A double-layered circuit board heat dissipation structure with serpentine arranged triangular straight ribs

Abstract

The application discloses a cooling channel heat dissipation structure containing a triangular straight-rib serpentine arrangement, and relates to the technical field of chip heat dissipation. The purpose is to construct a high-efficiency circuit heat dissipation channel using a serpentine rib arrangement and a tubular fluid mutual intersection formed on a single board under a small space and a high heat flow. The heat dissipation system comprises upper and lower heat-conducting plates, left and right supporting plates and a serpentine rib channel composed of triangular straight ribs. The upper and lower heat-conducting plates can simultaneously contact main components of stacked opposite double-layer circuit boards to conduct heat and transmit heat to cooling fluid. The triangular straight ribs arranged in a serpentine staggered manner inside the channel and the fluid direction form a 45-degree angle, which can generate a small vortex in the central area to increase the disturbance to the cooling fluid, thereby improving the heat dissipation effect and reducing the flow resistance. Meanwhile, the double-layer arranged ribbed heat-conducting plates can utilize the tubular fluid intersection in space to increase the fluid disturbance, thereby strengthening the heat dissipation effect and significantly reducing the size of the overall circuit module.

Description

Technical Field

[0001] This invention belongs to the field of circuit heat dissipation technology, and in particular to a heat dissipation structure for a double-layer circuit board with serpentine triangular straight ribs arranged in a serpentine pattern, which is designed for heat dissipation in a confined space environment of micro-circuits. Background Technology

[0002] With the trend towards miniaturization in current electronic products, the overall packaging module stacking density is becoming increasingly higher. Furthermore, as electronic components consume more power, the heat they dissipate during operation also increases, thus placing higher demands on heat dissipation. The increased component density and overall packaging stacking density during circuit miniaturization further exacerbate the challenge of heat dissipation.

[0003] Poor heat dissipation can drastically reduce the reliability and lifespan of components in a circuit. Therefore, to improve the overall reliability and lifespan of a circuit, active / passive cooling methods are generally used to cool critical heat-generating components and reduce heat buildup, such as the active cooling of CPUs and GPUs on computer motherboards. However, with the dramatic increase in overall circuit stacking density and component density, traditional cooling methods are insufficient to meet the heat dissipation requirements of components in small spaces with high heat flux. Summary of the Invention

[0004] The purpose of this invention is to construct a high-efficiency circuit heat dissipation channel that utilizes a serpentine rib arrangement and the intermingling of tubular fluids formed on a single board under small space and high heat flux conditions. By designing the internal cooling channel structure and the arrangement and shape of the ribs, the invention aims to adapt to the heat dissipation of stacked circuits.

[0005] The above-mentioned objective of this invention is achieved through the following technical solution: a cooling channel heat dissipation structure with triangular straight ribs arranged in a serpentine pattern, comprising an upper heat-conducting plate, a lower heat-conducting plate, a left supporting side plate, a right supporting plate, and multiple upper heat-conducting plate triangular straight ribs and multiple lower heat-conducting plate triangular straight ribs. The upper heat-conducting plate, lower heat-conducting plate, left supporting side plate, and right supporting plate form a cooling airflow channel. The multiple upper heat-conducting plate triangular straight ribs are disposed on the lower surface of the upper heat-conducting plate, and the multiple lower heat-conducting plate triangular straight ribs are disposed on the upper surface of the lower heat-conducting plate.

[0006] Multiple upper heat-conducting plates with triangular straight ribs are arranged in a staggered manner to form a serpentine flow channel, and multiple lower heat-conducting plates with triangular straight ribs are arranged in a staggered manner to form a serpentine flow channel.

[0007] Furthermore, one end of the triangular straight rib of the upper heat-conducting plate is located at one side edge of the upper heat-conducting plate, and the other end extends to the central axis of the flow direction of the upper heat-conducting plate. Multiple triangular straight ribs of the upper heat-conducting plate are arranged alternately on both sides of the upper heat-conducting plate. One end of the triangular straight rib of the lower heat-conducting plate is located at one side edge of the lower heat-conducting plate, and the other end extends to the central axis of the flow direction of the lower heat-conducting plate. Multiple triangular straight ribs of the lower heat-conducting plate are arranged alternately on both sides of the lower heat-conducting plate.

