Packaging material, manufacturing method of packaging material and packaging structure

Abstract

The present disclosure provides a packaging material, a manufacturing method for the packaging material, and a packaging structure for packaging electronic devices. The packaging material comprises a stacked packaging material sheet and a film. The packaging material sheet is doped with an antistatic liquid, and the film is provided with a plurality of micropores, each having a pore size smaller than the diameter of droplets of the antistatic liquid. This packaging material retains its antistatic function while also preventing the antistatic liquid from dripping, thereby ensuring the surface quality of the packaged electronic device.

Description

Technical Field

[0001] The present application relates to the technical field of electronic product packaging, and in particular to a packaging material, a manufacturing method of the packaging material, and a packaging structure. Background Art

[0002] Packaging materials used in the electronics industry usually need to have anti-static design capabilities. Before the packaging materials are thermoformed, an appropriate amount of anti-static liquid can be added along with the packaging materials (such as resin particles) through the equipment inlet. The packaging sheets are extruded through a screw extruder to prepare them. The packaging sheets of appropriate sizes are then thermoformed to prepare packaging structures or packaging products with anti-static capabilities.

[0003] However, during periods of high ambient temperature, such as spring, summer, and autumn, the high temperatures within the shipping container can easily cause the anti-static fluid to precipitate and drip onto the surface of the packaged products, contaminating them and making removal difficult or, for some products, impossible, leading to quality issues. This problem is particularly acute in the semiconductor display and integrated circuit chip sectors, due to the high precision and strict surface cleanliness requirements of semiconductor products. Summary of the Invention

[0004] In view of the above problems, the present disclosure provides a packaging material, a method for manufacturing the packaging material, and a packaging structure, which can prevent the antistatic liquid in the packaging structure or packaging material from precipitating and dripping, and improve the surface quality of the packaged product.

[0005] In a first aspect, the present disclosure provides the following technical solutions through an embodiment:

[0006] A packaging material for packaging electronic equipment, comprising stacked packaging material sheets and films, wherein the packaging material sheets are doped with antistatic liquid, and the film is provided with a plurality of micropores, wherein the pore diameter of the micropores is smaller than the diameter of the precipitated droplets of the antistatic liquid.

[0007] In some embodiments, the multiple micropores are arranged in an array of N-gons, and one of the micropores is arranged at the common endpoint of 360 / Q N-gons that are spliced ​​together, N ≥ 3 and is an integer, and Q is the degree of a single internal angle of the N-gon; the side length of the N-gon is determined according to the maximum diffusion distance of the antistatic liquid and the radius of the micropore, and the maximum diffusion distance is the distance between the precipitated droplets of the antistatic liquid.

[0008] In some embodiments, the N-gon is a square, and the side length of the square, the maximum diffusion distance of the antistatic liquid, and the radius of the micropore satisfy:

[0009]

[0010] Wherein, L' is the maximum diffusion distance, in nm; L1 is the side length of the square, in nm; R1 is the radius of the micropore, in nm.

[0011] In some embodiments, the N-gon is an equilateral triangle, and the side length of the equilateral triangle, the maximum diffusion distance of the antistatic liquid, and the radius of the micropore satisfy:

[0012]

[0013] Wherein, L" is the maximum diffusion distance, in nm; L2 is the side length of the equilateral triangle; R2 is the radius of the micropore, in nm.

[0014] In some embodiments, the pore size of the micropores is 10% to 50% of the diameter of the precipitated droplets.

[0015] In some embodiments, in a direction parallel to the surface of the packaging material sheet, the cross-sectional shape of the micropore is circular or polygonal.

[0016] In some embodiments, in the thickness direction of the film, the pore size of the micropore is positively correlated with the distance between the micropore and the packaging material sheet.

[0017] In the second aspect, based on the same inventive concept, the present disclosure provides the following technical solutions through an embodiment:

[0018] A method for manufacturing a packaging material, comprising:

[0019] Providing a packaging material sheet, wherein the packaging material sheet is doped with an antistatic liquid;

[0020] Providing a film and a needle mold, adsorbing the film onto a foaming plate, and forming a plurality of micropores on the film using the needle mold;

[0021] The film including the plurality of micropores is disposed on the packaging material sheet to obtain the packaging material.

