are cut off, the cutting process is simple in logic, without redundant actions or strokes, and is high in efficiency;

[0054] After the quartz wafer 101 is cut four times by the cutting unit, the rotating shaft 2 drives the adsorption assembly to rotate by 90 degrees, and the adsorption assembly together with the quartz wafer 101 is rotated to the position of the discharging unit, the suction cup 6 is rotated to the position of the notch 17, and the cut quartz wafer 101 is rotated into the notch 17, at this time, the electric push rod 4 is synchronously withdrawn, the suction cup 6 is pulled backward to separate from the quartz wafer 101, and then the quartz wafer 101 rolls away from the equipment along the inclination angle of the discharging plate 16, so that the quartz wafer 101 is discharged;

[0055] During the backward pulling process of the suction cup 6 by the electric push rod 4, the suction cup 6 will first deform, then the suction cup 6 is pulled backward, the connecting rod 5 moves backward, at this time, the air vent hole 19 on the connecting rod 5 gradually communicates with the through hole 20, and external gas flows into the suction cup 6 along the through hole 20, the air vent hole 19 and the air duct 18, at this time, the suction cup 6 loses the negative pressure environment, the suction cup 6 no longer adsorbs the quartz wafer 101, and the quartz wafer 101 is smoothly separated from the suction cup 6, so that the stable discharging of the quartz wafer 101 is ensured;

[0056] The quartz wafer 101 to be cut is in a disc shape, the quartz wafers 101 roll along the guide groove and collide together, which causes the edges of the quartz wafers 101 to be broken, therefore, the first air nozzle 22 is arranged, the gas discharged from the first air nozzle 22 impacts the rolling quartz wafers 101, slows down the impact caused by the rolling of the quartz wafers 101, and enables each quartz wafer 101 to stably roll to the position of the gap 11;

[0057] After the quartz wafer 101 is cut, the edge of the quartz wafer 101 has four straight edges, and it is relatively difficult to roll or slide along the discharging plate 16, therefore, the second air nozzle 24 is arranged, the second air nozzle 24 impacts the quartz wafer 101, provides a gas thrust for the rolling or sliding of the quartz wafer 101, and promotes the quartz wafer 101 to quickly leave the discharging plate 16, so as to facilitate the subsequent quartz wafer 101 to be discharged to move to the position of the notch 17;

[0058] The quartz wafer 101 generates debris when being cut. In order to reduce the flying of the debris, the negative pressure pipe 25 is arranged. The end of the rotating shaft 2 is rotatably connected with a hose. The hose is connected with a negative pressure pump. The negative pressure pipe 25 is in a negative pressure state. The debris generated in the cutting is sucked into the extension rod 3 by the negative pressure pipe 25, and then is sucked away along the rotating shaft 2, so as to reduce the pollution of the debris to the working environment.

[0059] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments. The above-mentioned embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application. These changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A quartz wafer cutting apparatus characterized by comprising: The utility model provides a quartz wafer cutting device, including base (1), be equipped with transfer unit on base (1), and transfer unit is used for circumferential transfer quartz wafer (101), one side of transfer unit is equipped with feeding unit, and feeding unit is used for the feeding of quartz wafer (101);The upper side of transfer unit is equipped with cutting unit, and cutting unit is used for cutting quartz wafer (101);The other side of transfer unit is equipped with discharge unit, and discharge unit is used for the discharge of quartz wafer (101) after cutting; The transfer unit includes a rotating shaft (2), both ends of the rotating shaft (2) are rotatably connected to the base (1), a plurality of extension rods (3) are vertically fixed to the rotating shaft (2), the plurality of extension rods (3) are circumferentially arranged around the axis of the rotating shaft (2), and the ends of the two extension rods (3) in each group are provided with an adsorption assembly; Each adsorption assembly includes two electric push rods (4), the two electric push rods (4) are fixed to the ends of the two extension rods (3) in the same group on one side, the output end of the electric push rod (4) penetrates the extension rod (3), and a connecting rod (5) is rotatably connected to the output end of the electric push rod (4), the end of the connecting rod (5) is fixedly connected to a suction cup (6), the two adjacent suction cups (6) are oppositely arranged, and the quartz wafer (101) is adsorbed between the two suction cups (6); a driven gear (7) is fixed to the outer ring of the connecting rod (5), a driving gear (8) is engaged with the outer part of the driven gear (7), the output end of a servo motor (9) is fixed to the driving gear (8), and the servo motor (9) is fixed to the end of the extension rod (3) on one side; The feeding unit includes a plurality of feeding plates (10), each feeding plate (10) is arranged vertically to the ground, and each feeding plate (10) is arranged opposite to each adsorption assembly; a guide groove is formed in the upper edge of each feeding plate (10), and the to-be-cut quartz wafer (101) is vertically and rollingly connected in the guide groove; a gap (11) is formed in the end of the feeding plate (10), the suction cup (6) can rotate into the gap (11), and the quartz wafer (101) at the position of the gap (11) is adsorbed; The cutting unit includes a truss (12), the truss (12) is symmetrically arranged above the transfer unit, a sliding block is slidably connected in the truss (12), and a lead screw is movably connected to the sliding block; a connecting plate (13) is fixedly connected between the two sliding blocks, a plurality of cutting motors (14) are fixed to the lower surface of the connecting plate (13), each cutting motor (14) corresponds to each adsorption assembly, and the output end of each cutting motor (14) is fixedly connected to a cutting disc (15); The discharge unit includes a plurality of discharge plates (16), each discharge plate (16) is arranged vertically to the ground, and each discharge plate (16) is arranged opposite to each adsorption assembly; a rolling groove is formed in the upper edge of each discharge plate (16), and the quartz wafer (101) after cutting is vertically and rollingly connected in the rolling groove; a notch (17) is formed in the head of the discharge plate (16), and the suction cup (6) can rotate into the notch (17).

2. The apparatus of claim 1 wherein: The connecting rod (5) is internally provided with an air passage (18) which is communicated with the suction disc (6), and a plurality of air release holes (19) are provided on the outer ring of the end of the connecting rod (5) close to the electric push rod (4), and the air release holes (19) are communicated with the air passage (18); and a through hole (20) is provided on the end of each extension rod (3).

3. The apparatus of claim 1 wherein: A first pipe (21) is arranged on the outer side of each feeding plate (10), and a plurality of first air nozzles (22) are communicated with the first pipe (21), the first air nozzles (22) extend into the guide groove, and the air jet of the first air nozzles (22) is obliquely directed to the edge of the quartz wafer (101) to be cut which moves over.

4. The apparatus of claim 1 wherein: A second pipe (23) is arranged on the outer side wall of the discharging plate (16), a plurality of second air nozzles (24) are communicated with the second pipe (23), the second air nozzles (24) extend into the rolling groove, and the air jet of the second air nozzles (24) is obliquely directed to the edge of the quartz wafer (101) which has been cut.

5. The apparatus of claim 1 wherein: The rotating shaft (2) and the extension rod (3) are hollow, and the extension rod (3) is communicated with the rotating shaft (2), and a negative pressure pipe (25) is communicated with the end of each extension rod (3), and the suction port of the negative pressure pipe (25) is directed to the suction disc (6).

6. The apparatus of claim 1 wherein: A rubber buffer pad is arranged on the vertical inner side wall of each accommodation opening (11).

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