A heat dissipation device and method for a module

Abstract

The application provides a heat dissipation device and method for a module, which uses a same movable screw to connect a heat dissipation plate, a module and a PCB in series, a supporting block is arranged on the movable screw between the PCB and the module, and the elastic contact between the module and the heat dissipation plate is realized through the elastic force of the abutment of the supporting block by a tower spring on the movable screw, so that the module and the heat dissipation plate can be well connected and fixed when the module is deformed due to the temperature rise in normal operation.

Description

Technical Field

[0001] This invention relates to the field of communication equipment technology, and more specifically, to a heat dissipation device and method for a module. Background Technology

[0002] As communication products continue to evolve, the same spatial capacity demands ever-increasing data exchange capacity, leading to continuous miniaturization of module packaging and ever-increasing transmission rates. Simultaneously, these modules must meet heat dissipation requirements. Currently, common heat dissipation installation methods for modules include: Method 1: Toothed heat sink with elastic clips; Method 2: Springs and screws are installed on the heat sink substrate, and a fixing strip is installed on the PCB, tightened onto the fixing strip by screws; Method 3: Clip-on fixing rods and springs are installed on the heat sink substrate, securing it to the PCB with clips, allowing the heat sink to elastically adhere to the chip.

[0003] Of these three options, Option 1 is limited by the structure; if there are no corresponding hooks on the structure, the clips and the corresponding heatsink cannot be installed. Option 2 is limited by space; the screws for installing the heatsink must extend beyond the module's boundaries. Option 3 is also limited by space. The other three options require the heatsink to be installed only after the module is already fixed in place. When the module structure lacks hooks, and due to the enclosed space, the heatsink cannot extend beyond the module's boundaries, and the module requires additional fixing, none of the three options meet the installation requirements.

[0004] Therefore, overcoming the shortcomings of the existing technology is an urgent problem to be solved in this technical field. Summary of the Invention

[0005] The technical problem to be solved by this invention is that when the module undergoes a certain degree of deformation due to the increase in operating temperature, the heat sink and the module cannot maintain a good fixation.

[0006] Firstly, a heat dissipation device for a module includes a heat sink 1, a module 2, a PCB board 3, a tower spring 4, a movable screw 5, and a support block 6, specifically:

[0007] The support block 6 is fixed on the PCB board 3;

[0008] On the PCB board 3, a first mounting hole 31 is provided at the position of the through hole 62 of the support block 6; wherein, the head of the movable screw 5 is located in the first mounting hole 31, and the head indirectly abuts against the bottom of the support block 6 through the tower spring 4; the module 2 abuts against the upper surface of the support block 6.

[0009] After the movable screw 5 passes through the second mounting hole 21 on the module 2, it is coupled and fixed with the heat sink 1; thereby, the module 2 is fixed after being pressed by the heat sink 1, wherein the pressing force of the heat sink 1 is generated by the movable screw 5 abutting against the support block 6 through the tower spring 4.

[0010] Preferably, the support block 6 includes a cylindrical end 61, a through hole 62, a stepped end 63, and a second threaded hole 64, wherein:

[0011] The cylindrical end 61 is disposed on the upper end of the stepped end 63. The through hole 62 extends from top to bottom through the cylindrical end 61 and the stepped end 63, and is used to insert the screw 51 of the movable screw 5, providing a channel for the up and down movement of the screw 51 of the movable screw 5. The upper surface of the cylindrical end 61 abuts against the lower surface of the module 2, and is used to support the module 2. The lower surface around the through hole 62 of the stepped end 63 abuts against the tower spring 4, and the lower outer surface of the stepped end 63 abuts against the upper surface of the PCB board 3.

[0012] The second threaded hole 64 is disposed on the stepped end 63 and corresponds to the position of the third threaded hole 32 on the PCB board 3. The second threaded hole 64 and the third threaded hole 32 are connected by the first screw to fix the support block 6 on the upper surface of the PCB board 3.

[0013] Preferably, the connector on the lower surface of the module 2 is connected to the connector base on the upper surface of the PCB board 3, while ensuring that the lower surface of the module 2 is in contact with the upper surface of the cylindrical end 61 of the support block 6, thereby realizing the fixed connection between the module 2 and the PCB board 3.