[0022] In some embodiments, the plurality of micropores are arranged in an array of N-gons, and one micropore is provided at a common endpoint of 360 / Q of the N-gons that are connected to each other, where N is greater than or equal to 3 and is an integer, and Q is the degree of a single internal angle of the N-gon.

[0023] Provide needle molds, including:

[0024] Obtaining the type of the antistatic liquid, the diameter of the precipitated droplets, and the crosslinking properties between the antistatic liquid and the packaging material sheet;

[0025] determining a maximum diffusion distance of the antistatic liquid according to the type and the cross-linking performance;

[0026] Determining the pore size of the micropores according to the diameter of the precipitated liquid droplets;

[0027] Determining the side length of the N-gon according to the maximum diffusion distance and the aperture;

[0028] The needle mold is manufactured according to the N-gon, the side length of the N-gon and the hole diameter.

[0029] In a third aspect, based on the same inventive concept, the present disclosure provides the following technical solutions through an embodiment:

[0030] A packaging structure includes a first packaging material and a second packaging material. The first packaging material and the second packaging material are combined to form a housing cavity for an electronic device. The first packaging material and / or the second packaging material are obtained by molding the packaging material provided in an embodiment of the first aspect. The film in the first packaging material and / or the second packaging material is located in the housing cavity.

[0031] In some embodiments, the electronic device is a display panel having a display area, and the orthographic projection of the setting area of ​​the multiple micropores in the first packaging material and the second packaging material on the display panel coincides with the display area, or the setting area of ​​the multiple micropores covers the display panel.

[0032] In some embodiments, the first packaging material and the second packaging material include a contact area in contact with the display panel and a non-contact area separated from the display panel, and the pore density of the micropores in the contact area is lower than the pore density in the non-contact area.

[0033] Through one or more technical solutions of the present disclosure, the present disclosure has the following beneficial effects or advantages:

[0034] The present disclosure provides a packaging material, a method for manufacturing the packaging material, and a packaging structure, wherein a thin film on a packaging material sheet is provided with a plurality of micropores. The plurality of micropores can, on the one hand, serve as static dissipation channels to ensure antistatic performance for the packaged product; on the other hand, the diameter of the precipitated droplets of the antistatic liquid is based on the surface tension and viscosity of the antistatic liquid. The diameter required for the antistatic liquid to precipitate and drip is obtained through a droplet model. Therefore, when the pore diameter of the micropore is smaller than the diameter of the precipitated droplet, even if the antistatic liquid precipitates, it cannot drip through the micropore. Thus, the antistatic liquid is prevented from dripping at the micropores and the precipitation of the antistatic liquid is isolated in the area outside the micropores, thereby ensuring the surface quality of the packaged product.

[0035] The above description is only an overview of the technical solution of the present disclosure. In order to more clearly understand the technical means of the present disclosure, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present disclosure more obvious and easy to understand, the specific implementation methods of the present disclosure are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present disclosure. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0037] Figure 1 shows a top view of a packaging material according to an embodiment of the present disclosure;

[0038] Figure 2 shows a cross-sectional view of a packaging material according to an embodiment of the present disclosure;

[0039] Figure 3 A schematic diagram showing a plurality of microwells arranged in a square array according to an embodiment of the present disclosure is shown;

[0040] Figure 4 A schematic diagram showing a plurality of microwells arranged in an equilateral triangle array according to an embodiment of the present disclosure is shown;

[0041] Figure 5 A schematic diagram of a manufacturing method of a packaging material according to an embodiment of the present disclosure is shown;

[0042] Figure 6 shows a front view of a plate-shaped needle mold according to an embodiment of the present disclosure;

[0043] Figure 7 shows a cross-sectional view of a plate-shaped needle mold according to an embodiment of the present disclosure;

[0044] Figure 8 A schematic diagram showing a needle mold forming holes on a film according to an embodiment of the present disclosure is shown;

[0045] Figure 9 A cross-sectional view of a roller-shaped needle mold according to an embodiment of the present disclosure is shown.

