A flip chip on film roll chip area circuit adhesion force measurement system and method

Abstract

The application relates to the technical field of reliability test of a chip on film (COF), and discloses a COF roll belt chip area circuit adhesion force measuring system and method, wherein the COF roll belt chip area circuit adhesion force measuring system comprises a COF roll belt, a chip area is arranged on the top surface of the COF roll belt, and a circuit is arranged on the chip area; the system further comprises a circuit stripping device for applying a force to the circuit to strip the circuit from the chip area and a stripping force measuring device for measuring the force applied by the circuit stripping device to the circuit to strip the circuit from the chip area; and the application further discloses a COF roll belt chip area circuit adhesion force measuring method applied to the COF roll belt chip area circuit adhesion force measuring system. The circuit adhesion force of the chip area can be measured, and the quality of the COF can be controlled based on the circuit adhesion force.

Description

Technical Field

[0001] This invention relates to the field of flip-chip reliability testing technology, specifically to a flip-chip tape roll chip area line adhesion measurement system and method. Background Technology

[0002] After the flip-chip film roll production is completed, the adhesion of the circuits needs to be inspected in the copper-covered areas of the areas without solder resist ink. The adhesion is quantified through experiments, and this is used as a basis for quality control of the flip-chip film. For the adhesion of the circuits at the output and input ends of the external pin area, because the circuits are relatively wide (generally greater than 10 micrometers), the current method used in the industry is to peel the circuits from the polyimide film and then use a universal tensile testing machine to test the adhesion. However, this method is not suitable for measuring the adhesion of the circuits at the output and input ends of the chip area, because the circuits at these two locations are thinner (generally less than 10 micrometers), and the thin circuits will break because they cannot withstand the tensile force generated when the circuits are peeled from the polyimide film.

[0003] In practical applications, the adhesion of the lines at the input terminals of the external pin area is generally not considered because the line width here is much larger than in other locations, and the reliability risk is extremely low. However, the output terminals of the external pin area, the output terminals of the chip area, and the input terminals of the chip area have relatively thin lines, and the possibility of line peeling is relatively high in practical applications. Currently, the industry generally tests and monitors the adhesion of the lines at the output terminals of the external pin area, but it is impossible to test the adhesion of the lines in the chip area. It is worth noting that the lines in the chip area are generally the thinnest part of the entire product, and the risk of line peeling is even greater.

[0004] Therefore, there is an urgent need for a device and method to measure the adhesion of lines in a chip area. Summary of the Invention

[0005] The purpose of this invention is to provide a system and method for measuring the adhesion of flip-chip film to the circuit area, which can measure the adhesion of the circuit to the chip area, and based on this, the quality of flip-chip film can be controlled.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following solution:

[0007] In a first aspect, a chip region line adhesion measurement system for flip-chip film tape includes a flip-chip film tape, a chip region is disposed on the top surface of the flip-chip film tape, and lines are laid on the chip region. The system includes a line peeling device that applies a force to the contacting lines to peel them off from the chip region and a peeling force measuring device that measures the force applied by the line peeling device to peel the contacting lines off from the chip region.

[0008] Furthermore, the part of the line stripping device that comes into contact with the line is made of a rigid material.

[0009] Furthermore, the peel force measuring device includes several force sensors, which are evenly distributed on the bottom surface of the flip-chip film roll and in contact with the bottom surface of the flip-chip film roll.

[0010] Furthermore, it also includes a flip-chip film roll fixing platform, on the top surface of which is a flip-chip film roll limiting groove with the same shape as the flip-chip film roll. The flip-chip film roll can be detachably installed in the flip-chip film roll limiting groove, and the plurality of force sensors are evenly laid on the bottom surface of the flip-chip film roll limiting groove.

[0011] Furthermore, it also includes a linear motion module that drives the flip-chip film roll to move along the length direction of the lines on it. The flip-chip film roll fixing platform is fixedly installed on the slider of the linear motion module. The length direction of the linear motion module is consistent with the length direction of the lines on the flip-chip film roll installed on the flip-chip film roll fixing platform.

