A semiconductor heat dissipation performance testing device

Abstract

The present application relates to a semiconductor heat dissipation performance testing device, belonging to the technical field of semiconductor performance testing. It includes a base, a testing platform, a thermocouple, a tester, and two vertical blocks. The two vertical blocks are respectively installed on the base and are parallel to each other. The testing platform is located above the vertical blocks and is fixedly connected to the base. The thermocouple is installed on the upper surface of the testing platform and is electrically connected to the tester. Two slots for inserting semiconductor pins are provided on the testing platform, and the slots penetrate the testing platform. An installation block is further provided below the testing platform, and the installation block is connected to the part of the testing platform between the two slots. Movable plates capable of synchronously moving towards the vertical blocks are respectively provided on the side surfaces of the installation block corresponding to the two vertical blocks. Pressing plates capable of moving towards the installation block are provided on the side surfaces of the two vertical blocks corresponding to the installation block. Contact spring pieces capable of abutting against the pins are respectively provided on the opposite sides of the movable plates and the pressing plates. Sockets electrically connected to the contact spring pieces on the pressing plates are provided on each vertical block. The present application has the effect of improving the testing efficiency of semiconductor heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of semiconductor performance testing, and particularly to a semiconductor heat dissipation performance testing device. Background Art

[0002] Semiconductors have a wide range of application scenarios in the fields of integrated circuits, communication systems, lighting, etc. The heat dissipation performance of semiconductors directly affects their reliability and service life. Currently, the testing of semiconductor heat dissipation performance is usually carried out by energizing the pins on the semiconductor, and at the same time, collecting the heat generated by the energized semiconductor using thermocouples, and finally feeding back through relevant instruments electrically connected to the thermocouples.

[0003] In the prior art, in order to ensure that the position of the semiconductor does not change easily during testing and thus affect the test results, the semiconductor pins are usually inserted into the insertion tubes to fix the position of the semiconductor. The insertion tubes are provided with contact reeds that can be connected to the external circuit. After the semiconductor pins are inserted into the insertion tubes, the semiconductor can be energized by contacting the contact reeds. Further, in order to be compatible with the pins of different pitches on various semiconductors, the two insertion tubes are connected by a bidirectional screw, and then the distance between the two insertion tubes can be adjusted.

[0004] However, this method of fixing the semiconductor requires the staff to spend time rotating the bidirectional screw to adjust the distance between the two insertion tubes before fixing the pins of different pitches on various semiconductors, so that the pins of the semiconductor can be smoothly inserted into the insertion tubes without deformation, resulting in low test efficiency. Summary of the Invention

[0005] In order to improve the test efficiency of semiconductor heat dissipation performance, this application provides a semiconductor heat dissipation performance testing device.

[0006] The semiconductor heat dissipation performance testing device provided by this application adopts the following technical solutions:

[0007] It includes a base, a test platform, a thermocouple, a tester, and two vertical blocks. The two vertical blocks are respectively installed on the base and are parallel to each other. The test platform is located above the vertical blocks and is fixedly connected to the base. The thermocouple is installed on the upper surface of the test platform and is electrically connected to the tester. There are two slots on the test platform for inserting semiconductor pins. The slots penetrate the test platform. There is also an installation block below the test platform. The installation block is connected to the part of the test platform between the two slots. Movable plates capable of synchronously moving towards the vertical blocks are provided on the side surfaces of the installation block corresponding to the two vertical blocks respectively. Pressing plates capable of moving towards the installation block are provided on the side surfaces of the two vertical blocks corresponding to the installation block. Contact spring pieces capable of abutting against the pins are respectively provided on the opposite surfaces of the movable plates and the pressing plates. Sockets electrically connected to the contact spring pieces on the pressing plates are provided on each vertical block.