[0046] Figure 10 A left side view of a roller-shaped needle mold according to an embodiment of the present disclosure is shown;

[0047] Figure 11 A schematic diagram of a packaging structure according to an embodiment of the present disclosure is shown;

[0048] Figure 12A top view of a first packaging material formed into a concave mold shape and used for packaging a display panel according to an embodiment of the present disclosure is shown;

[0049] Figure 13 A top view of a first packaging material for packaging a display panel and having micropores only in the display area according to an embodiment of the present disclosure is shown;

[0050] Description of reference numerals:

[0051] 10. Packaging material; 11. Packaging sheet; 12. Film; 13. Micropore;

[0052] 20. Needle mold; 21. Mold base; 22. Needle; 23. Spindle hole;

[0053] 30. Foam board; 31. Through hole;

[0054] 40. Packaging structure; 41. First packaging material; 42. Second packaging material; 43. Accommodating cavity. DETAILED DESCRIPTION

[0055] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are merely illustrative and are not intended to limit the scope of the present disclosure. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0056] The accompanying drawings illustrate various schematic diagrams of structures according to embodiments of the present disclosure. These figures are not drawn to scale, and for the purpose of clarity, certain details are exaggerated and certain details may be omitted. The shapes of the various regions and layers shown in the figures, as well as their relative sizes and positional relationships, are merely exemplary and may deviate in practice due to manufacturing tolerances or technical limitations. Those skilled in the art may design regions / layers with different shapes, sizes, and relative positions as needed.

[0057] In the context of the present disclosure, when a layer / element is referred to as being "on" another layer / element, it can be directly on the other layer / element or an intervening layer / element may be present therebetween. In addition, if a layer / element is "on" another layer / element in one orientation, it may be "below" the other layer / element when the orientation is reversed.

[0058] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0059] Traditional packaging materials are made by extrusion. The raw materials for these sheets can include PET (polyethylene terephthalate) / ABS (a terpolymer of acrylonitrile (A), butadiene (B), and styrene (S)), PP (polypropylene), or PE (polyethylene), plus masterbatch, electrostatic fluid, and polishing powder. The prepared sheets are then molded or thermoformed to create anti-static packaging. These sheets can be used for packaging and shipping various electronic products, such as semiconductor displays and integrated circuit chips.

[0060] However, packaging materials that use antistatic fluid for ESD protection can precipitate in high-temperature environments, leading to secondary contamination of the packaged products. For example, a company recently faced concerns about surface cleanliness issues with displays and medical imaging detectors caused by leaching of antistatic fluid from packaging materials. Display products contaminated with antistatic fluid require vigorous wiping with alcohol to remove it, a process that can cause ESD (electrostatic discharge) or scratches on the panel. Furthermore, FPXD medical flat-panel X-ray detectors, whose surfaces cannot be wiped clean, are irreparable after contamination by antistatic fluid. However, reducing the amount of antistatic fluid incorporated into the packaging sheet during preparation to mitigate contamination will result in a reduction in the ESD protection provided by the electronic component packaging.

[0061] Therefore, in order to better solve the pollution problem caused by the precipitation and dripping of the anti-static liquid, firstly, in an optional embodiment, refer to Figures 1 and 2 , provides a packaging material 10 for packaging electronic equipment, the packaging material 10 includes a stacked packaging material sheet 11 and a film 12, the packaging material sheet 11 is doped with antistatic liquid, and the film 12 is provided with a plurality of micropores 13, the pore diameter of the micropores 13 is smaller than the diameter of the precipitated droplets of the antistatic liquid.

[0062] Specifically, the packaging material 10 provided in this embodiment can be a pre-molded profile in the shape of the electronic device to be packaged, or a pre-molded sheet. The packaging material sheet 11, also known as the packaging material substrate, is formed by extruding a base material such as PET / ABS / PP / PE into which materials such as masterbatch, electrostatic fluid, and polishing powder are added. A film 12 having multiple micropores 13 is applied to the packaging material sheet 11 to form the plate- or sheet-like packaging material 10. This can then be molded into a packaging structure for various electronic products or components.

[0063] Among them, the multiple micropores 13 set on the film 12 can serve as static dissipation channels to ensure the anti-static performance of the packaged products. Without the micropores 13, the static electricity on the electronic products cannot be released, causing the packaging material 10 to lose its electrostatic protection function.