[0008] Furthermore, the number of triangular straight ribs on the upper heat-conducting plate and the lower heat-conducting plate are each at least 3.

[0009] Furthermore, the triangular straight ribs of the upper heat-conducting plate and the triangular straight ribs of the lower heat-conducting plate form an angle of α = 45° with the direction of cold flow, the ratio of rib spacing to rib height is 8:1, and the ratio of rib length to cooling airflow channel width is 2:3.

[0010] Furthermore, the side length of the triangular straight rib cross section of the upper heat-conducting plate and the lower heat-conducting plate is between 0.6mm and 10mm.

[0011] Furthermore, the triangular straight ribs of the upper heat-conducting plate and the lower heat-conducting plate are arranged in a staggered manner to enhance the disturbance of cooling airflow.

[0012] Furthermore, the cooling airflow channel includes a cooling airflow inlet and a cooling airflow outlet, and the ratio of the equivalent diameter of the cooling airflow inlet to the width of the cooling airflow channel is 2:3.

[0013] Furthermore, the distance between the first row of air-facing starting ribs on the upper and lower heat-conducting plates and the cooling airflow inlet is between 3mm and 10mm.

[0014] A heat dissipation structure for opposing stacked circuits uses the aforementioned serpentine cooling channel structure with triangular straight ribs to achieve circuit heat dissipation. The upper and lower heat-conducting plates directly contact the circuit components to conduct heat.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. By utilizing the upper and lower heat-conducting plate structure of the contact circuit components, the circuit components are simultaneously contacted through the outer sides of the upper and lower heat-conducting plates. This takes into account the circuit board stacking design and achieves the purpose of heat dissipation. It can be applied to situations such as chip crossfire heat dissipation or heat dissipation of electronic components and power supply modules. It enhances heat dissipation while minimizing the overall size of the circuit board.

[0017] 2. The upper and lower heat-conducting plate structure can make full use of the tubular fluid generated when the cooling airflow passes over the surface of the single plate. The two tubular fluids generated on the inner side of the upper and lower heat-conducting plates can converge twice in space to form a stronger cold flow disturbance on the two heat-conducting plates, thereby enhancing the heat exchange capacity.

[0018] 3. Although the triangular straight ribs on the inner side of the heat-conducting plate have poor reliability at the tip structure under high speed and high temperature conditions in turbine blades, they have a high average surface heat transfer coefficient and uniform distribution and low flow resistance. When used for heat dissipation of circuit boards, there is no need to impose high requirements on the reliability of its tip; only its high overall heat dissipation efficiency under the same volume needs to be considered.

[0019] 4. The triangular straight ribs form a 45° angle with the cooling airflow direction, and the front and rear ribs are distributed on both sides of the supporting wall to form a serpentine rib channel. The serpentine rib channel enhances the cooling airflow disturbance near the wall surface, forming micro-scale vortices at the rear of the rib edges. This area is located at the heat dissipation center of the heat conduction plate, which can greatly enhance the surface heat transfer coefficient of the central area. Overall, the serpentine rib channel has strong and continuous disturbance to the cooling airflow, while also significantly reducing the flow resistance coefficient.

[0020] 5. The ribs on the inner side of the cooling channels of the upper and lower heat conduction plates are staggered in space, which further enhances the airflow disturbance when the converging tubular fluids enter near the wall surface, and further enhances the heat transfer coefficient of the wall surface. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation channel.

[0022] Figure 2 This is a schematic diagram of the cooling airflow channel.

[0023] Figure 3 This is a schematic diagram of the serpentine rib channel of the upper heat-conducting plate.

[0024] Figure 4 This is a schematic diagram of the serpentine rib channel of the lower heat conduction plate.

[0025] Figure 5 This is a comparison diagram of the surface temperatures of the upper and lower heat-conducting plates in the traditional structure and this structure. Detailed Implementation

[0026] The specific content of the present invention will be further explained in detail below with reference to the accompanying drawings.