[0008] By adopting the above technical solution, first place the semiconductor on the test platform so that the two pins of the semiconductor respectively pass through the two slots. At this time, the two pins are respectively on both sides of the installation block. Then, make the movable plate move from the installation block towards the vertical block until the contact spring piece on the movable plate abuts against the side of the pin close to the installation block. Then, make the pressing plate move towards the installation block until the contact spring piece on the pressing plate abuts against the side of the pin close to the vertical block, and the fixation of the semiconductor on the test platform can be realized. Subsequently, by connecting the socket to an external power supply, the semiconductor is in an energized state. At this time, the thermocouple on the test platform senses the heat of the semiconductor and converts the heat into an electrical signal and transmits it to the tester. The staff can record the relevant parameters at the tester. During the whole test process, the contact spring piece plays a certain buffering role for the pins, reducing the probability of deformation of the pins. And only need to align the pins on the semiconductor with the slots and make the pins be between the contact spring pieces on the movable plate and the pressing plate, without spending extra time adjusting the distance between the two insertion cylinders, saving time and achieving the effect of improving the test efficiency of the heat dissipation performance of the semiconductor.

[0009] Optionally, a first gas channel is provided in the installation block. A first valve for controlling the gas flow rate in the first gas channel is provided on the installation block. A first connecting plate is provided on the side surface of the movable plate close to the installation block. One end of the first connecting plate is vertically connected to the movable plate. The other end of the first connecting plate is provided with a first piston plate. The first piston plate is located in the first gas channel.

[0010] By adopting the above technical solution, the pressure in the first gas channel is increased by conveying gas into the first gas channel. The first piston plate drives the first connecting plate to extend from the installation block under the action of the pressure, so that the pressing plate can move towards the vertical block, and the contact spring piece on the movable plate can abut against the pin. And the pressure applied to the pin by the movable plate can be adjusted through the first valve, reducing the probability of deformation of the pin when the contact spring piece on the movable plate abuts against the pin.

[0011] Optionally, a second gas passage is provided in each upright block, and a second valve for controlling the gas flow rate in the second gas passage is provided on the upright block. A second connecting plate is provided on the side of the pressing plate close to the upright block. One end of the second connecting plate is vertically connected to the pressing plate, and the other end of the second connecting plate is provided with a second piston plate, and the second piston plate is located in the second gas passage.

[0012] By adopting the above technical solution, the pressure in the second gas passage is increased by respectively delivering gas into the two second gas passages. Under the action of the pressure, the second piston plate drives the second piston rod to extend from the upright block, and the pressing plate moves towards the mounting block, so that the contact spring piece on the pressing plate can contact the pin. The second valve can adjust the pressure applied by the pressing plate on the pin. This makes it possible to increase the pressure applied by the pressing plate on the pin when the pin is deformed due to excessive pressure applied by the movable plate when the pin contacts the movable plate, thereby compensating for the deformation of the pin.

[0013] Optionally, a limiting groove is provided on the side of the movable plate away from the first connecting plate, and the contact spring piece on the movable plate is located in the limiting groove and can contact the semiconductor pin.

[0014] By adopting the above technical solution, a limiting groove is provided on the movable plate, and the contact spring piece on the movable plate is located in the limiting groove. This makes it so that after the contact spring piece on the movable plate contacts the pin, the position of the semiconductor on the test platform does not easily change.

[0015] Optionally, a limiting block is provided at the position of the pressing plate corresponding to the limiting groove. The limiting block can be inserted and matched with the limiting groove, and the contact spring piece on the pressing plate is mounted on the limiting block.

[0016] By adopting the above technical solution, a limiting block that can be inserted and matched with the limiting groove is provided at the position of the pressing plate corresponding to the limiting groove, and the contact spring piece on the pressing plate is provided on the limiting block. This makes it so that when the semiconductor is in an energized state, the two contact spring pieces are in a relatively enclosed space formed by the limiting block and the limiting groove, reducing the risk of electric shock when the operator accidentally touches the contact spring piece during operation.

[0017] Optionally, the base is provided with a C-shaped sliding groove, the test platform is provided with a guiding groove parallel to the C-shaped sliding groove, sliding parts that can be slidably matched with the C-shaped sliding groove are provided at the positions of the respective upright blocks corresponding to the C-shaped sliding groove, and guiding parts that can be slidably matched with the guiding groove are provided at the positions of the respective upright blocks corresponding to the guiding groove. The two upright blocks can slide towards each other or away from each other between the base and the test platform.