[0064] The diameter of the precipitated droplets of the antistatic liquid is based on the surface tension and viscosity of the antistatic liquid. It is the necessary diameter or minimum diameter that the antistatic liquid needs to precipitate and drip, calculated by the droplet model. The droplet model is a model used to describe the behavior of liquids (including high molecular organic matter) at the microscopic scale. The droplet model regards the liquid as a whole composed of countless tiny droplets. Each droplet has a certain surface tension and viscosity. By simulating and analyzing the interaction force between the droplets, the macroscopic dripping properties of the liquid can be obtained, and the minimum diameter that the antistatic liquid needs to precipitate and drip can be obtained. Optionally, the simulation of the precipitation and dripping behavior of the antistatic liquid can be carried out under the conditions of an ambient temperature of 80°C and a duration of 500 hours.

[0065] Therefore, if the diameter of micropores 13 is smaller than the diameter of the precipitated droplets, even if the antistatic liquid precipitates, it cannot aggregate into droplets of sufficient diameter to drip through micropores 13. Therefore, although the film 12 has micropores 13, they cannot serve as channels for the antistatic liquid to penetrate or drip. This prevents the antistatic liquid from dripping through the micropores 13 and isolates the antistatic liquid from precipitating in areas outside the micropores 13, thus ensuring the surface quality of the packaged product.

[0066] In some embodiments, the plurality of micropores 13 are arranged in an array of N-gons, with each micropore 13 located at the common endpoint of 360 / Q interconnected N-gons, where N is an integer ≥ 3, and Q is the degree of a single internal angle of the N-gon. This array arrangement makes the distribution of the plurality of micropores 13 more uniform across the film 12, thereby providing better electrostatic protection and preventing the antistatic liquid from precipitating and dripping, and helps reduce the number of micropores 13.

[0067] In some embodiments, the side length of the N-gon is determined based on the maximum diffusion distance of the antistatic liquid and the radius of the micropores. The maximum diffusion distance is the distance between the precipitated droplets of the antistatic liquid. For the sake of clarity, the following further describes the example of a square and an equilateral triangle.

[0068] Specifically, the square layout is as follows Figure 3 As shown, multiple micropores 13 form a micropore array with a square layout. Each square is a minimum, repeatedly arranged array unit, and a micropore 13 is provided at its four endpoints or corners. Multiple squares are sequentially spliced ​​to form a micropore array. The angle of one inner corner of the square is 90°, so the micropore 13 at one corner point belongs to the array units of four squares at the same time. At this time, the maximum diffusion distance of the antistatic liquid is equal to the length of the side of the square. The difference between the radius of the micropore 13 (referred to as the pore radius) is related to the times, and its mathematical expression is as follows:

[0069]

[0070] In the above formula, L' is the maximum diffusion distance of the antistatic liquid in a square layout, measured in nm, and can be a one-dimensional diffusion distance; L1 is the side length of the square, i.e., the distance between two adjacent microwells 13, measured in nm; and R1 is the radius of microwell 13, measured in nm. For a square microwell array, the maximum diffusion distance L' of the antistatic liquid can be considered the distance between the center of the square and the edge of the microwell 13.

[0071] The array arrangement of equilateral triangles is as follows Figure 4 As shown, multiple micropores 13 form a micropore array with an equilateral triangle layout; each equilateral triangle is a minimum, repeatedly arranged array unit, and a micropore 13 is provided at its three endpoints or corners. Multiple equilateral triangles are sequentially spliced ​​to form a micropore array, and the angle of an internal angle of an equilateral triangle is 60°, so the micropore 13 at a corner point belongs to the array units of 6 equilateral triangles at the same time. At this time, the maximum diffusion distance of the antistatic liquid is equal to the length of the side of the equilateral triangle. The times are related to the difference in hole radius, and its mathematical expression is as follows:

[0072]

[0073] In the above formula, L" is the maximum diffusion distance of the antistatic liquid (in one-dimensional direction) in the equilateral triangle scheme, and the unit is nm; L2 is the side length of the equilateral triangle, that is, the distance between two adjacent micropores 13, and the unit is nm; R2 is the pore radius of the micropore 13, and the unit is nm. For a micropore array with an equilateral triangle layout, the maximum diffusion distance L" of the antistatic liquid can be regarded as the distance between the center point of the equilateral triangle and the edge of the micropore 13.

