A gallium oxide crystal cutting method and clamp

Abstract

A gallium oxide crystal cutting method and clamp, adjust the bolt, set the rotating connecting rod 2 pointer at the specified scale; measure the size of the crystal, mark the position to be cut; adjust the position of the four fixed claws according to the size of the crystal; the (001) main surface of the crystal or the (100) main surface of the crystal is fixed on the horizontal plate of the four fixed claws, and the position to be cut of the crystal is arranged between the two adjusting frames; the clamp is fixed on the base of the cutting machine through the base support; the cutting parameters are set, the diamond wire with a diameter is selected, the feed speed is set, and the cutting is carried out; the gallium oxide crystal without cleavage is obtained; the crystal is not bonded, the size regular and size irregular crystal is clamped through the designed clamp, the crystal with different main surfaces is adjusted, the cutting angle suitable for cutting is adjusted, the complete crystal without cleavage is obtained, and the crystal with different main surfaces is cut.

Description

TECHNICAL FIELD

[0001] The application relates to a gallium oxide crystal cutting method and a clamp and belongs to the technical field of processing of semiconductor materials. BACKGROUND

[0002] Gallium oxide is one of wide-bandgap semiconductor materials and belongs to a monoclinic crystal system. A relatively mature growth method is a guide mode method. As a novel semiconductor material with a monoclinic crystal structure, gallium oxide has typical anisotropy. Different atomic arrangement structures and arrangement densities of different crystal faces lead to differences in physical properties of the different crystal faces. Due to the anisotropy and poor thermal conductivity, gallium oxide crystal is prone to cleavage during the crystal processing. There are mainly two cleavage planes of (100) and (001) in the gallium oxide crystal.

[0003] At present, the mainstream growth process of gallium oxide crystal is to grow through the guide mode method. The shape of the grown crystal is an irregular long plate. Two products with a (100) crystal direction and a (001) crystal direction main surface need to be cut into the required length for processing during the crystal processing. The traditional cutting method is to use wax to bond and heat or use glue to bond the gallium oxide crystal on the bonding table and use a diamond wire to cut. Due to the low thermal conductivity of the gallium oxide crystal, the crystal is prone to cracking during the wax bonding and degumming heating process. Due to the anisotropy of the crystal, the angle between the main surface and the cutting line is different when cutting the crystal with different main surfaces. Therefore, the crystal needs to be bonded on the bonding table at different angles for cutting. In order to reduce the cleavage cracking of the crystal, the crystal should not be heated as much as possible, and the gallium oxide crystal needs to be cut at different angles according to the processing of different main surfaces.

[0004] The existing CN217704117U discloses an angle adjusting device for crystal cutting. The device drives the gear on the gear groove to rotate through the servo motor, then drives the support rod below the rotation shaft to rotate, and the clamp can also rotate to realize the longitudinal angle adjustment. The servo motor drives the rotating disc to rotate, drives the clamp and the clamped crystal to realize the transverse angle adjustment, so that the crystal can be adjusted to the appropriate position facing the cutting line according to the set value, and the cutting work under different angles can be performed. The adjustment is accurate and convenient, and the cutting precision is greatly improved. However, the device still has the following shortcomings:

[0005] The device structure is complex, there are many electric control devices, the manufacturing cost is high, and the motor device has high sealing requirements in the actual use of cutting the process. Therefore, the practicability is insufficient.

[0006] The device can only clamp and cut the crystals with regular shapes such as cylinders or squares, and cannot clamp and cut the gallium oxide crystals with irregular shapes.

[0007] The device clamps the crystal for cutting process, and the cut crystal falls and cannot be protected. SUMMARY

[0008] In view of the process requirement of cutting and truncating the gallium oxide crystal with different main surfaces grown by the guided mode method, the problems of cleavage cracking of the crystal caused by repeated bonding through heating in the crystal processing process of the prior art, and the problems of single appearance of the processed crystal and high cost caused by the adjustment of the angle of the clamp driven by the electric control device, the gallium oxide crystal cutting method and clamp are designed, the irregular size crystal can be directly clamped by the clamp, different angles are adjusted, the gallium oxide crystal is cut, and the suitable cutting angle is found according to the gallium oxide crystal with different main surfaces, so that the problem of cleavage cracking in the crystal cutting process is effectively solved.

