An etching method and etching control system for a reed

Abstract

The application provides an etching method and etching control system for a swing plate. The etching method comprises the following steps: firstly, a swing plate etching pre-test is performed to obtain a relationship curve between the residual weight of a center swing and the residual etching time; secondly, a batch of quartz plates assembled with etching masks are etched for a predetermined time to complete the first etching; thirdly, the residual weight of the center swing of the batch of quartz plates is measured, the quartz plates are grouped according to the residual weight interval, the average residual weight of each group is calculated, and the residual etching time of each group of quartz plates is calculated; and finally, the second etching is completed according to the residual etching time of each group of quartz plates. The method indirectly controls the consistency of the flat bridge thickness by measuring the residual mass, only requires the operator to complete the etching mask assembling and disassembling, greatly reduces the operation difficulty, and improves the process control level and the continuous production efficiency.

Description

Technical Field

[0001] This invention belongs to the field of accelerometer component manufacturing technology, and relates to an etching method and etching control system for a pendulum, specifically to an etching control method for a pendulum flat bridge. Background Technology

[0002] Two torque converter coils are symmetrically mounted on both sides of the quartz pendulum of the accelerometer to form a pendulum assembly, used to sense external acceleration. The thickness of the flexible bridge of the pendulum directly affects the accelerometer bias. Different types of accelerometers have different biases, corresponding to a certain range of pendulum bridge thickness. The level of control over the consistency of the pendulum bridge thickness determines the bias range of batch products. Therefore, the etching time needs to be evaluated before pendulum etching, and the bridge thickness needs to be measured before the bridge reaches the target thickness to determine the remaining etching time, thereby ensuring the range of pendulum bridge thickness during batch production.

[0003] Currently, the vast majority of steps in the quartz crystal etching process are performed manually. The consistency of the flat bridge thickness control is highly dependent on the operator's experience, and the flat bridge thickness measurement needs to be performed on a piece-by-piece basis. In existing technologies, the flat bridge thickness is characterized by calculating the specific stiffness of the flat bridge. This is done by measuring the sag of the central pendulum of a horizontally placed quartz crystal, thus estimating the specific stiffness of the flat bridge. However, since the flat bridge is approximately 30 μm thick, the central pendulum is prone to wobbling after the crystal is placed horizontally, making accurate measurement of the sag position difficult and time-consuming. Furthermore, when quartz crystal crystals are produced in large quantities continuously, operators may experience fatigue due to the heavy workload, increasing the likelihood of operational errors. Therefore, it is necessary to improve the existing etching methods for crystal crystals to enhance the etching control level of the flat bridge thickness and improve production efficiency. Summary of the Invention

[0004] To address the technical problems in the etching process of quartz accelerometers, such as high operator dependence, poor consistency in flat bridge thickness control during mass production, and low production efficiency, this invention provides an etching method and etching control system for quartz accelerometers. This etching system and method have a high degree of mechanization, requiring only operators to complete the etching mask mounting and dismounting during operation, which greatly reduces the difficulty of operation, improves the level of process control and continuous production efficiency, and is suitable for automated mass production of quartz accelerometers.

[0005] The technical solution adopted by the present invention to solve the above problems is as follows:

[0006] This invention provides an etching method for a planar plate, comprising the following steps:

[0007] S1. Through the pre-test of pendulum etching, the relationship curve between the remaining weight of the central pendulum and the remaining etching time was statistically analyzed.

[0008] S2. Place the batch of quartz sheets with the etching mask in the etching solution, complete the first etching according to the predetermined etching time, take out the quartz sheets, rinse and dry them, and remove the etching mask.

[0009] S3. Measure the remaining weight of the central pendulum of the batch of quartz sheets, group the quartz sheets according to the remaining weight range, calculate the average remaining weight of each group, and calculate the remaining etching time of each group of quartz sheets according to the relationship curve in step S1.

[0010] S4. Each set of quartz plates completes the second etching according to the remaining etching time, and then the quartz plates are removed, rinsed, and dried.

[0011] Further, step S1 includes the following steps:

[0012] Preliminary etching experiments were conducted using quartz plates and etching solutions of the same specifications.

