Mass transfer method

Abstract

The present application provides a mass transfer method, comprising: adhering a plurality of first micro-LEDs to a first stretchable film, adhering a plurality of second micro-LEDs to a second stretchable film, and adhering a plurality of third micro-LEDs to a third stretchable film; stretching the first stretchable film, the second stretchable film, and the third stretchable film respectively to obtain a first expansion film, a second expansion film, and a third expansion film; adhering the plurality of first micro-LEDs on the first expansion film, the plurality of second micro-LEDs on the second expansion film, and the plurality of third micro-LEDs on the third expansion film respectively to a transfer film; and placing the transfer film above an array substrate to cause the plurality of first micro-LEDs, the plurality of second micro-LEDs, and the plurality of third micro-LEDs to fall off the transfer film and onto the array substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a mass transfer method. Background Art

[0002] Currently, micro-light emitting diodes (microLEDs) realize full-color display technology. The traditional method is to transfer red micro-LEDs, blue micro-LEDs, and green micro-LEDs to a driving backplane in sequence. The traditional method has the problem of low transfer efficiency.

[0003] Therefore, how to improve the transfer efficiency of micro light-emitting diodes is a technical problem that needs to be solved. Summary of the Invention

[0004] The purpose of this application is to provide a mass transfer method to improve the transfer efficiency of micro light emitting diodes.

[0005] In a first aspect, the present application provides a mass transfer method, comprising:

[0006] Adhering a plurality of first micro-LEDs to a first stretchable film, adhering a plurality of second micro-LEDs to a second stretchable film, and adhering a plurality of third micro-LEDs to a third stretchable film, wherein the first micro-LEDs, the second micro-LEDs, and the third micro-LEDs are configured to emit light of three different colors respectively;

[0007] stretching the first stretchable film, the second stretchable film, and the third stretchable film respectively to obtain a first expanded film, a second expanded film, and a third expanded film;

[0008] Adhere the plurality of first micro-LEDs on the first expansion film, the plurality of second micro-LEDs on the second expansion film, and the plurality of third micro-LEDs on the third expansion film to the first surface of the transfer film, respectively, with the first micro-LEDs, the second micro-LEDs, and the third micro-LEDs being spaced apart from each other;

[0009] The transfer film is placed above an array substrate including a plurality of first electrode pairs, a plurality of second electrode pairs, and a plurality of third electrode pairs, so that the plurality of first micro-light emitting diodes, the plurality of second micro-light emitting diodes, and the plurality of third micro-light emitting diodes fall off the transfer film and onto the array substrate, and the plurality of first micro-light emitting diodes are arranged one-to-one with the plurality of groups of first electrode pairs, the plurality of second micro-light emitting diodes are arranged one-to-one with the plurality of groups of second electrode pairs, and the plurality of third micro-light emitting diodes are arranged one-to-one with the plurality of groups of third electrode pairs.

[0010] In the mass transfer method of some embodiments, the transfer film further has a second surface, and the first surface and the second surface are arranged opposite to each other in the thickness direction of the transfer film;

[0011] Placing the transfer film above an array substrate including a plurality of first electrode pairs, a plurality of second electrode pairs, and a plurality of third electrode pairs comprises:

[0012] The second surface of the transfer film is adsorbed onto an adsorption substrate so that the plurality of first micro-light emitting diodes and the plurality of first electrode pairs, the plurality of second micro-light emitting diodes and the plurality of second electrode pairs, and the plurality of third micro-light emitting diodes and the plurality of third electrode pairs are arranged in a one-to-one correspondence.

[0013] In the mass transfer method of some embodiments, the adsorption substrate includes a first alignment mark, and a second alignment mark is provided on a surface of the array substrate close to the adsorption substrate;

[0014] The method further comprises:

[0015] The first alignment mark and the second alignment mark are arranged correspondingly.

[0016] In the mass transfer method of some embodiments, after the first alignment mark and the second alignment mark are set correspondingly, and before the plurality of first micro-LEDs, the plurality of second micro-LEDs, and the plurality of third micro-LEDs are removed from the transfer film and placed onto the array substrate, the method further includes:

[0017] The transfer film is separated from the adsorption substrate, and the plurality of the first micro-light emitting diodes, the plurality of the second micro-light emitting diodes and the plurality of the third micro-light emitting diodes fall on the array substrate, and the plurality of the first micro-light emitting diodes are arranged in a one-to-one correspondence with the plurality of groups of the first electrode pairs, the plurality of the second micro-light emitting diodes are arranged in a one-to-one correspondence with the plurality of groups of the second electrode pairs, and the plurality of the third micro-light emitting diodes are arranged in a one-to-one correspondence with the plurality of groups of the third electrode pairs.