[0012] Furthermore, it also includes a stripping force adjustment device that adjusts the force applied by the stripping device to the contacted lines to peel them off from the chip area. The stripping force adjustment device includes a bracket on which a rotating shaft with its axis parallel to the horizontal plane is mounted. A connecting rod is rotatably mounted on the rotating shaft. Weights are detachably mounted on two parts of the connecting rod located on both sides of the rotating shaft. The stripping device is fixedly mounted on one end of the connecting rod.

[0013] Furthermore, it also includes an observation device for observing whether the circuitry has been stripped from the chip area.

[0014] Secondly, a method for measuring the adhesion of flip-chip tape-and-roll area circuits, applied to the flip-chip tape-and-roll area circuit adhesion measurement system described in any of the above solutions, includes method A, which mainly includes the following steps:

[0015] SA1: The flip-chip film roll to be tested is installed in the flip-chip film roll limiting groove, and the force sensor is in contact with the bottom surface of the flip-chip film roll to be tested.

[0016] SA2: The part of the circuit stripping device made of rigid material is brought into contact with the top surface of the flip-chip film roll to be tested, wherein the position on the flip-chip film roll to be tested that is in contact with the circuit stripping device is located on the axis of the circuit.

[0017] SA3: Adjust the weight of the weight on the connecting rod until the force sensor measures the value as N0, where N0 is a fixed value.

[0018] SA4: Control the linear movement module to move the lines on the flip-chip film roll to be tested toward the line stripping device. After the lines come into contact with the line stripping device, they continue to move a specified distance X along the original moving direction, where X is a set fixed value.

[0019] SA5: Use the observation device to observe whether the line is peeled off from the chip area. If the line is peeled off from the chip area, replace another flip-chip film roll in the same batch as the flip-chip film roll to be tested with the flip-chip film roll to be tested, and update N0 to N0-N, where N is a set fixed value.

[0020] SA6: Repeat steps SA1 to SA5 until the lines no longer peel off from the chip area. Record N0+N as the line adhesion of this batch of flip-chip film tape.

[0021] Furthermore, it also includes method B, which mainly includes the following steps:

[0022] SB1: The flip-chip film roll to be tested is installed in the flip-chip film roll limiting groove, and the force sensor is in contact with the bottom surface of the flip-chip film roll to be tested;

[0023] SB2: The portion of the circuit stripping device made of a rigid material is brought into contact with the top surface of the flip-chip film roll to be tested, wherein the contact point between the flip-chip film roll and the circuit stripping device is located on the axis of the circuit.

[0024] SB3: Adjust the weight of the weight on the connecting rod until the force sensor measures the value as N0, where N0 is a fixed value.

[0025] SB4: The linear motion module controls the lines on the flip-chip film roll to be tested to move toward the line stripping device. After the lines come into contact with the line stripping device, they continue to move a specified distance X along the original direction of movement, where X is a fixed value.

[0026] SB5: Use the observation device to observe whether the line is peeled off from the chip area. If the line is not peeled off from the chip area, replace the flip-chip film tape of the same batch as the flip-chip film tape to be tested with another flip-chip film tape of the same batch as the flip-chip film tape to be tested, and update N0 to N0+N, where N is a set fixed value.

[0027] SB6: Repeat steps SB1 to SB5 until the circuit is peeled off from the chip area. Record N0 as the circuit adhesion of this batch of flip-chip film tape.

[0028] Furthermore, method A is used when the lines on the first flip-chip film roll to be tested are stripped off, and method B is used when the lines on the first flip-chip film roll to be tested are not stripped off.

[0029] The beneficial effects of this invention are as follows:

[0030] 1. In this invention, the flip-chip film roll is first installed in the flip-chip film roll limiting groove. Then, the part of the circuit stripping device made of rigid material is brought into contact with the top surface of the flip-chip film roll. The weight of the weight on the connecting rod is adjusted until the value measured by the force sensor is the set value. Then, the linear motion module is controlled to move the circuit toward the direction of the circuit stripping device. After the circuit contacts the circuit stripping device, the linear motion module is controlled to move the circuit a specified distance along the original moving direction. The observation device is used to observe whether the circuit is stripped from the chip area. The weight of the weight on the connecting rod is adjusted according to the stripping status of the circuit in the chip area. The above process is repeated with another flip-chip film roll from the same batch until the value measured by the force sensor when the circuit is just stripped from the chip area is obtained. This value is recorded as the circuit adhesion force of the flip-chip film roll of this batch. The system and method provided by this invention can measure the circuit adhesion force in the chip area, and the quality of the flip-chip film can be controlled based on this.

