Dust blowing apparatus and method

Abstract

The application discloses a dust blowing device and method, which comprises a plasma gas generating device and a blowing device. The blowing device is provided with a first air inlet, a first air outlet, a second air inlet, a second air outlet, a component clamping structure and a blowing chamber. The first air inlet, the first air outlet, the second air inlet and the second air outlet are all communicated with the blowing chamber. The component clamping structure is used for placing a component to be blown and is provided with a blowing opening which is communicated with the blowing chamber. The first air inlet faces the blowing opening and is connected with the plasma gas generating device and receives the plasma gas generated by the plasma gas generating device. The dust blowing device blows the dust on the surface of the component to be blown by the plasma gas, thereby achieving the dust removal of the component to be blown.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device housing packaging, and particularly to a dust blowing device and method. Background Technology

[0002] With technological advancements and social development, semiconductor devices are increasingly widely used in various fields and industries. Among them, optoelectronic semiconductor devices are key components in monitoring, security, and detection, possessing broad application scenarios and representing a significant development direction for high-tech enterprises. Due to the unique operating characteristics of optoelectronic semiconductor devices, they cannot be packaged using the traditional injection molding or encapsulation methods found in logic semiconductor devices. Instead, they require a packaging structure that exposes the photosensitive surface within a cavity. The space on the photosensitive surface can lead to the electrostatic adsorption of tiny particles, dust, and other debris, which can obstruct the photosensitive surface and directly affect the device's performance. Therefore, controlling cleanliness during the packaging process and removing surface debris is crucial for optoelectronic semiconductor devices.

[0003] Maintaining cleanliness within the process room requires minimizing dust introduction by personnel and promptly removing dust generated by vibrations. While this reduces dust, it doesn't meet the cleanliness requirements for photodetector packaging. This approach is challenging, costly, and ineffective in controlling cleanliness. Therefore, to effectively remove dust adsorbed on the surface of the photodetector chip and ensure the cleanliness of the packaging cavity, a centralized dust treatment system can be implemented within the cavity. This will facilitate the cleaning of excess material adsorbed inside the casing and more effectively guarantee internal cleanliness. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art in removing dust from the semiconductor surface, which is difficult and costly, and to provide a dust blowing device and method.

[0005] The present invention solves the above-mentioned technical problems through the following technical solution:

[0006] A dust blowing device includes: a plasma gas generating device and a blowing device;

[0007] The purging device is provided with a first air inlet, a first air outlet and a component clamping structure, and the purging device is provided with a purging chamber inside;

[0008] Both the first air inlet and the first air outlet are connected to the purge chamber. The component clamping structure is used to place the purged component and is provided with a purge opening. The purge opening is connected to the purge chamber. The first air inlet faces the purge opening. The first air inlet is connected to the plasma gas generating device and receives the plasma gas generated by the plasma gas unit.

[0009] In this solution, the dust blowing device sprays plasma gas onto the surface of the component being blown through the first air inlet. The positive and negative charges contained in the plasma gas neutralize the charges contained in the dust adsorbed on the surface of the component being blown, causing it to lose its electrostatic adsorption capacity. At the same time, the kinetic energy brought in by the blowing will shake the dust up and suspend it in the gas in the cavity, forming a colloid. The colloid is then discharged through the first outlet, thus achieving dust removal from the component being blown.

[0010] Preferably, the purging device is further provided with a second outlet, which is connected to the purging chamber and located at the bottom of the purging chamber.

[0011] In this design, a second outlet is provided at the bottom of the purge chamber, which allows large particles not suspended in the gas to be discharged.

[0012] Preferably, the dust blowing device further includes an air intake unit, and the first outlet and / or the second outlet are connected to the air intake unit.

[0013] In this design, the suction unit makes it easier to remove dust-containing colloids and large dust particles from the purge chamber.

[0014] Preferably, the purging device is further provided with a second air inlet, which is connected to the purging chamber and is located obliquely above and directly opposite the second outlet.

[0015] In this design, by setting a second air inlet directly opposite the second exhaust outlet, large dust particles can be discharged more easily.

[0016] Preferably, a ramp is provided between the second air inlet and the second air outlet, with the second air inlet located at the upper end of the ramp and the second air outlet located at the lower end of the ramp.

