A top heating cooking appliance

Abstract

The present application relates to a kind of top heating cooking utensils, including pot body and cover with pot cover above pot body, the pot cover includes outer cover and the inner cover of installation in the inner side of outer cover, heating device is equipped between the inner cover and outer cover, the heating device is contacted with the inner cover to heat the inner cover, the heating structure is facet heating device, the inner cover is equipped with heat conduction structure, heat conduction structure is overlaid and distributed in the inner cover, heat conduction structure contains heat conduction medium, at least part of the facet heating device is contacted with the heat conduction structure to pass through heat conduction medium and the heat of facet heating device is conducted to the inner cover, the facet heating device is at least partially set in the lower half region of the pot cover.The present application is overlaid and set on the heat conduction structure of inner cover and the facet heating device of lower half region of pot cover, to realize the uniform heating of inner cover, while ensuring that the heat transfer efficiency between facet heating device and inner cover is not affected in the open cover state.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of kitchen small household appliances, in particular to a top heating cooking utensil. BACKGROUND

[0002] At present, the pot cover of the electric rice cooker used in the kitchen generally comprises an outer cover and an inner cover. When sealed and heated, the temperature of the inner cover is relatively low compared with the temperature inside the pot body. The water vapor generated by the pot body continuously rises and is very easy to condense into condensed water on the lower surface of the inner cover when it contacts the inner cover. The condensed water may flow into the pot body during the cooking process, reducing the taste of the food in the pot body. In the existing technology, a heat preservation plate is arranged between the inner cover and the outer cover to improve the temperature of the inner cover. However, in the existing electric rice cooker, a certain gap is usually provided between the inner cover and the heat preservation plate. The heat conduction between the inner cover and the heat preservation plate mainly relies on radiation, and the heat conduction efficiency is relatively low. Therefore, the temperature of the inner cover cannot be effectively improved, and the formation of condensed water still cannot be avoided.

[0003] In view of the above problems, a technical scheme of heating the inner cover is proposed in the existing technology. The heat preservation plate is arranged between the inner cover and the outer cover. The heat preservation plate is provided with a heating device, and the lower surface of the heat preservation plate directly contacts at least part of the upper surface of the inner cover to improve the heat transfer efficiency of the inner cover. In another scheme, a heating plate is arranged between the inner cover and the outer cover. The heating plate contacts at least part of the inner cover, and a rib is designed on the heating plate to increase the contact area between the heating plate and the inner cover to improve the heat transfer efficiency.

[0004] In the above technical scheme, the heating device is arranged on the heat preservation plate. This requires additional components, and the inner cover still has some areas that receive less heat, which cannot achieve uniform heating of the entire inner cover and may cause condensed water. To avoid this situation, the power of the heating device needs to be increased, but a high-power heating device will increase the overall power consumption of the electric rice cooker. In the scheme of the heating plate, a large-area heating plate is needed to increase the contact area with the inner cover. The design of the heating plate including the rib structure will increase the production cost of the electric rice cooker accessories, and it also needs a large power to prevent the generation of condensed water, which consumes a lot of energy. SUMMARY

[0005] To solve the above problems, the present application provides a top heating cooking utensil. A heat conduction structure containing a heat conduction medium is arranged on the inner cover. The heat conduction structure is arranged on the inner cover in a covering manner, and a small-face heating device in contact with at least part of the heat conduction structure transmits heat to the heat conduction medium. The heat conduction medium diffuses in the heat conduction structure to the entire inner cover to achieve overall heating of the inner cover. At the same time, the small-face heating device is arranged in the lower half area of the pot cover. In the open cover state, the heat conduction medium can be concentrated near the small-face heating device to ensure that the heat conduction medium can be continuously heated and warmed, further preventing the generation of condensed water.