[0031] 2. In this invention, the peeling force adjustment device includes a bracket, a rotating shaft horizontally mounted on the bracket, and a connecting rod rotatably mounted on the rotating shaft. Weights are detachably mounted on both sides of the connecting rod, and the line peeling device is fixedly mounted on one end of the connecting rod. The force applied by the line peeling device to the contacted line to peel it from the chip area can be adjusted by adjusting the weight of the weights on the connecting rod.

[0032] 3. In this invention, an observation device is used to observe whether the circuit is peeled off from the chip area. Attached Figure Description

[0033] Figure 1 This is an overall structural diagram of a flip-chip tape-and-roll chip area line adhesion measurement system according to the present invention;

[0034] Figure 2 This is a top view of the flip-chip tape fixing platform and force sensor in a flip-chip tape-to-chip regional line adhesion measurement system of the present invention.

[0035] Figure 3 This is a front view of the flip-chip tape fixing platform in a flip-chip tape area line adhesion measurement system of the present invention;

[0036] Figure 4 This is a top view of the flip-chip tape in a flip-chip tape area line adhesion measurement system according to the present invention.

[0037] Figure 5 This is an overall flowchart of method A in the method for measuring the adhesion of flip-chip tape-and-roll area lines in the present invention;

[0038] Figure 6 This is an overall flowchart of method B in the method for measuring the adhesion of circuit lines in a flip-chip roll area according to the present invention.

[0039] Reference numerals: 1-base, 2-linear movement module, 3-chip film roll fixing platform, 4-connecting rod, 5-rotating shaft, 6-rotating shaft; 7-weight fixing screw, 8-bracket, 9-weight fixing platform, 10-line stripping device, 11-fixing bolt, 12-chip film roll; 13-force sensor, 14-chip film roll limiting groove, 15-line. Detailed Implementation

[0040] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the embodiments of the present invention are not limited thereto.

[0041] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "longitudinal," "lateral," "horizontal," "inner," "outer," "front," "rear," "top," and "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "have," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] Example 1:

[0044] like Figures 1 to 4 As shown, a flip-chip film tape chip area line adhesion measurement system includes a flip-chip film tape 12, a chip area is disposed on the top surface of the flip-chip film tape 12, and lines 15 are laid on the chip area. The system includes a line peeling device 10 that applies a force to the contacting lines 15 to peel them off from the chip area, and a peeling force measuring device that measures the force applied by the line peeling device 10 to peel the contacting lines 15 off from the chip area.

[0045] In this embodiment, the part of the line stripping device 10 that contacts the line 15 is made of a rigid material.

[0046] Specifically, the line stripping device 10 includes a pencil. After sharpening the pencil lead, the tip of the pencil lead is flattened so that the flattened end of the pencil lead contacts the line 15 and applies a force to the line 15 to strip it from the chip area. If there are wear marks on the part of the pencil lead that contacts the line 15, the end of the pencil lead can be flattened again.

[0047] Specifically, the angle between the pencil and line 15 is 45°.

[0048] In this embodiment, the peel force measuring device includes a plurality of force sensors 13, which are evenly distributed on the bottom surface of the flip-chip film roll 12 and in contact with the bottom surface of the flip-chip film roll 12.

[0049] In this embodiment, a flip-chip film roll fixing platform 3 is also included. A flip-chip film roll fixing platform 3 has a flip-chip film roll limiting groove 14 with the same shape as the flip-chip film roll 12 on its top surface. The flip-chip film roll 12 can be detachably installed in the flip-chip film roll limiting groove 14. A plurality of force sensors 13 are evenly laid on the bottom surface of the flip-chip film roll limiting groove 14.

[0050] Specifically, 20 force sensors 13 are provided, which are evenly laid out in a 4*5 matrix on the bottom surface of the flip-chip film roll limiting groove 14.