[0017] In this design, by setting a ramp between the second air inlet and the second outlet, large dust particles can easily roll down the ramp and be discharged from the second outlet.

[0018] Preferably, the first exhaust port is located below and adjacent to the second air inlet.

[0019] In this design, the first outlet is located below and adjacent to the second inlet, which allows the airflow from the second inlet to easily remove dust from the first outlet.

[0020] Preferably, the air outlet path of the first exhaust port is staggered from the air inlet path of the second air inlet.

[0021] In this design, the air outlet route of the first outlet and the air inlet route of the second inlet are staggered, which can prevent the second inlet from blowing large dust particles directly into the first outlet and clogging it.

[0022] Preferably, both the first outlet and the second inlet include multiple holes, and the holes of the first outlet and the holes of the second inlet are arranged alternately.

[0023] In this design, the first outlet and the second inlet include multiple holes. When the gas is discharged from the multiple holes, it is pressurized, which can increase the airflow velocity. This allows the gas to be sprayed onto the surface of the part being cleaned more effectively, removing the dust adhering to the surface. At the same time, the staggered arrangement of the holes can prevent the second inlet from blowing large dust particles directly into the first outlet and clogging it.

[0024] Preferably, the purge opening is located at the top of the purge chamber, and the air intake direction of the first air inlet is inclined relative to the purge opening; in the gas flow direction, the first air inlet is located upstream of the purge opening, and the first outlet is located downstream of the purge opening.

[0025] In this design, the first air inlet and the second air outlet are located on the upstream and downstream sides of the purging opening, respectively, so that dust on the purged parts can be directly blown from the parts to the second air outlet.

[0026] Preferably, the component clamping structure is inclined relative to the horizontal direction.

[0027] In this design, the component clamping structure is tilted horizontally to facilitate the catching of downward-sloping dust from the second row of outlets located on the downstream side.

[0028] Preferably, the first air inlet, the first air outlet, or the second air inlet includes a plurality of holes.

[0029] In this design, the first air inlet, the first air outlet, and the second air inlet include multiple holes. When the gas is discharged from the multiple holes, it is pressurized, which can increase the airflow velocity, thereby more effectively blowing away the dust adhering to the surface of the part being blew when it is sprayed onto the surface of the part being blew.

[0030] Preferably, the plasma gas generating device includes a housing with an air inlet and an air outlet, and a first static electrode and a second static electrode disposed inside the housing.

[0031] The first static electrode is located near the air inlet, and the second static electrode is located near the air outlet;

[0032] A plurality of ash-adhesive components are also provided between the first static electrode and the second static electrode.

[0033] In this solution, by setting static electrodes near the air inlet and outlet, and setting dust-adhesive components between the two static electrodes, dust in the plasma gas can be effectively removed, thereby ensuring that the output plasma gas is clean, which facilitates the purging operation in the purging device.

[0034] Preferably, the ash-adhesive component is detachable from the box body.

[0035] In this design, the ash-adhesive components are made detachable, allowing for convenient periodic replacement and ensuring that the output plasma gas is clean.

[0036] Preferably, the adhesive components are arranged alternately within the box.

[0037] In this scheme, dust in the plasma gas can be removed more effectively by arranging the dust-adhesive components in an alternating manner.

[0038] Preferably, the dust blowing device is used to blow away dust inside the semiconductor housing during the packaging process.

[0039] A dust blowing method, which uses the dust blowing device described above to blow dust off a component being blown, includes the following steps:

[0040] S1: Turn on the plasma gas generator;

[0041] S2: Place the part to be purged in the part clamping structure and face the purging opening;

[0042] S3: Open the first exhaust outlet, at which time the first air inlet is closed, and the gas in the purging chamber is emptied;

[0043] S4: Close the first exhaust outlet, open the first air inlet, and fill the purge chamber with plasma gas;

[0044] S5: Close the first air inlet and open the first exhaust outlet to purge the plasma gas in the purging chamber;

[0045] S6: Close the first exhaust outlet, and simultaneously open the second exhaust outlet and the second air inlet to clean the dust on the bottom surface of the blow-through chamber;

[0046] S7: Close the second exhaust outlet and the second air inlet to complete one purging cycle;

[0047] S8: Repeat steps S3 to S7 once or more. Plasma gas generating device.