[0014] Preferably, the movable screw 5 passes through the second mounting hole 21 on the module 2 and is then coupled and fixed to the heat sink 1, specifically including:

[0015] The heat sink is provided with a first threaded hole 11, which corresponds to the positions of the first mounting hole 31 and the second mounting hole 21. The thread on the movable screw 5 engages with the thread on the first threaded hole 11 to achieve the connection and fixation between the heat sink and the movable screw 5.

[0016] Preferably, the first threaded hole 11 engages with the thread on the screw 51 of the movable screw 5, specifically including:

[0017] The upper end of the screw 51 of the movable screw 5 is provided with a threaded end 511. The length of the threaded end 511 is a preset length. When the threaded end 511 is engaged with the first threaded hole 11 of the heat sink 1, the threaded end 511 of the preset length is completely inserted into the first threaded hole 11 and engaged with it, which ensures the fixation between the movable screw 5 and the heat sink 1, as well as the up and down movement of the movable screw 5 in the first mounting hole 31 of the module 2 and the through hole 62 of the support block 6.

[0018] Preferably, the connection and fixation between the heat sink and the movable screw 5 specifically includes:

[0019] When the movable screw 5 moves upward in the first mounting hole 31 and the second mounting hole 21, the upper end of the tower spring 4 on the movable screw 5 is subjected to a downward force from the stepped end 63. The tower spring 4 applies a downward elastic force to the nut 52 of the movable screw 5 that abuts at its lower end. As a result, the heat sink 1, which is fixedly connected to the movable screw 5, also undergoes elastic displacement, thus achieving elastic contact between the heat sink 1 and the module 2.

[0020] Preferably, the heat sink 1 further includes:

[0021] The lower surface of the heat sink 1 is provided with a boss, which corresponds to the position of the heat-generating device 22 on the upper surface of the module 2. A heat dissipation spring 12 is provided on the boss for contacting the heat-generating device 22 on the upper surface of the module 2, thereby dissipating heat from the heat dissipation device.

[0022] Preferably, the upper surface of the heat sink 1 is provided with heat dissipation teeth 13, which are used to dissipate the heat exchanged between the heat dissipation spring 12 and the heat-generating device 22.

[0023] Preferably, the protrusion height L1 of the nut 52 of the movable screw 5 relative to the lower surface of the PCB board 3 is less than 2.5 mm.

[0024] Secondly, a heat dissipation method for a module, using the aforementioned heat dissipation device for the module, wherein the control terminal of the heat dissipation spring 12 acquires the positional relationship between all heat dissipation springs 12 and the corresponding heat-generating devices 22, and monitors the current temperature of the heat-generating devices 22 corresponding to all heat dissipation springs 12 in real time. When the temperature of the heat-generating device 22 is higher than the preset operating temperature, the current temperature of each heat dissipation spring 12 is adjusted accordingly to absorb and dissipate the heat of the heat-generating device 22 until the temperature of the heat-generating device 22 is lower than or equal to the preset operating temperature.

[0025] This invention provides a heat dissipation device and method for a module. The heat sink, module and PCB are connected in series by the same movable screw. A support block is set on the movable screw between the PCB and the module. The elastic force of the spring on the movable screw against the support block is used to achieve elastic contact between the module and the heat sink. This ensures that the module and the heat sink can still be well connected and fixed when the module is heated and deformed during normal operation. Attached Figure Description

[0026] Figure 1 This is an exploded view of a heat dissipation device for a module provided in an embodiment of the present invention;

[0027] Figure 2 This is an exploded view of a heat dissipation device for a module provided in an embodiment of the present invention;

[0028] Figure 3 This is a partial cross-sectional view of the heat dissipation device for a module provided in an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of a PCB board device for a heat dissipation device for a module provided in an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of a PCB board device for a heat dissipation device for a module provided in an embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of a template device for a heat dissipation device for a module provided in an embodiment of the present invention;

[0032] Figure 7 This is a schematic diagram of a template device for a heat dissipation device for a module provided in an embodiment of the present invention;

[0033] Figure 8 This is a schematic diagram of the structure of the support block for the heat dissipation device of the module provided in an embodiment of the present invention;

[0034] Figure 9 This is a schematic diagram of the structure of the support block for the heat dissipation device of the module provided in an embodiment of the present invention;

[0035] Figure 10 This is a schematic diagram of a PCB board device for a heat dissipation device for a module provided in an embodiment of the present invention;

