A quartz wafer spherical grinding device

Abstract

This invention discloses a spherical grinding apparatus for quartz wafers, belonging to the field of grinding technology. It includes a frame, a loading and unloading system, a circulating sand system, and a grinding system. The grinding system includes a grinding disc, a drive mechanism, and a pressure pin mechanism. Both the pressure pin mechanism and the grinding disc are located on the working platform of the frame. The pressure pin mechanism is located on one side of the grinding disc and is used to press material against the surface of the grinding disc from above. The circulating sand system includes a circulating pump, a sand slurry tank, an outlet pipe, and an inlet pipe. The grinding disc is located in the sand slurry tank. The outlet of the outlet pipe is located directly above the grinding disc, and the inlet of the inlet pipe is located in the sand slurry tank. The circulating pump connects the outlet pipe and the inlet pipe to provide power for the circulation of the sand slurry. This invention achieves automated production of spherical quartz wafers, enabling mass production with high reliability. It reduces problems such as poor processing consistency and low efficiency associated with manual operation, making it suitable for large-scale production.

Description

Technical Field

[0001] This invention belongs to the field of grinding technology, and specifically refers to an automatic spherical grinding device for quartz wafers. Background Technology

[0002] The construction of 5G base stations requires oven-controlled crystal oscillators with excellent short-term stability, and quartz crystals are the core component of oven-controlled crystal oscillators. The spherical design of the quartz crystal directly affects important indicators such as short-term stability, and the consistency of spherical processing plays a decisive role in this performance during the manufacturing process.

[0003] Currently, because quartz wafers are only 0.1-0.6mm thick, the spherical processing methods commonly used in the optical field cannot be used. The industry generally adopts manual grinding on a grinding wheel for spherical processing. This results in problems such as poor processing consistency and low efficiency, and is a bottleneck process in the production of temperature-controlled crystal oscillators. Summary of the Invention

[0004] In view of this, the present invention proposes an automatic spherical grinding device for quartz wafers. This device realizes the automated production of spherical processing of quartz wafers, can be mass-produced and has high reliability, reduces the problems of poor processing consistency and low efficiency caused by manual operation, and is suitable for mass production.

[0005] To achieve the above objectives, the technical solution of the present invention is as follows:

[0006] A quartz wafer spherical grinding apparatus, characterized in that it includes a frame, a loading and unloading system, a circulating sand system, and a grinding system;

[0007] The grinding system includes a grinding disc, a drive mechanism, and a pressing needle mechanism; wherein the pressing needle mechanism and the grinding disc are both located on the working platform of the frame, and the pressing needle mechanism is located on one side of the grinding disc, used to press the material against the surface of the grinding disc from above;

[0008] The loading and unloading system includes an XY two-axis motion mechanism, a suction cup mechanism, and a return gripper mechanism. The XY two-axis motion mechanism is located at the top of the frame, and the suction cup mechanism and the return gripper mechanism are both connected to the moving ends of the XY two-axis motion mechanism. The suction cup mechanism is used to place the material onto the grinding disc, and the return gripper mechanism is used to precisely adjust the material on the grinding disc to the corresponding position.

[0009] The circulating sand system includes a circulating pump, a sand slurry tank, an outlet pipe, and an inlet pipe; the grinding disc is located in the sand slurry tank, the outlet of the outlet pipe is located directly above the grinding disc, the inlet of the inlet pipe is located in the sand slurry tank, and the circulating pump is connected to the outlet pipe and the inlet pipe to provide power for the circulation of the sand slurry.

[0010] Furthermore, the XY two-axis motion mechanism mainly consists of an X-axis motion mechanism and a Y-axis motion mechanism. Both the X-axis and Y-axis motion mechanisms include guide grooves, lead screws, and sliders threadedly connected to the lead screws. The two ends of the X-axis lead screw are connected to the frame via bearings. The X-axis slider, corresponding to the X-axis lead screw, serves as a support platform to receive one end of the Y-axis lead screw. The other end of the Y-axis lead screw is constrained to the X-axis guide rail of the frame via a bearing seat in a sliding connection. The suction cup mechanism and the return gripper are connected to the Y-axis slider. Both the X-axis and Y-axis lead screws are driven to rotate by corresponding lead screw motors.

