Ink cartridge chip, ink cartridge and inkjet printing device

Abstract

The application provides an ink cartridge chip, an ink cartridge and an inkjet printing device. The ink cartridge chip comprises a substrate and an electronic module. The electronic module comprises a plurality of functional pins. A plurality of connection terminals are arranged on a first surface of the substrate. Each of the plurality of connection terminals comprises a contact area which is electrically contacted by a stylus on the printing device. At least one of the connection terminals comprises a low-resistivity component and a high-resistivity component. The low-resistivity component comprises or is electrically connected to the contact area. The low-resistivity component is electrically connected to the functional pin. The high-resistivity component has a resistance between an edge of the high-resistivity component and the low-resistivity component which is greater than a resistance between the contact area and the functional pin. The ink cartridge provided by the application has the ink cartridge chip described above. The application can avoid signal interference between different connection terminals when foreign matter such as ink drops.

Description

Technical Field

[0001] This invention relates to the technical field of inkjet printing, specifically to an ink cartridge chip, an ink cartridge having such an ink cartridge chip, and an inkjet printing device equipped with such an ink cartridge. Background Technology

[0002] Printing equipment, as a common office tool, provides great convenience for modern offices. Common printing equipment is divided into inkjet printers and laser printers. Inkjet printers use ink cartridges containing ink as consumable containers to spray ink onto paper to form the text or pattern to be printed on the paper; laser printers use toner cartridges containing toner as consumable containers to form the text or pattern to be printed on the medium.

[0003] See Figure 1 A color inkjet printing device has a housing 11. Figure 1 The inkjet printer shown omits the tray of the housing 11. The housing 11 houses the inkjet printer's mechanism 12 and includes a slide bar. The printing carriage 14 is mounted on a motor (…). Figure 1 Driven by the invisible component, it reciprocates along the slide bar. The printing carriage 14 contains the main control circuit board (…). Figure 1 (Not visible in the middle), the main control circuit board communicates with the mechanism 12 through the ribbon cable 13.

[0004] Multiple ink cartridges 15 are detachably mounted on the printing carriage 14, each containing ink of a different color. The structure of the ink cartridge 15 is as follows: Figure 2 As shown. The ink cartridge 15 has a housing 16, which forms a cavity for containing ink. The lower end of the cavity is provided with an ink outlet 17. The ink in the cavity flows out through the ink outlet 17 and supplies ink to the ink supply needle of the printing carriage 14.

[0005] A chip 18 is mounted on the outer wall of the cartridge body 16 of the ink cartridge 15. The chip 18 has a substrate, and one side of the substrate has multiple connection terminals 19 for electrical connection with the contact pins on the print carriage 14. The other side of the substrate has a memory (…). Figure 2 (Not visible in the image) Typically, this memory is a non-volatile memory, such as EEPROM or FLASH, which stores information related to the ink cartridge, including variable information and invariant information. Variable information is information that changes continuously with the printing operation, such as ink level, printing time, and number of sheets printed. Invariant information is information that does not change with the printing operation, such as ink cartridge model, applicable inkjet printer model, and ink color.

[0006] After ink cartridge 15 is installed into the print carriage 14 of the inkjet printer, the inkjet printer powers on the chip 18 and reads the data stored in the memory of the chip 18 to determine whether the ink cartridge 15 is the right model and whether there is enough ink remaining in the ink cartridge 15. Only after determining that the ink cartridge 15 is the right model and that there is enough ink in the ink cartridge 15 can the inkjet printer perform the printing operation.

[0007] See Figure 3 In a certain type of ink cartridge chip 18, five connection terminals 21, 22, 23, 24, and 25 are provided on one surface of the substrate 20. The five connection terminals include a power terminal, a ground terminal, a clock terminal, a data terminal, and a chip select terminal, respectively. Typically, the ground terminal 25 is relatively far from the other connection terminals.

[0008] However, due to the small distance between the power terminal, clock terminal, data terminal, and chip select terminal, a short circuit will occur if there is a foreign object between two adjacent connection terminals, such as an ink droplet falling between the power terminal and the data terminal. During the operation of the inkjet printer, the ink cartridge 15 is constantly shaking due to the continuous back-and-forth movement of the print carriage. Foreign objects such as ink will fall off during this shaking. Therefore, even if there is a short circuit between two adjacent connection terminals for a short time, the shaking of the ink cartridge will cause the foreign object to fall off and the short circuit will stop.