[0027] like Figure 1 As shown, a dual-circuit board heat sink with a serpentine rib channel includes at least one channel heat dissipation unit. The channel heat dissipation unit includes an upper heat-conducting plate 1, a lower heat-conducting plate 2, a left support side plate 3, a right support plate 4 used for fixing, a triangular straight rib 5 on the upper heat-conducting plate, and a triangular straight rib 6 on the lower heat-conducting plate. The cooling airflow channel 9 formed by the upper heat-conducting plate 1, the lower heat-conducting plate 2, the left support side plate 3, and the right support plate 4 has a cooling airflow inlet 7 and a cooling airflow outlet 8 at both ends, respectively.

[0028] The width of the cooling airflow channel 9 is determined by the size of the upper and lower heat dissipation electronic components. Preferably, the width of the cooling airflow channel 9 is the same as the width of the electronic components. Preferably, the equivalent diameter of the cooling airflow channel is 2 / 3 of the channel width.

[0029] Preferably, the width of the upper heat-conducting plate 1 and the lower heat-conducting plate 2 is the same as the width of the cooling airflow channel 9, and the ratio of the height of the upper heat-conducting plate 1 and the lower heat-conducting plate 2 to the width of the heat-conducting plate is (0.05~0.1):1.

[0030] Preferably, the height of the left support side plate 3 and the right support side plate 4 is the sum of the height of the upper heat-conducting plate 1, the lower heat-conducting plate 2, and the cooling airflow channel 9, and the ratio of the width of the left support side plate 3 and the right support side plate 4 to their height is (0.03~0.05):1.

[0031] like Figure 1 , Figure 3 , Figure 4 As shown, the upper heat-conducting plate 1 and the lower heat-conducting plate 2 have serpentine rib channels distributed inside the cooling airflow channel 9. Preferably, the square ribs 5 on the upper surface are arranged in a staggered manner, with the ribs forming an angle of α = 45° with the direction of cold airflow, the ratio of rib spacing to rib height being 8:1, and the ratio of rib length to width of the cooling airflow channel 9 being 2:3. The rib arrangement of the upper heat-conducting plate 1 is the same as that of the lower heat-conducting plate 2, but the upper and lower ribs on the same side are spatially staggered.

[0032] Preferably, the ribs are triangular straight ribs with an equilateral triangular cross-section, which can be integrally molded with the heat-conducting plate. To improve heat dissipation and minimize manufacturing costs, the rib cross-sectional dimensions can be adapted to the actual channel dimensions, but should be controlled between 0.6mm and 10mm; to ensure heat dissipation, the number of pairs of triangular straight ribs on each heat-conducting plate should not be less than 3 pairs.

[0033] The present invention provides upper and lower heat-conducting plates that can simultaneously contact the main components of stacked, opposing double-layer circuit boards for heat conduction and transfer of heat to the cooling fluid. The triangular straight ribs arranged in a serpentine pattern inside the channels form a 45° angle with the fluid direction, generating small eddies in the central region to increase disturbance to the cooling fluid, thereby improving heat dissipation and reducing flow resistance. Simultaneously, the double-layered ribbed heat-conducting plates utilize tubular fluid convergence in space to increase fluid disturbance and enhance heat dissipation, while significantly reducing the overall size of the circuit module.

[0034] This invention addresses the issue that a large tubular fluid is generated on the plane of the rib area in the chord region of a turbine blade when airflow passes through. In cases where the distance between a single heat-conducting plate or two heat-conducting plates is too great, the airflow disturbance caused by the convergence of this tubular fluid cannot be fully utilized, significantly limiting the use of this airflow disturbance. Simultaneously, considering the relatively large size of single-layer circuit boards, and the increasingly significant volume advantages of stacked circuit board packaging in the trend of electronic miniaturization, a structure that can simultaneously accommodate heat dissipation from double-layer circuit boards and enhance heat dissipation by utilizing tubular fluid offers substantial structural advantages.

