Simulation test structure and test apparatus
By setting a stress-relieving structure, such as a groove, on the second surface of the test body, the problem of difficulty in separating the fake finger structure from the fingerprint module is solved, enabling smooth testing of the fingerprint module and reducing the risk of fragmentation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- RECO TECH CHENGDU CO LTD
- Filing Date
- 2023-09-15
- Publication Date
- 2026-05-29
AI Technical Summary
After the fingerprint module is manufactured, the adhesion between the fake finger structure and the fingerprint module makes separation difficult, affecting testing operations and increasing the risk of breakage.
A stress-relief structure, such as a groove, is set on the second surface of the test body. By applying a driving force to the operating component, the stress-relief structure releases the internal stress, allowing the test body to be smoothly separated from the fingerprint module.
The fingerprint module underwent a smooth testing process, reducing the risk of fragment breakage and improving ease of operation.
Smart Images
Figure CN117275049B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of fingerprint testing technology, and in particular to a simulation testing structure and testing device for fingerprint modules. Background Technology
[0002] After the fingerprint module is manufactured, a dummy finger structure is needed to simulate the surface of the fingerprint module for testing. During the simulation test, the dummy finger structure is first placed on the fingerprint module to simulate the normal fingerprint acquisition process. Then, the dummy finger structure is lifted, and the acquired signal is written into the fingerprint module's chip. However, when lifting the dummy finger structure, due to adhesion, it is difficult to separate from the fingerprint module, causing inconvenience in operation and affecting the testing process. Summary of the Invention
[0003] Based on this, a simulation test structure and test device are provided to enable the fingerprint module to successfully complete the test process.
[0004] According to a first aspect of this application, a simulation test structure is provided for testing a fingerprint module, the simulation test structure comprising:
[0005] The test body has a first surface and a second surface disposed opposite to each other along a first direction, the first surface being used to adhere to the fingerprint module; and
[0006] The operating component is connected to the test body;
[0007] The second surface is provided with a stress relief structure;
[0008] Along the first direction, the size of the stress relief structure is smaller than the size of the test body.
[0009] In one embodiment, the stress relief structure is configured as a groove.
[0010] In one embodiment, the cross-sectional shape of the stress relief structure along the extension direction of the stress relief structure includes a triangle, a semicircle, or a trapezoid.
[0011] In one embodiment, the stress relief structure has a head end and an end end;
[0012] The direction from the head to the tail intersects with the direction from the test body to the operating component; both the direction from the head to the tail and the direction from the test body to the operating component are perpendicular to the first direction.
[0013] In one embodiment, the direction from the head to the tail is perpendicular to the direction from the test body to the operating element.
[0014] In one embodiment, the test body has a first side and a second side disposed opposite to each other along a second direction;
[0015] A straight line passing through the first end and the last end is defined as a reference line, and the reference line passes through the first side and the second side.
[0016] The first direction, the second direction, and the direction in which the test body points to the operating component are perpendicular to each other.
[0017] In one embodiment, the head end intersects with the first side surface; and / or
[0018] The end intersects with the second side.
[0019] In one embodiment, the stress relief structure has a head end and an end end;
[0020] The stress relief structure extends in a straight line between the first and last ends; or
[0021] The stress relief structure extends along a curve between the first and last ends; or
[0022] The stress relief structure extends along a zigzag line between the first and last ends.
[0023] In one embodiment, the stress relief structure is continuously provided along the extending direction of the stress relief structure; or
[0024] The stress relief structure is intermittently set along the extension direction of the stress relief structure.
[0025] In one embodiment, along the direction from the test body to the operating member, the test body has a first end and a second end that are disposed opposite to each other, the first end being connected to the operating member;
[0026] The stress-relief structure is closer to the first end.
[0027] In one embodiment, the first surface can cover the surface of the fingerprint module used to fit with the simulation test structure;
[0028] In one embodiment, the first surface has a simulated texture.