[0018] By adopting the above technical solution, a C-shaped chute is provided on the base, and a guiding groove is provided on the test platform, which enables the distance between the two vertical blocks to be adjusted. When the pressure in the second gas passage is at its maximum but the pressure on the pressing plate is still insufficient to compensate for the deformation of the pins, the distance between the vertical blocks can be shortened to increase the pressure that the pressing plate can exert on the pins, thereby increasing the range of the pressure exerted by the pressing plate.

[0019] Optionally, a limit bolt is inserted through the sliding part. The limit bolt is connected to the sliding part by means of a threaded fit. After passing through the sliding part, the limit bolt can abut against the bottom surface of the C-shaped chute.

[0020] By adopting the above technical solution, the positions of the two vertical blocks on the base can be fixed by setting the limit bolt, and the limit bolt plays a role in limiting.

[0021] Optionally, an input main pipeline is provided on the test platform. One end of the input main pipeline is located between the two slots. The other end of the input main pipeline is respectively communicated with the first gas passage and the second gas passage. A connecting hose is provided between the input main pipeline and the second gas passage.

[0022] By adopting the above technical solution, one end of the input main pipeline is located between the two slots on the test platform, which makes the time taken for the gas to flow through the input main pipeline into the first gas passage shorter than the time for the gas to flow into the second gas passage, realizing the sequential movement of the movable plate and the pressing plate. At the same time, a connecting hose is provided between the input main pipeline and the second gas passage, so that when the positions of the two vertical blocks on the base change, the input main pipeline can always remain communicated with the second gas passage, and only by supplying gas into the input main pipeline can the gas in the first gas passage and the second gas passage be replenished.

[0023] In summary, the present application includes at least the following beneficial technical effects:

[0024] 1. After the semiconductor pins are respectively inserted into the slots, the movable plate on the mounting block and the pressing plate on the vertical block can respectively abut against the pins. The abutting spring pieces on the movable plate and the pressing plate play a buffering role when the pins abut against the movable plate and the pressing plate, achieving the effect of reducing the probability of pin deformation during the thermal performance test of the semiconductor.

[0025] 2. By providing a first valve on the mounting block, the pressure in the first gas passage can be adjusted, achieving the effect of adjusting the abutting force between the movable plate and the pins, and reducing the probability of pin deformation caused by excessive abutting pressure between the movable plate and the pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1It is a three-dimensional schematic diagram of a semiconductor placed on a semiconductor heat dissipation performance testing device in an embodiment of the present application;

[0027] Figure 2 It is to hide Figure 1 The three-dimensional schematic diagram after the semiconductor in;

[0028] Figure 3 It is Figure 1 The cross-sectional schematic diagram after the front view is cut open;

[0029] Figure 4 It is Figure 1 The three-dimensional schematic diagram after hiding the test platform in;

[0030] Figure 5 It is Figure 4 The enlarged schematic diagram at position A in;

[0031] Figure 6 It is Figure 1 The right view of;

[0032] Figure 7 It is Figure 6 The cross-sectional schematic diagram cut along B-B;

[0033] Figure 8 It is Figure 3 The cross-sectional schematic diagram after cutting along C-C.

[0034] Explanation of reference numerals: 1, base; 2, test platform; 3, thermocouple; 4, tester; 5, vertical block; 6, slot; 7, mounting block; 8, movable plate; 9, pressing plate; 10, abutting reed; 11, socket; 12, gas passage 1; 13, valve 1; 14, connecting plate 1; 15, piston plate 1; 16, gas passage 2; 17, valve 2; 18, connecting plate 2; 19, piston plate 2; 20, limiting groove; 21, limiting block; 22, C-shaped sliding groove; 23, guiding groove; 24, sliding part; 25, guiding part; 26, limiting bolt; 27, input main pipeline; 28, connecting hose. Detailed implementation manners

[0035] The following further elaborates on the present application in conjunction with the attached Figure 1-8 figures. Embodiment

[0036] An embodiment of the present application discloses a semiconductor heat dissipation performance testing device. Refer to Figure 1 , Figure 2 and Figure 3, including a base 1, a test platform 2, a thermocouple 3, a tester 4, and two vertical blocks 5. The base 1 is horizontally arranged, and the two vertical blocks 5 are vertically arranged on the upper surface of the base 1. The two vertical blocks 5 are parallel to each other. The test platform 2 is installed above the vertical blocks 5, and the two vertical blocks 5 are respectively located at both ends of the test platform 2 in the length direction. Two slots 6 for inserting semiconductor pins and passing through the test platform 2 are provided on the test platform 2. The two slots 6 are symmetrically distributed with the midline of the test platform 2 in the length direction as the axis of symmetry. The thermocouple 3 is installed on the part of the test platform 2 between the two slots 6 and is electrically connected to the tester 4.