[0048] In this solution, the dust blowing device sprays plasma gas onto the surface of the component being blown through the first outlet. The positive and negative charges contained in the plasma gas neutralize the charges contained in the dust adsorbed on the surface of the component being blown, causing it to lose its electrostatic adsorption capacity. At the same time, the kinetic energy brought in by the blowing will shake the dust up and suspend it in the gas in the cavity, forming a colloid. The colloid is then discharged through the second outlet, thus achieving dust removal from the component being blown. Furthermore, repeating steps S3 and S7 multiple times can improve the cleanliness of the housing after dust removal.

[0049] The positive and progressive effects of this invention are as follows: the dust blowing device sprays plasma gas onto the surface of the part being blown through the first outlet. The positive and negative charges contained in the plasma gas neutralize the charges contained in the dust adsorbed on the surface of the part being blown, causing it to lose its electrostatic adsorption capacity. At the same time, the kinetic energy brought in by the blowing will shake the dust up and suspend it in the gas in the cavity, forming a colloid. The colloid is then discharged through the first outlet. For particles with larger volume and weight, after losing their adsorption capacity, they will not be suspended in the colloid and will fall to the bottom of the blowing cavity, where they can be discharged through the second outlet, thus achieving dust removal from the part being blown. Attached Figure Description

[0050] Figure 1 This is a schematic diagram of the internal structure of a plasma gas generating apparatus according to a preferred embodiment of the present invention.

[0051] Figure 2 This is a schematic diagram of the internal structure of a purging device according to a preferred embodiment of the present invention.

[0052] Figure 3 This is a schematic diagram of the hole arrangement of the second air inlet and the first air outlet according to a preferred embodiment of the present invention.

[0053] Figure 4 This is a schematic flowchart of a dust blowing method according to a preferred embodiment of the present invention.

[0054] Explanation of reference numerals in the attached figures:

[0055] Plasma gas generating device 100

[0056] Box 101

[0057] Air inlet 103

[0058] Air outlet 105

[0059] First static electrode 107

[0060] Second static electrode 109

[0061] Adhesive component 111

[0062] 200 purging device

[0063] Casing 201

[0064] 203 purge chamber

[0065] First air intake 205

[0066] First row exit 207

[0067] Second air intake 209

[0068] Second row exit 211

[0069] Component clamping structure 213

[0070] 215 locking protrusions

[0071] purge opening 217

[0072] Slope 219

[0073] 300 parts being purged Detailed Implementation

[0074] The present invention will be further described below with reference to the accompanying drawings and by way of embodiments, but the present invention is not limited to the scope of the embodiments.

[0075] like Figure 1-2 As shown, this embodiment provides a dust blowing device, which is applied in the packaging process of an InGaAs short-wave infrared photodetector, for example, with a housing size of 44×22×7mm, specifically for the internal cleaning process of the detector before sealing. However, the present invention is not limited to this; the dust blowing device can also be applied to the surface cleaning of other large or small parts, or the internal cleaning of parts such as semiconductor housings.

[0076] The dust blowing device includes a plasma gas generating device 100 and a blowing device 200.

[0077] like Figure 1 As shown, the plasma gas generating device 100 includes a housing 101 with an air inlet 103 and an air outlet 105, and a first static electrode 107 and a second static electrode 109 disposed inside the housing 101. Figure 1 This is a top view of the plasma gas generating device 100.

[0078] The first static electrode 107 is located near the air inlet 103, and the second static electrode 109 is located near the air outlet 105.

[0079] A plurality of dust-adhesive components 111 are further disposed between the first static electrode 107 and the second static electrode 109. In this embodiment, the dust-adhesive component 111 is a plate-shaped structure, but the present invention is not limited thereto. In other embodiments, the dust-adhesive component 111 may also be a strip-shaped structure, a mesh structure, or a fence structure. Preferably, the dust-adhesive component 111 is a silicone self-absorbing plate. By disposing static electrodes near the air inlet 103 and the air outlet 105, and by disposing dust-adhesive components 111 between the two static electrodes, dust in the plasma gas can be effectively removed, thereby ensuring that the output plasma gas is clean, thus facilitating the purging operation in the purging device 200.

[0080] The ash-adhesive component 111 is detachable from the housing 101. Making the ash-adhesive component 111 detachable allows for convenient periodic replacement, thus ensuring the cleanliness of the output plasma gas.