[0029] In one embodiment, the test body is made of an elastic material.
[0030] According to a second aspect of this application, a testing apparatus is provided, including a simulation test structure as described in any of the preceding embodiments.
[0031] In the aforementioned simulation test structure and testing device, the simulation test structure includes at least a test body and an operating component connected to each other. The simulation test structure can perform simulation testing on the fingerprint module using a first surface on the test body. The simulation test structure is placed on the fingerprint module. After the fingerprint module completes the acquisition of simulation information from the first surface, a driving force is applied to the operating component. Due to the stress-relieving structure on the second surface of the test body, the first surface near the operating component can smoothly separate from the fingerprint module. Then, the driving force is applied to the test body, moving the entire simulation test structure upwards to completely separate it from the fingerprint module. This facilitates the fingerprint module's successful completion of the testing process. Attached Figure Description
[0032] Figure 1 This is a test schematic diagram of a fingerprint module in one embodiment of the related technology.
[0033] Figure 2 for Figure 1 A schematic diagram of the lifting process of the prosthetic finger structure.
[0034] Figure 3 This is a schematic diagram of the lifting process of the prosthetic finger structure in another embodiment of the related technology.
[0035] Figure 4 This is a schematic diagram of the simulation test structure in one embodiment of this application.
[0036] Figure 5 This is a schematic diagram of the simulation test structure in another embodiment of this application.
[0037] Figure 6 for Figure 4 The simulation test structure is shown in the test diagram on the fingerprint module.
[0038] Figure 7 for Figure 4 A schematic diagram of the lifting process of the simulation test structure.
[0039] Figure 8 This is a top view of the simulation test structure in one embodiment of this application.
[0040] Figure 9 This is a top view of the simulation test structure in another embodiment of this application.
[0041] Figure 10 This is a top view of the simulation test structure in another embodiment of this application.
[0042] Explanation of reference numerals in the attached figures:
[0043] The structure of the artificial finger is 100.
[0044] Fingerprint module 200;
[0045] Flexible circuit board 300;
[0046] Test platform 1000;
[0047] Simulation test structure 10;
[0048] Test body 11, first surface 11a, second surface 12b, stress relief structure Q, first end Q1, end Q2, first side 11c, second side 11d, first end M1, second end M2;
[0049] Operating component 12;
[0050] Reference plane ss;
[0051] Reference line L;
[0052] First direction D1, second direction D2, third direction D3;
[0053] First dimension S1, second dimension S2;
[0054] Driving force F. Detailed Implementation
[0055] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0056] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0057] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0058] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0059] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0060] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0061] In one embodiment of the related technology, such as Figure 1 and Figure 2As shown, on the test stage 1000, a dummy finger structure 100 is used to simulate the surface of the fingerprint module 200 for testing. A flexible circuit board 300 is connected to the fingerprint module 200 to jointly complete the testing process. The testing process includes, in sequence, power-on testing, placing the dummy finger structure 100 and continuing testing, lifting the dummy finger structure 100 and continuing testing, and finally, testing completion. Generally, the fingerprint module 200 is about 150μm thick, relatively thin, and lightweight. When the dummy finger structure 100 is lifted, due to the adhesion between the dummy finger structure 100 and the surface of the fingerprint module 200, the dummy finger structure 100 can easily lift the fingerprint module 200, preventing the fingerprint module 200 from naturally separating from the dummy finger structure 100. This affects the fingerprint module 200's ability to write the collected signals into its chip.
[0062] In another embodiment of the related technology, such as Figure 3 As shown, a fixing fixture (not shown in the figure), such as a steel sheet, is added to the flexible circuit board 300 to block the flexible circuit board 300. However, during the test, when the fake finger structure 100 is lifted, the fake finger structure 100 and the fingerprint module 200 cannot be separated smoothly because there is still an adhesion between them. The side of the fingerprint module 200 closest to the flexible circuit board 300 is torn by the flexible circuit board 300, and there is a risk of the fingerprint module 200 breaking.