[0074] Alternatively, the arrangement design of the micropores 13 may also adopt other shapes, such as a micropore array composed of regular pentagons or regular hexagons. The spacing of the micropores, that is, the side length of the regular pentagon or regular hexagon, can refer to the principles of formula (1) and formula (2), and the distance from the center point of the regular pentagon or regular hexagon to the edge of the micropore 13 is used as the maximum diffusion distance of the antistatic liquid for reverse calculation. The diffusion distance of the antistatic liquid can be simulated by the packaging material sheet 11 under the conditions of 60℃~100℃, so as to obtain the distance L' or L" between adjacent electrostatic liquid precipitation droplets. The design value of the pore size needs to be determined by considering the type and concentration ratio of the antistatic liquid in combination with the droplet model. Usually, the electrostatic liquid material is organic. Under the above simulation environment, the diameter D of the precipitation droplet can be determined, and then the pore size of the micropore 13 is obtained. Considering the diffusion performance of the antistatic liquid, the arrangement method of the micropore array composed of equilateral triangles is more effective, and the number of micropores 13 required under this arrangement scheme is relatively small, which can reduce production costs.

[0075] Therefore, the specific arrangement of the plurality of micropores 13 on the film 12 can be determined using the following process:

[0076] 1) Determine the maximum diffusion distance (L' or L") of the antistatic liquid in one dimension through simulation based on the type of antistatic liquid and the crosslinking properties between the antistatic liquid and the packaging sheet 11;

[0077] 2) Based on the type and concentration ratio of the antistatic liquid, the diameter D of the antistatic liquid droplets is simulated in combination with a droplet model, and the pore size (diameter) of the micropore 13 is determined based on the precipitated droplet diameter D. For example, if the precipitated droplet diameter D of a certain antistatic liquid is determined to be 0.2 μm to 0.3 μm, then the pore size of the micropore 13 only needs to be designed to be less than 0.2 μm to prevent the antistatic liquid from precipitating and dripping. The preferred pore size is 1 / 2 to 1 / 10 of the precipitated droplet diameter D, that is, the pore diameter of the micropore 13 is 10% to 50% of the precipitated droplet diameter D. This can better prevent the aggregation and dripping of the antistatic liquid while not affecting the static discharge of the packaged electronic device.

[0078] 3) Calculate the side length (L1 or L2) of the N-gon based on the maximum diffusion distance (L' or L") and the pore size, combined with the shape of the N-gon.

[0079] After determining the pore diameters of the micropore array and the side lengths of the N-gon, a corresponding needle mold 20 can be manufactured to form the corresponding micropore array on the film 12. The needle mold 20 can be provided with multiple needles 22 corresponding to the shape of the micropore array and the pore diameters of the micropores 13 to puncture the desired micropore array on the film 12.

[0080] Therefore, an optional method for manufacturing the packaging material 10 can be found in Figure 5 , including steps S51 to S53, specifically as follows:

[0081] S51: providing a packaging material sheet 11, wherein the packaging material sheet 11 is doped with antistatic liquid.

[0082] S52 : providing a film 12 and a needle mold 20 , adsorbing the film 12 onto the foaming plate 30 , and forming a plurality of micropores 13 on the film 12 using the needle mold 20 .

[0083] The film 12 can be made of a material that matches the packaging sheet 11, such as a PET film, a PE film, a PS film, or an ASB film. Alternatively, a resin material combination that has a high degree of adhesion to the packaging sheet 11, such as a combination of an amino resin and an epoxy resin, can be selected. This can improve the bonding strength between the film 12 and the sheet substrate and facilitate the formation of multiple micropores 13 through the needle mold 20. The thickness of the film 12 can be 3 μm to 50 μm, such as 3 μm, 6 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, and the like.

