Hemispherical resonator force flow variable polishing apparatus and force flow variable polishing method

Abstract

The hemispherical resonator force flow rheological polishing device comprises a rack; a material tank module, a workpiece clamping driving polishing module, a polishing tool module, a flow guide module and a feeding module are correspondingly arranged on the rack; the material tank module comprises a horizontal material tank for containing force flow rheological polishing liquid, and the polishing tool module comprises an outer spherical surface polishing tool and an inner spherical surface polishing tool; the flow guide module comprises a fixed scraper, and during polishing, the force flow rheological polishing liquid is guided into the polishing tool module. The hemispherical resonator force flow rheological polishing device can perform efficient, high-quality and low-cost force flow rheological polishing processing on a hemispherical resonator. Correspondingly, the application also provides a method for performing force flow rheological polishing processing on a hemispherical resonator by using the polishing device. The method has high polishing efficiency, the surface quality of the workpiece after polishing is good, and the cost of the polishing device and the polishing liquid is relatively low, so that the production cost of the hemispherical resonator can be greatly reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of precision and ultra-precision machining, and particularly relates to a hemispherical resonator force rheological polishing device and method. BACKGROUND

[0002] The hemispherical resonator gyro is a new type of inertial gyro that appeared in the 1960s, and has the advantages of simple structure, high precision and low power consumption, and has broad application prospects in the new generation of long-life satellite inertial systems. The hemispherical resonator is the core part of the hemispherical resonator gyro, and the machining precision and quality of the hemispherical resonator directly restrict the performance of the gyro device and system. The hemispherical resonator is a special-shaped part, and its main structure is a small-size thin-walled hemispherical shell with a center support rod. The material is high-melting quartz glass, which is processed by cutting, grinding and precision machining. The specific service environment and working principle have very high requirements for the surface quality and shape and position precision of the hemispherical resonator, and the high hardness and brittleness of the material, the thin-walled characteristics of the structure and the inner surface sphere all bring great challenges to the high-efficiency and high-quality polishing of the hemispherical resonator.

[0003] At present, the polishing methods for complex surfaces mainly include abrasive jet polishing, magnetorheological finishing, ion beam polishing, airbag polishing, and force rheological polishing. Abrasive flow polishing is to repeatedly pass through the workpiece surface under pressure by viscoelastic body carrying abrasive to achieve polishing processing, but it needs a complex abrasive flow driving system and has low polishing efficiency. The principle of magnetorheological finishing (MRF) is to add polishing powder to the magnetorheological fluid (usually a suspension composed of magnetic particles, base fluid and stabilizer), and through the action of high-strength magnetic field, the characteristics of the magnetorheological fluid change sharply, showing the properties of a solid, so as to achieve the purpose of removing trace materials. However, the processing medium (magnetic abrasive particles, magnetic suspension and magnetorheological fluid) of magnetorheological finishing technology is relatively complex to make, and the use cost is high, and the processing equipment needs a relatively complex magnetic auxiliary device, which restricts the application of this processing method. Ion beam polishing is based on the principle of ion beam sputtering to achieve material removal. Ion beam polishing, like MRF, has the advantages of high processing precision and good material removal, and has the advantages of no stress and non-contact, which is especially suitable for super-precision polishing of complex surfaces. However, due to the high precision requirement of the equipment, the cost is high. The principle of airbag polishing is that the spherical polishing tool airbag is elastic after inflation, which can adapt to the curvature shape of the workpiece surface, so it can also be used for super-precision polishing of complex surfaces. However, for hemispherical resonator polishing, it is difficult for the airbag to contact the inside of the hemispherical resonator due to the small size and complex structure of the hemispherical resonator. In addition, the hemispherical resonator is easy to break, and the direct contact of the airbag is easy to cause the breakage of the hemispherical resonator, resulting in processing failure, thus restricting the application of airbag polishing in this regard. Force rheological polishing utilizes the shear thickening effect of non-Newtonian fluid to form a rheological layer of flexible holding abrasive on the surface to be polished under the action of shear stress, which can realize high-efficiency and high-quality polishing of the workpiece surface, and has the advantage of low cost. However, there is currently no force rheological polishing equipment that can be used for resonator polishing.

