Semiconductor process equipment door opening mechanism

Abstract

This invention provides a door opening mechanism for semiconductor process equipment, including a driving component, a rotating component, a supporting connecting component, a damping buffer component, and a position detection structure. The driving component provides operating power, driving the rotating component to reciprocate circumferentially to adjust the opening and closing state of the door panel. The damping buffer component, corresponding to the rotating component, reduces rigid collisions, lowers noise, and improves machine stability and lifespan. The position detection structure provides timely feedback on the opening and closing state of the door panel, ensuring the safety of wafer transport. Furthermore, by adjusting the limit block, the opening and closing angle of the door panel can be adjusted, improving applicability. It is applicable to single-door or double-door semiconductor process equipment, and the extension and retraction direction of the driving component can include horizontal or vertical extension and retraction, making it widely applicable.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor process equipment and relates to a door opening mechanism for semiconductor process equipment. Background Technology

[0002] Semiconductor processing equipment is a type of machinery used to process wafers to produce wafer products that meet specific requirements. During processing, wafers need to enter and exit the semiconductor processing equipment. To avoid splashes of liquids such as water, acids, and alkalis, or to prevent the release of harmful gases or dust contamination, the doors of the semiconductor processing equipment need to be frequently opened and closed during wafer processing.

[0003] Currently, most door opening mechanisms used in semiconductor process equipment suffer from limitations in their use due to the inability to adjust the door position and range; the opening and closing of the doors can easily cause rigid collisions, resulting in excessive noise, affecting machine stability, and reducing machine lifespan; and they cannot guarantee the safety of wafer transport. Therefore, existing door opening mechanisms for semiconductor process equipment are insufficient to meet application requirements.

[0004] Therefore, it is necessary to provide a door opening mechanism for semiconductor process equipment. Summary of the Invention

[0005] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a door opening mechanism for semiconductor process equipment, which solves the above-mentioned application problems of the door opening mechanism for semiconductor process equipment in the prior art.

[0006] To achieve the above and other related objectives, the present invention provides a semiconductor process equipment door opening mechanism, the semiconductor process equipment door opening mechanism comprising:

[0007] The driving component includes a telescopic part;

[0008] A rotating component, comprising a first connecting end, a second connecting end, a first contact end, and a second contact end, wherein the first connecting end is rotatably connected to the telescopic part;

[0009] A support connector is fixedly connected to the door panel and to the second connection end. The rotating component reciprocates in a circumferential direction under the drive of the telescopic part to adjust the opening and closing state of the door panel.

[0010] A damping buffer is provided corresponding to the first contact end and the second contact end;

[0011] A position detection structure, comprising a correspondingly configured sensor and a sensing element, wherein the sensing element operates synchronously with the door panel.

[0012] Optionally, a limiting block corresponding to the first contact end and the second contact end is further provided.

[0013] Optionally, the limiting block includes a first adjusting limiting block and a second adjusting limiting block. The adjusting direction of the first adjusting limiting block is consistent with the telescopic direction of the telescopic part, and the adjusting direction of the second adjusting limiting block is perpendicular to the telescopic direction of the telescopic part.

[0014] Optionally, the rotating part is in the shape of "up". The first connecting end, the second connecting end, the first contact end and the second contact end are respectively located at the ends of the "up" shape, and the first contact end and the second contact end are respectively located at both ends of the long horizontal line in the "up" shape.

[0015] Optionally, the rotation angle range of the rotating part includes -5° to 95°.

[0016] Optionally, the induction sheet is fixedly connected to the second connecting end. The induction sheet and the rotating part include a split structure or an integrally formed structure.

[0017] Optionally, the driving part includes a single-rod double-acting cylinder.

[0018] Optionally, the telescopic direction of the telescopic part includes telescoping along the horizontal direction or telescoping along the vertical direction.

[0019] Optionally, the door opening mechanism of the semiconductor process equipment is a single-door opening mechanism or a double-door opening mechanism.

[0020] Optionally, the door opening mechanism of the semiconductor process equipment includes a door opening mechanism applied to a semiconductor cleaning tank.