[0009] The technical scheme adopted by the present application is as follows: a gallium oxide crystal cutting method, the gallium oxide crystal with a (001) crystal direction is cut according to the following steps:

[0010] Step one, adjust the bolt, and set the scale indication line on the pointer of the rotating connecting rod 2 between 100°-120° scale;

[0011] Step two, measure the size of the crystal, and mark the position to be cut;

[0012] Step three, adjust the position of the four fixed claws according to the size of the crystal;

[0013] Step four, place the (001) main surface of the crystal upward on the horizontal plate of the four fixed claws, adjust the distance between the two adjusting frames, place the position to be cut of the crystal between the two adjusting frames, lock the crystal on the four fixed claws by adjusting the locking bolt, and complete the clamping of the crystal;

[0014] Step five, fix the clamp on the base of the cutting machine through the base support;

[0015] Step six, set the cutting parameters, select a diamond wire with a diameter of 0.18-0.35mm, set the feed speed to 0.2-0.5mm / min, and set the feed speed to 3-8m / s for cutting;

[0016] Step seven, loosen the locking bolt on the fixed claw stand after cutting, take out the crystal, and get the gallium oxide crystal without cleavage;

[0017] The gallium oxide crystal cutting steps of the gallium oxide crystal with a (100) crystal direction are as follows:

[0018] Step one, adjust the bolt, and set the scale indication line on the pointer of the rotating connecting rod 2 between 135°-180° scale;

[0019] Step two, measure the size of the crystal, mark the position that needs to be cut;

[0020] Step three, adjust the position of the four fixed claws according to the size of the crystal;

[0021] Step four, place the (100) main surface of the crystal upwards on the horizontal plate of the four fixed claws, adjust the distance between the two adjusting frames, place the position that needs to be cut between the two adjusting frames, adjust the locking bolt to lock the crystal on the four fixed claws, complete the clamping of the crystal;

[0022] Step five, fix the clamp on the base of the cutting machine through the base support;

[0023] Step six, set the cutting parameters, select a diamond wire with a diameter of 0.18-0.35mm, set the feed speed to 0.2-0.5mm / min, and set the feed speed to 3-8m / s for cutting;

[0024] Step seven, after cutting, loosen the locking bolt on the fixed claw stand, take out the crystal, and get the gallium oxide crystal without cleavage.

[0025] A clamp comprises a base support, a rotating connecting rod, an adjusting frame, an adjusting plate, a fixed claw and an adjusting bolt; two adjusting frames are fixed together through an adjusting plate, two fixed claws are respectively fixed on the two adjusting frames, the rotating connecting rod is fixed with one adjusting frame, the base support is fixed on the rotating connecting rod through the adjusting bolt, the pointer of the rotating connecting rod penetrates into the semicircular pointer slot, and the semicircular pointer slot is provided with a scale value for reading; the adjusting bolt is adjusted to realize the left and right inclination angle adjustment of the two adjusting frames and the upper end surface of the base support.

[0026] The technical effect of the present application is that the present application clamps the crystal with regular size and irregular size through the designed clamp without bonding the crystal, adjusts the cutting angle suitable for the crystal with different main surfaces for cutting, obtains the complete crystal without cleavage, and realizes the cutting of the crystal with different main surfaces. The present application can solve the problem that the gallium oxide crystal needs to be bonded by heating through wax in the cutting process in the prior art, avoid the problem that the crystal is easy to crack when bonded repeatedly, and reduce the probability of cracking of the crystal. The clamp structure is simple and easy to operate, and the manufacturing cost is low. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 It is a structural schematic view of the clamp of the present application;

[0028] Figure 2Structure diagram of base support of the present application;

[0029] Figure 3 Structure diagram of rotating connecting rod of the present application;