[0036] Figure 11 This is a schematic diagram of a heat sink device for a module provided in an embodiment of the present invention;

[0037] Figure 12 This is a schematic diagram of a heat sink device for a module provided in an embodiment of the present invention;

[0038] Figure 13 This is a schematic diagram of the movable screw structure of the heat dissipation device for the module provided in an embodiment of the present invention;

[0039] Figure 14 This is a schematic diagram of the movable screw structure of the heat dissipation device for the module provided in an embodiment of the present invention;

[0040] Figure 15 This is a schematic diagram of a tower spring structure for a heat dissipation device for a module provided in an embodiment of the present invention;

[0041] Figure 16 This is a schematic diagram of a template device for a heat dissipation device for a module provided in an embodiment of the present invention;

[0042] Figure 17 This is a schematic diagram of a heat sink device for a module provided in an embodiment of the present invention. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0044] In the description of this invention, the terms "inner", "outer", "longitudinal", "lateral", "upper", "lower", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and do not require that this invention must be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0045] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0046] Example 1:

[0047] This embodiment provides a heat dissipation device for a module, including a heat sink 1, a module 2, a PCB board 3, a tower spring 4, a movable screw 5, and a support block 6. Specifically:

[0048] like Figures 1-7 As shown, the support block 6 is fixed on the PCB board 3;

[0049] On the PCB board 3, a first mounting hole 31 is provided at the position of the through hole 61 of the support block 6; wherein, the head of the movable screw 5 is located in the first mounting hole 31, and the head indirectly abuts against the bottom of the support block 6 through the tower spring 4; the module 2 abuts against the upper surface of the support block 6.

[0050] After the movable screw 5 passes through the second mounting hole 21 on the module 2, it is coupled and fixed with the heat sink 1; thereby, the module 2 is fixed after being pressed by the heat sink 1, wherein the pressing force of the heat sink 1 is generated by the movable screw 5 abutting against the support block 6 through the tower spring 4.

[0051] At least four first mounting holes 31 are provided on the PCB board 3, corresponding to the positions of the second mounting holes 21 on the module 2. Each first mounting hole 31 is equipped with a movable screw 5 and a support block 6. When the movable screw 5 is inserted into the first mounting hole 31, only the screw shank 51 of the movable screw 5 is positioned above the upper surface of the PCB board 3. The horizontal position of the nut 52 of the movable screw 5 is either in the first mounting hole 31 or below the lower surface of the PCB board 3. The diameter of the nut 52 of the movable screw 5 is smaller than the diameter of the first mounting hole 31 on the PCB board 3. Here, the diameter of the screw shank 51 of the movable screw 5 is smaller than the diameter of the nut 52 of the movable screw 5, ensuring that the nut 52 of the movable screw 5 can move up and down in the first mounting hole 31 of the PCB board 3. When the diameter of the tower spring 4 is greater than the diameter of the nut 52 of the movable screw 5, the diameter of the first mounting hole 31 on the PCB board 3 needs to be greater than the diameter of the tower spring 4 to ensure that there is enough space in the first mounting hole 31 for the tower spring 4 to be installed. When the upper diameter of the tower spring 4 is greater than the diameter of the first mounting hole 31, the upper end of the tower spring 4 abuts against the lower surface of the PCB board 3, which can also achieve elastic contact between the heat sink 1 and the module 2. However, since the interval between the upper end of the tower spring 4 and the lower end of the heat sink 1 changes from the module 2 and the support block 6 to the module 2, the support block 6 and the PCB board 3, the number of interval layers increases, and the force is relatively more unstable. Therefore, the upper diameter of the tower spring 4 should be smaller than the diameter of the first mounting hole 31 to ensure that the upper end of the tower spring 4 abuts against the lower surface of the support block 6.

[0052] The lower surface area of ​​the support plate is larger than the area of ​​the first mounting hole 31, and it completely covers the upper surface of the first mounting hole 31. The upper end of the tower spring 4 abuts against the lower surface of the support plate, and the lower end of the tower spring 4 abuts against the nut 52 of the movable screw 5, so that when the movable screw 5 moves up and down in the support block 6, it is subjected to the elastic force of the tower spring 4.