[0021] As described above, the door opening mechanism of the semiconductor process equipment of the present invention includes a driving part, a rotating part, a support connecting part, a damping buffer part and a position detection structure. The driving part provides operating power to drive the rotating part to rotate in a reciprocating circular motion to adjust the opening and closing states of the door panel; the damping buffer part corresponding to the rotating part can reduce rigid collision, reduce noise, improve the stability of the machine platform and increase the service life of the machine platform; through the setting of the position detection structure, the opening and closing states of the door panel can be fed back in time to ensure the safety of wafer transmission; further, through the setting of the adjusting limiting block, the opening and closing angles of the door panel can be adjusted to improve applicability; it can be applied to single-door or double-door semiconductor process equipment, and the telescopic direction of the driving part can include telescoping along the horizontal direction or telescoping along the vertical direction, with a wide range of applications. Description of the Drawings

[0022] Figure 1 It shows a schematic structural diagram of the door opening mechanism of the semiconductor process equipment in the embodiment of the present invention.

[0023] Figure 2 Displayed as Figure 1 A magnified structural diagram of region A in the middle.

[0024] Component designation explanation

[0025] 100-Drive component; 101-Telescopic part; 102-Adjusting nut; 200-Rotating component; 201-First connecting end; 202-Second connecting end; 203-First contact end; 204-Second contact end; 300-Supporting connector; 401-First damping buffer; 402-Second damping buffer; 500-Position detection structure; 501-First sensor; 502-Second sensor; 503-Sensing sheet; 601-First limiting block; 602-Second limiting block; 700-Door panel. Detailed Implementation

[0026] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0027] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0028] like Figure 1 This embodiment provides a semiconductor process equipment door opening mechanism, which includes a driving component 100, a rotating component 200, a supporting connecting component 300, a damping buffer component, and a position detection structure 500.

[0029] The driving component 100 includes a telescopic part 101; the rotating component 200 includes a first connecting end 201, a second connecting end 202, a first contact end 203, and a second contact end 204, wherein the first connecting end 201 is rotatably connected to the telescopic part 101; the supporting connecting component 300 is fixedly connected to the door panel 700, and the supporting connecting component 300 is fixedly connected to the second connecting end 202; the rotating component 200 reciprocates circumferentially under the drive of the telescopic part 101 to adjust the opening and closing state of the door panel 700; the damping buffer is correspondingly arranged with the first contact end 203 and the second contact end 204; the position detection structure 500 includes a correspondingly arranged sensor and a sensing plate 503, and the sensing plate 503 operates synchronously with the door panel 700.

[0030] For details, please refer to Figure 1 and Figure 2 The driving component 100 provides operating power, enabling the telescopic part 101 to extend and retract. Since the rotating component 200 is rotatably connected to the telescopic part 101 via the first connecting end 201, the extension and retraction of the telescopic part 101 will drive the rotating component 200 to rotate. The rotating component 200 then drives the supporting connecting component 300, which is fixedly connected to the second connecting end 202, thereby driving the door panel 700 to rotate, thus achieving opening and closing control of the door panel 700. The damping buffer, namely the first damping buffer 401 contacting the first contact end 203 and the second damping buffer 402 contacting the second contact end 204, can reduce the rotation of the rotating component 200. The rigid collision is reduced to decrease noise, improve machine stability, and increase machine life. The position detection structure 500 includes a first sensor 501, a second sensor 502, and a corresponding sensing element 503. The first sensor 501 and the sensing element 503 can be used to detect whether the door panel 700 is in a closed state, and the second sensor 502 and the sensing element 503 can be used to detect whether the door panel 700 is in an open state. The detection information is transmitted in a timely manner to provide feedback on the opening and closing status of the door panel 700, ensuring the safety of wafer transmission. The information can also be transmitted to a controller (not shown) to facilitate the operation and control of other mechanical structures, improving operational convenience and control accuracy.

[0031] As an example, the telescopic direction of the telescopic part 101 may include telescopic extension or extension along the lateral direction or telescopic extension or extension along the vertical direction.

[0032] For details, please refer to Figure 1 and Figure 2 In this embodiment, the telescopic part 101 extends and retracts vertically, but it is not limited to this. In another embodiment, the telescopic part 101 can also extend and retract horizontally, that is, it can... Figure 1 The semiconductor process equipment door opening mechanism described herein rotates 90° as a whole to be suitable for different semiconductor process equipment and expand the application range.

[0033] As an example, the opening mechanism of the semiconductor process equipment can be a single-door mechanism or a double-door mechanism, and the specific type is not excessively limited here.