[0011] Furthermore, both the X-axis slider and the Y-axis slider are constrained in their respective guide grooves, which are perpendicular to each other and parallel to their respective lead screws.

[0012] Furthermore, the suction cup mechanism includes a suction nozzle, a negative pressure component, and a suction cup lifting cylinder; both the suction nozzle and the negative pressure component are located at the actuating end of the suction cup lifting cylinder; the fixed end of the suction cup lifting cylinder is connected to the Y-axis slider; the return gripper mechanism includes a gripper, a gripper drive cylinder, and a gripper lifting cylinder; both the gripper and the gripper drive cylinder are located at the actuating end of the gripper lifting cylinder, and the fixed end of the gripper lifting cylinder is connected to the Y-axis slider.

[0013] Furthermore, the pressure needle mechanism includes a rotating shaft, a moving frame, a pressure needle, and a pressure needle cylinder; the rotating shaft is parallel to the platform of the machine frame by means of bearing connection, one end of the moving frame is connected to the rotating shaft, and the other end is connected to the pressure needle; the pressure needle is perpendicular to the plane of the moving frame; the pressure needle cylinder drives the moving frame to pitch.

[0014] Furthermore, the sand slurry reactor is an annular container, and the output shaft of the drive mechanism passes through the center of the annular container from bottom to top and is fixedly connected to the grinding disc; the drive mechanism includes a drive motor, a pulley and an output shaft, the pulley is located at the bottom of the output shaft and the drive motor provides power to the pulley through the belt; the output shaft and the pulley are fixedly connected to the frame through a lifting mechanism.

[0015] Furthermore, the lifting mechanism includes a lifting screw, a lifting motor, a lifting reducer, and an output shaft support frame; the lifting motor and the lifting reducer are both fixed to the frame, one end of the screw is connected to the reducer, and the other end is connected to the frame bearing; the output shaft support frame is threadedly connected to the screw; and the output shaft is connected to the output shaft support frame bearing.

[0016] Furthermore, a gas-liquid separation filter is provided between the suction nozzle and the negative pressure component to separate the sand liquid sucked up during the material feeding process and the material unloading process.

[0017] Furthermore, the suction cup lifting cylinder is also equipped with a silicone scraper, which sweeps the material that the suction nozzle failed to suck up onto the receiving net through the movement of the XY two-axis motion mechanism.

[0018] Furthermore, the output shaft is also equipped with a stirring joint; the stirring joint is L-shaped, with one end fixedly connected to the output shaft and the other end extending to the bottom of the sand-liquid reactor.

[0019] Furthermore, the suction cup mechanism is provided in two sets, and the suction nozzle of the second set of suction cup mechanism is located between the grippers; the second set of suction cup mechanism also includes a telescopic cylinder, the fixed end of the telescopic cylinder is located on the second suction cup lifting cylinder, and the second suction cup lifting cylinder drives the telescopic cylinder to rise and fall; the suction nozzle of the second set of suction cup mechanism is located at the movable end of the telescopic cylinder; the telescopic direction of the telescopic cylinder is parallel to the X-axis.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] 1. This invention provides a novel automatic spherical grinding device for quartz wafers, which improves production efficiency.

[0022] 2. Wafers polished using the method of this invention exhibit good consistency in spherical surface processing.

[0023] 3. Wafers spherically ground using the method of this invention exhibit good angle processing consistency. Attached Figure Description

[0024] Figure 1 This is a flowchart of the processing procedure of the present invention.

[0025] Figure 2 This is a schematic diagram of the overall structure of the present invention.

[0026] Figure 3 This is a schematic diagram of a two-axis motion device (XY axis).

[0027] Figure 4 This is a schematic diagram of the suction cup mechanism, the return gripper device, and the residual material cleaning device.

[0028] Figure 5 It is a sand-liquid filtration device.

[0029] Figure 6 This is a schematic diagram of a peristaltic pump.

[0030] Figure 7 This is a schematic diagram of a stirring device.