[0053] Currently, common heat dissipation installation methods have several limitations. The first requires hooks in the structure to accommodate the mounting clips and the corresponding heat sink. The second requires a screw 51 that is too tall and may exceed the installation range of module 2. The third requires a large amount of space and may not be suitable for structures with overly enclosed layouts. Therefore, when module 2 lacks hooks and the heat sink must not exceed the range of module 2 due to the enclosed layout, and module 2 requires additional fixation, current common installation methods cannot solve the problem. The structure of this invention does not require clips and does not require additional space. Through the elastic fixation between the heat sink 1 and module 2, it ensures that when module 2 is heating up normally and undergoes a certain degree of deformation, the heat sink 1 and module 2 can still maintain good fixation due to the elastic contact between them.

[0054] At least four second mounting holes 21 are provided on the module 2, located at the four corners of the module 2. The diameter of the second mounting hole 21 is greater than or equal to the diameter of the screw 51 of the movable screw 5, and less than or equal to the diameter of the cylindrical end 61 of the support block 6, so as to ensure that the lower surface of the module 2 abuts against the upper surface of the cylindrical end 61 of the support block 6.

[0055] The length of the heat sink 1 is less than or equal to the length of the module 2, and the width of the heat sink 1 is less than or equal to the width of the module 2. At least four stepped pillars are provided on the lower surface of the heat sink 1, corresponding to the positions of the second mounting holes 21 of the module 2. The height of each stepped pillar should be higher than the highest height of the upper surface of the module 2 to ensure that the area of ​​the lower surface of the heat sink 1, excluding the stepped pillars, is in contact with the upper surface of the module 2. The length of the threaded hole in the stepped pillar should be greater than or equal to the length of the threaded portion of the movable screw 5 to ensure that the threaded portion of the movable screw 5 can fully enter the interior of the stepped pillar. Simultaneously, under the influence of no external force, the screw receives a downward elastic force due to the tower spring 4, causing the heat sink 1, which is fixedly connected to the movable screw 5, to also receive a downward elastic force, thereby causing the lower surface of the stepped pillar to abut against the upper surface of the module 2.

[0056] Since the tower spring 4 can be compressed or extended under elastic force, when the tower spring 4 is fully compressed, the height of the tower spring 4 is slightly greater than its wire diameter. Therefore, when an upward external force is applied to the heat sink 1, the heat sink 1 can move upward a certain distance. When the external force is removed, due to the elastic restoring force of the tower spring 4, the small surface of the stepped column of the heat sink 1 returns to contact with the upper surface of the module 2, thereby achieving elastic fixation of the heat sink 1 above the module 2.

[0057] Since the support block 6 provides space for the vertical displacement of the movable screw 5, and provides a downward force to the tower spring 4, while supporting the lower surface of the module 2, the support block 6 includes the following structure:

[0058] like Figures 8-10 As shown, the support block 6 includes a cylindrical end 61, a through hole 62, a stepped end 63, and a second threaded hole 64, wherein:

[0059] The cylindrical end 61 is disposed on the upper end of the stepped end 63. The through hole 62 extends from top to bottom through the cylindrical end 61 and the stepped end 63, and is used to insert the screw 51 of the movable screw 5, providing a channel for the up and down movement of the screw 51 of the movable screw 5. The upper surface of the cylindrical end 61 abuts against the lower surface of the module 2, and is used to support the module 2. The lower surface around the through hole 62 of the stepped end 63 abuts against the tower spring 4, and is used to apply a downward force to the tower spring 4. The lower outer surface of the stepped end 63 abuts against the upper surface of the PCB board 3.

[0060] The height of the support block 6 should ensure that, except for the connection between the module 2 and the PCB board 3, no other position of the module 2 will directly contact the upper surface of the PCB board 3. The diameter of the through hole 62 of the cylindrical end 61 should be larger than the diameter of the screw 51 of the movable screw 5, ensuring that the screw 51 of the movable screw 5 can move vertically up and down without obstruction in the through hole 62. The periphery of the stepped end 63 is used to abut against the upper surface of the PCB board 3, and the periphery of the through hole 62 of the stepped end 63 is used to abut against the tower spring 4.

[0061] The lower surface of the support block 6 may also be provided with a recessed step surface to buffer the height occupied by the tower spring 4. The recessed thickness of the step surface is determined by the downward protrusion thickness of the movable screw 5. If the movable screw 5 protrudes too much relative to the lower end of the PCB board 3, the recessed thickness of the step surface needs to be increased to ensure that the movable screw 5 does not protrude too much relative to the lower end of the PCB board 3.