[0063] Based on this, the embodiments of this application provide a simulation test structure and test device to enable the fingerprint module to successfully complete the test process while reducing the risk of fingerprint module breakage.
[0064] See Figures 4 to 7 , Figure 4 A schematic diagram of the simulation test structure in one embodiment of this application is shown. Figure 5 A schematic diagram of the simulation test structure in another embodiment of this application is shown. Figure 6 It shows Figure 4 The simulation test structure is shown in the test diagram on the fingerprint module. Figure 7 It shows Figure 4 A schematic diagram of the lifting process of the simulation test structure. In the diagram, the first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other.
[0065] An embodiment of this application provides a simulation test structure 10 for testing a fingerprint module 200. The simulation test structure 10 includes a test body 11 and an operating element 12 connected to each other. The test body 11 has a first surface 11a and a second surface 12b disposed opposite to each other along a first direction D1. The first surface 11a is used to adhere to the fingerprint module 200. A stress relief structure Q is provided on the second surface 12b. Along the first direction D1, the size of the stress relief structure Q is smaller than the size of the test body 11.
[0066] The fingerprint module 200 is a sensor used to collect user fingerprint information. In this embodiment, the fingerprint module 200 includes, but is not limited to, ultrasonic fingerprint modules, capacitive fingerprint modules, and optical fingerprint modules. For example, the planar shape of the fingerprint module 200 can be rectangular. For instance, the fingerprint module 200 may have a small size of 8mm*8mm and a large size of 20mm*30mm. During testing, compared to the 8mm*8mm small fingerprint module 200, the 20mm*30mm large fingerprint module 200 has a greater adhesion to the simulation test structure 10. That is, the larger the planar size of the fingerprint module 200, the greater its adhesion to the simulation test structure 10, and naturally, the more difficult it is to separate.
[0067] The test body 11 is a structure used to simulate a user's fingerprint information. The planar shape of the test body 11 can be rectangular, circular, or elliptical, and can be specifically set according to actual needs; this application embodiment does not impose specific limitations on this. The thickness of the test body 11 is generally 8mm to 10mm, as long as it meets the testing requirements. In some embodiments, the test body 11 can be made of an elastic material such as rubber, so that when the operating member 12 is lifted, the side of the test body 11 near the operating member 12 can undergo slight bending deformation, facilitating separation from the fingerprint module 200, and reducing the risk of fragmentation of the fingerprint module 200 during the flexible separation process of the test body 11. The operating member 12 is a component used to lift one side of the structure of the test body 11. The operating member 12 can also be made of an elastic material such as rubber. The shape and size of the operating member 12 are not limited, as long as they meet the requirements of the lifting operation.
[0068] The test body 11 has a first surface 11a and a second surface 12b disposed opposite to each other along a first direction D1. The first surface 11a is used to adhere to the fingerprint module 200. The first direction D1 may refer to the thickness direction of the test body 11. The first surface 11a has simulated patterns, i.e., simulated fingerprints. These simulated fingerprints can be diagonal patterns, arc patterns, or ring patterns, etc., as long as they can simulate the user's fingerprint information.
[0069] The stress relief structure Q refers to a structure used to release stress. It can be understood that the stress relief structure Q can be constructed as a weak structure. This weak structure can be a gap, opening, or groove, such that the two parts of the test body 11 located on either side of the stress relief structure Q are at least partially separated from each other. Thus, when stress is transmitted from one part of the test body 11 to the other, it is blocked by the stress relief structure Q. That is, the stress transmission path can be roughly considered as at least a portion of the stress being transmitted sequentially through one part, the stress relief structure Q, and then to the other part. Because the stress relief structure Q is a weak structure, at least a portion of the stress is more easily transmitted to the stress relief structure Q and released through it, thereby weakening the stress reaching the other part. In other words, when the operating member 12 is lifted, the stress accumulated inside the test body 11 can be released by the stress relief structure Q, and the side of the test body closest to the operating member 12 can be easily lifted to separate it from the fingerprint module 200.