[0084] See also Figure 6 and Figure 7 , provides a plate-shaped needle mold 20, including a mold base 21 and a plurality of needles 22 arranged on the mold base 21. The mold base 21 can be made of alloy steel, which has the advantages of being not easily deformed and worn. The array of needles 22 composed of multiple needles 22 arranged on the mold base 21 corresponds to the array of micropores to be punctured on the film 12. The diameter of the needle tail of the needle 22 connected to the mold base 21 can be set to 0.2mm~2mm, such as 1mm, to facilitate fixing the needle 22 on the mold base 21. The diameter of the needle tip of the needle 22 is determined according to the aperture of the micropore 13 to be formed, and the length of the needle 22 can be designed to be 5mm~20mm. Since the pore size of the micropore 13 can be determined based on indicators such as the precipitation characteristics of the antistatic liquid and the polymer cross-linking characteristics between the antistatic liquid and the polymer material of the resin packaging material 10, the pore size of the micropore 13 can be adjusted by controlling the pressing depth of the needle mold 20 to form nano-scale, micron-scale or millimeter-scale micropores 13 to meet the control requirements of the precipitation droplet diameter of different antistatic liquids.

[0085] The foaming plate 30 is used to fix the film 12 when forming the micropores 13, and then the micropores 13 are punched out using the needle mold 20. Figure 8Optionally, the foaming plate 30 is further provided with a through hole 31. When forming the micropores 13, a negative pressure can be set in the through hole 31 to adsorb the film 12 onto the foaming plate 30. This prevents the film 12 from being removed from the foaming plate 30 when the needle mold 20 is removed. The foaming plate 30 and its through hole 31 can also prevent the needle 22 from being injured.

[0086] See also Figure 9 and Figure 10 , provides a roller-shaped needle mold 20, including a cylindrical mold base 21 and a plurality of needles 22 arranged on the mold base 21, a main shaft hole 23 is provided at the axis of the cylindrical mold base 21, and the inner wall of the main shaft hole 23 is provided with a thread for setting a rotating shaft or a motor output shaft to realize controlling the roller-shaped needle mold 20 to form holes on the surface of the film 12 by rolling.

[0087] Since the shape and arrangement of the needles 22 on the needle mold 20 correspond to the micropore array, the following method can be used to provide:

[0088] Obtain the type of antistatic liquid, the diameter of the precipitated droplets, and the cross-linking properties between the antistatic liquid and the packaging material sheet 11; determine the maximum diffusion distance of the antistatic liquid based on the type and cross-linking properties; determine the pore size of the micropore 13 based on the diameter of the precipitated droplets; determine the side length of the N-gon based on the maximum diffusion distance and the pore size; and manufacture the needle mold 20 based on the N-gon, the side length of the N-gon, and the pore size.

[0089] Optionally, the shape of the needle used to form the micropore 13 can be circular or polygonal. Then, in the corresponding micropore array formed, the cross-sectional shape of the micropore 13 is circular or polygonal in the surface direction parallel to the packaging material sheet 11, that is, in the plane direction of the packaging material sheet 11.

[0090] Optionally, along the thickness direction of the film 12, the diameter of the micropores 13 is positively correlated with the distance from the packaging sheet 11. In other words, the micropores 13 are funnel-shaped, with a relatively small diameter near the packaging sheet 11 and a relatively large diameter farther from the packaging sheet 11. This prevents the antistatic liquid from precipitating and dripping while also enhancing electrostatic protection.

[0091] S53 : placing the film 12 including a plurality of micropores 13 on the packaging material sheet 11 to obtain the packaging material 10 .

[0092] The film 12 and the packaging material sheet 11 can be preheated and bonded to obtain the packaging material 10, which can then be molded, such as through a heat blister process, using a mold that matches the size of the electronic product to be packaged to form, cool and remove burrs to prepare a packaging structure 40 that can be used to package electronic products.