[0004] At present, the polishing method for hemispherical resonators still mainly relies on manual polishing. Not only does it require high technical requirements for the processing personnel, but also requires years of polishing experience to make the roughness and roundness of the polished quartz resonator meet the design requirements. In addition, due to the material properties and structural characteristics of the hemispherical resonator, it is easy to break, so the loss rate during manual polishing is extremely high. In addition, the time required for resonator manual polishing is as long as 1 week, resulting in high price of hemispherical resonators. SUMMARY

[0005] In view of the above deficiencies of the prior art, the present application proposes a hemispherical resonator force rheological polishing device. The hemispherical resonator force rheological polishing device of the present application can perform efficient, high-quality and low-cost force rheological polishing processing on a hemispherical resonator. Correspondingly, the present application also provides a method for performing force rheological polishing processing on a hemispherical resonator using the polishing device of the present application.

[0006] For the polishing device, the present application provides the following technical solutions:

[0007] The hemispherical resonator force rheological polishing device comprises a rack; a material tank module, a workpiece clamping and driving polishing module, a polishing tool module, a flow guide module and a feeding module are correspondingly arranged on the rack; the material tank module comprises a horizontal material tank for containing force rheological polishing liquid, and the horizontal material tank can be driven to rotate by a material tank driving motor; the workpiece clamping and driving polishing module comprises a workpiece clamp and a workpiece driving motor in transmission connection with the workpiece clamp, and the hemispherical resonator can be driven to rotate by the workpiece driving motor after being clamped on the workpiece clamp; the polishing tool module comprises an outer spherical surface polishing tool and an inner spherical surface polishing tool arranged in opposition; the outer spherical surface polishing tool is fixedly arranged in front of the workpiece clamp, the outer spherical surface polishing tool is provided with a hemispherical groove capable of accommodating an outer spherical surface of the hemispherical resonator, and a clearance hole is arranged at the bottom of the groove so that a center support rod of the hemispherical resonator can pass through the clearance hole and be clamped by the workpiece clamp, an A feeding port and an A discharging port are respectively arranged at the top and the side of the outer spherical surface polishing tool; the inner spherical surface polishing tool is provided with a hemispherical head, and a passage hole is arranged at the top of the hemispherical head to discharge the polishing liquid; after the inner spherical surface polishing tool and the outer spherical surface polishing tool are closed, the center support rod of the hemispherical resonator is inserted into the passage hole; the top of the inner spherical surface polishing tool is provided with a B feeding port, and a feeding cutout is correspondingly arranged on the hemispherical head to form a feeding flow channel; the flow guide module comprises a fixedly arranged scraper, and during polishing, the scraper can guide the force rheological polishing liquid attached to the upper part of the horizontal material tank to enter the polishing tool module; the inner spherical surface polishing tool is fixedly arranged below the scraper; the feeding module can drive the workpiece clamping and driving polishing module and the outer spherical surface polishing tool to move forward as a whole so that the outer spherical surface polishing tool is closed with the inner spherical surface polishing tool, or move backward as a whole to exit.