[0034] In this embodiment, since the semiconductor process equipment has two door panels 700, the opening mechanism of the semiconductor process equipment adopts a double opening mechanism, that is, it includes two sets of independent opening mechanisms. However, it is not limited to this and can be selected according to the number of door panels 700 corresponding to the semiconductor process equipment.

[0035] As an example, the semiconductor process equipment door opening mechanism includes a door opening mechanism applied to a semiconductor cleaning tank.

[0036] Specifically, the types of semiconductor process equipment are not excessively limited here, and can be selected as needed. In this embodiment, the semiconductor process equipment is only used as an example of a semiconductor cleaning tank, but the types of semiconductor process equipment are not limited to this.

[0037] As an example, a limiting block is also provided that corresponds to the first contact end 203 and the second contact end 204.

[0038] For details, please refer to Figure 1 and Figure 2 In this embodiment, the limiting block includes a first limiting block 601 corresponding to the first contact end 203 and a second limiting block 602 corresponding to the second contact end 204. The first limiting block 601 can limit the first contact end 203. After the first limiting block 601 contacts the first damping buffer 401 and moves slowly, it stops running after encountering the first limiting block 601. Thus, during the entire process of closing the door panel 700, the first contact end 203 can be effectively prevented from having a violent collision, and the door panel 700 can be prevented from rotating excessively.

[0039] Similarly, the second limiting block 602 can limit the second contact end 204. After the second limiting block 602 contacts the second damping buffer 402 and moves slowly, it stops running after encountering the second limiting block 602. Thus, during the entire process of opening the door panel 700, the second contact end 204 can be effectively prevented from violently colliding, and the door panel 700 can be prevented from rotating excessively.

[0040] As an example, the limiting block includes a first adjusting limiting block and a second adjusting limiting block. The adjusting direction of the first adjusting limiting block is consistent with the telescopic direction of the telescopic part 101, and the adjusting direction of the second adjusting limiting block is perpendicular to the telescopic direction of the telescopic part 101.

[0041] For details, please refer to Figure 2, the first limiting block 601 can be used as the first adjusting limiting block. For example, an adjusting bolt can be used. By adjusting the lifting of the bolt, the rotation angle of the rotating member 200 can be adjusted to adjust the rotation angle of the door panel 700; the second limiting block 602 can be used as the second adjusting limiting block. For example, an adjusting bolt with a waist-shaped hole can be used. By adjusting the bolt in the transverse direction, the rotation angle of the rotating member 200 can be adjusted to adjust the rotation angle of the door panel 700.

[0042] Regarding the specific types, installation, etc. of the damping buffer member and the limiting block, no excessive restrictions are imposed here, and they can be selected according to needs.

[0043] As an example, the rotating member 200 can be in the shape of an upside-down "T". The first connection end 201, the second connection end 202, the first contact end 203, and the second contact end 204 are respectively located at the ends of the upside-down "T", and the first contact end 203 and the second contact end 204 are respectively located at both ends of the long horizontal bar in the upside-down "T".

[0044] Specifically, refer to Figure 1 and Figure 2 , in this embodiment, the rotating member 200 adopts an upside-down "T" - shaped rotating member perpendicular in horizontal and vertical directions. By rotating the rotating member 200, the door panel 700 can be switched between 0° and 90° to ensure the full opening and full closing of the door panel 700.

[0045] As an example, the rotation angle range of the rotating member 200 can include - 5° to 95°.

[0046] Specifically, according to needs, the rotation angle of the rotating member 200 can be selected as - 5° to 95°. By adjusting the rotation angle of the rotating member 200 and coordinating with the adjustment of the damping buffer member, the position detection structure 500, and the limiting block, the opening and closing angles of the door panel 700 can be adjusted to ensure the full closing and full opening of the door panel 700.

[0047] As an example, the sensing piece 503 is fixedly connected to the second connection end 202.

[0048] Specifically, in this embodiment, the first sensor 501 and the second sensor 502 are mounted on the mounting fastener, and preferably the first sensor 501 and the second sensor 502 can be adjusted in displacement along the mounting fastener. The sensing plate 503 is mounted on the rotating member 200 and moves with the rotating member 200 to ensure that the rotating member 200 moves synchronously with the door panel 700. Thus, by detecting the sensing plate 503 through the first sensor 501 and the second sensor 502, and through a controller that communicates with the sensors, the opening and closing status of the door panel 700 can be obtained in a timely manner, so as to ensure the security of wafer transmission.