[0018] In the mass transfer method of some embodiments, on the array substrate, there is a first preset spacing between two adjacent groups of the first electrode pairs, a second preset spacing between two adjacent groups of the second electrode pairs, and a third preset spacing between two adjacent groups of the third electrode pairs;

[0019] The respectively stretching the first stretchable film, the second stretchable film and the third stretchable film comprises:

[0020] The first stretchable film is stretched until the spacing between two adjacent groups of the first micro-light emitting diodes is a first preset spacing, the second stretchable film is stretched until the spacing between two adjacent groups of the second micro-light emitting diodes is a second preset spacing, and the third stretchable film is stretched until the spacing between two adjacent groups of the third micro-light emitting diodes is a third preset spacing.

[0021] In the mass transfer method of some embodiments, the first preset interval, the second preset interval, and the third preset interval are equal.

[0022] In the mass transfer method of some embodiments, the step of causing the plurality of first micro-LEDs, the plurality of second micro-LEDs, and the plurality of third micro-LEDs to fall off from the transfer film onto the array substrate includes:

[0023] The transfer film is irradiated with ultraviolet light until the plurality of first micro-light emitting diodes, the plurality of second micro-light emitting diodes, and the plurality of third micro-light emitting diodes fall off the transfer film.

[0024] In the mass transfer method of some embodiments, each of the first micro-LEDs includes a first light-emitting body and a set of first pin pairs connected to the first light-emitting body, each of the second micro-LEDs includes a second light-emitting body and a set of second pin pairs connected to the second light-emitting body, and each of the third micro-LEDs includes a third light-emitting body and a set of third pin pairs connected to the third light-emitting body.

[0025] The method of adhering a plurality of first micro-LEDs to a first stretchable film, adhering a plurality of second micro-LEDs to a second stretchable film, and adhering a plurality of third micro-LEDs to a third stretchable film comprises:

[0026] A plurality of groups of the first pin pairs are adhered to the first stretchable film, a plurality of groups of the second pin pairs are adhered to the second stretchable film, and a plurality of groups of the third pin pairs are adhered to the third stretchable film.

[0027] In the mass transfer method of some embodiments, the step of respectively adhering the plurality of first micro-LEDs on the first expansion film, the plurality of second micro-LEDs on the second expansion film, and the plurality of third micro-LEDs on the third expansion film to the first surface of the transfer film includes:

[0028] A plurality of the first light emitting bodies, a plurality of the second light emitting bodies, and a plurality of the third light emitting bodies are adhered to the first surface of the transfer film.

[0029] In some embodiments of the mass transfer method, the method further includes:

[0030] The plurality of first lead pairs and the plurality of first electrode pairs, the plurality of second lead pairs and the plurality of second electrode pairs, and the plurality of third lead pairs and the plurality of third electrode pairs are bonded one to one.

[0031] Beneficial effect: Due to the first molding, multiple first micro-LEDs are adhered to the first stretchable film, multiple second micro-LEDs are adhered to the second stretchable film, and multiple third micro-LEDs are adhered to the third stretchable film; then the first stretchable film, the second stretchable film and the third stretchable film are stretched respectively by film expansion, so that the spacing between the multiple first micro-LEDs, the spacing between the multiple second micro-LEDs and the spacing between the multiple third micro-LEDs are all increased; then the second molding is performed to transfer the multiple first micro-LEDs, the multiple second micro-LEDs and the multiple third micro-LEDs to a transfer film; finally, the multiple first micro-LEDs, the multiple second micro-LEDs and the multiple third micro-LEDs on the transfer film are transferred to the array substrate through a one-time transfer process to improve the transfer efficiency of multiple micro-LEDs emitting three different colors of light to the array substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic flow chart of a mass transfer method according to an embodiment of the present application;

[0033] Figures 2A to 2G for Figure 1 Schematic diagram of the process of the mass transfer method shown. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0035] See also Figure 1 , which is a flow chart of a mass transfer method according to an embodiment of the present application. The mass transfer method includes the following steps:

[0036] S101: Adhere a plurality of first micro-LEDs to a first stretchable film, adhere a plurality of second micro-LEDs to a second stretchable film, and adhere a plurality of third micro-LEDs to a third stretchable film, wherein the first micro-LEDs, the second micro-LEDs, and the third micro-LEDs are respectively used to emit three different colors of light.