[0013] During the etching process, the quartz sheet is removed at fixed time intervals. With the quartz sheet in a horizontal state, a weight sensor is used to measure the remaining weight of the central pendulum at a fixed position and with a fixed sag. The specific stiffness of the pendulum is calculated, and the etching experiment continues until the specific stiffness meets the design requirements. The complete etching time is recorded.

[0014] The remaining etching time corresponding to each remaining weight was calculated, and the relationship curve between the remaining weight and the remaining etching time was fitted.

[0015] Furthermore, in step S3, when measuring the remaining weight of the central pendulum of the batch of quartz wafers, the measurement position and sag of the central pendulum are consistent with those of the etching pre-test.

[0016] Furthermore, the fixed sag of the central pendulum is 0.2mm to 5.0mm; the preset etching time in step S2 is the time required for the thickness of the pendulum flat bridge to reach 1.2 to 2 times the target thickness.

[0017] The present invention also provides an etching control system for a plate, including...

[0018] An etching assembly, which is used to perform two etching processes on the plate, including cleaning and drying;

[0019] A measurement assembly, comprising a measurement stage and a measurement robotic arm;

[0020] The measuring platform includes a swivel frame, a weight sensor, a fine-tuning platform, an industrial computer, and a base. The swivel frame is fixed on the base, and the swivel to be measured is placed on the swivel frame. The fine-tuning platform is located on the base below the swivel frame and has adjustment functions along the swivel axis and in the height direction. The weight sensor is installed on the fine-tuning platform to measure the remaining weight of the swivel at a certain position and with a fixed sag. The industrial computer is connected to the fine-tuning platform and the weight sensor via cables.

[0021] The measuring robotic arm picks up and moves the pendulum to a predetermined position.

[0022] Furthermore, the measuring assembly also includes a slab basket, a slab loading platform, a transfer area, and interval baskets. The slab baskets are placed on the slab loading platform to accommodate slabs with the etch mask removed. The interval baskets are placed in the transfer area and include multiple baskets, each accommodating slabs of different weight ranges. The slab loading platform, measuring platform, and transfer area are arranged in a ring, with the measuring robotic arm located in the middle of the three.

[0023] Furthermore, the slide holder is calibrated to a horizontal state, and the upper surface of the slide holder has a slide limiting component.

[0024] Furthermore, the limiting component is multiple limiting posts or limiting grooves; the swing plate frame is a ring structure, a U-shaped structure, or a C-shaped structure.

[0025] Furthermore, the etching assembly comprises two sets, arranged on both sides of the measuring assembly, for the first and second etching processes of the wafer; the etching assembly includes a basket, a robotic arm, a loading platform, an etching unit, a rinsing and drying unit, and a unloading platform; the basket is used to hold the wafer to be etched; the robotic arm is a slide rail type robotic arm, used to pick up and control the movement of the basket; the loading platform, etching unit, rinsing and drying unit, and unloading platform are located below the slide rail and arranged sequentially along the slide rail direction.

[0026] Furthermore, the robotic arm includes a slide rail, a vision positioning system, a picking gripper, and a gripper arranged sequentially from top to bottom, wherein the slide rail is linear; the rinsing and drying unit includes a neutralization tank, a rinsing tank, and a drying tank arranged sequentially.

[0027] The weight range of the basket is between 2mg and 50mg; the positional accuracy of the measuring robotic arm is not less than ±0.5mm; and the accuracy of the weight sensor is not less than 1mg.

[0028] The beneficial effects of this invention are:

[0029] The pendulum etching method provided by this invention calculates the specific stiffness of the pendulum bridge by measuring the remaining weight of the central pendulum under fixed sag during free swing, and determines the remaining etching time. This method is simple and convenient to operate, eliminating the need to wait for the central pendulum to stop swinging, saving measurement time and improving production efficiency. Simultaneously, this invention provides dedicated measuring equipment, with the measurement process completed by a robotic arm. This replaces the original manual measurement method of quartz plate specific stiffness with automated equipment measurement, eliminating the need for operator intervention, reducing human error, improving work efficiency, saving time and labor, and improving the accuracy and consistency of flat bridge thickness control.

[0030] The wafer etching control system provided by this invention has a high degree of mechanization. During the etching process, only operators need to complete the installation and removal of the etching mask, which reduces the difficulty of operation and improves the level of process control and continuous production efficiency. At the same time, it avoids operators coming into contact with the etching solution, thus improving process safety.