[0051] In this embodiment, a linear motion module 2 is also included, which drives the flip-chip film roll 12 to move along the length direction of the line 15 on it. The flip-chip film roll fixing platform 3 is fixedly installed on the slider of the linear motion module 2. The length direction of the linear motion module 2 is consistent with the length direction of the line 15 on the flip-chip film roll 12 installed on the flip-chip film roll fixing platform 3.

[0052] In this embodiment, a stripping force adjustment device is also included to adjust the force applied by the stripping device 10 to the contacted line 15 to peel it off from the chip area. The stripping force adjustment device includes a bracket 8, on which a rotating shaft 5 with its axis parallel to the horizontal plane is mounted. A connecting rod 4 is rotatably mounted on the rotating shaft 5. Weights are detachably mounted on two parts of the connecting rod 4 located on both sides of the rotating shaft 5. The stripping device 10 is fixedly mounted on one end of the connecting rod 4.

[0053] Specifically, it also includes a base 1. The fixed end of the linear motion module 2 and the bracket 8 are both fixedly installed on the bearing surface of the base 1. The weight is detachably installed on the connecting rod 4 by weight fixing screws 7 or weight fixing platform 9. A through hole is opened on one end of the connecting rod 4 for the line stripping device 10 to pass through. The side wall of the through hole is in contact with the outer side wall of the line stripping device 10. A fixing screw hole is opened on the side wall of the through hole. A fixing bolt 11 for pressing the line stripping device 10 tightly in the through hole is threaded in the fixing screw hole.

[0054] This embodiment also includes an observation device for observing whether the line 15 is stripped from the chip area.

[0055] Specifically, the observation device is a metallurgical microscope.

[0056] Example 2:

[0057] like Figure 5 As shown, a method for measuring the adhesion of flip-chip tape-and-roll circuit lines in any of the flip-chip tape-and-roll circuit adhesion measurement systems described in Example 1 is provided. The method includes method A, which mainly comprises the following steps:

[0058] SA1: The flip-chip film roll 12 to be tested is installed in the flip-chip film roll limiting groove 14, and the force sensor 13 is in contact with the bottom surface of the flip-chip film roll 12 to be tested.

[0059] SA2: The portion of the line stripping device 10 made of a rigid material is brought into contact with the top surface of the flip-chip film roll 12 to be tested. The position on the flip-chip film roll 12 to be tested that is in contact with the line stripping device 10 is located on the axis of the line 15.

[0060] SA3: Adjust the weight of the weight on the connecting rod 4 until the value measured by the force sensor 13 is N0, where N0 is a fixed value.

[0061] SA4: Control the linear movement module 2 to drive the line 15 on the flip-chip film roll 12 to be tested to move toward the line stripping device 10. After the line 15 contacts the line stripping device 10, it continues to move a specified distance X along the original moving direction, where X is a set fixed value.

[0062] SA5: Use the observation device to observe whether the line 15 is peeled off from the chip area. If the line 15 is peeled off from the chip area, replace another flip-chip film roll 12 in the same batch as the flip-chip film roll 12 to be tested with the flip-chip film roll 12 to be tested, and update N0 to N0-N, where N is a fixed value set.

[0063] SA6: Repeat steps SA1 to SA5 until line 15 no longer peels off from the chip area. Record N0+N as the line adhesion of the flip-chip film reel 12 in this batch.

[0064] In this embodiment, as Figure 6 As shown, it also includes method B, which mainly includes the following steps:

[0065] SB1: The flip-chip film roll 12 to be tested is installed in the flip-chip film roll limiting groove 14, and the force sensor 13 is in contact with the bottom surface of the flip-chip film roll 12 to be tested.

[0066] SB2: The portion of the line stripping device 10 made of a rigid material is brought into contact with the top surface of the flip-chip film roll 12 to be tested. The position on the flip-chip film roll 12 to be tested that is in contact with the line stripping device 10 is located on the axis of the line 15.

[0067] SB3: Adjust the weight of the weight on the connecting rod 4 until the value measured by the force sensor 13 is N0, where N0 is a fixed value.