[0070] It is understood that, along the first direction D1, the size of the stress relief structure Q is smaller than the size of the test body 11, that is, the thickness of the stress relief structure Q is smaller than the thickness of the test body 11, so the stress relief structure Q does not penetrate the test body 11. In this way, the two parts of the test body 11 on both sides of the stress relief structure Q are connected to each other. When the driving force F applied to the operating member 12 lifts one part, the driving force F can be transmitted to the other part, allowing the other part to also be lifted.
[0071] Specifically, the fingerprint module 200 and the flexible circuit board 300 are connected and placed together on the test stage 1000 for power-on testing. Then, the simulated test structure 10 is placed on the surface of the fingerprint module 200 for further testing. Next, a driving force F is applied to the operating member 12, which lifts one side of the test body 11. Then, a driving force F is applied to the test body 11 to move the entire simulated test structure 10 upwards to completely separate it from the fingerprint module 200, allowing the fingerprint module 200 to continue testing until the test is completed. It should be noted that the flexible circuit board 300 and the fingerprint module 200 can be packaged using, for example, a chip-on-film (COF) packaging method.
[0072] In this embodiment, the simulation test structure 10 includes at least a test body 11 and an operating component 12 connected to each other. The simulation test structure 10 can perform simulation testing on the fingerprint module 200 using the first surface 11a on the test body 11. The simulation test structure 10 is placed on the fingerprint module 200. After the fingerprint module 200 completes the acquisition of simulation information on the first surface 11a, a driving force F is applied to the operating component 12. Due to the stress relief structure Q on the second surface 12b of the test body 11, the first surface 11a can be smoothly separated from the fingerprint module 200 in the part near the operating component 12. Then, the driving force F is applied to the test body 11 to move the entire simulation test structure 10 upward to completely separate it from the fingerprint module 200. This facilitates the fingerprint module 200 in successfully completing the testing process.
[0073] Compared to related technologies, where using a fixing fixture to block the flexible circuit board 300 poses a risk of fingerprint module 200 breaking during the lifting of the prosthetic finger structure 100, this embodiment of the application provides a stress relief structure Q on the second surface 12b of the test body 11. By lifting the operating member 12, the stress accumulated inside the test body 11 is released by the stress relief structure Q, allowing the side of the test body 11 near the operating member 12 to be smoothly separated from the fingerprint module 200. This allows the simulation test structure 10 to be moved upward as a whole to separate from the fingerprint module 200, thus reducing the risk of fingerprint module 200 breaking.
[0074] In some embodiments, the stress relief structure Q is constructed as a groove. Specifically, the groove is formed on the second surface 12b of the test body 11, and the structure of the groove is such that when the operating member 12 is lifted, the groove can release the stress inside the test body 11, so that the side of the test body 11 near the operating member 12 can be smoothly separated from the fingerprint module 200.
[0075] Please continue reading 4 and... Figure 5 Furthermore, the cross-sectional shape of the stress relief structure Q along its extension direction includes a triangle, a semicircle, or a trapezoid. Specifically, the cross-sectional shape of the groove along its extension direction can be triangular, semicircular, trapezoidal, or other shapes; that is, the shape of the groove can be a triangular prism, a semi-cylinder, a trapezoidal prism, or other prism shapes, as long as it can release the stress inside the test body 11. Figure 4 For example, the case where the cross-sectional shape of the stress-relieving structure Q along its extension direction is triangular is illustrated. Figure 5 For example, the illustration shows a case where the cross-sectional shape of the stress relief structure Q along its extension direction is semi-circular. This allows for flexible configuration based on usage requirements, and the embodiments in this application do not impose specific limitations on this.