[0008] Compared with the prior art, the force flow variable polishing device of the application has a corresponding trough module, a workpiece clamping and driving polishing module, a polishing tool module, a flow guiding module and a feeding module, wherein the trough module is used to bring the force flow variable polishing liquid to the upper part of the horizontal trough, the workpiece clamping and driving polishing module is used to clamp and drive the rotation of the hemispherical resonator, the flow guiding module is used to scrape the force flow variable polishing liquid from the upper part of the horizontal trough and guide it to the inside of the polishing tool, and the structure of the polishing tool module enables the rotating hemispherical resonator to cause the force flow variable polishing liquid inside it to produce a shear thickening effect, form a flexible fixed mold, and realize high-efficiency and high-quality polishing processing of the outer and inner spherical surfaces of the hemispherical resonator. Moreover, the rotating hemispherical resonator causes the polishing liquid inside the polishing tool to form a flow field, continuously flows out, and enables the polishing liquid on the scraper to smoothly flow in to achieve replacement, thereby avoiding the performance decline or even failure of the force flow variable polishing liquid in the processing area due to excessively high temperature. The polishing liquid inlet on the polishing tool is arranged at the top and has a height difference with the outlet, so that the siphon effect can be generated during polishing, which is beneficial to the discharge of the polishing liquid at the bottom of the polishing tool and can accelerate the flow of the polishing liquid to a certain extent. The feeding module is used to drive the workpiece clamping and driving polishing module and the outer spherical surface polishing tool as a whole to feed forward to make the outer spherical surface polishing tool engage with the inner spherical surface polishing tool, or move backward to withdraw, thereby facilitating the clamping and dismounting of the workpiece. The combination of the modules forms a whole, so that the force flow variable polishing processing of the hemispherical resonator can be continuously performed. In addition, the device has high polishing efficiency, is easy to manufacture, has relatively low cost, and the force flow variable polishing liquid required for polishing has good economy compared with other polishing liquids, so that the economic cost of the resonator polishing processing can be greatly reduced.

[0009] As an optimization, in the aforementioned hemispherical resonator force flow variable polishing device, the side of the inner spherical surface polishing tool is provided with a B discharge port, and a discharge flow channel is formed by the corresponding discharge cutout on the hemispherical head. In this way, the force flow variable polishing liquid inside the hemispherical resonator can be discharged from the two places of the passage hole and the discharge flow channel, so that the force flow variable polishing liquid at the processing site is more easily discharged, and the performance decline of the polishing liquid caused by poor flow in the local part is avoided.

[0010] As an optimization, in the aforementioned hemispherical resonator force flow variable polishing device, the inside of the scraper is provided with a cooling water flow channel, and the two ends of the cooling water flow channel are respectively communicated with a water inlet joint and a water outlet joint arranged on the scraper. In this way, cooling water can be introduced into the cooling water flow channel during polishing to cool the force flow variable polishing liquid and maintain the stable performance of the force flow variable polishing liquid. Further, the water inlet joint and the water outlet joint are respectively communicated with the water outlet and the backwater outlet of the water cooler through pipelines. By providing the water cooler, the user can avoid the trouble of building a water cooling system when cooling the polishing liquid.

[0011] As an optimization, in the aforementioned hemispherical resonator force rheological polishing device, the horizontal tank is in a cylindrical tube shape, and the axis thereof is inclined relative to the horizontal plane so that the polishing liquid on the tank bottom does not flow out.

[0012] As an optimization, in the aforementioned hemispherical resonator force rheological polishing device, the feeding module can be an electric screw rod module. The electric screw rod module has high reliability and is easy to implement.

[0013] As an optimization, in the aforementioned hemispherical resonator force rheological polishing device, the workpiece holder is arranged at the front end of the driving spindle, and the driving spindle is connected to the rotating shaft of the workpiece driving motor. This structure has good reliability and is easy to implement.

[0014] For the method, the present application provides the following technical solutions:

[0015] A hemispherical resonator force rheological polishing method, which is implemented on the aforementioned force rheological polishing device of the present application, and includes the following steps:

[0016] A. Configuring a force rheological polishing liquid and pouring it into the horizontal tank;

[0017] B. Clamping the hemispherical resonator to be polished on the workpiece holder;

[0018] C. Starting the tank driving motor to drive the horizontal tank to rotate, and the force rheological polishing liquid is attached to the inner wall of the horizontal tank due to its viscosity, and is brought to the upper part of the horizontal tank;

[0019] D. The feeding module drives the workpiece holder to feed the polishing module and the outer spherical surface polishing tool as a whole forward until the outer spherical surface polishing tool and the inner spherical surface polishing tool are engaged; the scraper makes the force rheological polishing liquid flow into the outer spherical surface polishing tool and the inner spherical surface polishing tool from the A feeding port and the B feeding port;

[0020] E. Starting the workpiece driving motor to drive the hemispherical resonator to rotate; there is relative motion between the hemispherical resonator and the force rheological polishing liquid, so that there is a certain relative shear strain rate between them. The contact area between the force rheological polishing liquid and the hemispherical resonator generates shear thickening phenomenon due to the action of shear stress, forming a flexible "fixed abrasive tool", which rapidly polishes the outer spherical surface and the inner spherical surface of the hemispherical resonator; at the same time, the force rheological polishing liquid forms a flow field under the driving of the hemispherical resonator, so that the force rheological polishing liquid in the polishing area is timely discharged, realizing replacement.