[0031] Figure 8 This is a schematic diagram of the lifting mechanism.

[0032] Figure 9 This is a schematic diagram of the needle pressing mechanism.

[0033] Figure 10 Schematic diagram of a mechanical motion device.

[0034] In the diagram, 1. Loading and unloading system, 2. Grinding system, 3. Frame, 4. Sand liquid tank, 5. Stirring joint, 1-1, 1-2. X-axis motion mechanism, 1-3. X-axis guide rail, 1-4. Y-axis motion mechanism, 1-6. Suction nozzle, 1-7. Silicone scraper, 1-8. Hand gripper, 1-9. Suction nozzle lifting cylinder, 1-10. Hand gripper lifting cylinder, 2-1. Grinding disc, 2-2. Pulley, 2-3. Lifting screw, 2-4. Reducer, 2-5. Motor, 2-6. Output shaft support frame, 2-7. Rotating shaft, 2-8. Triangle frame, 2-9. Needle press cylinder, 2-10. Needle press. Detailed Implementation

[0035] The technical solution of this patent will be further explained in more detail below with specific examples.

[0036] Reference Figures 2 to 10 This embodiment mainly includes a loading and unloading system, a circulating sand system, and a grinding system. The automatic loading and unloading device includes a suction nozzle device, an XY two-axis motion device, a sand filtrate filtration device, a material positioning device, and a residual material cleaning device; the automatic circulating sand system includes a peristaltic pump and a stirring device; the automatic grinding system includes a height adjustment device, a counterweight lifting device, and a mechanical motion device.

[0037] The XY-axis motion device is used to move the material sucked up by the suction nozzle to the working position. X-axis servo modules are installed on both sides of the truss, and sliders that move along the X-axis are mounted on the X-axis servo modules. Y-axis servo modules are assembled between the two Z-axis sliders on both sides, and sliders that move along the Y-axis are mounted on the front of the Y-axis servo modules. The mounting plate is mounted on the front of the Y-axis slider. By controlling the Y-axis servo motor and the X-axis servo motor, the Y-axis servo module drives the slider to move left and right along the Y-axis, and further drives the mounting plate to move along the Y-axis. The X-axis servo module drives the slider to move back and forth along the X-axis, and further drives the mounting plate to move along the X-axis.

[0038] The suction nozzle device is used to pick up and place materials. A telescopic cylinder is connected to the lower left side of the mounting plate via a connector. The telescopic cylinder is connected to a lifting cylinder via a connector. The lifting cylinder is connected to a suction nozzle connector with a buffer via a connector. An air nozzle is connected below the suction nozzle connector. By controlling the telescopic cylinder and the lifting cylinder, the telescopic cylinder drives the lifting cylinder and the suction nozzle to move forward and backward, and the lifting cylinder drives the movable rod to rise and fall.

[0039] The sand slurry filtration device is used to filter the sand slurry sucked up by the suction nozzle during the suction process. During the operation of the equipment, the suction nozzle will inevitably suck up some grinding slurry used for grinding. Therefore, the sand slurry filtration device can prevent the air circuit of the equipment from being contaminated by sand slurry. Specifically, an air-liquid separation filter is added between the suction nozzle connector and the solenoid valve through an air pipe to separate the sand slurry sucked up during the material feeding and unloading processes.

[0040] The material positioning device is used to adjust the material placed by the suction nozzle to a precise position. A lifting cylinder at the bottom of the mounting plate connects to a gripper drive cylinder, with clamps attached to both sides of the gripper drive cylinder. By controlling the lifting cylinder, the gripper drive cylinder and clamps rise and fall, and the gripper drive cylinder clamps and releases. When material is placed on the grinding disc, the clamps tighten the material, precisely adjusting it to the working position.

[0041] The residual material cleaning device is used to clean up the material that the suction nozzle device at the working position failed to pick up. An L-shaped bracket is connected to the bottom of a lifting cylinder, and a silicone scraper is installed at the end of the L-shaped bracket. By controlling the lifting cylinder of the material positioning device, the L-shaped bracket is raised and lowered. When it lowers, the silicone scraper falls onto the grinding disc, and the XY axis motion transmission mechanism moves, scraping the remaining wafers onto the receiving net.