[0062] The second threaded hole 64 is disposed on the stepped end 63 and corresponds to the position of the third threaded hole 32 disposed on the PCB board 3. The second threaded hole 64 and the third threaded hole 32 are connected by the first screw to fix the support block 6 on the upper surface of the PCB board 3.

[0063] At least two second threaded holes 64 are provided on the stepped end 63. At the corresponding position of the second threaded holes 64, there is also a third threaded hole 32 on the PCB board 3. The third threaded hole 32 is arranged around the first mounting hole 31 and is used to correspond to the second threaded holes 64. A first screw is used to cooperate with the third threaded hole 32 and the second threaded hole 64 on the PCB to ensure the fixation of the stepped end 63 and the upper surface of the PCB board 3.

[0064] There is a basic connection between the module 2 and the PCB board 3, enabling the module 2 and the PCB board 3 to work normally.

[0065] The second mounting hole 21 is fitted onto the screw 51 of the movable screw 5 in the first mounting hole 31, and the lower surface of the module 2 is in contact with the upper surface of the support block 6, and also includes:

[0066] The connector on the lower surface of module 2 is connected to the connector base on the upper surface of PCB board 3, while ensuring that the lower surface of module 2 is in contact with the upper surface of the cylindrical end 61 of support block 6, thus realizing the fixed connection between module 2 and PCB board 3.

[0067] The height of the cylindrical end 61 of the support block 6 needs to ensure that when the connector on the lower surface of the module 2 is connected to the joint base on the upper surface of the PCB board 3, the lower surface of the module 2 is in contact with the upper surface of the cylindrical end 61 of the support block 6, so as to further ensure the installation stability of the module 2 on the PCB board 3; the connector on the lower surface of the module 2 and the joint base on the upper surface of the PCB board 3 realize signal docking, ensuring the working interaction between the module 2 and the PCB board 3.

[0068] like Figures 11-14 As shown, the movable screw 5 passes through the second mounting hole 21 on the module 2 and is then coupled and fixed to the heat sink 1, specifically including:

[0069] The heat sink is provided with a first threaded hole 11, which corresponds to the positions of the first mounting hole 31 and the second mounting hole 21. The thread on the movable screw 5 engages with the thread on the first threaded hole 11 to achieve the connection and fixation between the heat sink and the movable screw 5.

[0070] The first threaded hole 11 provided inside the stepped column engages with the thread on the screw 51 of the movable screw 5, specifically including:

[0071] The upper end of the movable screw 51 is provided with a threaded end 511. The length of the threaded end 511 is a preset length. When the threaded end 511 is engaged with the first threaded hole 11 in the stepped column of the heat sink 1, the threaded end 511 of the preset length is completely inserted into the first threaded hole 11 and engaged with it, ensuring the fixation between the movable screw 5 and the heat sink 1, and the up and down movement of the movable screw 5 in the first mounting hole 31 of the module 2 and the through hole 62 of the support block 6. Under the elastic action of the tower spring 4, elastic contact is achieved between the heat sink 1 and the module 2.

[0072] The preset length is determined by those skilled in the art based on the height of the screw 51 of the movable screw 5, the thickness of the PCB board 3, the height of the support block 6, and the thickness of the module 2. The screw 51 is divided into a threaded end 511 and a non-threaded end 511. The threaded end 511 is located at the tail end of the screw 51, and the other part of the screw 51 is the non-threaded end 511. It is necessary to ensure that the length of the non-threaded end 511 is greater than the sum of the thickness of the PCB board 3, the height of the support block 6, and the thickness of the module 2, so that the threaded end 511 can completely enter the threaded hole in the stepped column. All preset length settings that meet the conditions should be within the protection scope of this invention. At the same time, the length of the threaded hole in the stepped column should be greater than or equal to the length of the threaded end 511 of the movable screw 5 to ensure that the threaded end 511 of the movable screw 5 can completely enter the interior of the stepped column, avoiding the thread of the threaded end 511 from abutting against the lower surface of the stepped column of the heat sink 1 or the lower surface of the module 2, which would affect the up and down movement of the movable screw 5 in the support block 6 and the first mounting hole 31 and the second mounting hole 21.