[0093] In summary, the packaging material 10 provided in the embodiment of the present disclosure can effectively prevent the precipitation and dripping of the antistatic liquid in the packaging material sheet 11 by setting micropores 13 with a pore size smaller than the diameter of the precipitated liquid droplets on the packaging material sheet 11 containing the antistatic liquid, while retaining the antistatic performance of the packaging material 10. After the packaging material 10 is formed into a packaging structure 40, it can be used to package various electronic products or components, reduce the risk of secondary contamination during packaging and transportation, and improve product quality. For example, electronic products or components that can be used for packaging include but are not limited to: thin film transistor-liquid crystal display products TFT-LCD, sub-millimeter light emitting diode / micro light emitting diode display products Mini / Micro LED, virtual application and virtual reality products VA&VR, medical flat panel X-ray detectors FPXD, gene sequencing products, smart windows, molecular antennas, electronic paper display products EPD, MM display products, semi-transparent and semi-reflective products, etc. Before packaging, one or more pieces of packaging material 10 can be used for molding to obtain a packaging structure that matches the specific shape of the electronic device to better package the electronic product.

[0094] In another optional embodiment, please refer to Figure 11 An optional packaging structure 40 includes a first packaging material 41 and a second packaging material 42. The first packaging material 41 and the second packaging material 42 are combined to form a receiving cavity 43 for the electronic device. The first packaging material 41 and / or the second packaging material 42 are obtained by molding the packaging material 10 provided in the embodiment of the present disclosure. The film 12 in the first packaging material 41 and / or the second packaging material 42 is located in the receiving cavity 43.

[0095] Specifically, the packaging structure 40 of the electronic product can be a concave-convex mold structure, which can form the first packaging material 41 into a concave mold structure for containing electronic products; the second packaging material 42 is formed into a convex mold structure, which can be used as a protective cover to prevent foreign matter or other debris from falling onto the surface of electronic components, and can also play a shading role.

[0096] In actual applications, different electronic devices, such as liquid crystal panels LCD, micro-electromechanical (MEMS) products, MiniLED, etc., have different surface quality requirements for the front and back sides. When both sides have requirements, a film 12 containing multiple micropores 13 can be set on the first packaging material 41 and the second packaging material 42 on the side close to the display panel; if only one side is required, a film 12 containing multiple micropores 13 can be set only on one side to reduce packaging costs. Taking the display panel as an example, if the base substrate of the display panel is a pure glass substrate or other substrate with low surface quality requirements, the second packaging material 42 located on the base substrate or the backlight side of the display panel may not be provided with a film 12 containing multiple micropores 13; and the first packaging material 41 located on the light-emitting side of the display panel and in contact with the display panel needs to be provided with a film 12 containing multiple micropores 13, that is, the packaging material 10 provided by the first embodiment is obtained by thermal absorption molding.

[0097] For the packaging of the display panel, in some embodiments, the orthographic projection of the setting area of ​​the multiple micropores 13 in the first packaging material 41 and the second packaging material 42 on the display panel coincides with the display area, or the setting area of ​​the multiple micropores 13 covers the display panel.

[0098] For details, please refer to Figure 12 , provides a schematic diagram of a first packaging material 41 formed into a concave mold for packaging display panels. A flat packaging material 10 can be used and formed by thermoforming according to the shape or layout of the display panel to be packaged. The micropores 13 of the first packaging material 41 cover the entire display panel placement area. Figure 13 Another schematic diagram of a first packaging material 41 formed into a concave mold for packaging a display panel is provided. Figure 12 The difference is that the micropores 13 on the film 12 only cover the display area of ​​the display panel, that is, the positive projection of the micropore 13 area of ​​the first packaging material 41 on the display panel coincides with the display area. Since the display area of ​​the display panel is a sensitive area, for display products, droplets will cause a lot of rework, and for sensor devices such as FPXD, micro-electromechanical MEMS devices, etc., dripping of anti-static liquid must be strictly avoided. Therefore, micropores 13 need to be arranged on the film 12 of the second packaging material 42 corresponding to the backlight side of the display area, and on the film 12 of the first packaging material 41 corresponding to the light-emitting side of the display area. Micropores 13 may not be arranged in other areas of the display panel, or they may be arranged (such as Figure 12 It can be flexibly adjusted according to actual needs.

[0099] Optionally, the first packaging material 41 and the second packaging material 42 include a contact area that contacts the display panel and a non-contact area separated from the display panel, and the micropores 13 have a lower density in the contact area than in the non-contact area. Providing fewer micropores 13 in the contact area can prevent surface damage to the product caused by the micropores 13, thereby reducing surface quality issues that may occur during product transportation.