[0042] The peristaltic pump is used to deliver the abrasive. The peristaltic pump works by squeezing the hose with rollers. The squeezing speed is adjustable. Both ends of the hose are placed in the abrasive solution. One end is the abrasive inlet and the other end is the abrasive outlet. The direction cannot be reversed, which can achieve the purpose of circulating supply of abrasive.

[0043] The stirring device is used to stir the grinding agent evenly. The stirring device refers to the stirring joint fixed to the base of the grinding disc. One end of the stirring joint is fixed to the bottom side of the grinding disc, and the other end is placed in the sand liquid and in direct contact with the bottom of the container. During the rotation of the grinding disc, the scraper at the bottom of the stirring joint rotates at the same speed to stir the sand liquid evenly and prevent the sand liquid from settling.

[0044] The height adjustment device is used to adjust the grinding disc to the appropriate grinding position. A double groove is installed on the lower back of the worktable, with an output shaft support frame embedded in the middle of the groove. A lifting motor is located below the output shaft support frame. By controlling the lifting motor, the lead screw driven by the motor is threadedly connected to the output shaft support frame to achieve vertical movement. This allows the grinding disc to be raised and lowered regardless of its thickness, ensuring that the grinding disc is always at the same horizontal position, thus avoiding repeated parameter adjustments, which wastes time and is cumbersome to operate.

[0045] The counterweight lifting device is used for automatic lifting each time the material is changed. The lifting is accomplished by a cylinder. The cylinder rod pushes against the tripod, and the tripod pops out and retracts with the cylinder push rod, realizing the downward pressing and lifting of the counterweight.

[0046] Figure 1 In the working process of this embodiment, the mechanical motion device is used to provide mechanical rotation and start / stop during grinding. A servo motor is installed under the worktable to provide power for the rotation of the grinding disc. The position sensing is performed by a fiber optic probe to ensure accurate recording of the start / stop position and the number of grinding revolutions each time, thus ensuring the consistency of the grinding effect.

[0047] The table below compares the data from SC-10M quartz wafer spherical processing performed using this equipment with manual processing:

[0048] project Handicrafts This process promote efficiency Approximately 40 pieces / hour 127 pieces / hour 3 times Curvature pass rate 75％ 92％ 17％ Angle pass rate 82％ 95％ 13％ Frequency pass rate 92％ 96％ 4％

[0049] As can be seen, the present invention realizes the automated production of spherical processing of quartz wafers, which can be mass-produced with high reliability, reduces the problems of poor processing consistency and low efficiency caused by manual operation, and is suitable for mass production.

Claims

1. A spherical grinding apparatus for quartz wafers, characterized in that, Includes the frame, loading and unloading system, circulating sand system, and grinding system; The grinding system includes a grinding disc, a drive mechanism, and a pressing needle mechanism; wherein the pressing needle mechanism and the grinding disc are both located on the working platform of the frame, and the pressing needle mechanism is located on one side of the grinding disc, used to press the material against the surface of the grinding disc from above; The loading and unloading system includes an XY two-axis motion mechanism, a suction cup mechanism, and a return gripper mechanism. The XY two-axis motion mechanism is located at the top of the frame, and the suction cup mechanism and the return gripper mechanism are both connected to the moving ends of the XY two-axis motion mechanism. The suction cup mechanism is used to place the material onto the grinding disc, and the return gripper mechanism is used to precisely adjust the material on the grinding disc to the corresponding position. The circulating sand system includes a circulating pump, a sand slurry tank, an outlet pipe, and an inlet pipe; the grinding disc is located in the sand slurry tank, the outlet of the outlet pipe is located directly above the grinding disc, the inlet of the inlet pipe is located in the sand slurry tank, and the circulating pump is connected to the outlet pipe and the inlet pipe to provide power for the circulation of the sand slurry.