[0076] Please continue reading. Figure 4 , Figure 7 and Figure 8 In some embodiments, the stress relief structure Q has a head end Q1 and an end end Q2. The direction in which the head end Q1 points to the end end Q2 intersects the direction in which the test body 11 points to the operating member 12. Both the direction in which the head end Q1 points to the end end Q2 and the direction in which the test body 11 points to the operating member 12 are perpendicular to the first direction D1.
[0077] For example, the stress relief structure Q is constructed as a groove with a head end Q1 and an end end Q2. The direction from the head end Q1 to the end end Q2 is angled or perpendicular to the direction from the test body 11 to the operating member 12 (i.e., the third direction D3 in the figure). In other words, the extension direction of the groove intersects with the direction from the test body 11 to the operating member 12. Thus, by providing a driving force F to the operating member 12, the operating member 12 is lifted upward. Since the operating member 12 is connected to the test body 11, stress accumulates inside the test body 11. The groove in the aforementioned extension direction can release at least part of the stress inside the test body 11, allowing the side of the test body 11 near the operating member 12 to be easily separated from the fingerprint module 200.
[0078] Furthermore, the direction in which the first end Q1 points to the last end Q2 is perpendicular to the direction in which the test body 11 points to the operating member 12. For example, the extension direction of the groove is perpendicular to the direction in which the test body 11 points to the operating member 12. This allows most of the stress accumulated inside the test body 11 to be released during the lifting of the operating member 12, maximizing the stress-relieving effect of the groove.
[0079] Please continue reading. Figure 4 and combined Figure 7 and Figure 8 In some embodiments, the test body 11 has a first side surface 11c and a second side surface 11d disposed opposite each other along a second direction D2. A straight line passing through the first end Q1 and the last end Q2 is defined as a reference line L, which passes through the first side surface 11c and the second side surface 11d. The first direction D1, the second direction D2, and the direction of the test body 11 pointing towards the operating member 12 are perpendicular to each other.
[0080] Furthermore, the first end Q1 intersects with the first side 11c. And / or, the last end Q2 intersects with the second side 11d.
[0081] For example, if the planar shape of the test body 11 is rectangular, it can be assumed that the direction of the test body 11 pointing towards the operating member 12 is the length direction of the test body 11, and the second direction D2 is parallel to the width direction of the test body 11. Two surfaces arranged opposite each other along the width direction of the test body 11 are the first side surface 11c and the second side surface 11d. The reference line L passes through the beginning Q1 and the end Q2 of the groove, and also passes through the first side surface 11c and the second side surface 11d. The extension direction of the reference line L can be parallel to or intersect with the second direction D2, which indirectly indicates that the extension direction of the groove intersects with the first side surface 11c and the second side surface 11d, respectively. Further, the beginning Q1 of the groove intersects with the first side surface 11c, and the end Q2 of the groove intersects with the second side surface 11d. Alternatively, the beginning Q1 of the groove intersects with the first side surface 11c, and the end Q2 of the groove does not intersect with the second side surface 11d. Alternatively, the beginning Q1 of the groove does not intersect with the first side surface 11c, and the end Q2 of the groove intersects with the second side surface 11d. Thus, during the lifting of the operating member 12, the groove can release the stress inside the test body 11 near the first side 11c and / or the second side 11d, so that the part of the test body 11 near the operating member 12 and near the first side 11c and / or the second side 11d can be smoothly separated from the fingerprint module 200.
[0082] In some embodiments, the stress relief structure Q has a first end Q1 and a second end Q2. The stress relief structure Q extends along a straight line between the first end Q1 and the second end Q2. Alternatively, the stress relief structure Q extends along a curve between the first end Q1 and the second end Q2. Or, the stress relief structure Q extends along a broken line between the first end Q1 and the second end Q2.
[0083] For example, the stress relief structure Q is constructed as a groove. The structure between the first end Q1 and the last end Q2 of the groove can be a straight structure, a wave-like curved structure, or a zigzag-like bent structure. In this way, the stress relief structure Q can have the function of stress relief.