[0006] The technical solution of the present application is as follows:

[0007] A top heating cooking utensil, comprising a pot body and a pot cover arranged above the pot body, the pot cover comprising an outer cover and an inner cover arranged on the inner side of the outer cover, a heating device being arranged between the inner cover and the outer cover, the heating device being in contact with the inner cover to heat the inner cover, the heating structure being a facet heating device, a heat conduction structure being arranged on the inner cover and covering the inner cover, the heat conduction structure containing a heat conduction medium, the heat conduction structure being at least partially in contact with the facet heating device to conduct the heat of the facet heating device to the inner cover through the heat conduction medium, the facet heating device being arranged at least partially in the lower half region of the pot cover.

[0008] As an embodiment of the present application, the facet heating device protrudes towards the inner cover relative to the lower surface of the outer cover, and the inner cover is tightly attached to the facet heating device when the inner cover is arranged on the outer cover, so that the facet heating device is in abutment between the outer cover and the inner cover.

[0009] As an embodiment of the present application, the outer cover is provided with a mounting hole, and the facet heating device is fixed in the mounting hole and protrudes towards the inner cover relative to the mounting hole.

[0010] As an embodiment of the present application, the heat conduction structure is protruded on the lower surface of the inner cover, and the upper surface of the inner cover is at least partially in contact with the facet heating device to form a contact plane for heat transfer.

[0011] As an embodiment of the present application, the heat conduction structure comprises a heat transfer region and a heating region in contact with the facet heating device, and the heat transfer region is communicated to the heating region, so that the heat conduction medium is concentrated in the heating region in the open cover state.

[0012] As an embodiment of the present application, the heating region comprises a contact surface arranged on the upper surface of the inner cover and a containing cavity containing the heat conduction medium, and the heat transfer region is provided with a heat transfer vessel, and the heat transfer vessel is communicated to the containing cavity.

[0013] As an embodiment of the present application, the area of the contact surface is equal to the area of the lower surface of the facet heating device.

[0014] As an embodiment of the present application, the heat conduction structure is provided with a heat transfer vessel containing the heat conduction medium, and the upper surface of the inner cover is at least partially in contact with the facet heating device to form a heating region in contact with the facet heating device by cooperating with the heat transfer vessel, and the heat transfer vessel is at least partially arranged in the heat transfer region.

[0015] As an embodiment of the present application, the facet heating device is arranged at the center of the lower half region of the pot cover.

[0016] As an embodiment of the present application, a heat insulation ring is further arranged between the facet heating device and the outer cover.

[0017] The technical effects of the present application are as follows:

[0018] The present application realizes effective heating of the inner cover as a whole by the heating device with smaller power, saves electric energy, and prevents the generation of condensed water on the lower surface of the inner cover. In order to prevent the generation of condensed water on the pot cover in the long-term open cover state, the facet heating device is arranged in the lower half region of the pot cover, so that the heat conducting medium is mostly concentrated near the facet heating device, the temperature of the inner cover is ensured to be within a certain range, and the generation of condensed water is prevented. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed by the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0020] Figure 1 It is the overall structure diagram of the cooking utensil in the present application.

[0021] Figure 2 It is the structure schematic diagram of the inner cover part structure and the facet heating device cooperation in embodiment 1.

[0022] Figure 3 It is the structure schematic diagram of the inner cover in embodiment 1.

[0023] Figure 4 It is Figure 1 It is the local enlarged view of A in the present application.

[0024] Figure 5 It is the structure schematic diagram of the inner cover part structure and the facet heating device cooperation in embodiment 2.

[0025] Figure 6 It is the structure schematic diagram of the inner cover in embodiment 2.

[0026] Figure 7Figure 3 is a schematic diagram of the structure of the inner cover in Example 3.

[0027] Figure 8 Figure 3 is a schematic diagram of the structure of the inner cover in Example 3.