[0009] To protect memory and prevent data transmission errors, existing inkjet printers immediately stop operating and issue a warning upon detecting a short circuit between two connection terminals. However, if the short circuit can be eliminated quickly, immediately stopping operation after a short circuit would be inconvenient for users and negatively impact their experience. Summary of the Invention

[0010] To address the aforementioned problems, the first objective of this invention is to provide an ink cartridge chip that can prevent immediate cessation of operation after a short circuit in the connection terminals.

[0011] A second objective of this invention is to provide an ink cartridge incorporating the aforementioned ink cartridge chip.

[0012] A third objective of this invention is to provide an inkjet printing device that uses the aforementioned ink cartridge.

[0013] To achieve the first objective of this invention, the ink cartridge chip provided by this invention includes a substrate and an electronic module. The electronic module includes multiple functional pins. Multiple connection terminals are disposed on a first surface of the substrate. Each of the multiple connection terminals includes a contact area that makes electrical contact with a stylus on a printing device. Furthermore, at least one connection terminal includes a low-resistivity component and a high-resistivity component. The low-resistivity component includes a contact area or is electrically connected to the contact area. The low-resistivity component is electrically connected to the functional pin. The resistance between the edge of the high-resistivity component and the low-resistivity component is greater than the resistance between the contact area and the functional pin.

[0014] As can be seen from the above scheme, since the connection terminal includes low-resistivity components and high-resistivity components, the resistance of the high-resistivity components is much greater than that of the low-resistivity components, and the high-resistivity components are formed on the outer periphery of the low-resistivity components, once foreign objects such as ink are located between two adjacent high-resistivity components, due to the larger resistivity of the high-resistivity components, a large resistance is formed between the two connected high-resistivity components. Even if the signals on the two low-resistivity components are different at the same time, the two high-resistivity components will electrically isolate the different signals, and the data signals between the two low-resistivity components will not interfere with each other.

[0015] In addition, since the stylus of the inkjet printer contacts the contact part, which is located on or electrically connected to the low-resistivity component, and the low-power component is directly electrically connected to the functional pin of the electronic module, the resistance of the low-resistivity component is very small and will not affect the data transmission between the inkjet printer and the electronic module. The electronic module can still correctly identify the signals sent by the inkjet printer, and the signals sent from the electronic module can also be correctly transmitted to the inkjet printer, ensuring normal communication between the inkjet printer and the electronic module.

[0016] The preferred solution is that the high resistivity component has a room temperature resistivity greater than 1.0 × 10⁻⁶. -6 The first thin film is made of Ω.M; the low resistivity component is made of material with a room temperature resistivity of less than 2.0 × 10⁻⁶. -7 A second thin film of Ω.M is made.

[0017] A further option is that the first thin film is a carbon film, an alloy film, or an organic material film doped with metal powder; and the second thin film is a conductive metal film.

[0018] A further approach is to have the contact area be a portion of the low-resistivity component, with the high-resistivity component formed on the periphery of the low-resistivity component.

[0019] In this way, if foreign matter such as ink drips between two adjacent high resistivity components, the two high resistivity components will short-circuit first, and the larger resistance can prevent the two functional pins of the electronic module from short-circuiting directly.

[0020] Alternatively, the contact area may be a portion of the high-resistivity component covering the low-resistivity component. Preferably, the low-resistivity component is located directly beneath the contact area along the thickness direction of the substrate.

[0021] As can be seen, when low-resistivity components are covered by high-resistivity components, foreign objects such as ink will not directly short-circuit the two low-resistivity components, thus ensuring that the ink is connected to the high-resistivity components and preventing the two functional pins of the electronic module from being directly short-circuited.

[0022] A further embodiment involves providing a test area along the edge of the high-resistivity component. Furthermore, the test area includes at least one test point; and / or the test area semi-encloses the high-resistivity component in the circumferential direction.

[0023] In this way, the resistance between the edge of the high resistivity component and the low resistivity component can be detected through the test area, making it convenient to adjust the resistance of the high resistivity component.