[0068] SB4: Control the linear movement module 2 to move the line 15 on the flip-chip film roll 12 to be tested toward the line stripping device 10. After the line 15 contacts the line stripping device 10, it continues to move a specified distance X along the original moving direction, where X is a set fixed value.

[0069] SB5: Use the observation device to observe whether the line 15 is peeled off from the chip area. If the line 15 is not peeled off from the chip area, replace another flip-chip film roll 12 in the same batch as the flip-chip film roll 12 to be tested with the flip-chip film roll 12 to be tested, and update N0 to N0+N, where N is a set fixed value.

[0070] SB6: Repeat steps SB1 to SB5 until line 15 is peeled off from the chip area. Record N0 as the line adhesion of the flip-chip film reel 12 in this batch.

[0071] Specifically, the value of N0 is 50 grams, the value of N is 10 grams, and the value of X is 3 millimeters.

[0072] In this embodiment, method A is used when the circuit 15 on the first flip-chip film roll 12 to be tested is peeled off, and method B is used when the circuit 15 on the first flip-chip film roll 12 to be tested has not been peeled off.

[0073] The working principle of this embodiment:

[0074] Currently, the industry cannot detect the adhesion of lines in the chip area. Since the lines 15 in the chip area are generally the thinnest part of the entire product, the risk of line 15 peeling off is high. Therefore, there is an urgent need for a device and method that can measure the adhesion of lines in the chip area.

[0075] This invention provides a method and system for measuring the adhesion force of flip-chip tape-on-chip circuits. First, the flip-chip tape 12 is installed in the flip-chip tape limiting groove 14. Then, the portion of the circuit stripping device 10 made of a rigid material is brought into contact with the top surface of the flip-chip tape 12. The weight of the weight on the connecting rod 4 is adjusted until the value measured by the force sensor 13 is the set value. Then, the linear motion module 2 is controlled to move the circuit 15 towards the circuit stripping device 10. After the circuit 15 contacts the circuit stripping device 10, the linear motion module 2 continues to move the circuit 15 along the original direction. The system moves a specified distance in the direction of movement and observes whether the line 15 is peeled off from the chip area using an observation device. Based on the peeling of the line 15 from the chip area, the weight of the weight on the connecting rod 4 is adjusted, and the above process is performed using another flip-chip film roll 12 from the same batch until the value measured by the force sensor 13 when the line 15 is just peeled off from the chip area is obtained. This value is recorded as the line adhesion force of the flip-chip film roll 12 of this batch. The system and method provided in this embodiment can measure the line adhesion force of the chip area, and the quality of the flip-chip film can be controlled based on this.

[0076] In addition, in this embodiment, a metallographic microscope is used to observe whether the circuit 15 has been peeled off from the chip area.

[0077] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Based on the technical essence of the present invention, any simple modifications, equivalent substitutions, and improvements made to the above embodiments within the spirit and principles of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A system for measuring the adhesion of flip-chip film tape to a chip region, comprising a flip-chip film tape (12), wherein a chip region is disposed on the top surface of the flip-chip film tape (12), and a circuit (15) is laid on the chip region, characterized in that, It also includes a line stripping device (10) that applies a force to the contact line (15) to peel it off from the chip region and a stripping force measuring device for measuring the force applied by the line stripping device (10) to the contact line (15) to peel it off from the chip region. The peeling force measuring device includes a plurality of force sensors (13), which are evenly distributed on the bottom surface of the flip-chip film roll (12) and in contact with the bottom surface of the flip-chip film roll (12). It also includes a flip-chip film roll fixing platform (3), on the top surface of which is a flip-chip film roll limiting groove (14) with the same shape as the flip-chip film roll (12). The flip-chip film roll (12) can be detachably installed in the flip-chip film roll limiting groove (14), and the plurality of force sensors (13) are evenly laid on the bottom surface of the flip-chip film roll limiting groove (14). It also includes a linear motion module (2) that drives the flip-chip film roll (12) to move along the length direction of the line (15) on it. The flip-chip film roll fixing platform (3) is fixedly installed on the slider of the linear motion module (2). The length direction of the linear motion module (2) is consistent with the length direction of the line (15) on the flip-chip film roll (12) installed on the flip-chip film roll fixing platform (3). It also includes a stripping force adjustment device for adjusting the force applied by the stripping device (10) to the contacted line (15) to peel it off from the chip area. The stripping force adjustment device includes a bracket (8) on which a rotating shaft (5) with its axis parallel to the horizontal plane is mounted. A connecting rod (4) is rotatably mounted on the rotating shaft (5). Weights are detachably mounted on two parts of the connecting rod (4) located on both sides of the rotating shaft (5). The stripping device (10) is fixedly mounted on one end of the connecting rod (4).