[0028] Reference signs:

[0029] 100, outer cover; 101, mounting hole; 200, inner cover; 201, positioning hole; 300, heat conduction structure; 301, blow-in inlet; 302, heat transfer channel; 303, contact surface; 304, accommodating cavity; 400, facet heating device; 401, heat source; 402, fixing portion; 403, heat insulation ring; 500, inner container. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0031] The present application provides a top heating cooking appliance, which comprises a pot body and a pot cover arranged above the pot body, the pot cover comprises an outer cover and an inner cover mounted on the inner side of the outer cover, a heating device is arranged between the inner cover and the outer cover, the heating device is in contact with the inner cover to heat the inner cover, the heating structure is a facet heating device, a heat conduction structure is arranged on the inner cover and covers the inner cover, a heat conduction medium is contained in the heat conduction structure, and the heat conduction structure is at least partially in contact with the facet heating device to conduct the heat of the facet heating device to the inner cover through the heat conduction medium, and the facet heating device is arranged at least partially in the lower half region of the pot cover.

[0032] In the above, the inner cover is provided with a heat conduction structure, the heat conduction structure is distributed on the inner cover in a covering manner, and the heat conduction structure is in contact with part of the heat conduction structure through the facet heating device to transfer heat to the inner cover. A heat conduction medium is contained in the heat conduction structure, the heat conduction medium spreads the heat to the entire inner cover after being heated, thereby achieving uniform heating of the inner cover and preventing the generation of condensed water. The facet heating device is arranged in the lower half region of the pot cover, so that the heat conduction medium concentrated at the bottom of the inner cover is in full contact with the facet heating device in the open cover state, thereby ensuring that the temperature of the inner cover can be maintained within a certain range and preventing condensed water from condensing on the lower surface of the inner cover in the open cover state. In addition, the facet heating device is a smaller accessory compared with the heat insulation plate, heating plate and other components in the prior art, the assembly process is simpler, the required input power is lower, and the overall power consumption of the cooking appliance is lower.

[0033] For the above technical solutions, the technical features and technical effects are described in detail in the following embodiments.

[0034] Embodiment 1:

[0035] Referring to Figures 1-3 , the embodiment provides a top heating cooking utensil, which comprises a pot body and a pot cover arranged above the pot body, the pot cover comprises an outer cover 100 and an inner cover 200, the inner cover 200 is covered with heat conduction structures 300, the heat conduction structures 300 are provided with heat conduction medium, and a facet heating device 400 is fixedly installed on the outer cover 100, and the facet heating device 400 is in contact with at least part of the heat conduction structures to transfer heat to the heat conduction medium, the facet heating device 400 is arranged in the lower half region close to the pot cover, that is, the half region close to the tail of the pot cover, wherein the heat conduction structure 300 is a heat transfer vessel, which is made by blow molding on the inner cover according to a preset path, and the heat conduction medium is input after the blow molding is completed, the heat conduction medium flows in the heat transfer vessel and diffuses heat to the entire inner cover 200.

[0036] It should be noted that the facet heating device in the embodiment is a small heating assembly provided in the embodiment, which has a size range of 1 / 20 to 1 / 3 of the size of the inner cover.

[0037] In detail, as shown in Figures 1-3 , the heat conduction structure 300, that is, the heat transfer vessel, is arranged on the lower surface of the inner cover 200 and protrudes towards the inner container 500, the facet heating device 400 is fixedly installed on the outer cover 100 and protrudes towards the inner cover relative to the lower surface of the outer cover 100, so as to be closely attached to the upper surface of the inner cover 200 when the inner cover 200 is installed on the outer cover 100, and the facet heating device 400 is abutted between the outer cover 100 and the inner cover 200, and in the embodiment, the contact plane of the upper surface of the inner cover 200 corresponding to the facet heating device 400 and the part of the heat transfer vessel arranged below the contact plane are defined as a heating area, the heating area is externally connected with a heat transfer area, the heat transfer area and the heat transfer vessel arranged in the heating area cover the lower surface of the inner cover 200, the heating area is used for direct contact with the facet heating device 400, and most of the heat conduction medium is concentrated in the area when the cover is opened, so that the heat conduction medium can obtain heat when the facet heating device 400 operates, and rapidly diffuse the heat to the heat transfer area with the heat transfer vessel, so as to ensure that the temperature of the entire inner cover 200 can be stably maintained within a certain range during the cooking process, so as to prevent water vapor from condensing on the lower surface of the inner cover 200, and improve the cooking effect of the cooking utensil.