[0030] Figure 4 Structure diagram of adjusting support of the present application;

[0031] Figure 5 Structure diagram of adjusting plate of the present application;

[0032] Figure 6 Structure diagram of fixing claw of the present application;

[0033] Figure 7 Cutting diagram of regular crystal of the present application;

[0034] Figure 8 Cutting diagram of irregular crystal of the present application. DETAILED DESCRIPTION

[0035] As Figure 1As shown, a clamp includes a base support 1, a rotating connecting rod 2, an adjusting frame 3, an adjusting plate 4, fixing claws 5, and adjusting bolts 6. Two adjusting frames 3 are positioned at one end on the horizontal plate I 4-2 of the adjusting plate 4. Two bolts are passed through the slots 4-1-1 of the adjusting plate 4 and screwed into the threaded holes III 3-4 of the two adjusting frames 3, fixing the two adjusting frames 3 to the adjusting plate 4. The gap between the two adjusting frames 3 can be adjusted by adjusting the position of two locking bolts 9 in the slots 4-1-1. Two fixing claws 5 are symmetrically selected on the two adjusting frames 3 according to the size of the fixed crystal 7, and are set on the threaded holes II 3-3. Bolts are passed through the countersunk holes 5-2-1 of the four fixing claws 5 and screwed into the threaded holes II 3-3 of the adjusting frames 3, fixing the four fixing claws 5 to the two adjusting frames 3. One end of the rotating connecting rod 2 is positioned below the two through holes 3-2 of one adjusting frame 3, and two bolts are passed through the two through holes 3-2. 2. The two threaded holes Ⅰ2-3 of the rotating connecting rod 2 are screwed together to fix the rotating connecting rod 2 and an adjusting bracket 3 together. The base bracket 1 is set on the front of the rotating connecting rod 2. The adjusting bolt 6 is screwed through the adjusting bolt hole 1-1-3 of the base bracket 1 and the adjusting bolt thread hole 2-2 of the rotating connecting rod 2 to fix the base bracket 1 on the rotating connecting rod 2. The pointer 2-1 of the rotating connecting rod 2 is inserted into the semi-circular pointer groove 1-1-1 of the rotating connecting rod 2. The scale indicator line 2-1-1 is used to read the value of the scale 1-1-2 on the side of the semi-circular pointer groove 1-1-1. When it is necessary to adjust the horizontal or left and right tilt angle between the two adjusting brackets 3 and the upper end face of the base bracket 1, the adjusting bolt 6 is adjusted counterclockwise. After determining the horizontal or left and right tilt angle between the two adjusting brackets 3 and the upper end face of the base bracket 1, the adjusting bolt 6 is tightened clockwise to achieve the adjustment of the left and right tilt angle between the two adjusting brackets 3 and the upper end face of the base bracket 1.

[0036] like Figure 2 As shown, the base bracket 1 consists of a vertically arranged rectangular plate 1-1 and a horizontally arranged flat plate 1-2. A semi-circular pointer groove 1-1-1 is provided on the rectangular plate 1-1, extending through the front and back of the rectangular plate 1-1. A scale 1-1-2 is provided along the inner edge of the semi-circular pointer groove 1-1-1, and an adjusting bolt hole 1-1-3 is provided at the upper end of the scale 1-1-2. Two fixing through holes 1-2-1 are provided on the flat plate 1-2. Figure 3 As shown, the rotating connecting rod 2 is a rectangular body. An adjusting bolt screw hole 2-2 is provided at the center of the rectangular body. A raised pointer 2-1 is provided on the lower end face. A scale indicator line 2-1-1 is provided on the end face of the raised pointer 2-1. Two threaded holes I2-3 are provided on the upper end face of the rectangular body.

[0037] like Figure 4As shown, the adjusting frame 3 is a strip body, a guide groove 3-1 is arranged on the upper surface of the strip body, two through holes 3-2 are arranged at the center of the guide groove 3-1, a plurality of threaded holes II 3-3 are arranged on both sides of the two through holes 3-2, and threaded holes III 3-4 are arranged on the side end surface of the strip body. The guide groove 3-1 is used to fix the direction of the fixed claw 5.