[0024] To achieve the second objective mentioned above, the ink cartridge provided by the present invention can be detachably installed into an inkjet printing device. The ink cartridge has a cartridge body, a cavity formed inside the cartridge body, an ink cavity containing ink, and an ink outlet provided at the bottom of the cavity. Furthermore, the aforementioned ink cartridge chip is provided on the outer wall of the cartridge body.

[0025] To achieve the third objective mentioned above, the inkjet printing device provided by the present invention includes a body, a main control circuit board and a printing carriage are disposed inside the body, a stylus holder is disposed on the printing carriage, a stylus is disposed on the stylus holder of the printing carriage, and one or more ink cartridges as described above are installed inside the inkjet printing device. Attached Figure Description

[0026] Figure 1 This is a structural diagram of an existing inkjet printing device.

[0027] Figure 2 This is a structural diagram of an existing ink cartridge.

[0028] Figure 3 This is a structural diagram of an existing ink cartridge chip.

[0029] Figure 4 This is a structural diagram of the first embodiment of the ink cartridge chip of the present invention and the stylus of the inkjet printing device.

[0030] Figure 5 This is a structural diagram from a first perspective of the first embodiment of the ink cartridge chip of the present invention.

[0031] Figure 6 This is a structural diagram from a second perspective of the first embodiment of the ink cartridge chip of the present invention.

[0032] Figure 7This is a structural diagram from a third perspective of the first embodiment of the ink cartridge chip of the present invention.

[0033] Figure 8 This is a partial cross-sectional view of the first embodiment of the ink cartridge chip of the present invention.

[0034] Figure 9 This is a power supply circuit diagram of the first embodiment of the ink cartridge chip of the present invention.

[0035] Figure 10 This is a structural diagram of the second embodiment of the ink cartridge chip of the present invention and the stylus of the inkjet printing device.

[0036] Figure 11 This is a structural diagram of the second embodiment of the ink cartridge chip of the present invention.

[0037] Figure 12 This is an exploded view of the structure of the second embodiment of the ink cartridge chip of the present invention.

[0038] Figure 13 This is a partial cross-sectional view of the second embodiment of the ink cartridge chip of the present invention.

[0039] Figure 14 This is a structural diagram of the third embodiment of the ink cartridge chip of the present invention and the stylus of the inkjet printing device.

[0040] Figure 15 This is a structural diagram of the third embodiment of the ink cartridge chip of the present invention.

[0041] Figure 16 This is an exploded view of the structure of the third embodiment of the ink cartridge chip of the present invention.

[0042] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation

[0043] First embodiment:

[0044] The inkjet printing device of this embodiment has a body, and a printing carriage is formed inside the body. The ink cartridges are detachably installed in the printing carriage. Each ink cartridge has a box body, which forms a cavity for containing ink. An ink outlet communicating with the cavity is provided at the bottom of the cavity. The ink in the cavity can flow into the print head of the inkjet printing device through the ink outlet. An ink cartridge chip is detachably installed on the front wall of the ink cartridge.

[0045] The print carriage of an inkjet printer is equipped with a stylus holder. The main control circuit board and ink cartridges are located on opposite sides of the stylus holder, which holds multiple stylus pins. See also Figure 4 The ink cartridge chip in this embodiment has a substrate 110, and a plurality of connection terminals are disposed on the first surface of the substrate 110, see [link to documentation]. Figure 5The multiple connection terminals include a data terminal 121, a chip select terminal 122, a clock terminal 123, a power terminal 124, and a ground terminal 130. The first surface faces the stylus holder, thus all the connection terminals contact the stylus 115 on the stylus holder of the inkjet printer. The connection terminals are conductive, and the stylus 115 is made of conductive metal; therefore, signals sent by the inkjet printer can be transmitted to the chip's electronic module via the stylus 115 and the connection terminals.

[0046] See Figure 6 An electronic module 111 is disposed on the second surface of the substrate 110, which is the surface opposite to the first surface. The electronic module 111 may include a processor and a memory. The processor may be a microcontroller or an application-specific integrated circuit (ASIC) or other control unit with computing capabilities. The memory may be non-volatile memory, such as FLASH or EEPROM. Connection terminals are electrically connected to the electronic module, such as by providing electrical connection lines on the substrate 110 to achieve the electrical connection between the connection terminals and the electronic module. For example, the electronic module 111 has multiple functional pins, each of which is electrically connected to a connection terminal. For instance, the multiple functional pins may include a clock pin, which is electrically connected to a clock terminal 123.