[0038] Specifically, the heat-conducting medium input in the embodiment is superconductive liquid mixed with heat-conducting medium, which is in liquid state at room temperature, evaporates into gaseous state and expands after being heated. Due to the restriction of the heat transfer duct, the expanded gas quickly spreads to each position of the inner cover along the heat transfer duct to realize rapid and uniform heating of the inner cover. After cooking, the facet heating device is turned off, and the temperature of the inner cover starts to drop. The gas filled in the heat transfer duct recondenses into superconductive liquid for recycling. In the open cover state, the liquid superconductive liquid flows into the heat transfer duct in the lower half area of the inner cover and concentrates near the heating area. When the facet heating device starts to heat, most of the heat-conducting medium can be heated and evaporated at the first time, quickly spreading to the heat transfer area to maintain the temperature of the lower surface of the inner cover in the long open cover state.

[0039] It should be noted that the heat-conducting medium introduced in the embodiment can be liquid or gas mixed with heat-conducting medium at room temperature. The type of heat-conducting medium is not limited, for example, in other embodiments of the embodiment, air mixed with hydrogen or helium can be used as heat-conducting medium. However, hydrogen has safety problems when heated, and the use of helium is more expensive. Based on the influence of heat-conducting performance, cost and safety, the superconductive liquid mixed with heat-conducting medium is preferred as heat-conducting medium in the embodiment.

[0040] In the embodiment, as shown in Figure 3 The inner cover 200 has a blow-in inlet 301 in the sidewall. In the embodiment, a blow-in medium such as high-pressure liquid or high-pressure gas is introduced into the blow-in inlet 301, and the pressure generated by the blow-in medium makes the pre-set path on the inner cover 200 expand into a pipeline to form a heat transfer duct. After the heat transfer duct is blown in and the heat-conducting medium is introduced, the blow-in inlet 301 needs to be closed. In the embodiment, the blow-in inlet 301 is sealed by die pressing or laser welding. Further, to improve the sealing performance, the heat transfer duct near the blow-in inlet 301 can be sealed by die pressing, and the blow-in inlet 301 can be sealed by laser welding.

[0041] In other embodiments of the embodiment, a common pipeline can also be used as a heat-conducting medium to contain the heat-conducting medium. Compared with the heat transfer duct formed by blowing, it is more difficult to set a common pipeline in the inner cover with a relatively thin thickness. When the pipeline with a certain containing volume is limited by the thickness, the outer wall of the pipeline is generally thin, which has the risk of rupture. The common pipeline needs to be additionally provided with components, which has a high assembly cost. Therefore, the heat transfer duct is preferred as the heat-conducting structure in the embodiment.

[0042] As an embodiment of the present application, as shown in Figure 4As shown, the outer cover 100 is provided with mounting holes 101 for fixing the small noodle heating device 400. The small noodle heating device 400 is fixed in the mounting holes 101 and protrudes towards the inner cover 200 relative to the mounting holes 100. Specifically, the small noodle heating device 400 includes a heat source 401 and a fixing part 402 covering the outside of the heat source. The heat source 401 is electrically connected to a power board provided in the cooking appliance. The fixing part 402 cooperates with the mounting holes 101 to fix the heat source 401 onto the outer cover 100. In this embodiment, the outer cover 100... Generally made of plastic parts, while the fixing part 402 is generally made of heat-conducting material to ensure that the heat from the heat source 401 can be stably transferred to the outside. When the fixing part 402 is installed on the outer cover 100 and the heat source 401 is operating normally, the outer cover 100 may deform or even release toxic gases due to continuous heating, affecting the performance of the product and the cooking effect. Therefore, a heat insulation ring 403 is also provided between the outer cover 100 and the fixing part 402 to isolate the heat from the small heating device 400 and prevent the heat from affecting the plastic outer cover 100.