[0081] The dust-adhesive components 111 are staggered in the flow channel from the air inlet 103 to the air outlet 105 inside the housing 101. In this way, the gas entering through the air inlet 103 will inevitably come into contact with the dust-adhesive components 111, so that the dust in the gas can adhere to the dust-adhesive components 111. By staggering the dust-adhesive components 111, dust in the plasma gas can be removed more effectively.

[0082] The air inlet 103 of the plasma gas generating device 100 is connected to a gas source. The gas pumped into the gas source can be purified air, nitrogen, argon, etc. Preferably, these gases pass through a filter screen before entering the air inlet 103, thereby filtering out larger particles in the gas.

[0083] Taking a short-wave infrared photodetector suitable for InGaAs as an example, the housing 101 of the plasma gas generating device 100 can be a metal housing 101 with a wall thickness of 1mm and a diameter of 96×40×22mm. Two static electrodes are connected to an external electrostatic generator, and the metal housing 101 is grounded, serving as the grounding electrode. The dimensions of the ash-adhesive component 111 can be 31×18×2mm.

[0084] like Figure 2 As shown, the purging device 200 includes a housing 201, which is provided with a first air inlet 205, a first air outlet 207, a second air inlet 209, a second air outlet 211 and a component clamping structure 213. The housing 201 is provided with a purging chamber 203 inside. Figure 2 This is a front view of the purging device 200. Figure 2 The solid arrows in the diagram indicate the direction of airflow.

[0085] Both the first air inlet 205 and the first outlet 207 are connected to the purge chamber 203. The component clamping structure 213 is used to place the purged component 300 and is provided with a purge opening 217. The purge opening 217 is connected to the purge chamber 203. The first air inlet 205 faces the purge opening 217. The first air inlet 205 is connected to the plasma gas generating device 100 and receives the plasma gas generated by the plasma gas unit.

[0086] The dust blowing device sprays plasma gas onto the surface of the component 300 being blown through the first outlet 207. The positive and negative charges contained in the plasma gas neutralize the charges contained in the dust adsorbed on the surface of the component 300, causing it to lose its electrostatic adsorption capacity. At the same time, the kinetic energy brought in by the blowing will shake the dust up and suspend it in the gas in the cavity, forming a colloid. The colloid is then discharged through the second outlet 211, thus achieving dust removal from the component 300 being blown.

[0087] The purge opening 217 is located at the top of the purge chamber 203, and the air intake direction of the first air inlet 205 is inclined relative to the purge opening 217. In the gas flow direction, the first air inlet 205 is located upstream of the purge opening 217, and the first outlet 207 is located downstream of the purge opening 217.

[0088] The first air inlet 205 and the second outlet 211 are located on the upstream and downstream sides of the purge opening 217, respectively, so that dust on the purged component 300 can be directly blown from the component to the second outlet 211.

[0089] The component clamping structure 213 is inclined relative to the horizontal direction. The component clamping structure 213 is inclined so that the second row outlet 211 located on the downstream side can catch the downward-sloping dust.

[0090] The second outlet 211 is connected to the purge chamber 203 and is located at the bottom of the purge chamber 203. The second outlet 211 located at the bottom of the purge chamber 203 allows large particles not suspended in the gas to be discharged.

[0091] The second air inlet 209 is connected to the purging chamber 203 and is located above and directly opposite the second outlet 211. By providing the second air inlet 209 directly opposite the second outlet 211, large dust particles can be discharged more easily.

[0092] A ramp 219 is provided between the second air inlet 209 and the second outlet 211, with the second air inlet 209 located at the upper end of the ramp 219 and the second outlet 211 located at the lower end of the ramp 219. By providing the ramp 219 between the second air inlet 209 and the second outlet 211, large dust particles can easily roll off the ramp 219 and be discharged from the second outlet 211. Alternatively, the ramp 219 may not be provided between the second air inlet 209 and the second outlet 211, and the airflow may simply blow the dust from the second air inlet 209 to the second outlet 211.

[0093] The first outlet 207 is located below and adjacent to the second air inlet 209. This location facilitates the use of airflow from the second air inlet 209 to remove dust from the first outlet 207. Alternatively, the first outlet 207 can also be located above the second air inlet 209 to prevent dust from being blown into it by the second air inlet 209.