[0047] In this embodiment, the data terminal 121, chip select terminal 122, clock terminal 123, and power terminal 124 all include high-resistivity components and low-resistivity components. Each contact area is located on a low-resistivity component, and the contact area is used for electrical contact with the stylus on the inkjet printer. The ground terminal 130 is relatively far from the other four terminals. The ground terminal 130 is formed using the traditional gold finger method, that is, the ground terminal 130 is formed by depositing gold salts onto copper foil using an immersion gold process.

[0048] The structure of the terminal is explained below using data terminal 121 as an example. (See also...) Figure 5 , Figure 7 and Figure 8, the data terminal 121 has a low-resistivity component 141. The contact area is a part of the area on the low-resistivity component 141. When the ink cartridge is installed in the inkjet printing device, the contact pin 115 abuts against a part of the area of the low-resistivity component 141, and the low-resistivity component 141 is electrically connected to the functional pin of the electronic module 111. It should be noted that the electrical connection referred to here means that the resistance between the entire low-resistivity component 141 and the corresponding functional pin of the electronic module 111 is very small, for example, less than 1 Ω. The low-resistivity component 141 can be a layer of metal film and constitutes the second thin film of this embodiment. The second thin film is formed on the substrate 110 by immersion gold, for example, made by the same process as the ground terminal 130. Therefore, the resistance of the second thin film is very small, for example, made of a material with a normal temperature resistivity less than 2.0×10 -7 Ω·M. In this way, the signal sent by the inkjet printing device is transmitted to the corresponding functional pin of the electronic module 111 through the low-resistivity component 141, and the low-resistivity component 141 will not cause a large attenuation of the signal due to excessive resistance, thus ensuring smooth communication between the inkjet printing device and the electronic module 111.

[0049] A high-resistivity component 142 is provided on the outer periphery of the low-resistivity component 141. From Figure 7 it can be seen that the area of the high-resistivity component 142 is larger than the area of the low-resistivity component 141. The high-resistivity component 142 is made of a first thin film with a normal temperature resistivity greater than 1.0×10 -6 Ω·M. Preferably, the first thin film is a carbon film, an alloy film or an organic material film doped with metal powder. Therefore, the resistivity of the first thin film is much greater than the resistivity of the second thin film. Therefore, the resistance between the edge of the high-resistivity component 142 and the low-resistivity component 141 is much greater than the resistance between the low-resistivity component 141 and the functional pin of the electronic module.

[0050] Refer to Figure 7 , the low-resistivity component 141 of this embodiment is rectangular, and the data terminal 121 is also rectangular. The high-resistivity component 142 is located around the low-resistivity component 141. Therefore, the high-resistivity component 142 is in the shape of a hollow "hui" character. Preferably, in the four directions of up, down, left and right of the low-resistivity component 141, the distance from the outer edge of the low-resistivity component 141 to the outer edge of the high-resistivity component 142 is equal, and the minimum distance from the outer edge of the low-resistivity component 141 to the outer edge of the high-resistivity component 142 is L1. The distance L1 is much greater than the thickness of the low-resistivity component 141. Preferably, the distance L1 is more than 10 times the thickness of the low-resistivity component 141. In addition, the low-resistivity component 141 and the high-resistivity component 142 are adjacent to each other and electrically connected.

[0051] Refer to Figure 8The low-resistivity component 141 has a smaller thickness, while the high-resistivity component 142 has a larger thickness. Preferably, the thickness of the high-resistivity component 142 is more than twice the thickness of the low-resistivity component 141. Preferably, the resistance between the edge of the high-resistivity component 142 and the low-resistivity component 141 is much greater than the resistance between the contact area and the corresponding functional pin of the electronic module 111. This method avoids signal interference between functional pins caused by ink droplets falling between two adjacent high-resistivity components 142.