[0031] The etching method and etching control system provided by this invention are easy to operate, highly repeatable, and can meet the needs of automated mass production of wafers. Attached Figure Description

[0032] The accompanying drawings, which form part of this specification, are provided to further illustrate embodiments of the invention and, together with the textual description, explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of the oscillating etching control system provided in a specific embodiment of the present invention;

[0034] Figure 2 A side view of the first etching component provided for a specific embodiment of the present invention;

[0035] Figure 3 A side view of the measurement component provided for a specific embodiment of the present invention;

[0036] Figure 4 A side view of the measuring table provided for a specific embodiment of the present invention;

[0037] Figure 5 A top view of the measuring platform provided in a specific embodiment of the present invention;

[0038] Figure 6 A side view of the second etching component provided for a specific embodiment of the present invention.

[0039] The accompanying drawings include the following reference numerals:

[0040] 1. Quartz wafer basket; 2. Quartz wafer tray; 3. First robotic arm; 31. Quartz wafer tray pick-up clamp; 32. First vision positioning system; 33. First gripper; 34. First slide rail; 4. Loading table; 5. Quartz wafer etching unit; 6. First rinsing and drying unit; 61. First neutralization tank; 62. First rinsing tank; 63. First drying tank; 7. Manual table; 8. Quartz wafer loading table; 9. Second robotic arm; 91. Vision positioning system; 92. Pick-up unit; 10. Measuring table; 10 1. Slab rack; 102. Weight sensor; 103. Fine-tuning platform; 104. Industrial computer; 105. Base; 11. Transfer area; 12. Slab etching unit; 13. Second rinsing and drying unit; 131. Second neutralization tank; 132. Second rinsing tank; 133. Second drying tank; 14. Unloading platform; 15. Third robotic arm; 151. Slab lifting basket pick-up clamp; 152. Second vision positioning system; 153. Second gripper; 154. Second slide rail; 16. Interval lifting basket. Detailed Implementation

[0041] The technical solution of the present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of components and steps set forth in these embodiments do not limit the scope of the invention.

[0043] In one embodiment of the present invention, an etching method for a planar plate is provided, which mainly includes the following steps:

[0044] S1. Pre-etching test of the pendulum: Through the pre-etching test of the pendulum, the relationship curve between the remaining weight of the central pendulum and the remaining etching time is statistically analyzed.

[0045] S2. First etching: Place the batch of quartz sheets with the etching mask in the etching solution, complete the first etching according to the predetermined etching time, remove the quartz sheets, rinse and dry them, and remove the etching mask.

[0046] S3. Measure the remaining weight of the fixed sag of the central pendulum: Measure the remaining weight of the fixed sag of the central pendulum of the batch of quartz sheets, group the quartz sheets according to the remaining weight range, calculate the average remaining weight of each group, and calculate the remaining etching time of each group of quartz sheets according to the relationship curve in step S1.

[0047] S4. Second etching: Each set of quartz plates completes the second etching according to the remaining etching time, and the quartz plates are removed, rinsed, and dried.

[0048] The pendulum etching method provided by this invention transforms the measurement of the sag of the central pendulum into the measurement of the remaining weight of the central pendulum with a fixed sag. This avoids waiting for the central pendulum to stabilize during the measurement process, saves production time, and improves the efficiency of mass production of pendulums.

[0049] Furthermore, the specific process of the pre-test for wave etching is as follows:

[0050] S11. Use quartz wafers of the same specifications to conduct a pre-test of wafer etching. The etching solution used in the pre-test has the same concentration as the etching solution used in subsequent batch etching.

[0051] S12. During the etching process, the quartz sheet is removed at fixed time intervals. With the quartz sheet in a horizontal state, the remaining weight of the measuring center pendulum at a fixed position and with a fixed sag is measured using a weight sensor. The specific stiffness of the pendulum is calculated, and the etching experiment is continued until the specific stiffness meets the design requirements. The complete etching time is recorded.

[0052] S13. Calculate the remaining etching time for each remaining weight and fit the relationship curve between the remaining weight and the remaining etching time.