[0094] The air outlet 207 of the first row has an air outlet path that is offset from the air intake path of the second air intake 209.

[0095] By staggering the air outlet route of the first outlet 207 and the air inlet route of the second inlet 209, large dust particles can be prevented from being blown directly into the first outlet 207 by the second inlet 209, thus preventing blockage of the first outlet 207.

[0096] The first air inlet 205, the first air outlet 207, or the second air inlet 209 preferably includes multiple holes, i.e., a sieve-like structure. The presence of multiple holes in the first air inlet 205, the first air outlet 207, and the second air inlet 209 pressurizes the gas as it exits through these holes, increasing the airflow velocity and thus more effectively removing dust adhering to the surface of the part being blew. The second air outlet 211 preferably has a large-hole structure, with the bottom of the hole flush with the ramp 219, facilitating the discharge of large dust particles. The second air outlet 211 is preferably a square hole measuring 36 × 4 mm.

[0097] like Figure 3 As shown, the holes of the first outlet 207 and the second inlet 209 are arranged alternately. The alternate arrangement of the holes can prevent the second inlet 209 from blowing large dust particles directly into the first outlet 207 and clogging it.

[0098] Taking a short-wave infrared photodetector suitable for InGaAs as an example, the external dimensions of the housing 201 can be 120×60×47mm, the size of the purge opening 217 is 44.2×22.2mm, and the component clamping structure 213 is also provided with a locking protrusion 215 to fix the detector housing to the component clamping structure 213, and the opening of the detector housing is open to the purge chamber 203.

[0099] The angle between the gas ejection direction of the first air inlet 205 and the purge opening 217 is preferably 150°. The angle between the gas ejection direction of the first outlet 207 and the horizontal direction is preferably -15°, and the angle between the gas ejection direction of the second air inlet 209 and the horizontal direction is preferably 15°.

[0100] The dust blowing device also includes an air intake unit (not shown), to which a first outlet 207 and a second outlet 211 are connected. An example of an air intake unit is a vacuum pump. A filter is placed between the air intake unit and the first outlet 207 and the second outlet 211 to filter dust and prevent damage to the vacuum pump.

[0101] The suction unit makes it easier to remove dust-containing colloids and large dust particles from the purge chamber 203.

[0102] A filter and a three-way valve are also provided in the connecting pipeline between the air outlet 105 of the plasma gas generating device 100 and the purging device 200. The filter further filters the gas supplied by the plasma gas generating device 100, and the three-way valve is used to supply the gas supplied by the plasma gas generating device 100 to the first air inlet 205 and the second air inlet 209 respectively.

[0103] Meanwhile, solenoid valves are provided in the first air inlet 205, the second air inlet 209, the first outlet 207, and the second outlet 211 to open and close them by means of electrical control.

[0104] like Figure 4 As shown, this embodiment also provides a dust blowing method, which uses the dust blowing device described above to blow dust off the component 300 being blown, and includes the following steps:

[0105] S1: Turn on the plasma gas generating device 100 and the intake unit to generate plasma gas.

[0106] S2: The part to be purged 300 is placed in the part clamping structure 213 and facing the purging opening 217.

[0107] S3: Open the first exhaust outlet 207. At this time, the first air inlet 205 is closed, and the gas in the purging chamber is emptied to prepare for purging.

[0108] S4: Close the first exhaust outlet 207, open the first air inlet 205, and fill the purge chamber with plasma gas;

[0109] Specifically, after closing the first outlet 207, the first inlet 205 is opened to blow up the part 300 being blown up. The gas is sprayed onto the part 300 being blown up at a certain angle relative to it. The positive and negative charges contained in the plasma gas will neutralize the charges contained in the dust adsorbed inside the housing 201, causing it to lose its electrostatic adsorption capacity. At the same time, the kinetic energy brought in by the blowing will shake up the dust, suspending it in the gas in the cavity to form a colloid. Meanwhile, some large dust particles will fall onto the ramp 219 between the second inlet 209 and the second outlet 211.

[0110] S5: Close the first air inlet 205 and open the first exhaust outlet 207 to purge the plasma gas in the purging chamber; after opening the first exhaust outlet 207, the suction in the first exhaust outlet 207 will suck out the above-mentioned colloid containing tiny dust particles.