[0021] Compared with the prior art, the method of the present application adopts the aforementioned hemispherical resonator force rheological polishing device to simultaneously perform force rheological polishing on the outer spherical surface and the inner spherical surface of the hemispherical resonator, has high polishing efficiency, has good surface quality of the workpiece after polishing, and has relatively low cost of the polishing device and the polishing liquid, so that the production cost of the hemispherical resonator can be greatly reduced.

[0022] As an optimization, in the aforementioned hemispherical resonator force rheological polishing method, the curvature radius of the hemispherical head in the polishing tool module used for machining is 0.5-3 mm smaller than the curvature radius of the inner spherical surface of the hemispherical resonator, and the curvature radius of the hemispherical groove is 0.5-5 mm larger than the curvature radius of the outer spherical surface of the hemispherical resonator. At this time, the force rheological polishing liquid is more conducive to generating a force rheological effect during polishing.

[0023] As an optimization, in the aforementioned hemispherical resonator force rheological polishing method, the force rheological polishing liquid on the scraper is subjected to cooling treatment during machining. In this way, the rheological performance of the force rheological polishing liquid flowing into the polishing tool module can be prevented from being reduced or even lost due to excessively high temperature. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a structural schematic diagram of a hemispherical resonator force rheological polishing device according to an embodiment of the present application;

[0025] Figure 2 is Figure 1 is a schematic diagram of a state of clamping a hemispherical resonator by a hemispherical resonator force rheological polishing device according to an embodiment of the present application (partially sectioned);

[0026] Figure 3 is a structural schematic diagram of a tank module according to an embodiment of the present application;

[0027] Figure 4 is a structural schematic diagram of a workpiece clamping and driving polishing module according to an embodiment of the present application;

[0028] Figure 5 is a structural schematic diagram of a polishing tool module according to an embodiment of the present application (a state of the outer spherical surface polishing tool and the inner spherical surface polishing tool being closed);

[0029] Figure 6 is a structural schematic diagram of an outer spherical surface polishing tool according to an embodiment of the present application;

[0030] Figure 7 is a structural schematic diagram of an inner spherical surface polishing tool according to an embodiment of the present application;

[0031] Figure 8 is a structural schematic diagram of a flow guide module according to an embodiment of the present application;

[0032] Figure 9is the structural schematic diagram of the scraper in the embodiment of the present application (after the bottom plate for sealing is removed, the state of exposing the cooling water flow channel);

[0033] Figure 10 is the processing state schematic diagram of the hemispherical resonator force rheological polishing equipment in the embodiment of the present application;

[0034] Figure 11 is the schematic diagram of the cooperation state of the polishing tool and the workpiece during processing (cross section);

[0035] Figure 12 is the surface roughness of the quartz hemispherical resonator measured by the Taylor roughness meter before processing in the embodiment;

[0036] Figure 13 is the surface roughness of the quartz hemispherical resonator measured by the Taylor roughness meter after processing in the embodiment.

[0037] The figure marks are: 1- rack; 2- trough module, 201- horizontal trough, 202- trough driving motor; 3- workpiece clamping driving polishing module, 301- workpiece holder, 302- workpiece driving motor, 303- driving main shaft; 4- polishing tool module, 401- outer spherical surface polishing tool, 4011- hemispherical groove, 4012- let hole, 4013- A feeding port, 4014- A discharging port, 402- inner spherical surface polishing tool, 4021- hemispherical head, 4022- channel hole, 4023- B feeding port, 4024- B discharging port; 5- drainage module, 501- scraper, 5011- cooling water flow channel, 502- water inlet joint, 503- water outlet joint; 6- feeding module; 7- hemispherical resonator. DETAILED DESCRIPTION

[0038] The present application will be further described below in combination with the drawings and specific embodiments (including examples), but it is not used as the basis for limiting the present application. In the following examples, the contents not described in detail are all the technical common sense in the art.