[0052] For example, when foreign matter such as ink drips onto the ink cartridge chip, assuming there is ink between the power terminal 124 and the chip select terminal 122, the edges of the power terminal 124 and the chip select terminal 122 are often connected by the ink. In this case, the high-resistivity component of the power terminal 124, the ink, and the high-resistivity component of the chip select terminal 122 are sequentially electrically connected. See also Figure 9 Because the resistance of the high-resistivity component is relatively large, the high-resistivity component at power terminal 124 is equivalent to... Figure 9 The high resistivity component of the chip select terminal 122, resistor R2, is equivalent to... Figure 9 The resistor R4 in the circuit is used as a resistor, while the low-resistivity component of the power terminal 124 is equivalent to resistor R1, and the low-resistivity component of the chip select terminal 122 is equivalent to resistor R3. If ink drips between the power terminal 124 and the chip select terminal 122, the power pin VCC_CHIP and the chip select pin CS_CHIP of the electronic module are connected sequentially through resistors R1, R2, R4, and R3. Since the resistance values ​​of resistors R2 and R4 are relatively large while the resistance values ​​of resistors R1 and R3 are relatively small, when the chip select pin CS_CHIP receives a low-level signal from the chip select terminal CS_CP_PR_ of the inkjet printer through resistor R3, while the power pin VCC_CHIP remains at a high level, the resistors R2 and R3 are connected. Resistor R4 acts as a pull-down resistor. Although both the chip select pin CS_CHIP and the chip select pin CS_CP_PR of the inkjet printer need to withstand a certain reverse current, it can pull the high-level signal on the power supply pin VCC_CHIP low on the chip select pin CS_CHIP. In this way, resistors R2 and R4 play a signal isolation role. The signal on the chip select pin CS_CHIP of the electronic module will not be interfered with by the signal on the power supply pin VCC_CHIP, and the electronic module 111 can still communicate normally with the inkjet printer.

[0053] In addition, the signal output from the power supply terminal VCC_CP_PR of the inkjet printer is transmitted to the power supply pin VCC_CHIP of the electronic module only through low resistivity components. Since the power supply terminal VCC_CP_PR of the inkjet printer and the power supply pin VCC_CHIP of the electronic module are only connected by a resistor R1, and since the resistance value of resistor R1 is very small, as mentioned earlier, this resistance can be less than 1Ω, and will not affect the signal transmission between the power supply terminal VCC_CP_PR of the inkjet printer and the power supply terminal VCC_CHIP of the electronic module.

[0054] As can be seen, even if a foreign object drips between two adjacent high-resistivity components, the presence of high-resistivity component 142 ensures that the signals between the two adjacent functional pins will not interfere with each other. Furthermore, the inkjet printer's stylus 115 will not contact the high-resistivity component 142, allowing normal data transmission between the inkjet printer and the electronic module 111. Even if the contact portion of the inkjet printer's stylus 115 extends beyond the edge of the low-resistivity component, it will generally not be too far from the edge of the low-resistivity component, and its equivalent resistance value will not be excessively large enough to affect data transmission.

[0055] Second embodiment:

[0056] See Figure 10 and Figure 11 The ink cartridge chip in this embodiment has a substrate 210, on which multiple connection terminals are disposed, including a data terminal 221, a chip select terminal 222, a clock terminal 223, a power terminal 224, and a ground terminal 230. The first surface faces the stylus holder, so all the connection terminals are in contact with styluses 215 on the stylus holder of the inkjet printer. The connection terminals are conductive, and the styluses 215 are made of conductive metal; therefore, signals sent by the inkjet printer can be transmitted to the chip's electronic module via the styluses 215 and the connection terminals. The electronic module is disposed on the second surface of the substrate 210.

[0057] See Figure 11 In this embodiment, the surfaces of the data terminal 221, chip select terminal 222, clock terminal 223, and power terminal 224 are all covered by high-resistivity components 242. Each high-resistivity component 242 has a contact area for electrical contact with the stylus pins on the inkjet printer. See also Figure 12 Each terminal includes a low-resistivity component 241 and a high-resistivity component 242. In this embodiment, the low-resistivity component 241 is a second thin film formed on the surface of the substrate. The second thin film is formed on the substrate 210 by immersion gold deposition. Therefore, the resistance of the second thin film is very small, for example, less than 2.0 × 10⁻⁶ at room temperature. -7 Made of Ω.M material.