[0043] In other embodiments of the above examples, the fixing part can also be modified to leave a certain gap between the inner cover and the outer cover. One side of the fixing part of the small face heating device extends out of the mounting hole and contacts the inner cover, so that the bottom of the fixing part is kept at a certain distance from the outer cover. The side wall of the fixing part is coated with a material that shields heat transfer to ensure that the outer cover is not affected by the heat on the small face heating device. The bottom wall of the fixing part uses a normal heat-conducting material to ensure heat transfer of the inner cover. This embodiment involves more steps and is more difficult to process than adding a heat insulation ring. The effect depends on the coating material, and the cost is difficult to predict. It is also impossible to guarantee that it will not affect the heat conduction effect of the inner cover. Therefore, adding a heat insulation ring is preferred in this embodiment.

[0044] Example 2:

[0045] This embodiment provides a top-heated cooking appliance, such as... Figure 1 and Figure 5As shown, the device includes a pot body and a lid mounted on top of the pot body. The lid includes an outer lid 100 and an inner lid 200. A small heating device is provided between the outer lid 100 and the inner lid 200. A heat-conducting structure 300 is distributed on the inner lid 200 in a covering manner. The heat-conducting structure 300 contains a heat-conducting medium. The heat-conducting structure 300 includes a heating area that contacts the small heating device 400 and a heat transfer area that connects to the heating area. A heat transfer duct 302 is provided in the heat transfer area. The heat transfer duct 302 is made by blowing along a predetermined path on the inner lid 200. The heating area contains a heat-conducting medium, which obtains heat through direct contact with the small heating device 400 and transfers it to the heat-conducting medium. After obtaining heat, the heat-conducting medium conducts the heat to the entire inner lid 200 through the heat transfer duct 302 that connects to the heating area, so as to achieve uniform heating of the inner lid 200 and keep the temperature of the lower surface of the inner lid 200 within a certain range, preventing the formation of condensation water and thus preventing damage to the cooking effect of the food.

[0046] It should be noted that the small heating device in this embodiment is a small heating component provided in this invention, and its size ranges from one-twentieth to one-third of the size of the inner cover.

[0047] Detailed, such as Figure 5 and Figure 6 As shown, the heating area is located in the lower half of the inner cover 200 so that the heat transfer medium can be concentrated in the heating area when the cover is open. To avoid installation interference with the steam valve, the heating area is generally located at the lower left or lower right of the inner cover 200. Meanwhile, the small heating device 400 is located on the outer cover 100 at the position corresponding to the heating area. Specifically, the heating area includes a contact surface 303 on the upper surface of the inner cover 200 and a receiving cavity 304 protruding from the lower surface of the inner cover 200. The receiving cavity 304 is used to accommodate the heat transfer medium. The heat transfer area is located in... Outside the accommodating cavity, the heat transfer pulsator 302 in the heat transfer area is connected to the accommodating cavity 304 so that the heat transfer medium can flow in the inner cover 200. The contact surface 303 is used to contact the lower surface of the small surface heating device 400 to transfer heat to the accommodating cavity 304 below. At this time, most of the heat transfer medium is gathered in the accommodating cavity 304. After receiving the heat, the heat transfer medium is quickly dispersed to various positions on the lower surface of the inner cover 200 along the heat transfer pulsator 302 so as to ensure that the temperature of the inner cover 200 can be maintained within a certain range whether the cover is closed or open for a long time.