[0037] An installation block 7 is also provided below the test platform 2. The length direction of the installation block 7 is parallel to the width direction of the test platform 2. The installation block 7 is connected to the part of the test platform 2 between the two slots 6. The installation block 7 is parallel to the vertical block 5. A gas passage 12 with an extension direction consistent with the length direction of the installation block 7 is provided inside the installation block 7. On the side surfaces of the installation block corresponding to the two vertical blocks 5 respectively, movable plates 8 are provided. On the side of the movable plate 8 close to the installation block 7, a connecting plate 14 and a piston plate 15 are provided. The piston plate 15 is located in the gas passage 12. One end of the connecting plate 14 is perpendicularly connected to the movable plate 8, and the other end of the connecting plate 14 is perpendicularly connected to the piston plate 15. This enables that when the gas passage 12 is filled with enough gas, the piston plate 15 pushes the connecting plate 14 to extend from the installation block 7 under the action of the gas, and then drives the movable plate 8 to move towards the direction close to the vertical block 5.

[0038] A gas passage 16 is provided inside the vertical block 5. On the side surfaces of the two vertical blocks 5 close to the installation block 7, pressing plates 9, connecting plates 18, and piston plates 19 are respectively provided. The piston plate 19 is located in the gas passage 16. One end of the connecting plate is perpendicularly connected to the pressing plate 9, and the other end of the connecting plate 18 is perpendicularly connected to the piston plate 19. When the gas passage 16 is filled with enough gas, the piston plate 19 pushes the connecting plate 18 to extend from the vertical block 5 under the action of the gas, and then drives the pressing plate 9 to move towards the direction of the installation block 7.

[0039] Both the above-mentioned movable plate 8 and the pressing plate 9 are made of insulating materials.

[0040] Refer to Figure 3 、 Figure 4 and Figure 5, Further, a limiting groove 20 is provided on the movable plate 8. The extending direction of the limiting groove 20 is consistent with the width direction of the movable plate 8. At the position corresponding to the limiting groove 20 on the movable plate 8 on the pressing plate 9, a limiting block 21 is provided. The limiting block 21 can be connected to the limiting groove 20 on the movable plate 8 in a plug-in fit manner. On the limiting groove 20 and the limiting block 21, abutting spring pieces 10 are provided. And on each vertical block 5, a socket 11 electrically connected to the abutting spring piece 10 is provided.

[0041] The plug-in fit between the plug-in groove and the limiting groove 20 enables the upper pins of the semiconductor to be in an energized state when contacting the abutting spring piece 10, and the pins will not be exposed to the outside in a large area, thereby reducing the risk probability of electric shock caused by accidental contact by the staff.

[0042] When it is necessary to test the heat dissipation performance of the semiconductor, first place the semiconductor on the test platform 2, then insert the two pins of the semiconductor into the slots 6 respectively, and then inject gas into the gas passage 12. Under the action of the gas, the movable plates 8 located on both sides of the mounting block 7 extend out of the mounting block 7 synchronously until the abutting spring piece 10 in the limiting groove 20 abuts against one side of the pin. Subsequently, by injecting gas into the gas passage 16, the pressing plate 9 extends out of the vertical block 5 until the limiting block 21 is inserted into the limiting groove 20. At this time, the abutting spring piece 10 on the limiting block 21 also abuts against the pin of the semiconductor. Then connect an external power supply to the socket 11 on one of the vertical blocks 5. At this time, the current will flow through the abutting spring piece 10 on the pressing plate 9 to the pins of the semiconductor, thereby enabling the semiconductor on the test platform 2 to be in an energized state. And the thermocouple 3 senses the temperature of the semiconductor at this time and converts it into an electrical signal and transmits it to the tester 4 for the staff to record.