[0035] like Figure 5The diagram shows a comparison of the surface temperatures (T) of the upper and lower heat-conducting plates in the traditional structure and the present structure. The traditional structure is a single heat-conducting plate with triangular straight ribs evenly arranged along the central axis. The vertical axis represents the surface temperature of the heat-conducting plate, and the horizontal axis represents the ratio of the reference position along the airflow direction to the equivalent diameter (x / d). It can be seen that compared with the traditional heat dissipation structure, the surface temperature rise of the present invention is smaller and the rate of temperature rise along the airflow direction is slower; moreover, it significantly suppresses the sudden temperature rise behind the ribs in the traditional heat dissipation structure, and the temperature distribution along the airflow direction is more uniform.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A heat sink structure comprising cooling channels in a triangular straight-rib serpentine arrangement, characterized by, The cooling structure comprises an upper heat-conducting plate (1), a lower heat-conducting plate (2), a left supporting side plate (3), a right supporting plate (4), and a plurality of upper heat-conducting plate triangular straight ribs (5) and a plurality of lower heat-conducting plate triangular straight ribs (6), the upper heat-conducting plate (1), the lower heat-conducting plate (2), the left supporting side plate (3), and the right supporting plate (4) form a cooling airflow channel (9), the plurality of upper heat-conducting plate triangular straight ribs (5) are arranged on the lower surface of the upper heat-conducting plate (1), and the plurality of lower heat-conducting plate triangular straight ribs (6) are arranged on the upper surface of the lower heat-conducting plate (2), The plurality of upper heat-conducting plate triangular straight ribs (5) are arranged in a staggered manner to form a serpentine curved flow channel, and the plurality of lower heat-conducting plate triangular straight ribs (6) are arranged in a staggered manner to form a serpentine curved flow channel. One end of the upper heat-conducting plate triangular straight rib (5) is located at one side edge of the upper heat-conducting plate (1), and the other end extends to the central axis of the flow direction of the upper heat-conducting plate (1), a plurality of upper heat-conducting plate triangular straight ribs (5) are arranged in a staggered manner on both sides of the upper heat-conducting plate (1), and one end of the lower heat-conducting plate triangular straight rib (6) is located at one side edge of the lower heat-conducting plate (2), and the other end extends to the central axis of the flow direction of the lower heat-conducting plate (2), a plurality of lower heat-conducting plate triangular straight ribs (6) are arranged in a staggered manner on both sides of the lower heat-conducting plate (2). The upper heat-conducting plate triangular straight rib (5) and the lower heat-conducting plate triangular straight rib (6) form an angle of α=45° with the cold airflow flow direction, the rib spacing to rib height ratio is 8:1, and the rib length to cooling airflow channel (9) width ratio is 2:

3.

2. The cooling channel heat sink structure containing a triangular straight-rib serpentine arrangement of claim 1, wherein, The number of the upper heat-conducting plate triangular straight rib (5) and the lower heat-conducting plate triangular straight rib (6) is at least 3.

3. The cooling channel heat sink structure containing a triangular straight-rib serpentine arrangement of claim 1, wherein, The triangular straight rib cross section side length of the upper heat-conducting plate triangular straight rib (5) and the lower heat-conducting plate triangular straight rib (6) is between 0.6mm and 10mm.

4. The cooling channel heat sink structure containing a triangular straight-rib serpentine arrangement of claim 1, wherein, The upper heat-conducting plate triangular straight rib (5) and the lower heat-conducting plate triangular straight rib (6) are arranged in a staggered manner in space to enhance the disturbance to the cooling airflow.

5. The cooling channel heat sink structure containing a triangular straight-rib serpentine arrangement of claim 1, wherein, The cooling airflow channel (9) comprises a cooling airflow inlet (7) and a cooling airflow outlet (8), and the ratio of the equivalent diameter of the cooling airflow inlet (7) to the width of the cooling airflow channel (9) is 2:

3.

6. The cooling channel heat sink structure containing a triangular straight-rib serpentine arrangement of claim 5, wherein, The distance between the first row of windward starting ribs on the upper heat-conducting plate (1) and the lower heat-conducting plate (2) and the cooling airflow inlet (7) is between 3mm and 10mm.

7. A heat dissipating structure for a stacked circuit, characterized by comprising: The cooling structure with triangular straight rib serpentine arrangement cooling channel is used to realize circuit heat dissipation, and the upper heat-conducting plate (1) and the lower heat-conducting plate (2) are directly in contact with the circuit elements to conduct heat.

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