[0084] Please continue reading. Figure 8 and combined Figure 9 and Figure 10 In some embodiments, the stress relief structure Q is continuously arranged along the extension direction of the stress relief structure Q. Alternatively, the stress relief structure Q is intermittently arranged along the extension direction of the stress relief structure Q.
[0085] For example, the stress relief structure Q is constructed as a groove. The extension direction of the groove can be continuous or discontinuous, as long as the farthest two ends of the groove can intersect with the first side 11c and the second side 11d.
[0086] Please continue reading. Figure 4 and Figure 7 In some embodiments, along the direction from the test body 11 to the operating member 12, the test body 11 has a first end M1 and a second end M2 disposed opposite to each other, the first end M1 being connected to the operating member 12. The stress relief structure Q is closer to the first end M1.
[0087] Specifically, if the planar shape of the test body 11 is rectangular, it can be assumed that the direction of the test body 11 pointing towards the operating member 12 is the length direction of the test body 11, and the two ends arranged opposite each other along the length direction of the test body 11 are the first end M1 and the second end M2, respectively. The first end M1 and the second end M2 can both refer to a complete end face or a partial end face. The stress relief structure Q is positioned close to the first end M1. In this way, during the process of lifting the operating member 12, the stress relief structure Q releases the stress inside the test body 11 near the first end M1, allowing the first end M1 of the test body 11 to be smoothly separated from the fingerprint module 200.
[0088] Please continue reading. Figure 4 Furthermore, a reference surface SS is defined, and the direction from the test body 11 to the operating member 12 is perpendicular to the reference surface SS. Along the direction from the test body 11 to the operating member 12, the two opposite edges of the stress relief structure Q on the second surface 12b are each equidistant from the reference surface SS by a maximum distance. The ratio between the maximum distance of the first end M1 from the reference surface SS and the maximum distance of the second end M2 from the reference surface SS is 0.2 to 0.25.
[0089] For example, the stress relief structure Q is constructed as a groove. If the planar shape of the test body 11 is rectangular, the direction of the test body 11 pointing towards the operating member 12 can be considered as the length direction of the test body 11. Along the length direction of the test body 11, if the groove is symmetrically arranged about the reference surface ss, then the two opposite edges of the groove on the second surface 12b have equal dimensions to the reference surface ss. Further, if both the first end M1 and the second end M2 are constructed as planes, then the ratio between the dimension of the first end M1 from the reference surface ss (i.e., the first dimension S1) and the dimension of the second end M2 from the reference surface ss (i.e., the second dimension S2) is set to 0.2, 0.22, 0.24, or 0.25, which can be specifically set according to actual needs. If the groove is not symmetrically arranged about the reference surface ss, then the maximum dimension of the two opposite edges of the groove on the second surface 12b from the reference surface ss is equal, thereby defining the reference surface ss. Furthermore, if the first end M1 and / or the second end M2 are constructed as curved surfaces, the ratio between the maximum distance of the first end M1 from the reference surface ss (i.e., the first dimension S1) and the maximum distance of the second end M2 from the reference surface ss (i.e., the second dimension S2) is set to 0.2, 0.22, 0.24, or 0.25, which can be specifically set according to actual needs. In this way, the stress relief structure Q is brought closer to the first end M1, and the first end M1 of the test body 11 can be smoothly separated from the fingerprint module 200 under the lifting operation of the operating member 12.
[0090] In some embodiments, the first surface 11a can cover the surface of the fingerprint module 200 that is in contact with the simulation test structure 10. Specifically, the first surface 11a of the simulation test structure 10 can cover the surface of the fingerprint module 200 to be tested. In this way, the surface of the fingerprint module 200 to be tested can be fully tested.
[0091] Please continue reading. Figure 7 Based on the same inventive concept, this application also provides a testing apparatus, including a simulation testing structure 10 as described in any previous embodiment. Specifically, the testing structure further includes a testing platform 1000 and a driving mechanism. The testing platform 1000 is used to support the fingerprint module 200, the flexible circuit board 300, and the simulation testing structure 10, and the driving mechanism is used to provide a driving force F to the simulation testing structure 10.