[0053] Preferably, the central pendulum has a fixed sag of 0.2 mm to 5.0 mm.

[0054] Furthermore, the specific process of the first etching is as follows:

[0055] S21. Use a basket to hold the quartz sheet etching mask. Use a robotic arm to pick up the basket from the loading table and place it in the etching equipment to etch the part of the quartz sheet exposed outside the etching mask.

[0056] S22. After the preset etching time is reached, the robotic arm picks up the basket from the etching equipment and puts it into the rinsing equipment to rinse and dry the quartz sheet and the etching mask. The robotic arm then picks up the dried basket from the etching equipment and places it on the operating table.

[0057] Preferably, the preset etching time is the time required for the thickness of the planar bridge to reach the target thickness.

[0058] S23. The operator manually removes the quartz disc from the etching mask, places it in the oscillating tray, and places the oscillating tray in the material position of the measuring equipment.

[0059] Furthermore, the specific process for measuring the remaining weight of the central pendulum is as follows:

[0060] S31. The robotic arm picks up a quartz disc from the swivel basket at the material level of the measuring equipment and places it on the swivel frame of the measuring equipment. The measuring equipment positions the outer ring of the quartz disc through the swivel frame and measures the remaining weight of the fixed droop of the free swinging center pendulum, and transmits the weight value back to the host computer.

[0061] When measuring the remaining weight of batch quartz plates, the same central pendulum position and sag amount as in step S12 are used.

[0062] S32. The robotic arm picks up the pendulum from the fixed ring according to the command from the host computer and places it into the corresponding pendulum basket at the designated position. The pendulum baskets at the designated positions are classified and sorted according to the measured remaining weight data range. The host computer calculates the remaining etching time of the pendulum baskets placed at different positions based on the relationship curve between the remaining weight of the central pendulum and the etching time.

[0063] Furthermore, the specific process of the second etching is as follows: after the batch is completed or the corresponding quartz wafer basket at the specified position is full, the robotic arm picks up the quartz wafer basket and places it into the etching equipment to etch the quartz wafers in the quartz wafer basket. After the remaining etching time of the basket is reached, the robotic arm picks up the quartz wafer basket from the etching equipment and places it into the rinsing equipment to rinse and dry the quartz wafers. The robotic arm then picks up the dried quartz wafer basket from the etching equipment and places it on the unloading platform.

[0064] The above process only requires the operator to remove the quartz sheet from the etching mask and place it in the basket. The operation is simple and suitable for batch continuous production. Moreover, the manual operation steps do not involve the etching process parameters, and the etching quality of the sheet placement can be effectively improved.

[0065] In another embodiment of the present invention, in order to improve the consistency of flat bridge thickness control, process control level, and continuous production efficiency during the batch production of wafers, a highly mechanized wafer etching control system is provided, such as... Figure 1 As shown, it includes a first etching component, a measurement component, and a second etching component.

[0066] like Figure 1 , 2 As shown, the first etching assembly includes a quartz wafer basket 1, a first robotic arm 3, a loading platform 4, a quartz wafer etching unit 5, a first rinsing and drying unit 6, and a manual table 7. The quartz wafer basket 1 is used to hold quartz wafers for assembling etching masks. The first robotic arm 3 is a slide rail type robotic arm, which, from top to bottom, includes a first slide rail 34, a first vision positioning system 32, a quartz wafer basket pick-up clamp 31, and a first gripper 33, used to pick up and control the movement of the quartz wafer basket 1. The loading platform 4, the quartz wafer etching unit 5, the first rinsing and drying unit 6, and the manual table 7 are located below the slide rail and arranged sequentially along the slide rail direction. The loading platform 4 is used to place the quartz wafer basket 1; the quartz wafer etching unit 5 includes an etching tank for etching quartz wafers; the first rinsing and drying unit 6 includes a neutralization tank 61, a rinsing tank 62, and a drying tank 63 arranged sequentially; the manual table 7 is a manual mask removal worktable, where the removed mask pieces are placed in the mask basket 2.

[0067] Preferably, the slide rail of the first robotic arm 3 is straight, and the loading table 4, the quartz etching unit 5, the first rinsing and drying unit 6, and the manual table 7 are arranged in sequence along a straight line.