[0039] Embodiment (see Figures 1-11 ):

[0040] The hemispherical resonator force rheological polishing equipment comprises a rack 1; the rack 1 is correspondingly provided with a trough module 2, a workpiece clamping driving polishing module 3, a polishing tool module 4, a drainage module 5 and a feeding module 6. Each module has its own function, and is used in cooperation, so that the equipment can continuously perform force rheological polishing processing on the outer spherical surface and the inner spherical surface of the hemispherical resonator 7 at the same time.

[0041] In the embodiment, the tank module 2 comprises a horizontal tank 201 for containing the force flowable polishing liquid, and the horizontal tank 201 is driven to rotate by a tank driving motor 202; in a specific embodiment, the tank driving motor 202 is in transmission connection with the horizontal tank 201 through a speed reducer. During polishing, the force flowable polishing liquid is contained in the horizontal tank 201, and due to the viscosity of the force flowable polishing liquid, the force flowable polishing liquid is attached to the wall of the horizontal tank 201 and is brought to the upper part by the rotating horizontal tank 201. During polishing, the rotation speed of the horizontal tank 201 is controlled to achieve the above-mentioned function.

[0042] In the embodiment, the workpiece clamping and driving polishing module 3 comprises a workpiece clamp 301 and a workpiece driving motor 302 in transmission connection with the workpiece clamp 301. During polishing, the hemispherical resonator 7 is clamped on the workpiece clamp 301 and is driven to rotate by the workpiece driving motor 302.

[0043] In the embodiment, the polishing tool module 4 comprises an outer spherical surface polishing tool 401 and an inner spherical surface polishing tool 402 arranged in opposition; the outer spherical surface polishing tool 401 is used for polishing the outer spherical surface of the hemispherical resonator 7, and the inner spherical surface polishing tool 402 is used for polishing the inner spherical surface of the hemispherical resonator 7 to obtain a high-quality surface.

[0044] In the embodiment, the outer spherical surface polishing tool 401 is fixed in front of the workpiece clamp 301, the outer spherical surface polishing tool 401 is provided with a hemispherical groove 4011 capable of accommodating the outer spherical surface of the hemispherical resonator 7, and the groove bottom is provided with a clearance hole 4012 so that the center support rod (outer support rod) of the hemispherical resonator 7 can pass through the clearance hole 4012 and be clamped by the workpiece clamp 301, and the top and side of the outer spherical surface polishing tool 401 are respectively provided with an A feeding port 4013 and an A discharging port 4014.

[0045] In the embodiment, the inner spherical surface polishing tool 402 is provided with a hemispherical head 4021, and the top of the hemispherical head 4021 is provided with a passage hole 4022 for discharging polishing liquid; after the inner spherical surface polishing tool 402 and the outer spherical surface polishing tool 401 are closed, the center support rod (inner support rod) of the hemispherical resonator 7 is inserted into the passage hole 4022; the top of the inner spherical surface polishing tool 402 has a B feeding port 4023, and the hemispherical head 4021 is correspondingly provided with a feeding cutout to form a feeding flow channel.

[0046] In the embodiment, the drainage module 5 comprises a fixed scraper 501, and during polishing, the scraper 501 enables the force flowable polishing liquid attached to the upper part of the horizontal tank 201 to be drained into the polishing tool module 4. During polishing, the scraper 501 scrapes the force flowable polishing liquid brought to the upper part by the horizontal tank 201 and then drains it into the polishing tool.

[0047] In the embodiment, the inner spherical polishing tool 402 is fixed below the scraper 501; the feeding module 6 can drive the workpiece clamping and driving polishing module 3 and the outer spherical polishing tool 401 to feed forward as a whole so that the outer spherical polishing tool 401 is engaged with the inner spherical polishing tool 402, or to move backward as a whole to exit. During polishing, the outer spherical polishing tool 401 is engaged with the inner spherical polishing tool 402, and after polishing, the feeding module 6 drives the workpiece clamping and driving polishing module 3 and the outer spherical polishing tool 401 to exit as a whole, which facilitates the removal of the polished workpiece and the clamping of the next workpiece to be polished.