[0043] Refer to Figure 1 and Figure 3 , Further, a valve 13 for adjusting the gas flow rate in the gas passage 12 is provided on the mounting block 7, and valves 17 for adjusting the gas flow rate in the gas passage 16 are respectively provided on each vertical block 5. The valve 13 can adjust the moving speed and abutting force of the movable plate 8 towards the pin, thereby reducing the probability that the force exerted by the movable plate 8 on the pin is too large and causing the pin to deform. And the valve 17 is used to adjust the gas flow rate in the gas passage 16, thereby adjusting the rate and force of the pressing plate 9 abutting against the pin. This enables even if the pin changes when the movable plate 8 abuts against the pin, the pressure in the gas passage 16 can be increased through the valve 17 subsequently, so that the force of the pressing plate 9 abutting against the pin is greater than the force of the movable plate 8 abutting against the pin, thereby realizing the compensation for the pin deformation.

[0044] A C-shaped chute 22 with an extension direction consistent with the length direction of the base 1 is provided on the base 1. On the lower surface of the test platform 2, a guiding groove 23 with a length direction consistent with the length direction of the test platform 2 is provided. The guiding groove 23 is parallel to the C-shaped chute 22. Above each upright block 5, a guiding portion 25 capable of slidingly cooperating with the guiding groove 23 is provided. Below each upright block 5, a sliding portion 24 capable of slidingly cooperating with the C-shaped chute 22 is provided. A connecting plate is provided between the test platform 2 and the base 1, which makes the test platform 2 and the base 1 fixedly connected. Thus, when each upright block 5 moves towards each other or away from each other along the sliding direction of the C-shaped groove, the stability of the test platform 2 will not be affected.

[0045] To facilitate driving the sliding of the upright blocks 5, two relatively arranged cylinders are provided on the base 1. The movable ends of the two cylinders are respectively connected to each upright block 5, thereby realizing the movement of the two upright blocks 5 on the base 1, so that the distance between the two upright blocks 5 can be adjusted.

[0046] In other embodiments, the relative movement or separation movement of the two upright blocks 5 can also be realized by a bidirectional screw rod whose two ends are respectively threadedly connected to the two upright blocks 5.

[0047] Furthermore, a limit bolt 26 is provided on the sliding portion 24. The limit bolt 26 is connected to the sliding portion 24 by means of threaded cooperation. When it is necessary to limit the position of the upright block 5 on the base 1, by tightening the limit bolt 26, the end of the limit bolt 26 can be made to abut against the bottom surface of the C-shaped chute 22, thereby fixing the position of the upright block 5 on the base 1.

[0048] Refer to Figure 6 、 Figure 7 and Figure 8 , an input main pipeline 27 for gas input is provided on the test platform 2. One end of the input main pipeline 27 is used to communicate with an external gas source, and the other end of the input main pipeline 27 branches into three branches respectively used to communicate with the gas passage one 12 and the two gas passages two 16. One end of the input main pipeline 27 used to communicate with the external gas source is located between the two slots 6 of the test platform 2. The input main pipeline 27 and the gas passage two 16 on the upright block 5 are communicated by means of a connecting hose 28, which enables the gas to be continuously supplied into the gas passage two 16 when the upright block 5 moves between the base 1 and the test platform 2.

[0049] The implementation principle of the embodiment of this application is as follows: First, insert the two pins of the semiconductor into the slot 6 respectively, close the second valve 17 and open the first valve 13, and at the same time, send gas into the input main pipeline 27, so that the gas enters the first gas channel 12, and then the movable plate 8 moves towards the direction of the column until the pin abuts against the contact reed 10 located in the limit groove 20. Then open the second valve 17, so that the pressing plates 9 on the two vertical blocks 5 move towards the direction of the movable plate 8 respectively until the limit block 21 is inserted into the limit groove 20 and the contact reed 10 on the limit block 21 abuts against the pin. After that, connect the power supply through the socket 11 to make the semiconductor in an energized state. Then the thermocouple 3 senses the heat of the semiconductor and transmits the relevant data to the tester 4 in the form of an electrical signal.

[0050] The above are all the preferred embodiments of this application. The protection scope of this application is not limited hereby. Therefore, all equivalent changes made according to the structure, shape and principle of this application shall be covered within the protection scope of this application.