[0038] As shown in the figure, Figure 5 The adjusting plate 4 is composed of a vertical plate I 4-1 and a horizontal plate I 4-2 of an integral structure, and a strip hole 4-1-1 is arranged on the vertical plate I 4-1.

[0039] As shown in the figure, Figure 6 The fixed claw 5 is composed of a vertical plate II 5-1 and a horizontal plate II 5-2 of an integral structure, two threaded holes IV 5-1-1 are arranged on the vertical plate II 5-1, and a counterbore 5-2-1 is arranged on the horizontal plate II 5-2.

[0040] As shown in the figure, Figure 7 The size of the main surface is the cutting method of the gallium oxide crystal with the (001) crystal direction:

[0041] The length of the crystal is 105mm (the length of the crystal is generally the length of the crystal after removing the shoulder part), the width of the crystal is about 60mm, and the thickness of the crystal is 10mm; when cutting the crystal 7 with the (001) crystal direction, the cutting line is parallel to the main surface, which will cause the contact area between the cutting line and the crystal 7 to be too large, which will reduce the cutting ability, and the stress on the crystal 7 will increase, which will cause the crystal to easily crack. The cutting line and the crystal 7 need to be cut at a certain angle, but the angle between the cutting line and the main surface of the crystal 7 cannot be too large, and if it is too large, the cutting line will be nearly parallel to the (100) surface of the crystal, which will also increase the probability of cracking of the crystal. When cutting the gallium oxide crystal with the (001) crystal direction, the angle between the main surface of the crystal 7 and the cutting line is within 10°-30° (i.e. the angle between the main surface of the crystal and the horizontal plane is 10°-30°), and the cracking of the crystal is the least.

[0042] The specific steps are as follows:

[0043] Step one, loosen the adjusting bolt 6 counterclockwise, rotate the rotating connecting rod 2 to the left, so that the scale line 2-1-1 on the pointer 2-1-1 of the rotating connecting rod 2 indicates the 110° scale 1-1-2 position, that is, the guide groove 3-1 of the adjusting frame 3 is 20° with the horizontal plane, and the adjusting bolt 6 is locked clockwise.

[0044] Step two, measure the size of the crystal, and mark the position line 7-1 to be cut;

[0045] Step three, according to the size of the crystal 7, use the bolt to pass through the four fixed claws 5 counterbores 5-2-1 and the four threaded holes II 3-3 on the two adjusting frames 3, and screw them, so as to fix the four fixed claws 5 on the two adjusting frames 3.

[0046] Step 4: Place the crystal 7 with its (001) main surface facing up on the horizontal plate 5-2 of the four fixing claws 5. Fix the distance between the two adjusting brackets 3 by adjusting the two locking bolts 9 so that the position line 7-1 to be cut on the crystal 7 is placed between the two adjusting brackets 3. First, place one side of the crystal 7 against the screws in the threaded holes Ⅳ5-1-1 of the two fixing claws 5 on one side of the two adjusting brackets 3. Adjust the screws in the threaded holes Ⅳ5-1-1 on one side to make the growth lines in the (010) direction on the crystal surface as perpendicular as possible to the direction of the guide groove of the adjusting bracket 3, and complete the orientation adjustment of the crystal 7. Then tighten the screws in the threaded holes Ⅳ5-1-1 of the two fixing claws 5 on the other side of the two adjusting brackets 3 to complete the clamping of the crystal 7.

[0047] Step 5: Fix the fixture with crystal 7 onto the cutting machine through the two fixing through holes 1-2-1 of the base bracket 1 and the bolts.

[0048] Step 6: Set the cutting parameters. Select a diamond wire with a diameter of 0.25 mm, set the feed rate to 0.3 mm / min, and set the wire speed to 5 m / s to perform the cutting.

[0049] Step 7: After cutting, loosen the locking bolt 8 on the plate of the fixing claw 5 counterclockwise to remove the crystal and obtain a gallium oxide crystal without cleavage.