[0048] In the embodiment, the side of the inner spherical polishing tool 402 is provided with a B discharge port 4024, and a discharge cutout is correspondingly provided on the half-spherical head 4021 to form a discharge flow channel. During polishing, part of the polishing liquid is discharged from the discharge flow channel, thereby avoiding the problem of poor local liquid discharge.

[0049] In the embodiment, the scraper 501 is internally provided with a cooling water flow channel 5011, and the two ends of the cooling water flow channel 5011 are respectively communicated with a water inlet joint 502 and a water outlet joint 503 provided on the scraper 501. During polishing, the polishing liquid on the scraper 501 can be cooled by supplying cooling water into the cooling water flow channel 5011. The water inlet joint 502 and the water outlet joint 503 are respectively communicated with a water outlet and a backwater outlet of a water cooler through pipelines. During polishing, the cooling water of a set temperature can be supplied into the cooling water flow channel 5011 by the water cooler. Of course, cooling is not necessary, and when the ambient temperature is low, cooling treatment can be omitted according to the actual situation.

[0050] In the embodiment, the horizontal tank 201 is in the shape of a cylindrical tube, and its axis is inclined at an angle of 30° with respect to the horizontal plane so that the polishing liquid on the tank bottom does not flow out. In the case of ensuring that the polishing liquid does not flow out, the horizontal tank 201 can be provided in other forms during the implementation of the present application, and equivalent replacement can be performed.

[0051] In the embodiment, the workpiece clamping device 301 is provided at the front end of the driving main shaft 303, and the driving main shaft 303 is connected with the rotating shaft of the workpiece driving motor 302. In the embodiment, the workpiece clamping device 301 is composed of a clamping cylinder and a locking nut. During polishing, the workpiece driving motor 302 transmits power to the half-spherical resonator 7 through the driving main shaft 303, so that the half-spherical resonator 7 rotates.

[0052] In the embodiment, the feeding module 6 is an electric screw rod module, which includes a G5 grade ball screw rod and a 750W servo motor. During use, the electric screw rod module is used to push or withdraw the workpiece clamping and driving polishing module 3 and the outer spherical polishing tool 401.

[0053] In the embodiment, the hemispherical resonator force rheological polishing device is equipped with a controller for controlling the operation of the motors in each module. The working parameters can be set through the controller.

[0054] The method for force rheological polishing of the outer spherical surface and the inner spherical surface of the hemispherical resonator 7 using the hemispherical resonator force rheological polishing device of the embodiment comprises the following steps:

[0055] A. Configure the force rheological polishing liquid and pour it into the horizontal tank 201;

[0056] B. Clamping the hemispherical resonator 7 to be polished on the workpiece holder 301;

[0057] C. Start the tank drive motor 202 to drive the horizontal tank 201 to rotate, and the force rheological polishing liquid is attached to the inner wall of the horizontal tank 201 due to its viscosity, and is brought to the upper part of the horizontal tank 201;

[0058] D. The feed module 6 drives the workpiece holder drive polishing module 3 and the outer spherical surface polishing tool 401 as a whole to feed forward until the outer spherical surface polishing tool 401 and the inner spherical surface polishing tool 402 are engaged; the scraper 501 makes the force rheological polishing liquid flow into the outer spherical surface polishing tool 401 and the inner spherical surface polishing tool 402 from the A feeding port 4012 and the B feeding port 4023;

[0059] E. Start the workpiece drive motor 302 to drive the hemispherical resonator 7 to rotate; there is relative motion between the hemispherical resonator 7 and the force rheological polishing liquid, so there is a certain relative shear strain rate between them, the contact area between the force rheological polishing liquid and the hemispherical resonator 7 produces shear thickening phenomenon due to the action of shear stress, forming a flexible "fixed abrasive tool", polishing the outer spherical surface and the inner spherical surface of the hemispherical resonator 7; at the same time, the force rheological polishing liquid is driven by the hemispherical resonator 7 to form a flow field, so that the force rheological polishing liquid in the polishing area is discharged in time to realize replacement.