Claims

1. A semiconductor heat dissipation performance testing device, characterized in that: It includes a base (1), a test platform (2), a thermocouple (3), a tester (4), and two vertical blocks (5). The two vertical blocks (5) are respectively installed on the base (1) and are parallel to each other. The test platform (2) is located above the vertical blocks (5) and is fixedly connected to the base (1). The thermocouple (3) is installed on the upper surface of the test platform (2) and is electrically connected to the tester (4). Two slots (6) for inserting semiconductor pins are provided on the test platform (2), and the slots (6) penetrate through the test platform (2). An installation block (7) is further provided below the test platform (2), and the installation block (7) is connected to the part of the test platform (2) between the two slots (6). Movable plates (8) capable of synchronously moving towards the vertical blocks (5) are provided on the corresponding sides of the installation block (7) and the two vertical blocks (5). Pressing plates (9) capable of moving towards the installation block (7) are respectively provided on the corresponding sides of the two vertical blocks (5) corresponding to the installation block (7). Contact spring pieces (10) capable of contacting the pins are respectively provided on the opposite sides of the movable plates (8) and the pressing plates (9). Sockets (11) electrically connected to the contact spring pieces (10) on the pressing plates (9) are provided on the vertical blocks (5); a limiting groove (20) is provided on the movable plate (8), and the extending direction of the limiting groove (20) is the same as the width direction of the movable plate (8). The contact spring piece (10) on the movable plate (8) is located in the limiting groove (20) and can contact the semiconductor pin. And a limiting block (21) is provided at the position corresponding to the limiting groove (20) on the movable plate (8) on the pressing plate (9). The limiting block (21) can be connected to the limiting groove (20) on the movable plate (8) in a plug-in fit manner, and the contact spring piece (10) on the pressing plate (9) is installed on the limiting block (21).

2. The semiconductor heat dissipation performance testing device according to claim 1, characterized in that: A gas passage one (12) is provided in the installation block (7), and a valve one (13) for controlling the gas flow in the gas passage one (12) is provided on the installation block (7). A connecting plate one (14) is provided on the side of the movable plate (8) close to the installation block (7). One end of the connecting plate one (14) is vertically connected to the movable plate (8), and a piston plate one (15) is provided at the other end of the connecting plate one (14). The piston plate one (15) is located in the gas passage one (12).

3. The semiconductor heat dissipation performance testing device according to claim 2, characterized in that: A gas passage two (16) is provided in each of the vertical blocks (5), and a valve two (17) for controlling the gas flow in the gas passage two (16) is provided on the vertical block (5). A connecting plate two (18) is provided on the side of the pressing plate (9) close to the vertical block (5). One end of the connecting plate two (18) is vertically connected to the pressing plate (9), and a piston plate two (19) is provided at the other end of the connecting plate two (18). The piston plate two (19) is located in the gas passage two (16).

4. The semiconductor heat dissipation performance testing device according to claim 3, characterized in that: The base (1) is provided with a C-shaped sliding groove (22), the test platform (2) is provided with a guiding groove (23) parallel to the C-shaped sliding groove (22), at positions corresponding to the C-shaped sliding groove (22) on each of the upright blocks (5), there are sliding parts (24) capable of slidingly cooperating with the C-shaped sliding groove (22), and at positions corresponding to the guiding groove (23) on each of the upright blocks (5), there are guiding parts (25) capable of slidingly cooperating with the guiding groove (23). The two upright blocks (5) can slide towards each other or away from each other between the base (1) and the test platform (2).

5. The semiconductor heat dissipation performance testing device according to claim 4, characterized in that: A limit bolt (26) is passed through the sliding part (24), the limit bolt (26) is connected to the sliding part (24) by means of a threaded fit, and after passing through the sliding part (24), the limit bolt (26) can abut against the bottom surface of the C-shaped sliding groove (22).

6. The semiconductor heat dissipation performance testing device according to claim 4, characterized in that: The test platform (2) is provided with an input main pipeline (27), one end of the input main pipeline (27) is located between the two slots (6), the other end of the input main pipeline (27) is respectively communicated with the gas passage one (12) and the gas passage two (16), and a connecting hose (28) is arranged between the input main pipeline (27) and the gas passage two (16).

Images