[0037] The first micro-LED R emits red light, the second micro-LED G emits green light, and the third micro-LED B emits blue light. The first micro-LED R, the second micro-LED G, and the third micro-LED B are all Micro-LEDs. It is understood that the micro-LEDs can also emit white or yellow light.

[0038] like Figure 2A As shown, each first micro-LED R includes a first light-emitting body RB and a set of first pin pairs RD connected to the first light-emitting body RB. Each first pin pair RD includes two first pins connected to the first light-emitting body RB. Each second micro-LED G includes a second light-emitting body GB and a set of second pin pairs GD connected to the second light-emitting body GB. Each second pin pair GD includes two second pins connected to the second light-emitting body GB. Each third micro-LED B includes a third light-emitting body BB and a set of third pin pairs BD connected to the third light-emitting body BB. Each set of third pin pairs BD includes two third pins connected to the third light-emitting body BB.

[0039] The first stretchable film 11, the second stretchable film 12 and the third stretchable film 13 are the same. The first stretchable film 11, the second stretchable film 12 and the third stretchable film 13 are all rectangular. The first stretchable film 11, the second stretchable film 12 and the third stretchable film 13 each include a first substrate and a first adhesive layer provided on the first substrate, so that the first stretchable film 11, the second stretchable film 12 and the third stretchable film 13 are adhesive. The first substrate includes an organic material, so that the first substrate is stretchable, and thus the first stretchable film 11, the second stretchable film 12 and the third stretchable film 13 are stretchable. The material of the first adhesive layer includes at least one of acrylate, epoxy resin and silicone.

[0040] The thickness of the first stretchable film 11 , the second stretchable film 12 , and the third stretchable film 13 is greater than or equal to 0.8 mm and less than or equal to 1.2 mm. The thickness of the first adhesive layer is greater than or equal to 3 μm and less than or equal to 6 μm.

[0041] Specifically, if Figure 2AAs shown, multiple groups of first pin pairs RD are adhered to the first stretchable film 11, so that multiple first micro-light emitting diodes R are adhered to the first stretchable film 11, and the multiple first micro-light emitting diodes R are arranged in a two-dimensional matrix on the first stretchable film 11, and the spacing between two adjacent first micro-light emitting diodes R is a first initial spacing d1; then multiple groups of second pin pairs GD are adhered to the second stretchable film 12, so that multiple second micro-light emitting diodes G are adhered to the second stretchable film 12, and the multiple second micro-light emitting diodes G are arranged in a two-dimensional matrix on the second stretchable film 12, and the spacing between two adjacent second micro-light emitting diodes G is a second initial spacing d2; and multiple groups of third pin pairs BD are adhered to the third stretchable film 13, so that multiple third micro-light emitting diodes B are adhered to the third stretchable film 13, and the multiple third micro-light emitting diodes B are arranged in a two-dimensional matrix on the third stretchable film 13, and the spacing between two adjacent third micro-light emitting diodes B is a third initial spacing d3.

[0042] The first initial distance d1 , the second initial distance d2 , and the third initial distance d3 are equal.

[0043] It should be noted that, through step S101 , the first film-turning of the plurality of first micro-LEDs R, the plurality of second micro-LEDs G, and the plurality of third micro-LEDs B is completed.

[0044] S102: stretching the first stretchable film, the second stretchable film, and the third stretchable film respectively to obtain a first expanded film, a second expanded film, and a third expanded film.

[0045] Specifically, if Figure 2B As shown, the first stretchable film 11 is stretched along its length and width directions to stretch the first stretchable film 11 until the spacing between two adjacent first micro-light-emitting diodes R is a first preset spacing D1, thereby obtaining a first expansion film 21 adhered with a plurality of first micro-light-emitting diodes R, and the first preset spacing D1 is greater than the first initial spacing d1; the second stretchable film 12 is stretched along its length and width directions to stretch the second stretchable film 12 until the spacing between two adjacent second micro-light-emitting diodes G is a second preset spacing D2, thereby obtaining a second expansion film 22 adhered with a plurality of second micro-light-emitting diodes G, and the second preset spacing D2 is greater than the second initial spacing d2; the third stretchable film 13 is stretched along its length and width directions to stretch the third stretchable film 13 until the spacing between two adjacent third micro-light-emitting diodes B is a third preset spacing D3, and the third preset spacing D3 is greater than the third initial spacing d3.