[0068] like Figure 1 , 3 As shown, the measurement assembly includes a slab basket 2, a second robotic arm 9, a slab loading platform 8, a measuring platform 10, a transfer area 11, and interval baskets 16. The slab basket 2 is used to hold slabs with the etched mask removed. The second robotic arm 9 is used to pick up slabs from the slab basket 2 and move them to the measuring platform 10, and to pick up slabs from the measuring platform 10 and place them into interval baskets 16 that are divided into weight intervals. The second robotic arm 9 includes a vision positioning system 91 and a pickup unit 92, which is mostly a suction cup structure. The slab loading platform 8 is used to place the slab basket 2; the transfer area 11 is used to place the interval baskets 16, which include multiple interval baskets 16 with different remaining weight intervals. The interval baskets 16 are used to hold slabs within different remaining weight intervals.

[0069] like Figure 4 , 5 As shown, the measuring stage 10 includes a swivel frame 101, a weight sensor 102, a fine-tuning platform 103, an industrial computer 104, and a base 105. The swivel frame 101 is fixed on the base 105, and the swivel to be measured is placed on the swivel frame 101; the fine-tuning platform 103 is disposed on the base 105 below the swivel frame 101, and the fine-tuning platform 103 can be adjusted along the swivel axis direction of the quartz swivel (e.g., ...). Figure 5 The X-direction movement adjustment allows for height adjustment. A weight sensor 102 is installed on the fine-tuning platform 103. The fine-tuning platform 103 adjusts the position and height of the weight sensor 102, thereby adjusting the relative distance and position between the swing plate and the weight sensor. The industrial control computer 104 is connected to the fine-tuning platform 103 and the weight sensor 102 via cables, controlling the movement of the fine-tuning platform 103 and reading data from the weight sensor 102. The swing plate holder 101 is calibrated to a horizontal state, and its upper surface has swing plate limiting components, such as multiple limiting posts and limiting grooves. The swing plate holder 101 can be a ring structure, a U-shaped structure, a C-shaped structure, etc.

[0070] Preferably, the loading platform 8, measuring platform 10, and transfer area 11 are arranged in a ring, with the second robotic arm 9 located in the middle of the three.

[0071] like Figure 1 , 6As shown, the second etching assembly includes an interval basket 16, a third robotic arm 15, a swivel etching unit 12, a second rinsing and drying unit 13, and a loading platform 14. The third robotic arm 15 is a slide rail type robotic arm, comprising, from top to bottom, a second slide rail 154, a second vision positioning system 152, a swivel basket picking clamp 151, and a second gripper 153, used to pick up and control the movement of the interval basket 16. The swivel etching unit 12, the second rinsing and drying unit 13, and the loading platform 14 are located below the slide rail and arranged sequentially along the slide rail direction. The swivel etching unit 12 includes an etching tank for secondary etching of the swivel basket; the second rinsing and drying unit 13 includes a neutralization tank 131, a rinsing tank 132, and a drying tank 133 arranged sequentially; the loading platform 14 is used to place the cleaned interval basket 16.

[0072] Preferably, the slide rail of the third robotic arm 15 is linear, and the swivel etching unit 12, the second rinsing and drying unit 13, and the unloading platform 14 are arranged sequentially along a straight line. The interval baskets 16 arranged on the transfer area 11 are collinear with the slide rail of the third robotic arm.

[0073] The weight sensors of the three robotic arms and the measuring components communicate with the host computer, which controls the mechanical movement of the three robotic arms and the adjustment and data acquisition of the measuring components according to the instructions of the host computer.

[0074] Preferably, the quartz disc basket 1 and the oscillating disc basket 2 have 10 to 20 compartments. The interval basket 16 has 5 to 30 compartments, and the positions are classified and sorted according to the interval of 2mg to 50mg, with each interval basket corresponding to the 2mg to 50mg range.

[0075] Preferably, the positional accuracy of the second robotic arm is no less than ±0.5mm, so as to accurately place the quartz disc onto the plate holder. The accuracy of the weight sensor is no less than 1mg.