[0100] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0101] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A packaging material, characterized in that: Used for packaging electronic devices, the packaging material comprises a stacked packaging material sheet and a film, the packaging material sheet is doped with antistatic liquid, and the film is provided with a plurality of micropores, the pore diameter of the micropores being smaller than the diameter of the precipitated droplets of the antistatic liquid; In which, the multiple micropores are arranged in an array of N-gons, and one of the micropores is arranged at the common endpoint of 360 / Q N-gons spliced ​​together, N ≥ 3 and is an integer, and Q is the degree of a single internal angle of the N-gon; the side length of the N-gon is determined according to the maximum diffusion distance of the antistatic liquid and the radius of the micropore, and the maximum diffusion distance is the distance between adjacent antistatic liquid droplets obtained by simulating the packaging material sheet at 60°C to 100°C.

2. The packaging material according to claim 1, wherein The N-gon is a square, and the side length of the square, the maximum diffusion distance of the antistatic liquid, and the radius of the micropore satisfy: ； Wherein, L' is the maximum diffusion distance, in nm; L1 is the side length of the square, in nm; R1 is the radius of the micropore, in nm.

3. The packaging material according to claim 1, wherein The N-gon is an equilateral triangle, and the side length of the equilateral triangle, the maximum diffusion distance of the antistatic liquid, and the radius of the micropore satisfy: ； Wherein, L'' is the maximum diffusion distance, in nm; L2 is the side length of the equilateral triangle; and R2 is the radius of the micropore, in nm.

4. The packaging material according to claim 1, wherein The pore size of the micropores is 10% to 50% of the diameter of the precipitated droplets.

5. The packaging material according to claim 1, wherein In a direction parallel to the surface of the packaging material sheet, the cross-sectional shape of the micropores is circular or polygonal.

6. The packaging material according to claim 5, wherein In the thickness direction of the film, the pore diameter of the micropore is positively correlated with the distance between the micropore and the packaging material sheet.

7. A method for manufacturing a packaging material, characterized in that: include: Providing a packaging material sheet, wherein the packaging material sheet is doped with an antistatic liquid; Providing a film and a needle mold, adsorbing the film onto a foaming plate, and forming a plurality of micropores on the film using the needle mold; placing the film including the plurality of micropores on the packaging material sheet to obtain the packaging material; In which, the multiple micropores are arranged in an array of N-gons, and one of the micropores is arranged at the common endpoint of 360 / Q N-gons spliced ​​together, N ≥ 3 and is an integer, and Q is the degree of a single internal angle of the N-gon; the side length of the N-gon is determined according to the maximum diffusion distance of the antistatic liquid and the radius of the micropore, and the maximum diffusion distance is the distance between adjacent antistatic liquid droplets obtained by simulating the packaging material sheet at 60°C to 100°C.

8. The manufacturing method according to claim 7, wherein: Provide needle molds, including: Obtaining the type of the antistatic liquid, the diameter of the precipitated droplets, and the crosslinking properties between the antistatic liquid and the packaging material sheet; determining a maximum diffusion distance of the antistatic liquid according to the type and the cross-linking performance; Determining the pore size of the micropores according to the diameter of the precipitated liquid droplets; Determining the side length of the N-gon according to the maximum diffusion distance and the aperture; The needle mold is manufactured according to the N-gon, the side length of the N-gon and the hole diameter.

9. A packaging structure, characterized in that: The device comprises a first packaging material and a second packaging material, wherein the first packaging material and the second packaging material are combined to form a housing cavity for an electronic device, wherein the first packaging material and / or the second packaging material are obtained by molding the packaging material according to any one of claims 1 to 6, and the film in the first packaging material and / or the second packaging material is located in the housing cavity.

10. The packaging structure according to claim 9, wherein: The electronic device is a display panel having a display area, and the orthographic projection of the setting area of ​​the multiple micropores in the first packaging material and the second packaging material on the display panel coincides with the display area, or the setting area of ​​the multiple micropores covers the display panel.

11. The packaging structure according to claim 10, wherein: The first packaging material and the second packaging material include a contact area in contact with the display panel and a non-contact area separated from the display panel, and the pore density of the micropores in the contact area is lower than the pore density in the non-contact area.

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