[0060] In the embodiment, the curvature radius of the hemispherical head 4021 in the polishing tool module 4 used for processing is 3mm smaller than the curvature radius of the inner spherical surface of the hemispherical resonator 7, and the curvature radius of the hemispherical groove 4011 is 5mm larger than the curvature radius of the outer spherical surface of the hemispherical resonator 7.

[0061] In the embodiment, the force rheological polishing liquid on the scraper 501 is cooled during processing. Specifically, the cooling water provided by the water cooling machine flows through the cooling flow channel inside the scraper 501 to cool the force rheological polishing liquid on the scraper 501.

[0062] In the embodiment, the rotation speed of the hemispherical resonator 7 is 300 rpm, the rotation speed of the horizontal tank 201 is 2 rpm, and the polishing time is 30 min. In the flow-reversible polishing liquid, 15 wt% of 5000# alumina abrasive is contained.

[0063] Through experiments, the hemispherical resonator 7 is polished by the device of the present application, and the roughness of the workpiece can be reduced to within 20 nm within 30 min, which has the characteristics of high polishing efficiency and good polishing quality. In the embodiment, the roughness of the workpiece before and after processing is shown in Figure 12 and Figure 13 After half an hour of processing, the surface roughness Ra of the hemispherical resonator 7 is reduced from 628 nm to 18 nm.

[0064] The general description of the invention involved in the present application and the description of the specific embodiments should not be understood as a limitation on the technical solutions of the invention. Based on the disclosure of the present application, those skilled in the art can add, reduce or combine the disclosed technical features in the general description or / and the specific embodiments (including the embodiments) without violating the elements of the invention involved, to form other technical solutions within the scope of protection of the present application.

Claims

1. A hemispherical resonator force flow rheo- polishing apparatus, characterized by: It comprises a rack (1), a material tank module (2), a workpiece clamping and driving polishing module (3), a polishing tool module (4), a flow guiding module (5) and a feeding module (6) are correspondingly arranged on the rack (1); The material tank module (2) comprises a horizontal material tank (201) for containing the flow-reforming polishing liquid, and the horizontal material tank (201) can be driven to rotate by a material tank driving motor (202); The workpiece clamping and driving polishing module (3) comprises a workpiece clamp (301) and a workpiece driving motor (302) in transmission connection with the workpiece clamp (301), and the hemispherical harmonic oscillator (7) can be driven to rotate by the workpiece driving motor (302) after being clamped on the workpiece clamp (301); The polishing tool module (4) comprises an outer spherical surface polishing tool (401) and an inner spherical surface polishing tool (402) arranged in opposition; The outer spherical surface polishing tool (401) is fixedly arranged in front of the workpiece clamp (301), the outer spherical surface polishing tool (401) is provided with a hemispherical groove (4011) capable of accommodating the outer spherical surface of the hemispherical harmonic oscillator (7), the groove bottom is provided with a clearance hole (4012) so that the center support rod of the hemispherical harmonic oscillator (7) can pass through the clearance hole (4012) and be clamped by the workpiece clamp (301), and the top and side of the outer spherical surface polishing tool (401) are respectively provided with an A feeding port (4013) and an A discharging port (4014); The inner spherical surface polishing tool (402) is provided with a hemispherical head (4021), the top of the hemispherical head (4021) is provided with a passage hole (4022) for discharging polishing liquid, the center support rod of the hemispherical harmonic oscillator (7) is inserted into the passage hole (4022) after the inner spherical surface polishing tool (402) and the outer spherical surface polishing tool (401) are closed, the top of the inner spherical surface polishing tool (402) is provided with a B feeding port (4023), and the hemispherical head (4021) is correspondingly provided with a feeding cutout to form a feeding flow channel; The flow guiding module (5) comprises a fixedly arranged scraper (501), and the scraper (501) can guide the flow-reforming polishing liquid attached to the upper part of the horizontal material tank (201) to enter the polishing tool module (4) during polishing; The inner spherical surface polishing tool (402) is fixedly arranged below the scraper (501), and the feeding module (6) can drive the workpiece clamping and driving polishing module (3) and the outer spherical surface polishing tool (401) to move forward as a whole so that the outer spherical surface polishing tool (401) is closed with the inner spherical surface polishing tool (402), or move backward as a whole to exit.