2. The quartz wafer spherical grinding apparatus according to claim 1, characterized in that, The XY two-axis motion mechanism is mainly composed of an X-axis motion mechanism and a Y-axis motion mechanism. Both the X-axis motion mechanism and the Y-axis motion mechanism include a guide groove, a lead screw, and a slider that is threadedly connected to the lead screw. The X-axis lead screw is connected to the frame at both ends by bearings. The X-axis slider corresponding to the X-axis lead screw serves as a support to receive one end of the Y-axis lead screw. The other end of the Y-axis lead screw is constrained to the X-axis guide rail of the frame by a sliding connection through a bearing seat. The suction cup mechanism and the return gripper are connected to the Y-axis slider. Both the X-axis lead screw and the Y-axis lead screw are driven to rotate by their respective lead screw motors.

3. The quartz wafer spherical grinding apparatus according to claim 2, characterized in that, Both the X-axis slider and the Y-axis slider are constrained in their respective guide slots, which are perpendicular to each other and parallel to their respective lead screws.

4. The quartz wafer spherical grinding apparatus according to claim 1, characterized in that, The suction cup mechanism includes a suction nozzle, a negative pressure component, and a suction cup lifting cylinder; both the suction nozzle and the negative pressure component are located at the actuating end of the suction cup lifting cylinder; the fixed end of the suction cup lifting cylinder is connected to the Y-axis slider; the return gripper mechanism includes a gripper, a gripper drive cylinder, and a gripper lifting cylinder; both the gripper and the gripper drive cylinder are located at the actuating end of the gripper lifting cylinder, and the fixed end of the gripper lifting cylinder is connected to the Y-axis slider.

5. The quartz wafer spherical grinding apparatus according to claim 1, characterized in that, The needle pressing mechanism includes a rotating shaft, a moving frame, a needle, and a needle pressing cylinder. The rotating shaft is parallel to the platform of the machine frame by means of bearing connection. One end of the moving frame is connected to the rotating shaft, and the other end is connected to the needle. The needle is perpendicular to the plane of the moving frame. The needle pressing cylinder drives the moving frame to pitch.

6. The quartz wafer spherical grinding apparatus according to claim 1, characterized in that, The sand slurry reactor is an annular container. The output shaft of the drive mechanism passes through the center of the annular container from bottom to top and is fixedly connected to the grinding disc. The drive mechanism includes a drive motor, a pulley, and an output shaft. The pulley is located at the bottom of the output shaft, and the drive motor provides power to the pulley through a belt. The output shaft and the pulley are fixedly connected to the frame through a lifting mechanism.

7. The quartz wafer spherical grinding apparatus according to claim 6, characterized in that, The lifting mechanism includes a lifting screw, a lifting motor, a lifting reducer, and an output shaft support frame; the lifting motor and the lifting reducer are both fixed on the frame, one end of the lifting screw is connected to the lifting reducer, and the other end is connected to the frame bearing; the output shaft support frame is threadedly connected to the lifting screw; the output shaft is connected to the output shaft support frame by a bearing, and the output shaft support frame is slidably connected to the frame.

8. The quartz wafer spherical grinding apparatus according to claim 4, characterized in that, A gas-liquid separation filter is also provided between the suction nozzle and the negative pressure component to separate the sand and liquid sucked up during the material feeding and material unloading processes; a silicone scraper is also provided on the gripper lifting cylinder to sweep the material that the suction nozzle failed to suck up onto the receiving net through the movement of the XY two-axis motion mechanism.

9. A quartz wafer spherical grinding apparatus according to claim 6, characterized in that, The output shaft is also equipped with a stirring joint; the stirring joint is L-shaped, with one end fixedly connected to the output shaft and the other end extending to the bottom of the sand-liquid reactor.

10. A quartz wafer spherical grinding apparatus according to claim 4, characterized in that, The suction cup mechanism is provided in two sets, and the suction nozzle of the second set of suction cup mechanism is located between the grippers; the second set of suction cup mechanism also includes a telescopic cylinder, the fixed end of the telescopic cylinder is located on the second suction cup lifting cylinder, and the second suction cup lifting cylinder drives the telescopic cylinder to rise and fall; the suction nozzle of the second set of suction cup mechanism is located at the movable end of the telescopic cylinder; the telescopic direction of the telescopic cylinder is parallel to the X-axis.

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