[0050] Methods for cutting gallium oxide crystals with a (100) crystal orientation and regular dimensionality:

[0051] When cutting a crystal with a (100) crystal orientation as the principal face, since the 100 face is a surface that is very easy to cleave, when the cutting line is close to parallel to the 100 face or the angle is small, the 100 face of the crystal is subjected to greater longitudinal pressure from the cutting line. During the cutting process, the crystal will undergo a phenomenon of cleaving layer by layer parallel to the 100 face. Therefore, when cutting a crystal with a (100) principal face, the angle between the (100) face and the cutting line should be controlled at 45°-90° (i.e., the principal face of the crystal is at 45°-90° to the horizontal plane) for cutting.

[0052] The crystal length is 105 mm (generally, the crystal length is the length excluding the shoulder portion), the crystal width is approximately 60 mm, and the crystal thickness is 10 mm;

[0053] Step 1: Loosen the adjusting bolt 6 counterclockwise, rotate the rotating connecting rod 2 to the left, so that the scale indicator line 2-1-1 on the pointer 2-1-1 of the rotating connecting rod 2 indicates the 150° scale 1-1-2 position, that is, the guide groove 3-1 of the adjusting frame 3 has an angle of 60° with the horizontal plane, and then tighten the adjusting bolt 6 clockwise.

[0054] Step 2: Measure the dimensions of the crystal and mark the cutting lines 7-1.

[0055] Step 3: According to the size of crystal 7, use bolts to pass through the countersunk holes 5-2-1 of the four fixing claws 5 and screw them into the four threaded holes II3-3 on the two determined adjustment brackets 3 respectively, and fix the four fixing claws 5 onto the two adjustment brackets 3 respectively;

[0056] Step 4: Place the crystal 7 with its (100) main surface facing up on the horizontal plate II5-2 of the four fixing claws 5. Fix the distance between the two adjusting brackets 3 by adjusting the two locking bolts 9 so that the position line 7-1 to be cut on the crystal 7 is placed between the two adjusting brackets 3. First, place one side of the crystal 7 against the screws in the threaded holes IV5-1-1 of the two fixing claws 5 on one side of the two adjusting brackets 3. Adjust the screws in the threaded holes IV5-1-1 on one side to make the growth lines in the (010) direction of the crystal surface as perpendicular as possible to the direction of the guide groove of the adjusting bracket 3, and complete the orientation adjustment of the crystal 7. Then tighten the screws in the threaded holes IV5-1-1 of the two fixing claws 5 on the other side of the two adjusting brackets 3 to complete the clamping of the crystal 7.

[0057] Step 5: Fix the fixture with crystal 7 onto the cutting machine through the two fixing through holes 1-2-1 of the base bracket 1 and the bolts.

[0058] Step 6: Set the cutting parameters. Select a diamond wire with a diameter of 0.25 mm, set the feed rate to 0.3 mm / min, and set the wire speed to 5 m / s to perform the cutting.

[0059] Step 7: After cutting, loosen the locking bolt 8 on the plate of the fixing claw 5 counterclockwise to remove the crystal and obtain a gallium oxide crystal without cleavage. Example

[0060] Methods for cutting gallium oxide crystals with irregularly sized principal faces of (001) crystal orientation, such as... Figure 8 As shown, the specific steps are as follows:

[0061] Step 1: Loosen the adjusting bolt 6 counterclockwise, rotate the rotating connecting rod 2 to the left, so that the scale indicator line 2-1-1 on the pointer 2-1-1 of the rotating connecting rod 2 indicates the 110° scale 1-1-2 position, that is, the angle between the guide groove 3-1 of the adjusting frame 3 and the horizontal plane is 20°, and then tighten the adjusting bolt 6 clockwise.

[0062] Step 2: Measure the size of the crystal and mark the positions to be cut (10-1).