[0048] Specifically, in this embodiment, the area of ​​the contact surface corresponds to the area of ​​the lower surface of the small-face heating device, so that the heat-conducting medium in the heating area can receive the heat transferred from the small-face heating device in the first time, ensuring that the heat-conducting medium added to the heating area is quickly heated and diffuses outward.

[0049] In another embodiment of this invention, the steam valve can be located in other positions, such as the middle of the inner cover. In this case, the heating area can be located in the center of the lower half of the inner cover to reduce the difficulty of inflating the heat transfer tubes and make the layout of the heat transfer tubes under the preset path more orderly.

[0050] Furthermore, such as Figure 6 As shown, the inner cover 200 has an inflation inlet 301 on its side wall. By introducing an inflation medium, such as high-pressure liquid or high-pressure gas, into the inflation inlet 301, the pressure generated by the inflation medium causes a preset path on the inner cover 200 to inflate into a pipe to form a heat transfer pulsator 302 and a receiving cavity 304 located in the heating area. After inflation is completed and a heat transfer medium is introduced, the inflation inlet 301 is sealed. In this example, the sealing is achieved by mold pressing or laser welding. Alternatively, to improve the sealing performance, the heat transfer pulsator near the inflation inlet 301 can be sealed by mold pressing, while the inflation inlet 301 can be sealed by laser welding.

[0051] In this embodiment, in order to achieve rapid heat transfer, such as Figure 6 As shown, the heat transfer ducts 302 in this example are distributed in a grid pattern, and multiple inlets of the heat transfer ducts 302 are connected to the outer periphery of the accommodating cavity. The specific number of inlets is not limited in this example and depends on the actual situation. In other embodiments of this example, the heat transfer ducts can also be distributed in a spiral pattern, including a distribution method in which a single pipe or multiple pipes are connected to the accommodating cavity. The heat transfer efficiency of a single pipe connection is lower, but the blowing difficulty is lower. The heat transfer efficiency of a multiple pipe connection is higher, but the blowing difficulty is relatively higher. Therefore, in this example, the grid pattern distribution is preferred as the preset path of the heat transfer ducts.

[0052] It should be noted that the heat-conducting medium introduced in this embodiment can be a liquid or gas mixed with a heat-conducting medium at room temperature. The specific type of heat-conducting medium is not limited. For example, in other embodiments of this embodiment, air mixed with hydrogen or helium can be used as the heat-conducting medium. However, hydrogen has safety issues when heated, and the cost of using helium is high. Based on the influence of thermal conductivity, cost and safety, superconducting liquid mixed with a heat-conducting medium is preferred as the heat-conducting medium in this example.

[0053] As one implementation method of this embodiment, such as Figure 4As shown, the outer cover 100 is provided with mounting holes 101 for fixing the small noodle heating device 400. The small noodle heating device 400 is fixed in the mounting holes 101 and protrudes towards the inner cover 200 relative to the mounting holes 100. Specifically, the small noodle heating device 400 includes a heat source 401 and a fixing part 402 covering the outside of the heat source 401. The heat source 401 is electrically connected to a power board provided in the cooking appliance. The fixing part 402 cooperates with the mounting holes 101 to fix the heat source 401 to the outer cover 10. In this embodiment, the outer cover 100 is generally made of plastic, while the fixing part 402 is generally made of thermally conductive material in order to ensure that the heat from the heat source 401 can be transferred outward. When the fixing part 402 is installed on the outer cover 100 and the heat source is operating normally, the outer cover 100 may deform or even release toxic gases due to continuous heating, affecting the performance of the product and the cooking effect. Therefore, a heat insulation ring 404 is also provided between the outer cover 100 and the fixing part 402 to isolate the heat from the small surface heating device 400.