[0092] In summary, the simulation test structure 10 of this embodiment includes at least a test body 11 and an operating component 12 connected to each other. The simulation test structure 10 can perform simulation testing on the fingerprint module 200 using the first surface 11a on the test body 11. The simulation test structure 10 is placed on the fingerprint module 200. After the fingerprint module 200 completes the acquisition of simulation information on the first surface 11a, a driving force F is applied to the operating component 12. Due to the stress relief structure Q on the second surface 12b of the test body 11, the first surface 11a can be smoothly separated from the fingerprint module 200 in the portion near the operating component 12. Then, the driving force F is applied to the test body 11, moving the entire simulation test structure 10 upwards to completely separate it from the fingerprint module 200. This facilitates the fingerprint module 200 in successfully completing the testing process. Furthermore, the stress relief structure Q can be constructed as a groove, with the extension direction of the groove intersecting the direction of the test body 11 pointing towards the operating member 12. In this way, the groove can have the function of releasing stress. During the process of lifting the operating member 12, the groove can release the stress accumulated in the test body 11, so that the side of the test body 11 close to the operating member 12 can be smoothly separated from the fingerprint module 200.
[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A simulation test structure for testing a fingerprint module, characterized in that, The simulation test structure includes: The test body has a first surface and a second surface disposed opposite to each other along a first direction, the first surface being used to adhere to the fingerprint module; and The operating component is connected to the test body; The second surface is provided with a stress relief structure; Along the first direction, the size of the stress relief structure is smaller than the size of the test body; The stress relief structure is constructed as a groove.
2. The simulation test structure according to claim 1, characterized in that, The cross-sectional shape of the stress relief structure along its extension direction includes a triangle, a semicircle, or a trapezoid.
3. The simulation test structure according to claim 1 or 2, characterized in that, The stress relief structure has a head end and an end end; The direction from the first end to the last end intersects with the direction from the test body to the operating element; both the direction from the first end to the last end and the direction from the test body to the operating element are perpendicular to the first direction.
4. The simulation test structure according to claim 3, characterized in that, The direction from the first end to the last end is perpendicular to the direction from the test body to the operating element.
5. The simulation test structure according to claim 3, characterized in that, The test body has a first side and a second side that are arranged opposite to each other along a second direction; A straight line passing through the first end and the last end is defined as a reference line, and the reference line passes through the first side and the second side; The first direction, the second direction, and the direction in which the test body points to the operating element are perpendicular to each other.
6. The simulation test structure according to claim 5, characterized in that, The first end intersects with the first side; and / or The end intersects with the second side.
7. The simulation test structure according to claim 1 or 2, characterized in that, The stress relief structure has a head end and an end end; Wherein, the stress relief structure extends in a straight line between the first end and the last end; or The stress relief structure is provided to extend along a curve between the first end and the last end; or The stress relief structure extends along a zigzag line between the first end and the last end.
8. The simulation test structure according to claim 1 or 2, characterized in that, The stress relief structure is continuously arranged along the extension direction of the stress relief structure; or The stress relief structure is intermittently arranged along the extension direction of the stress relief structure.
9. The simulation test structure according to claim 1 or 2, characterized in that, Along the direction from the test body to the operating element, the test body has a first end and a second end that are disposed opposite to each other, and the first end is connected to the operating element; The stress relief structure is closer to the first end.
10. The simulation test structure according to claim 1 or 2, characterized in that, The first surface can cover the surface of the fingerprint module used to fit with the simulation test structure.
11. The simulation test structure according to claim 1 or 2, characterized in that, The first surface has a simulated texture.
12. The simulation test structure according to claim 1 or 2, characterized in that, The test body is made of elastic material.
13. A testing device, characterized in that, Includes the simulation test structure as described in any one of claims 1-11.