2. The hemispherical resonator force- rheometer polishing apparatus of claim 1, wherein: The side of the inner spherical surface polishing tool (402) is provided with a B discharging port (4024), and the hemispherical head (4021) is correspondingly provided with a discharging cutout to form a discharging flow channel.

3. The hemispherical resonator force- rheometer polishing apparatus of claim 1, wherein: The scraper (501) is internally provided with a cooling water flow channel (5011), and the two ends of the cooling water flow channel (5011) are respectively in communication with a water inlet connector (502) and a water outlet connector (503) arranged on the scraper (501).

4. The hemispherical resonator force- rheometer polishing apparatus of claim 3, wherein: The water inlet connector (502) and the water outlet connector (503) are respectively in communication with a water outlet and a backwater outlet of a water cooling machine through pipelines.

5. The hemispherical resonator force- rheometer polishing apparatus of claim 1, wherein: The horizontal tank (201) is cylindrical, and its axis is inclined relative to the horizontal plane so that the polishing liquid does not flow out of the tank bottom.

6. The hemispherical resonator force- rheometer polishing apparatus of claim 1, wherein: The workpiece holder (301) is arranged at the front end of a driving spindle (303) connected to the rotating shaft of a workpiece driving motor (302).

7. The hemispherical resonator force- rheometer polishing apparatus of claim 1, wherein: The feeding module (6) is an electric screw module.

8. A hemispherical resonator force flow rheo-polishing method characterized by: The method is implemented on the force flow rheological polishing device of claim 1, and comprises the following steps: A. configuring a force flow rheological polishing liquid and pouring it into the horizontal tank (201); B. clamping the hemispherical resonator (7) to be polished on the workpiece holder (301); C. starting the tank driving motor (202) to drive the horizontal tank (201) to rotate, and the force flow rheological polishing liquid is attached to the inner wall of the horizontal tank (201) due to its viscosity, and is brought to the upper part of the horizontal tank (201); D. the feeding module (6) drives the workpiece holder driving polishing module (3) and the outer spherical surface polishing tool (401) to feed forward as a whole until the outer spherical surface polishing tool (401) is engaged with the inner spherical surface polishing tool (402); the scraper (501) makes the force flow rheological polishing liquid flow from the A feeding port (4013) and the B feeding port (4023) into the outer spherical surface polishing tool (401) and the inner spherical surface polishing tool (402); E. starting the workpiece driving motor (302) to drive the hemispherical resonator (7) to rotate; there is relative motion between the hemispherical resonator (7) and the force flow rheological polishing liquid, so that there is a certain relative shear strain rate between them; the contact area between the force flow rheological polishing liquid and the hemispherical resonator (7) generates shear thickening phenomenon due to the action of shear stress, forming a flexible "fixed abrasive tool", which polishes the outer spherical surface and the inner spherical surface of the hemispherical resonator (7); at the same time, the force flow rheological polishing liquid is driven by the hemispherical resonator (7) to form a flow field, so that the force flow rheological polishing liquid in the polishing area is discharged in time to realize replacement.

9. The hemispherical resonator force- rheometer polishing method of claim 8, wherein: In the polishing tool module (4) used for processing, the radius of curvature of the hemispherical head (4021) is smaller than the radius of curvature of the inner spherical surface of the hemispherical resonator (7) by 0.5-3 mm, and the radius of curvature of the hemispherical groove (4011) is larger than the radius of curvature of the outer spherical surface of the hemispherical resonator (7) by 0.5-5 mm.

10. The hemispherical resonator force- rheometer polishing method of claim 8, wherein: During processing, the force flow rheological polishing liquid on the scraper (501) is cooled.

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