[0058] A high-resistivity component 242 covers a low-resistivity component 241, and the area of ​​the high-resistivity component 242 is larger than the area of ​​the low-resistivity component 241; therefore, the high-resistivity component 242 completely covers the low-resistivity component 241. Similar to the first embodiment, the high-resistivity component 242 uses a component with a room-temperature resistivity greater than 1.0 × 10⁻⁶. -6 The first thin film of Ω.M was made.

[0059] Unlike the first embodiment, in this embodiment, the contact area is a portion of the high resistivity component 242 covering the low resistivity component 241. Therefore, in the thickness direction of the substrate, the low resistivity component 241 is located directly below the contact area. Furthermore, the contact area is electrically connected to the low resistivity component 241 through the high resistivity component 242 covering the low resistivity component 241.

[0060] In this way, the signal transmitted by the stylus 215 passes through the high-resistivity component 242 and the low-resistivity component 241 before being transmitted to the functional pin of the electronic module. Compared to the first embodiment, the low-resistivity component 241 is covered by the high-resistivity component 242. Therefore, although the resistance between the functional pin of the electronic module and the stylus of the inkjet printer is increased, the increase in resistance is not significant because the thickness of the high-resistivity component 242 covering the low-resistivity component 241 is very small, and it essentially does not affect the signal transmission between the inkjet printer and the electronic module. Furthermore, since the entire surface of the terminal is covered by the second film, the smooth surface of the second film makes it easier for foreign objects to fall off.

[0061] In addition, a test area is provided on the edge of the high resistivity component 242. For example, at least one of the data terminal 321, chip select terminal 322, clock terminal 323, and power terminal 324 is also connected to a test terminal 243, which is the test area in this embodiment. The test terminal 243 is also formed on the substrate 210 by immersion gold, and therefore, the test terminal 243 is also formed of a metal film. The test terminal 243 is connected to the edge of the corresponding high resistivity component 242. The test terminal 243 is used to test the resistance between the edge of the high resistivity component 242 and the contact portion, thereby ensuring that the resistance value of the high resistivity component 242 is large enough to avoid signal interference when two adjacent high resistivity components 242 are short-circuited.

[0062] Third embodiment:

[0063] See Figure 13 and Figure 14The ink cartridge chip in this embodiment has a substrate 310, on which multiple connection terminals are disposed, including a data terminal 321, a chip select terminal 322, a clock terminal 323, a power terminal 324, and a ground terminal 330. The first surface faces the stylus holder, therefore, all the connection terminals are in contact with styluses 315 on the stylus holder of the inkjet printer. The connection terminals are conductive, and the styluses 315 are made of conductive metal; therefore, signals sent by the inkjet printer can be transmitted to the chip's electronic module through the styluses 315 and the connection terminals. The electronic module is disposed on the second surface of the substrate 310.

[0064] In this embodiment, the data terminal 321, chip select terminal 322, clock terminal 323, and power terminal 324 all have contact areas. These contact areas are the portions that contact the contact pin 315, and are located at the center of the terminal. Taking the data terminal 321 as an example, see [link to documentation]. Figure 15 Each of the data terminal 321, chip select terminal 322, clock terminal 323, and power terminal 324 includes a low-resistivity component 341 and a high-resistivity component 342. In this embodiment, the low-resistivity component 341 is a second thin film formed on the surface of the substrate. The second thin film is formed on the substrate 310 by immersion gold deposition. Therefore, the resistance of the second thin film is very small, for example, less than 2.0 × 10⁻⁶ at room temperature. -7 Made of Ω.M material.

[0065] A high-resistivity component 342 covers a low-resistivity component 341, and the area of ​​the high-resistivity component 342 is larger than the area of ​​the low-resistivity component 341; therefore, the high-resistivity component 342 completely covers the low-resistivity component 341. Similar to the first embodiment, the high-resistivity component 342 uses a component with a room-temperature resistivity greater than 1.0 × 10⁻⁶. -6 The first thin film of Ω.M was made.

[0066] In this embodiment, the contact area is a portion of the high-resistivity component 342 that covers the low-resistivity component 341 directly above it. The signal transmitted by the contact pin 315 passes through the high-resistivity component 342 and the low-resistivity component 341 before being transmitted to the functional pin of the electronic module.