[0054] Example 3:

[0055] Reference Figure 1 and Figure 7 This embodiment provides a top-heated cooking appliance, including a pot body and a lid covering the pot body. The lid includes an outer lid 100 and an inner lid 200, with a small heating element 400 disposed between the outer lid 100 and the inner lid 200. A heat-conducting structure 300 is distributed coverically on the inner lid 200, wherein the heat-conducting structure 300 includes heat transfer ducts 302 containing a heat-conducting medium. The inner lid 200 has positioning holes 201 at positions corresponding to the small heating element 400 for positioning the small heating element 400 extending towards the inner lid 200. 0. At the same time, it also plays a certain role in preventing mistaken installation. The small heating device 400 is inserted into the positioning hole 201 and contacts the side wall of the positioning hole 201. The heat transfer pulse tube 302 is located on the outside of the positioning hole 201 and contacts the hole wall of the positioning hole 201, so that the heat transfer medium contained in the heat transfer pulse tube 302 can obtain heat and quickly disperse it to other positions on the lower surface of the inner cover 200 along the heat transfer pulse tube 302, so as to achieve uniform heating of the inner cover 200, prevent water vapor from condensing on the lower surface of the inner cover 200, and improve the cooking effect.

[0056] It should be noted that the small heating device in this embodiment is a small heating component provided in this invention, and its size ranges from one-twentieth to one-third of the size of the inner cover.

[0057] For details, please refer to Figure 7The heat-conducting structure 300 includes a heat transfer pulsator 302 that contacts the sidewall of the positioning hole 201. A heat transfer medium is disposed within the heat transfer pulsator 302, which protrudes from the lower surface of the inner cover 200. The positioning hole 201 is designed to penetrate the inner cover 200 and is located in the lower half of the inner cover 200, allowing the heat transfer medium to accumulate near the positioning hole 201 and correspondingly contact the small-face heating device 400 when the cover is open, thereby improving heat transfer efficiency. The positioning hole 301 is designed to correspond to the size of the small-face heating device 400, allowing the small-face heating device 400 to... After the inner cover 200 is installed, it fits precisely into the positioning hole 201 so that the hole wall of the positioning hole 201 contacts the side wall of the small heating device 400. At the same time, a heat transfer pulsator 302 is provided on the outside of the positioning hole 201, which contacts the hole wall. In this example, this part of the heat transfer pulsator and the hole wall of the positioning hole 201 that contacts it are defined as the heating area, and the area outside the heating area is defined as the heat transfer area. A heat transfer pulsator connected to the heating area is provided in the heat transfer area, and the small heating device 400 contacts the heating area to ensure effective heat transfer.

[0058] Furthermore, such as Figure 8 As shown, the inner cover 200 has an inflation inlet 301 on its side wall. By introducing an inflation medium, such as high-pressure liquid or high-pressure gas, into the inflation inlet 301, the pressure generated by the inflation medium causes a preset path on the inner cover 200 to inflate into a pipe to form a heat transfer pulsator 302. After inflation is completed and a heat transfer medium is introduced, the inflation inlet 301 is sealed. In this example, the sealing is achieved by mold pressing or laser welding. Alternatively, to improve the sealing performance, the heat transfer pulsator near the inflation inlet 301 can be sealed by mold pressing, while the inflation inlet 301 can be sealed by laser welding.

[0059] In this embodiment, as Figure 8 As shown, in order to ensure that heat can be quickly transferred to the entire inner cover 200 in this embodiment, the heat transfer tubes 302 in this example are distributed in a grid pattern, and multiple heat transfer tubes 302 are connected to the outside of the positioning hole 201. The hole wall of the positioning hole 201 serves as a barrier to block the heat, and the heat-conducting medium blocking the outside of the positioning hole 201 can receive the heat from the small-face heating device 400. The specific number of heat transfer tubes 302 blocking the side wall of the positioning hole 201 is not limited in this example and depends on the actual situation. In other embodiments of this example, the heat transfer tubes can also be distributed in a spiral pattern, with some heat transfer tubes surrounding the outside of the positioning hole to cooperate with the small-face heating device for heat transfer. Based on the difficulty and cost of inflation, the grid pattern is preferred as the preset path of the heat transfer tubes in this example.