[0063] Step 3: According to the size of crystal 7, use bolts to pass through the countersunk holes 5-2-1 of the four fixing claws 5 and screw them into the four threaded holes II3-3 on the two determined adjustment brackets 3 respectively, and fix the four fixing claws 5 onto the two adjustment brackets 3 respectively;

[0064] Step 4: Place the crystal 7 with its (001) main surface facing up on the horizontal plate II5-2 of the four fixing claws 5. Fix the distance between the two adjusting brackets 3 by adjusting the two locking bolts 9 so that the cutting position line 7-1 of the crystal 7 is placed between the two adjusting brackets 3. Place one side of the crystal 7 against the screws in the threaded holes IV5-1-1 of the two fixing claws 5 on one side of the two adjusting brackets 3. Adjust the screws in the threaded holes IV5-1-1 on one side to make the growth lines in the (010) direction of the crystal surface as perpendicular as possible to the direction of the guide groove of the adjusting bracket 3, thus completing the orientation adjustment of the crystal 7. Then tighten the screws in the threaded holes IV5-1-1 of the two fixing claws 5 on the other side of the two adjusting brackets 3 to complete the clamping of the crystal 7.

[0065] Step 5: Fix the fixture with crystal 7 onto the cutting machine through the two fixing through holes 1-2-1 of the base bracket 1 and the bolts.

[0066] Step 6: Set the cutting parameters. Select a diamond wire with a diameter of 0.25 mm, set the feed rate to 0.3 mm / min, and set the wire speed to 5 m / s to perform the cutting.

[0067] Step 7: After cutting, loosen the locking bolt 8 on the plate of the fixing claw 5 counterclockwise to remove the crystal and obtain a gallium oxide crystal without cleavage.

[0068] The method for cutting gallium oxide crystals with irregular sizes and a (100) crystal orientation is as follows: Step 1: Loosen the adjusting bolt 6 counterclockwise, rotate the rotating connecting rod 2 to the left, so that the scale indicator line 2-1-1 on the pointer 2-1-1 of the rotating connecting rod 2 indicates the scale 1-1-2 position at 150°, that is, the guide groove 3-1 of the adjusting frame 3 has an angle of 60° with the horizontal plane, and then tighten the adjusting bolt 6 clockwise.

[0069] The other steps are the same as those for cutting gallium oxide crystals with irregular sizes and a (001) crystal orientation.

[0070] Locking bolt 8 is made of polytetrafluoroethylene.

[0071] In summary, this fixture can hold gallium oxide crystals of different and irregular sizes. By adjusting the angle, crystals with different principal orientations can be cut. With the corresponding cutting process, cleavage-free gallium oxide crystals can be obtained. This fixture solves the problems of needing to repeatedly heat the crystals for bonding and the adjustable cutting angle.