[0067] Compared to the second embodiment, the test area in this embodiment is increased. The test area also includes a third thin film 344 located on a portion of the outer periphery of the high resistivity component 342. Preferably, the third thin film is made of the same material as the first thin film and is formed on the substrate 310 using immersion gold plating. Since the outer contour of the high resistivity component 342 is rectangular, the third thin film 344 is formed on the outer side of at least two edges of the high resistivity component 342, forming an "L"-shaped structure, that is, arranged in a semi-enclosed manner around the high resistivity component 342. Furthermore, the test area also includes test terminals 343, which are also formed on the substrate 310 using immersion gold plating. Preferably, the test terminals 343 are adjacent to and integrally formed with the third thin film 344.

[0068] A third thin film 344 is provided on the outside of the high resistivity component 342. When ink drops fall between two adjacent terminals, the third thin film 344 of the two terminals will first short-circuit, and the signal will be isolated by the high resistivity component of each terminal to avoid signal interference between two adjacent terminals.

[0069] In addition, by providing a third thin film 344, the resistance between the edge of the high resistivity component 342 and the contact portion or the low resistivity component 341 can be tested. If the resistance value of the high resistivity component 342 is found to be unsuitable, the resistance value of the portion other than the contact portion can be changed by adjusting the formula of the high resistivity component 342, so as to better avoid interference between the signals of two adjacent terminals when short-circuited.

[0070] In the above embodiments, the data terminal, chip select terminal, clock terminal, and power terminal all include a first thin film and a second thin film. In other embodiments, the presence of only one or two adjacent terminals with a first resistivity component and a second resistivity component is also within the scope of protection of this invention.

[0071] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. The above content is only for the purpose of facilitating the understanding of this invention and is not intended to limit this invention. Any modifications and changes in the form and details of the implementation can be made by those skilled in the art without departing from the technical scope disclosed in this invention, and all such modifications and changes should be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope defined in the claims.

Claims

1.A cartridge chip, comprising a substrate and an electronic module, the electronic module comprising a plurality of functional pins, a plurality of connection terminals are provided on a first surface of the substrate, each of the plurality of connection terminals comprises a contact area for electrically contacting a stylus on a printing device; characterized in that: at least one of the connection terminals comprises a low-resistivity component and a high-resistivity component, the low-resistivity component comprises or is electrically connected to the contact area; the low-resistivity component is electrically connected to the functional pin, and the high-resistivity component has an edge with an electrical resistance greater than that between the contact area and the functional pin; the high-resistivity component is formed on the periphery of the low-resistivity component, or, along the thickness direction of the substrate, the low-resistivity component is directly below the contact area. 2.The cartridge chip according to claim 1, characterized in that: The high resistivity component is made of a first film having a room temperature resistivity greater than 1.0 x 10 -6 Ω. M; and the low resistivity component is made of a second film having a room temperature resistivity less than 2.0 x 10 -7 Ω. M. 3.The cartridge chip according to claim 2, characterized in that: the first film is a carbon film, an alloy film or a thin film of organic material doped with metal powder; and the second film is a conductive metal film. 4.The cartridge chip according to any one of claims 1 to 3, characterized in that: the contact area is a part of the low-resistivity component. 5.The cartridge chip according to any one of claims 1 to 3, characterized in that: the contact area is a part of the high-resistivity component covering the low-resistivity component. 6.The cartridge chip according to any one of claims 1 to 3, characterized in that: the edge of the high-resistivity component is provided with a test area. 7.The cartridge chip according to claim 6, characterized in that: the test area comprises at least one test point; and / or the test area circumferentially surrounds the high-resistivity component in a semi-enclosed manner. 8.An ink cartridge, which is detachably installed to an inkjet printing device, the ink cartridge comprising: a cartridge body, a cavity is formed in the cartridge body, the cavity contains ink, and an ink outlet is provided below the cavity; characterized in that: the cartridge body is provided with the cartridge chip according to any one of claims 1 to 7 on the outer wall thereof. 9.An inkjet printing device, comprising a machine body, a main control circuit board and a printing carriage are provided in the machine body, a stylus holder is provided on the printing carriage, and a stylus is provided on the stylus holder, characterized in that: one or more ink cartridges according to claim 8 are installed in the inkjet printing device.

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