[0060] It should be noted that the heat-conducting medium introduced in this embodiment can be a liquid or gas mixed with a heat-conducting medium at room temperature. The specific type of heat-conducting medium is not limited. For example, in other embodiments of this embodiment, air mixed with hydrogen or helium can be used as the heat-conducting medium. However, hydrogen has safety issues when heated, and the cost of using helium is high. Based on the influence of thermal conductivity, cost and safety, superconducting liquid mixed with a heat-conducting medium is preferred as the heat-conducting medium in this example.

[0061] As one embodiment of the present invention, such as Figure 4 As shown, the outer cover 100 is provided with mounting holes 101 for fixing the small noodle heating device 400. The small noodle heating device 400 is fixed in the mounting holes 101 and protrudes towards the inner cover 200 relative to the mounting holes 100. Specifically, the small noodle heating device 400 includes a heat source 401 and a fixing part 402 covering the outside of the heat source 401. The heat source 401 is electrically connected to a power board provided in the cooking appliance. The fixing part 402 cooperates with the mounting holes 101 to fix the heat source to the outer cover 100. In this embodiment, the outer cover 100 is generally made of plastic, while the fixing part 402 is generally made of thermally conductive material in order to ensure that the heat from the heat source 401 can be transferred outward. When the fixing part 402 is installed on the outer cover 100 and the heat source 401 is operating normally, the outer cover 100 may deform or even release toxic gases due to continuous heating, affecting the performance of the product and the cooking effect. Therefore, a heat insulation ring 403 is also provided between the outer cover 100 and the fixing part 402 to isolate the heat from the small surface heating device 400.

[0062] The cooking appliance in this invention can be one of a rice cooker, an electric steamer, and an electric slow cooker.

[0063] Furthermore, in the description of this invention, it should be understood that the terms "upper part," "upper layer," "middle upper layer," "upper surface," "lower surface," "below," "lower half region," "inner," "inner side," "outer side," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0064] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," and "communication" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0065] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A top-heated cooking appliance, comprising a pot body and a lid disposed above the pot body, the lid comprising an outer lid and an inner lid mounted inside the outer lid, a heating device disposed between the inner lid and the outer lid, the heating device contacting the inner lid to heat the inner lid, characterized in that, The heating device is a small-face heating device. The inner cover is provided with a heat-conducting structure, which is distributed in a covering manner on the inner cover. The heat-conducting structure contains a heat-conducting medium. The heat-conducting structure is at least partially in contact with the small-face heating device so as to conduct the heat of the small-face heating device to the inner cover through the heat-conducting medium. The small-face heating device is at least partially disposed in the lower half of the pot lid. The inner cover is provided with a positioning hole at the position corresponding to the small-face heating device. The small-face heating device is inserted into the positioning hole and contacts the side wall of the positioning hole. The heat transfer pulse part is disposed outside the positioning hole and contacts the hole wall of the positioning hole. The lower half of the pot lid is the lower half of the pot lid in the open state.

2. A top-heated cooking appliance according to claim 1, characterized in that, The small heating device protrudes from the lower surface of the outer cover toward the inner cover.

3. A top-heated cooking appliance according to claim 2, characterized in that, The outer cover is provided with mounting holes, and the small heating device is fixed in the mounting holes and protrudes towards the inner cover relative to the mounting holes.

4. A top-heated cooking appliance according to claim 1, characterized in that, The heat-conducting structure includes a heat transfer area and a heating area that is in contact with the small-face heating device. The heat transfer area is connected to the heating area so that the heat-conducting medium is concentrated in the heating area when the cover is open.

5. A top-heated cooking appliance according to claim 1, characterized in that, The small heating device is located at the center of the lower half of the pot lid.

6. A top-heated cooking appliance according to claim 1, characterized in that, A heat insulation ring is also provided between the small heating device and the outer cover.

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