[0076] In another embodiment of the present invention, the aforementioned etching control system is used to provide a wafer etching method that reduces manual operation, specifically including the following steps:

[0077] S1. The operator places the quartz sheet to be etched using an etching mask;

[0078] S2. Use a 20-cell quartz wafer basket to hold the etching mask for the quartz wafer, and place the basket containing the etching mask into the loading platform.

[0079] S3. The industrial control computer controls the first robotic arm to move to the quartz wafer basket loading platform, controls the first robotic arm to pick up the quartz wafer basket, moves it to the quartz wafer etching unit, and places the quartz wafer basket into the quartz wafer etching unit.

[0080] S4. The quartz wafer etching unit etches the part of the quartz wafer exposed outside the etching mask according to the program; the preset etching time is the time required for the thickness of the swing plate bridge to reach 1.2 times the target thickness. After the preset etching time is reached, the industrial control computer controls the first robotic arm to take out the quartz wafer basket from the quartz wafer etching unit.

[0081] S5. Control the first robotic arm to move to the first rinsing and drying unit, place the quartz wafer basket into the first rinsing and drying unit, and the first rinsing and drying unit rinses and dries the masked quartz wafers in the quartz wafer basket according to the program.

[0082] S6. The industrial control computer controls the first robotic arm to pick up the quartz wafer basket that has been rinsed and dried in the first rinsing and drying unit and place it on the manual table.

[0083] S7. The operator manually removes the quartz wafer from the etching mask and places it in the wafer rack, then places the wafer rack on the quartz wafer loading platform.

[0084] S8. A second robotic arm with a positional accuracy of not less than ±0.2mm is used. The industrial control computer controls the second robotic arm to move to the quartz oscillator loading platform, pick up the quartz oscillator in the oscillator basket, and controls the second robotic arm to move to the measuring platform to place the quartz oscillator on the oscillator frame.

[0085] S9. Use a weight sensor with an accuracy of not less than 0.1mg to measure the remaining weight of the central pendulum of the quartz pendulum when it is fixed and droops by 2mm, and send the data to the industrial control computer.

[0086] S10. The industrial control computer controls the second robotic arm to pick up quartz pendulums from the pendulum rack. Based on the received remaining weight data, the second robotic arm is controlled to move to the interval baskets corresponding to different data ranges in the transfer area and place the quartz pendulums into the interval baskets. The interval baskets are classified and sorted in 10mg intervals. Each basket weight interval corresponds to a 10mg range, and each pendulum basket has 20 spaces.

[0087] S11. After the interval basket is full or a batch of quartz wafers has been tested, the industrial control computer controls the third robotic arm to move to the interval basket position, controls the third robotic arm to pick up the interval basket, moves it to the swing plate etching tank, and places the interval basket in the swing plate etching tank.

[0088] S12, the quartz etch tank etches the quartz slabs in the interval basket according to the procedure;

[0089] S13. The industrial control computer calculates the remaining etching time through a program based on the average remaining weight data of the quartz plates in the interval basket, and controls the third robotic arm to remove the interval basket from the swing plate etching unit when the remaining etching time ends.

[0090] S14. The industrial control computer controls the third robotic arm to move to the second rinsing and drying unit, placing the interval basket inside. The second rinsing and drying unit then rinses and dries the quartz discs in the interval basket according to the program.

[0091] S15. The industrial control computer controls the third robotic arm to pick up the basket of the rinsed and dried quartz wafers in the second rinsing and drying unit and place it on the unloading platform.

[0092] By applying the pendulum etching method and etching control system described in this invention during the production of quartz flexible accelerometers, the production efficiency of the pendulums can be effectively improved, labor intensity reduced, and the consistency of the pendulums' specific stiffness and the safety of the production process significantly enhanced.

[0093] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

[0094] The parts of this invention not described in detail are techniques known to those skilled in the art.

Claims

1. A method for etching a planar plate, characterized in that, Includes the following steps S1. Through the pre-test of pendulum etching, the relationship curve between the remaining weight of the central pendulum and the remaining etching time was statistically analyzed. S2. Place the batch of quartz sheets with the etching mask in the etching solution, complete the first etching according to the predetermined etching time, take out the quartz sheets, rinse and dry them, and remove the etching mask. S3. Measure the remaining weight of the central pendulum of the batch of quartz sheets, group the quartz sheets according to the remaining weight range, calculate the average remaining weight of each group, and calculate the remaining etching time of each group of quartz sheets according to the relationship curve in step S1. S4. Each set of quartz plates completes the second etching according to the remaining etching time, and then the quartz plates are removed, rinsed, and dried.