[0046] The first preset distance D1 , the second preset distance D2 and the third preset distance D3 are equal. In other words, the first stretchable film 11 , the second stretchable film 12 and the third stretchable film 13 are stretched in the same proportion.

[0047] It should be noted that, through this step S102, the distance between two adjacent first micro-light emitting diodes R, between two adjacent second micro-light emitting diodes G, and between two adjacent third micro-light emitting diodes B is increased, providing conditions for multiple first micro-light emitting diodes R, multiple second micro-light emitting diodes G, and multiple third micro-light emitting diodes B to be transferred to a transfer film.

[0048] S103: Adhere the plurality of first micro-LEDs on the first expansion film, the plurality of second micro-LEDs on the second expansion film, and the plurality of third micro-LEDs on the third expansion film to the first surface of the transfer film, respectively. The first micro-LEDs, the second micro-LEDs, and the third micro-LEDs are spaced apart from each other.

[0049] The transfer film 3 includes a second substrate and a photocurable adhesive layer disposed on the second substrate. The photocurable adhesive layer is viscous before being fully cured. The photocurable adhesive layer undergoes a curing reaction under ultraviolet light and loses its viscous properties after being fully cured. The material of the photocurable adhesive layer includes, but is not limited to, at least one of an acrylic material, an epoxy resin material, and a silicone material.

[0050] like Figure 2C As shown, the transfer film 3 has a first surface 3a and a second surface 3b opposite to each other in the thickness direction of the transfer film 3. The first surface 3a is the surface of the photocurable adhesive layer, making the first surface 3a adhesive. The second surface 3b is the surface of the second substrate, making the second surface 3b non-adhesive.

[0051] Specifically, the multiple first light-emitting bodies RB on the first expansion film 21 are adhered to the first surface 3a of the transfer film 3, and the multiple first micro-light-emitting diodes R are adhered to the first surface 3a of the transfer film 3; then, the multiple second light-emitting bodies GB on the second expansion film 22 are adhered to the first surface 3a of the transfer film 3, and the multiple second micro-light-emitting diodes G are adhered to the first surface 3a of the transfer film 3, and the multiple second micro-light-emitting diodes G are spaced apart from the multiple first micro-light-emitting diodes R; finally, the multiple third light-emitting bodies BB on the third expansion film 23 are adhered to the first surface 3a of the transfer film 3, and the multiple third micro-light-emitting diodes B are adhered to the first surface 3a of the transfer film 3, and the third micro-light-emitting diodes B, the second micro-light-emitting diodes G and the first micro-light-emitting diodes R are spaced apart from each other.

[0052] Through this step S103, multiple first micro-LEDs R, multiple second micro-LEDs G, and multiple third micro-LEDs B are adhered to a transfer film 3, so that the first micro-LEDs R, multiple second micro-LEDs G, and multiple third micro-LEDs B can be transferred to the array substrate through one transfer, reducing the number of transfers of micro-LEDs that emit three different colors of light, thereby improving the transfer efficiency of the micro-LEDs.

[0053] S104: placing a transfer film above an array substrate comprising a plurality of first electrode pairs, a plurality of second electrode pairs and a plurality of third electrode pairs, so that a plurality of first micro-light emitting diodes, a plurality of second micro-light emitting diodes and a plurality of third micro-light emitting diodes fall off the transfer film onto the array substrate, and the plurality of first micro-light emitting diodes are arranged one-to-one with the plurality of first electrode pairs, the plurality of second micro-light emitting diodes are arranged one-to-one with the plurality of second electrode pairs, and the plurality of third micro-light emitting diodes are arranged one-to-one with the plurality of third electrode pairs.

[0054] Specifically, if Figure 2D As shown, first, an array substrate 4 and an adsorption substrate 5 are provided. The array substrate 4 includes a substrate 41, a driving circuit layer 42, multiple groups of first electrode pairs 43, multiple groups of second electrode pairs 44, multiple groups of third electrode pairs 45, and a second alignment mark 46. The driving circuit layer 42 is disposed on the substrate 41. The multiple groups of first electrode pairs 43, multiple groups of second electrode pairs 44, and multiple groups of third electrode pairs 45 are located on the side of the driving circuit layer 42 away from the substrate 41. A group of first electrode pairs 43 includes two first electrodes, a group of second electrode pairs 44 includes two second electrodes, and a group of third electrode pairs 45 includes two third electrodes. A first preset spacing D1 is defined between two adjacent groups of first electrode pairs 43, a second preset spacing D2 is defined between two adjacent groups of second electrode pairs 44, and a third preset spacing D3 is defined between two adjacent groups of third electrode pairs 45. The second alignment mark 46 is located in the non-luminous area of ​​the array substrate 4. The adsorption substrate 5 includes multiple vacuum adsorption holes 51 and a first alignment mark 52. The first alignment mark 52 is located near the outer edge of the adsorption substrate 5.