[0049] Regarding the setting of the position detection structure 500, there are no excessive restrictions here. For example, the first sensor 501 and the second sensor 502 can be set on the device housing, and the sensing plate 503 can be set on the support connector 300, so that the sensing plate 503 and the door panel 700 can operate synchronously.

[0050] As an example, the sensing element 503 and the rotating element 200 may include a separate structure or a one-piece structure.

[0051] Specifically, the sensing element 503 can be integrally formed with the rotating component 200 to reduce installation complexity, but it is not limited to this. The sensing element 503 can also be separate from the rotating component 200 to facilitate the adjustment and replacement of components. No excessive restrictions are imposed here.

[0052] As an example, the drive unit 100 may include a single-lever double-acting cylinder.

[0053] Specifically, in this embodiment, the drive component 100 adopts a single-rod double-acting cylinder, which is relatively simple in structure, highly accurate, and easy to operate. However, the type of drive component 100 is not limited to this; it can also be a lifting screw, etc. Furthermore, by adjusting the adjusting nut 102 in the drive component 100, the extension and retraction of the drive component 100 can be fine-tuned to meet application requirements.

[0054] In summary, the semiconductor process equipment door opening mechanism of the present invention includes a driving component, a rotating component, a supporting connecting component, a damping buffer component, and a position detection structure. The driving component provides operating power, driving the rotating component to reciprocate circumferentially to adjust the opening and closing state of the door panel. The damping buffer component, corresponding to the rotating component, reduces rigid collisions, lowers noise, and improves machine stability and lifespan. The position detection structure provides timely feedback on the opening and closing state of the door panel, ensuring the safety of wafer transport. Furthermore, by adjusting the limit block, the opening and closing angle of the door panel can be adjusted, improving applicability. It is applicable to single-door or double-door semiconductor process equipment, and the extension and retraction direction of the driving component can include horizontal or vertical extension and retraction, making it widely applicable.

[0055] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A door opening mechanism for semiconductor process equipment, characterized in that, The door opening mechanism of the semiconductor process equipment includes: A driving member, the driving member includes a telescopic portion; A rotating member, the rotating member includes a first connection end, a second connection end, a first contact end and a second contact end. The first connection end is rotatably connected to the telescopic portion. The rotating member is in the shape of an inverted "T". The first connection end, the second connection end, the first contact end and the second contact end are respectively located at the ends of the inverted "T", and the first contact end and the second contact end are respectively located at both ends of the long horizontal bar in the inverted "T". There are also provided limiting blocks corresponding to the first contact end and the second contact end; A support connecting member, the support connecting member is fixedly connected to the door panel and is also fixedly connected to the second connection end. The rotating member rotates circumferentially and reciprocally under the drive of the telescopic portion to adjust the opening and closing state of the door panel; A damping buffer member, the damping buffer member is provided corresponding to the first contact end and the second contact end; A position detection structure, the position detection structure includes a sensor and an induction piece arranged correspondingly, and the induction piece runs synchronously with the door panel.

2. The semiconductor process equipment door opening mechanism according to claim 1, characterized in that: The limiting blocks include a first adjusting limiting block and a second adjusting limiting block. The adjusting direction of the first adjusting limiting block is the same as the telescopic direction of the telescopic portion, and the adjusting direction of the second adjusting limiting block is perpendicular to the telescopic direction of the telescopic portion.

3. The semiconductor process equipment door opening mechanism according to claim 1, characterized in that: The rotation angle range of the rotating member is -5° to 95°; 4. The semiconductor process equipment door opening mechanism according to claim 1, characterized in that: The induction piece is fixedly connected to the second connection end, and the induction piece and the rotating member include a split structure or an integrally formed structure.

5. The semiconductor process equipment door opening mechanism according to claim 1, characterized in that: The driving member includes a single-rod double-acting cylinder.

6. The semiconductor process equipment door opening mechanism according to claim 1, characterized in that: The telescopic direction of the telescopic portion includes telescoping horizontally or telescoping vertically.

7. The semiconductor process equipment door opening mechanism according to claim 1, characterized in that: The door opening mechanism of the semiconductor process equipment is a single-door mechanism or a double-door mechanism.

8. The semiconductor process equipment door opening mechanism according to claim 1, characterized in that: The door opening mechanism of the semiconductor process equipment includes a door opening mechanism applied to a semiconductor cleaning tank.

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