2. The etching method for the oscillating plate as described in claim 1, characterized in that, Step S1 includes the following steps: Preliminary etching experiments were conducted using quartz plates and etching solutions of the same specifications. During the etching process, the quartz sheet is removed at fixed time intervals. With the quartz sheet in a horizontal state, a weight sensor is used to measure the remaining weight of the central pendulum at a fixed position and with a fixed sag. The specific stiffness of the pendulum is calculated, and the etching experiment continues until the specific stiffness meets the design requirements. The complete etching time is recorded. The remaining etching time corresponding to each remaining weight was calculated, and the relationship curve between the remaining weight and the remaining etching time was fitted.

3. The etching method for the oscillating plate as described in claim 2, characterized in that, In step S3, when measuring the remaining weight of the central pendulum of the batch of quartz wafers, the measurement position and sag of the central pendulum are consistent with those of the etching pre-test.

4. The etching method for the oscillating plate as described in claim 3, characterized in that, The fixed sag of the central pendulum is 0.2mm to 5.0mm; the preset etching time in step S2 is the time required for the thickness of the pendulum flat bridge to reach 1.2 to 2 times the target thickness.

5. An etching control system for a plate, characterized in that, The etching control system comprising any one of claims 1 to 4, using the etching method described in any one of claims 1 to 4. An etching assembly, which is used to perform two etching processes on the plate, including cleaning and drying; A measurement assembly, comprising a measurement stage and a measurement robotic arm; The measuring platform includes a swivel frame, a weight sensor, a fine-tuning platform, an industrial computer, and a base. The swivel frame is fixed on the base, and the swivel to be measured is placed on the swivel frame. The fine-tuning platform is located on the base below the swivel frame and has adjustment functions along the swivel axis and in the height direction. The weight sensor is installed on the fine-tuning platform to measure the remaining weight of the swivel at a certain position and with a fixed sag. The industrial computer is connected to the fine-tuning platform and the weight sensor via cables. The measuring robotic arm picks up and moves the pendulum to a predetermined position.

6. The etching control system for the oscillating plate as described in claim 5, characterized in that, The measurement assembly also includes a slab basket, a slab loading platform, a transfer area, and interval baskets. The slab baskets are placed on the slab loading platform to accommodate slabs with the etch mask removed. The interval baskets are placed in the transfer area and include multiple baskets, each accommodating slabs of different weight ranges. The slab loading platform, measurement platform, and transfer area are arranged in a ring, with the measurement robotic arm located in the middle of the three.

7. The etching control system for the oscillating plate as described in claim 6, characterized in that, The slide holder is calibrated to a horizontal state, and the upper surface of the slide holder has a slide limiting component; the weight range of the interval basket is in the range of 2mg to 50mg.

8. The etching control system for the oscillating plate as described in claim 7, characterized in that, The limiting component is a combination of multiple limiting posts or limiting grooves; the swing plate frame is a ring structure, a U-shaped structure, or a C-shaped structure.

9. The etching control system for the oscillating plate as described in claim 5, characterized in that, The etching assembly comprises two sets, arranged on both sides of the measuring assembly, for the first and second etching processes of the wafers, respectively; the etching assembly includes a basket, a robotic arm, a loading platform, an etching unit, a rinsing and drying unit, and a unloading platform; the basket is used to hold the wafers to be etched; the robotic arm is a slide rail type robotic arm, used to pick up and control the movement of the basket; the loading platform, etching unit, rinsing and drying unit, and unloading platform are located below the slide rail and arranged sequentially along the slide rail direction.

10. The etching control system for the oscillating plate as described in claim 9, characterized in that, The robotic arm includes a slide rail, a vision positioning system, a pickup gripper, and a gripper arranged sequentially from top to bottom, and the slide rail is linear; the rinsing and drying unit includes a neutralization tank, a rinsing tank, and a drying tank arranged sequentially. The positional accuracy of the measuring robotic arm is no less than ±0.5mm; the accuracy of the weight sensor is no less than 1mg.

Images