Claims

1. A method for cutting gallium oxide crystals, characterized in that, The fixture includes a base support (1), a rotating connecting rod (2), an adjusting frame (3), an adjusting plate (4), a fixing claw (5), an adjusting bolt (6), and a locking bolt (8). Two adjusting frames (3) are fixed together by the adjusting plate (4). Two fixing claws (5) are fixed on each of the two adjusting frames (3), and two locking bolts (8) are fixed on each fixing claw (5). The rotating connecting rod (2) is fixed together with one adjusting frame (3). The base support (1) is fixed on the rotating connecting rod (2) by the adjusting bolt (6). The pointer (2-1) of the rotating connecting rod (2) is inserted into the semi-circular pointer groove (1-1-1) of the rotating connecting rod (2) for reading the value of the scale (1-1-2) provided on the side surface of the semi-circular pointer groove (1-1-1). The adjusting bolt (6) is adjusted to realize the left and right tilt angle adjustment between the two adjusting frames (3) and the upper surface of the base support (1). The rotating connecting rod (2) is a rectangular body. The center of the rectangular body is provided with an adjusting bolt screw hole (2-2). The lower end face is provided with a protruding pointer (2-1). The end face of the protruding pointer (2-1) is provided with a scale indicator line (2-1-1). The upper end face of the rectangular body is provided with two threaded holes I (2-3). The fixing claw (5) is composed of an integral vertical plate II (5-1) and a horizontal plate II (5-2). The vertical plate II (5-1) is provided with two threaded holes IV (5-1-1), and the horizontal plate II (5-2) is provided with a countersunk hole (5-2-1). The cutting steps for a gallium oxide crystal with a (001) crystal orientation on the main face are as follows: Step 1: Adjust the bolt (6) and set the scale indicator line (2-1-1) on the pointer (2-1) of the rotating connecting rod (2) between the 100°-120° scale (1-1-2); Step two: Measure the size of the crystal and mark the locations where it needs to be cut; Step 3: Adjust and fix the positions of the four fixing claws (5) according to the crystal size; Step 4: Place the crystal with its (001) main surface facing up on the horizontal plate II (5-2) of the four fixed claws (5), adjust the distance between the two adjustment brackets (3) so that the position of the crystal to be cut is between the two adjustment brackets (3), and adjust the locking bolts (8) to lock the crystal on the four fixed claws (5) to complete the crystal clamping. Step 5: Fix the fixture to the base of the cutting machine via the base bracket (1); Step 6: Set the cutting parameters. Select a diamond wire with a diameter of 0.18-0.35 mm, set the feed speed to 0.2-0.5 mm / min, and set the wire speed to 3-8 m / s for cutting. Step 7: After cutting, loosen the locking bolt (8) on the plate of the fixing claw (5), remove the crystal, and obtain a gallium oxide crystal without cleavage; The cutting steps for a gallium oxide crystal with a (100) crystal orientation as the main face are as follows: Step 1: Adjust the bolt (6) and set the scale indicator line (2-1-1) on the pointer (2-1) of the rotating connecting rod (2) between the 135° and 180° scale (1-1-2); Step two: Measure the size of the crystal and mark the locations where it needs to be cut; Step 3: Adjust and fix the positions of the four fixing claws (5) according to the crystal size; Step 4: Place the crystal with its (100) main surface facing up on the horizontal plate II (5-2) of the four fixed claws (5), adjust the distance between the two adjustment brackets (3) so that the position of the crystal to be cut is between the two adjustment brackets (3), adjust the locking bolts (8) to lock the crystal on the four fixed claws (5) and complete the crystal clamping. Step 5: Fix the fixture to the base of the cutting machine via the base bracket (1); Step 6: Set the cutting parameters. Select a diamond wire with a diameter of 0.18-0.35 mm, set the feed speed to 0.2-0.5 mm / min, and set the wire speed to 3-8 m / s for cutting. Step 7: After cutting, loosen the locking bolt (8) on the fixed claw (5) plate, remove the crystal, and obtain a gallium oxide crystal without cleavage.

2. The gallium oxide crystal cutting method according to claim 1, characterized in that: The locking bolt (8) is a bolt made of polytetrafluoroethylene.

3. The gallium oxide crystal cutting method according to claim 1, characterized in that: The base bracket (1) is composed of a vertically arranged rectangular plate (1-1) and a horizontally arranged planar plate (1-2). The rectangular plate (1-1) has a semi-circular pointer groove (1-1-1) on its surface. The semi-circular pointer groove (1-1-1) passes through the front and back of the rectangular plate (1-1). A scale (1-1-2) is provided along the edge of the semi-circular pointer groove (1-1-1). An adjustment bolt hole (1-1-3) is provided at the upper end of the scale (1-1-2). The planar plate (1-2) has two fixing through holes (1-2-1).

4. The gallium oxide crystal cutting method according to claim 1, characterized in that: The adjusting frame (3) is a strip-shaped body. The strip-shaped body is provided with a guide groove (3-1). Two through holes (3-2) are provided at the center of the guide groove (3-1) at intervals. Several threaded holes II (3-3) are provided on both sides of the two through holes (3-2). The side end face of the strip-shaped body is provided with threaded holes III (3-4).

5. The gallium oxide crystal cutting method according to claim 1, characterized in that: The adjusting plate (4) is composed of an integral vertical plate I (4-1) and a horizontal plate I (4-2), and the vertical plate I (4-1) is provided with a slot (4-1-1).

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