2. The system for measuring the adhesion of flip-chip tape-and-roll circuitry in a specific region according to claim 1, characterized in that, The part of the line stripping device (10) that comes into contact with the line (15) is made of a hard material.

3. The system for measuring the adhesion of flip-chip tape-and-roll circuitry in a specific region according to claim 1, characterized in that, It also includes an observation device for observing whether the line (15) is stripped from the chip area.

4. A method for measuring the adhesion of flip-chip tape-and-roll circuitry in a region, applied to the flip-chip tape-and-roll circuitry adhesion measurement system according to any one of claims 1-3, comprising method A, wherein method A mainly includes the following steps: SA1: The flip-chip film roll (12) to be tested is installed in the flip-chip film roll limiting groove (14), and the force sensor (13) is in contact with the bottom surface of the flip-chip film roll (12) to be tested. SA2: The part of the line stripping device (10) made of rigid material is brought into contact with the top surface of the flip-chip film roll (12) to be tested. The position of the flip-chip film roll (12) to be tested in contact with the line stripping device (10) is located on the axis of the line (15). SA3: Adjust the weight of the weight on the connecting rod (4) until the value measured by the force sensor (13) is N0, where N0 is a fixed value. SA4: Control the linear movement module (2) to drive the line (15) on the flip-chip film roll (12) to be tested to move toward the line stripping device (10). After the line (15) contacts the line stripping device (10), it continues to move a specified distance X along the original moving direction. X is a fixed value set. SA5: Use the observation device to observe whether the line (15) is peeled off from the chip area. If the line (15) is peeled off from the chip area, then replace another flip-chip film roll (12) in the same batch as the flip-chip film roll (12) to be tested with the flip-chip film roll (12) to be tested, and update N0 to N0-N, where N is a fixed value set. SA6: Repeat steps SA1 to SA5 until the line (15) does not peel off from the chip area. Record N0+N as the line adhesion of the flip-chip film tape (12) of this batch.

5. The method for measuring the adhesion of flip-chip tape-and-roll circuitry in a region according to claim 4, characterized in that, It also includes method B, which mainly includes the following steps: SB1: The flip-chip film roll (12) to be tested is installed in the flip-chip film roll limiting groove (14), and the force sensor (13) is in contact with the bottom surface of the flip-chip film roll (12) to be tested; SB2: The part of the line stripping device (10) made of rigid material is brought into contact with the top surface of the flip-chip film roll (12) to be tested. The position of the flip-chip film roll (12) to be tested in contact with the line stripping device (10) is located on the axis of the line (15). SB3: Adjust the weight of the weight on the connecting rod (4) until the value measured by the force sensor (13) is N0, where N0 is a fixed value set; SB4: The linear motion module (2) controls the line (15) on the flip-chip film roll (12) to be tested to move toward the line stripping device (10). After the line (15) contacts the line stripping device (10), it continues to move a specified distance X along the original moving direction. X is a fixed value set. SB5: Use the observation device to observe whether the line (15) is peeled off from the chip area. If the line (15) is not peeled off from the chip area, replace another flip-chip film roll (12) in the same batch as the flip-chip film roll (12) to be tested with the flip-chip film roll (12) to be tested, and update N0 to N0+N, where N is a fixed value set. SB6: Repeat steps SB1 to SB5 until the line (15) is peeled off from the chip area, and denote N0 as the line adhesion of the flip-chip film tape (12) of this batch.

6. The method for measuring the adhesion of flip-chip tape-and-roll circuitry in a region according to claim 5, characterized in that, Method A is used when the lines (15) on the first flip-chip film reel (12) to be tested are peeled off, and Method B is used when the lines (15) on the first flip-chip film reel (12) to be tested are not peeled off.

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