[0055] Then, if Figure 2DAs shown, multiple vacuum adsorption holes 51 are evacuated and the second surface 3b of the transfer film 3 is adsorbed onto the adsorption substrate 5. The adsorption substrate 5 is then placed above the array substrate 4, and the first alignment marks 52 are aligned with the second alignment marks 46. This results in a one-to-one correspondence between the multiple first micro-LEDs R and the multiple groups of first electrode pairs 43, between the multiple second micro-LEDs G and the multiple groups of second electrode pairs 44, and between the multiple third micro-LEDs B and the multiple groups of third electrode pairs 45. When the adsorption substrate 5 is placed above the array substrate 4 and the first alignment marks 52 are aligned with the second alignment marks 46, a certain distance must be maintained between the adsorption substrate 5 and the array substrate 4 to prevent damage to the array substrate 4 and the micro-LEDs caused by the adsorption substrate 5.

[0056] Then, if Figure 2E As shown, the transfer film 3 is separated from the adsorption substrate 5, and a plurality of first micro-light emitting diodes R, a plurality of second micro-light emitting diodes G, and a plurality of third micro-light emitting diodes B fall on the array substrate 4, and the first pin pairs RD of the plurality of first micro-light emitting diodes R are arranged in a one-to-one correspondence with the plurality of first electrode pairs 43, the second pin pairs GD of the plurality of second micro-light emitting diodes G are arranged in a one-to-one correspondence with the plurality of second electrode pairs 44, and the third pin pairs BD of the plurality of third micro-light emitting diodes B are arranged in a one-to-one correspondence with the plurality of third electrode pairs 45.

[0057] Finally, if Figure 2F and Figure 2G As shown, ultraviolet light H is used to irradiate the transfer film 3 until the first micro-LEDs R, the second micro-LEDs G, and the third micro-LEDs B fall off the transfer film 3, and the transfer film 3 is removed. The wavelength of the ultraviolet light H is greater than or equal to 254 nanometers and less than or equal to 400 nanometers, and the irradiation time of the ultraviolet light H is greater than or equal to 5 seconds and less than or equal to 10 seconds. For example, the wavelength of the ultraviolet light H is greater than or equal to 365 nanometers, and the irradiation time of the ultraviolet light H is 8 seconds.

[0058] It should be noted that the one-to-one correspondence between the first lead pairs RD of the plurality of first micro-LEDs R and the plurality of first electrode pairs 43 means that a first lead pair RD and a first electrode pair 43 are vertically overlapped in the thickness direction of the array substrate 4, and one first lead and one first electrode are vertically overlapped. The same applies to the one-to-one correspondence between the second lead pairs GD of the plurality of second micro-LEDs G and the plurality of second electrode pairs 44, and the one-to-one correspondence between the third lead pairs BD of the plurality of third micro-LEDs B and the plurality of third electrode pairs 45, and will not be further elaborated here.

[0059] In step S104 , a plurality of micro-LEDs emitting light of three different colors are transferred to the array substrate through a single transfer process, thereby improving the transfer efficiency of the micro-LEDs.

[0060] S105 : bonding the plurality of first lead pairs to the plurality of first electrode pairs, the plurality of second lead pairs to the plurality of second electrode pairs, and the plurality of third lead pairs to the plurality of third electrode pairs in a one-to-one manner.

[0061] Specifically, a metal bonding process is used to connect a group of first pin pairs RD of the first micro-light-emitting diode R and a group of first electrode pairs 43, a group of second pin pairs GD of the second micro-light-emitting diode G and a group of second electrode pairs 44, and a group of third pin pairs BD of the third micro-light-emitting diode B and a group of third electrode pairs 45 to obtain a light-emitting substrate.

[0062] It is understandable that a conductive metal such as tin or a conductive glue can also be used as a connecting material to connect a group of first pin pairs RD of the first micro-light-emitting diode R to a group of first electrode pairs 43, a group of second pin pairs GD of the second micro-light-emitting diode G to a group of second electrode pairs 44, and a group of third pin pairs BD of the third micro-light-emitting diode B to a group of third electrode pairs 45.