[0111] S6: Close the first exhaust outlet 207, open the second air inlet 209 and the second exhaust outlet 211, and clean the dust on the bottom surface of the blow-through chamber;

[0112] The gas ejected from the second air inlet 209 and the suction force from the second outlet 211 will expel large dust particles from the ramp 219 through the second outlet 211.

[0113] S7: Close the second exhaust outlet 211 and the second intake 209 in sequence to complete one purging cycle.

[0114] S8: Repeat steps S3 and S7 once or more, preferably at least twice in this embodiment.

[0115] Repeating steps S3 to S7 multiple times can improve the accuracy of dust removal.

[0116] S9: Dust removal is complete. Turn off the vacuum pump, turn off the gas source, and turn off the plasma gas generator 100.

[0117] Those skilled in the art will understand that all openings and electronic components in this dust blowing device are closed before being opened.

[0118] In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship of the device relative to the operator during normal use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation at all times, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention in this respect.

[0119] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A dust blowing device, characterized in that, It includes: Plasma gas generating device and purging device; The purging device is provided with a first air inlet, a first air outlet and a component clamping structure, and the purging device is provided with a purging chamber inside; Both the first air inlet and the first air outlet are connected to the purge chamber. The component clamping structure is used to place the purged component and is provided with a purge opening. The purge opening is connected to the purge chamber. The first air inlet faces the purge opening. The first air inlet is connected to the plasma gas generating device and receives the plasma gas generated by the plasma gas generating device. The purging device is further provided with a second outlet, which is connected to the purging chamber and located at the bottom of the purging chamber; The purging device is also provided with a second air inlet, which is connected to the purging chamber and is located diagonally above and directly opposite the second outlet. The first exhaust outlet is located below and adjacent to the second air inlet; The air outlet path of the first exhaust port is staggered from the air inlet path of the second air inlet; A ramp is provided between the second air inlet and the second air outlet, with the second air inlet located at the upper end of the ramp and the second air outlet located at the lower end of the ramp; The purge opening is located at the top of the purge chamber, and the air intake direction of the first air inlet is inclined relative to the purge opening. In the gas flow direction, the first air inlet is located upstream of the purge opening, and the first outlet is located downstream of the purge opening; The component clamping structure is inclined relative to the horizontal direction.

2. The dust blowing device as described in claim 1, characterized in that, The dust blowing device further includes an air intake unit, and the first outlet and / or the second outlet are connected to the air intake unit.

3. The dust blowing device as described in claim 1, characterized in that, Both the first outlet and the second inlet include multiple holes, and the holes of the first outlet and the holes of the second inlet are arranged alternately.

4. The dust blowing device as described in claim 1, characterized in that, The first air inlet, the first air outlet, or the second air inlet includes multiple holes.

5. The dust blowing device as described in claim 1, characterized in that, The plasma gas generating device includes a housing with an air inlet and an air outlet, and a first static electrode and a second static electrode disposed inside the housing. The first static electrode is located near the air inlet, and the second static electrode is located near the air outlet; A plurality of ash-adhesive components are also provided between the first static electrode and the second static electrode.

6. The dust blowing device as described in claim 5, characterized in that, The adhesive component is detachable from the box body.

7. The dust blowing device as described in claim 5, characterized in that, The adhesive components are arranged alternately inside the box.

8. The dust blowing device as described in claim 1, characterized in that, The dust blowing device is used to blow away dust adsorbed inside the device housing during the packaging process.

9. A method for blowing away dust, characterized in that, It uses the dust blowing device as described in any one of claims 1-8 to blow dust off the part being blown, and includes the following steps: S1: Turn on the plasma gas generator; S2: Place the part to be purged in the part clamping structure and face the purging opening; S3: Open the first exhaust outlet, at which time the first air inlet is closed, and the gas in the purging chamber is emptied; S4: Close the first exhaust outlet, open the first air inlet, and fill the purge chamber with plasma gas; S5: Close the first air inlet and open the first exhaust outlet to purge the plasma gas in the purging chamber; S6: Close the first exhaust outlet, and simultaneously open the second exhaust outlet and the second air inlet to clean the dust on the bottom surface of the blow-through chamber; S7: Close the second exhaust outlet and the second air inlet to complete one purging cycle; S8: Repeat steps S3 to S7 once or more.

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