[0073] like Figure 15 As shown, the diameter of the tower spring 4 gradually increases from bottom to top. The end of the tower spring 4 with a larger diameter abuts against the lower surface of the through hole 62 of the stepped end 63, and the end of the tower spring 4 with a smaller diameter abuts against the nut 52 of the movable screw 5.

[0074] The smaller diameter end of the tower spring 4 has a slightly larger diameter than the screw 51 of the movable screw 5, allowing the tower spring 4 to be stably fitted onto the screw 51 of the movable screw 5 without arbitrarily moving left or right. Since the through hole 62 of the support block 6 has a slightly larger diameter than the screw 51 of the movable screw 5, the larger diameter end of the tower spring 4 needs to abut against the lower surface of the support block 6, while the smaller diameter end of the tower spring 4 abuts against the nut 52 of the movable screw 5. Furthermore, when the tower spring 4 is compressed, its diameter will increase to some extent, providing more space on the lower surface of the support block 6 for the tower spring 4 to deform.

[0075] like Figure 16 and Figure 17 As shown, the heat dissipation of module 2 by heat sink 1 specifically includes:

[0076] The lower surface of the heat sink 1 is provided with a boss, which corresponds to the position of the heat-generating device 22 on the upper surface of the module 2. A heat dissipation spring 12 is provided on the boss for contacting the heat-generating device 22 on the upper surface of the module 2, thereby dissipating heat from the heat dissipation device.

[0077] The lower surface of the heat sink 1 is provided with a second preset number of protrusions. The second preset number is determined according to the number of heat-generating devices 22 on the surface of the module 2. Each protrusion has a heat dissipation spring 12 that corresponds one-to-one with the heat-generating device 22 on the surface of the module 2. All the heat dissipation springs 12 are controlled by the control terminal to change their temperature, thereby absorbing heat from the heat dissipation device and cooling it down. The thickness of the protrusion needs to ensure that the heat dissipation spring 12 can fit in contact with the heat-generating device 22 to achieve heat exchange.

[0078] The upper surface of the heat sink 1 is provided with heat dissipation teeth 13, which are used to dissipate the heat exchanged between the heat dissipation spring 12 and the heat-generating device 22.

[0079] The heat dissipation teeth 13 can be disposed on the upper surface or side of the heat dissipation plate 1. When the heat dissipation teeth 13 are disposed on the upper surface of the heat dissipation plate 1, the heat dissipation teeth 13 are sufficient to cover all the heat dissipation springs 12 on the bottom surface of the heat dissipation plate 1, so that after the heat dissipation springs 12 exchange heat with the heat dissipation devices on the module 2, the collected heat can be dissipated with the highest efficiency. When the heat dissipation teeth 13 are disposed on the side of the heat dissipation plate 1, the heat dissipation teeth 13 are disposed on the side close to the position of most of the heat dissipation springs 12 according to the position of all the heat dissipation springs 12 on the bottom surface of the heat dissipation plate 1, so as to maximize the overall heat dissipation efficiency of the heat dissipation plate 1, thereby improving the overall cooling efficiency of the heat-generating device 22 on the module 2.

[0080] The protrusion height L1 of the nut 52 of the movable screw 5 relative to the lower surface of the PCB board 3 is less than 2.5mm.

[0081] Due to the space occupied by the support block 6 and the tower spring 4, the position of the nut 52 of the movable screw 5 may extend beyond the lower surface of the PCB board 3 by a certain distance. However, due to the limitations of the module 2 package corresponding to the module 2 model and the position of the heat sink 1, the distance L1 between the bottom end of the nut 52 of the movable screw 5 and the lower surface of the PCB board 3 must be less than 2.5mm.

[0082] Example 2:

[0083] Embodiment 2 of the present invention provides a heat dissipation method for a module. The foregoing embodiments mainly describe the heat dissipation device for the module. The heat dissipation method for the module is described in detail below with reference to the heat dissipation device for the module in Embodiment 1.

[0084] The control terminal of the heat dissipation spring 12 obtains the positional relationship between all heat dissipation springs 12 and the corresponding heat-generating device 22, and monitors the current temperature of the heat-generating device 22 corresponding to all heat dissipation springs 12 in real time. When the temperature of the heat-generating device 22 is higher than the preset working temperature, the current temperature of each heat dissipation spring 12 is adjusted accordingly to absorb and dissipate the heat of the heat-generating device 22 until the temperature of the heat-generating device 22 is lower than or equal to the preset working temperature.

[0085] The preset operating temperature is set by those skilled in the art based on the model of module 2 and the specific circumstances of its operation. All preset operating temperature settings that meet the conditions should be within the protection scope of this invention. The control terminal corresponding to the heat sink 1 obtains the spatial relationship of the layout of each heat-generating device 22 on the current module 2, thereby determining the corresponding positional relationship between each heat-generating device 22 and each heat sink 12, as well as the temperature control ratio model of each heat sink 12. When the temperature sensor inside the device detects the temperature change of module 2, thereby triggering the heat sink 12 to adjust its temperature, the temperature control output of each heat sink 12 is adjusted according to the temperature control ratio model. The spatial relationship of the layout includes one or more of the following: single horizontal setting, single vertical setting, double parallel setting, and triple array setting. The temperature control ratio model is specifically obtained by testing the distribution characteristics of the corresponding heat generation on each heat sink 12 based on the number of heat sink 12 and the number of heat-generating devices 22 on module 2 and the spatial relationship of the layout, thereby obtaining the temperature control ratio model of each heat sink 12 and storing it in the control terminal of the heat sink 1.

[0086] Example 3:

[0087] Embodiment 3 of the present invention provides a heat dissipation method for a module. Based on Embodiments 1 and 2, Embodiment 3 demonstrates the usage method of the heat dissipation device for a module in a more specific scenario.

[0088] In this embodiment, there are two heating elements 22 on module 2. One heating element 22 is located in the middle of the upper half of module 2, and the other heating element 22 is located in the middle of the entire module 2. Therefore, according to the position of the heating element 22 on module 2, the heat sink 1 is provided with a protrusion at the middle of the upper half of the bottom of the heat sink 1 and at the middle of the entire bottom. The protrusion is provided with heat dissipation springs 12, which correspond to the two heating elements 22 on module 2. At the same time, since the heat sink 1 and module 2 have elastic contact, the contact relationship between the heat sink 1 and module 2 can be changed to adjust the heat dissipation intensity of the heat sink 1 on module 2. After the control terminal of the heat sink 1 obtains the positional relationship between all heat dissipation springs 12 and the corresponding heating elements 22, as well as the temperature control ratio model of each heat dissipation spring 12, module 2 starts to work normally. When the temperature sensor first detects that the temperature of the heat-generating device 22 in the upper half of module 2 exceeds the normal operating temperature range, the control terminal of the heat sink 1 first increases the temperature control ratio of its corresponding heat dissipation spring 12 to prioritize cooling the heat sink in the upper half of module 2. Then, when the temperature sensor in the device detects that the temperature of the large heat-generating device in the middle of module 2 exceeds the normal operating temperature range, the control terminal of the heat sink 1 increases the temperature control ratio of the heat dissipation spring 12 in the middle of the heat sink 1 until the temperature of the two heat-generating devices 22 on module 2 returns to the normal operating temperature range, the temperature control ratio of the corresponding two heat dissipation spring 12 is reduced, and the heat dissipation of module 2 is completed. The temperature sensor in the device continuously detects the temperature of the two heat-generating devices 22 on module 2. When the temperature of a heat-generating device 22 exceeds the normal operating temperature range, the above steps are repeated to dissipate heat from the heat-generating device 22.

[0089] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat dissipation device for a module, characterized in that, Including heat sink (1), module (2), PCB board (3), tower spring (4), movable screw (5), and support block (6), specifically: The support block (6) is fixed on the PCB board (3); On the PCB board (3), a first mounting hole (31) is provided at the position of the through hole (62) of the support block (6); wherein, the head of the movable screw (5) is located in the first mounting hole (31), and the head is indirectly abutted to the bottom of the support block (6) through the tower spring (4); the module (2) abuts to the upper surface of the support block (6); After the movable screw (5) passes through the second mounting hole (21) on the module (2), it is coupled and fixed with the heat sink (1); thereby the module (2) is fixed after being pressed by the heat sink (1), wherein the pressing force of the heat sink (1) is generated by the movable screw (5) abutting the support block (6) through the tower spring (4); The support block (6) includes a cylindrical end (61), a through hole (62), a stepped end (63), and a second threaded hole (64), wherein: the cylindrical end (61) is located at the upper end of the stepped end (63), the through hole (62) extends from top to bottom through the cylindrical end (61) and the stepped end (63), and is used to insert the screw (51) of the movable screw (5), providing a channel for the up and down movement of the screw (51) of the movable screw (5); the upper surface of the cylindrical end (61) abuts against the lower surface of the module (2), and is used to support the module (2) The lower surface of the through hole (62) of the stepped end (63) abuts against the tower spring (4), and the lower surface of the outer periphery of the stepped end (63) abuts against the upper surface of the PCB board (3); the second threaded hole (64) is provided on the stepped end (63) and corresponds to the position of the third threaded hole (32) on the PCB board (3). The second threaded hole (64) and the third threaded hole (32) are connected by the first screw to fix the support block (6) on the upper surface of the PCB board (3).

2. The heat dissipation device for a module according to claim 1, characterized in that, The connector on the lower surface of the module (2) is connected to the connector base on the upper surface of the PCB board (3), while ensuring that the lower surface of the module (2) is in contact with the upper surface of the cylindrical end (61) of the support block (6), thus realizing the fixed connection between the module (2) and the PCB board (3).

3. The heat dissipation device for a module according to claim 1, characterized in that, The movable screw (5) passes through the second mounting hole (21) on the module (2) and is then coupled and fixed to the heat sink (1), specifically including: The heat sink is provided with a first threaded hole (11), which corresponds to the position of the first mounting hole (31) and the second mounting hole (21). The thread on the movable screw (5) is engaged with the thread on the first threaded hole (11) to realize the connection and fixation between the heat sink and the movable screw (5).

4. The heat dissipation device for a module according to claim 3, characterized in that, The first threaded hole (11) engages with the thread on the screw (51) of the movable screw (5), specifically including: The upper end of the screw (51) of the movable screw (5) is provided with a threaded end (511). The length of the threaded end (511) is a preset length. When the threaded end (511) is engaged with the first threaded hole (11) of the heat sink (1), the threaded end (511) of the preset length is completely inserted into the first threaded hole (11) and engaged with it, which ensures the fixation between the movable screw (5) and the heat sink (1), as well as the up and down movement of the movable screw (5) in the first mounting hole (31) of the module (2) and the through hole (62) of the support block (6).

5. The heat dissipation device for a module according to claim 4, characterized in that, To achieve the connection and fixation between the heat sink and the movable screw (5), the method further includes: When the movable screw (5) moves upward in the first mounting hole (31) and the second mounting hole (21), the upper end of the tower spring (4) on the movable screw (5) is subjected to a downward force from the step end (63). The tower spring (4) applies a downward elastic force to the nut (52) of the movable screw (5) that abuts at its lower end. As a result, the heat sink (1) that is fixedly connected to the movable screw (5) also undergoes elastic displacement, thus achieving elastic contact between the heat sink (1) and the module (2).

6. The heat dissipation device for a module according to claim 1, characterized in that, The heat sink (1) also includes: The lower surface of the heat sink (1) is provided with a boss, which corresponds to the position of the heat-generating device (22) on the upper surface of the module (2). A heat dissipation spring (12) is provided on the boss to fit against the heat-generating device (22) on the upper surface of the module (2) to dissipate heat from the heat dissipation device.

7. The heat dissipation device for a module according to claim 6, characterized in that, The heat sink (1) has heat dissipation teeth (13) on its upper surface, which are used to dissipate the heat exchanged between the heat dissipation spring (12) and the heat-generating device (22).

8. The heat dissipation device for a module according to claim 1, characterized in that, The protrusion height L1 of the nut (52) of the movable screw (5) relative to the lower surface of the PCB board (3) is less than 2.5 mm.

9. A heat dissipation method for a module, characterized in that, Using the heat dissipation device for module (2) as described in any one of claims 1-8, wherein the control terminal of the heat dissipation spring (12) acquires the positional relationship between all heat dissipation springs (12) and the corresponding heat-generating device (22), and monitors the current temperature of the heat-generating device (22) corresponding to all heat dissipation springs (12) in real time. When the temperature of the heat-generating device (22) is higher than the preset working temperature, the current temperature of each heat dissipation spring (12) is adjusted accordingly to absorb and dissipate the heat of the heat-generating device (22) until the temperature of the heat-generating device (22) is lower than or equal to the preset working temperature.

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