[0063] Due to the first molding, multiple first micro-LEDs are adhered to the first stretchable film, multiple second micro-LEDs are adhered to the second stretchable film, and multiple third micro-LEDs are adhered to the third stretchable film; then the first stretchable film, the second stretchable film and the third stretchable film are stretched respectively by film expansion, so that the spacing between the multiple first micro-LEDs, the spacing between the multiple second micro-LEDs and the spacing between the multiple third micro-LEDs are all increased; then, through the second molding, the multiple first micro-LEDs, the multiple second micro-LEDs and the multiple third micro-LEDs are transferred to a transfer film; finally, the multiple first micro-LEDs, the multiple second micro-LEDs and the multiple third micro-LEDs on the transfer film are transferred to the array substrate through a one-time transfer process to improve the transfer efficiency of the multiple micro-LEDs emitting three different colors to the array substrate.

[0064] The description of the above embodiments is only used to help understand the technical solutions and core ideas of this application; ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A mass transfer method, characterized in that: include: Adhering a plurality of first micro-LEDs to a first stretchable film, adhering a plurality of second micro-LEDs to a second stretchable film, and adhering a plurality of third micro-LEDs to a third stretchable film, wherein the first micro-LEDs, the second micro-LEDs, and the third micro-LEDs are configured to emit light of three different colors respectively; stretching the first stretchable film, the second stretchable film, and the third stretchable film respectively to obtain a first expanded film, a second expanded film, and a third expanded film; Adhere the plurality of first micro-LEDs on the first expansion film, the plurality of second micro-LEDs on the second expansion film, and the plurality of third micro-LEDs on the third expansion film to the first surface of the transfer film, respectively, with the first micro-LEDs, the second micro-LEDs, and the third micro-LEDs being spaced apart from each other; as well as The transfer film is placed above an array substrate including a plurality of first electrode pairs, a plurality of second electrode pairs, and a plurality of third electrode pairs, so that the plurality of first micro-light emitting diodes, the plurality of second micro-light emitting diodes, and the plurality of third micro-light emitting diodes fall off the transfer film and onto the array substrate, and the plurality of first micro-light emitting diodes are arranged one-to-one with the plurality of groups of first electrode pairs, the plurality of second micro-light emitting diodes are arranged one-to-one with the plurality of groups of second electrode pairs, and the plurality of third micro-light emitting diodes are arranged one-to-one with the plurality of groups of third electrode pairs.

2. The mass transfer method according to claim 1, wherein: The transfer film further has a second surface, and the first surface and the second surface are arranged opposite to each other in the thickness direction of the transfer film; Placing the transfer film above an array substrate including a plurality of first electrode pairs, a plurality of second electrode pairs, and a plurality of third electrode pairs comprises: The second surface of the transfer film is adsorbed onto an adsorption substrate so that the plurality of first micro-light emitting diodes and the plurality of first electrode pairs, the plurality of second micro-light emitting diodes and the plurality of second electrode pairs, and the plurality of third micro-light emitting diodes and the plurality of third electrode pairs are arranged in a one-to-one correspondence.

3. The method for mass transfer according to claim 2, wherein: The adsorption substrate includes a first alignment mark, and a second alignment mark is provided on the surface of the array substrate close to the adsorption substrate; The method further comprises: The first alignment mark and the second alignment mark are arranged correspondingly.

4. The method for mass transfer according to claim 3, wherein: After the first alignment mark and the second alignment mark are set correspondingly, and before the plurality of first micro-LEDs, the plurality of second micro-LEDs, and the plurality of third micro-LEDs are removed from the transfer film and placed onto the array substrate, the method further includes: The transfer film is separated from the adsorption substrate, and the plurality of the first micro-light emitting diodes, the plurality of the second micro-light emitting diodes and the plurality of the third micro-light emitting diodes fall on the array substrate, and the plurality of the first micro-light emitting diodes are arranged in a one-to-one correspondence with the plurality of groups of the first electrode pairs, the plurality of the second micro-light emitting diodes are arranged in a one-to-one correspondence with the plurality of groups of the second electrode pairs, and the plurality of the third micro-light emitting diodes are arranged in a one-to-one correspondence with the plurality of groups of the third electrode pairs.

5. The method for mass transfer according to claim 1, wherein: On the array substrate, there is a first preset distance between two adjacent groups of the first electrode pairs, a second preset distance between two adjacent groups of the second electrode pairs, and a third preset distance between two adjacent groups of the third electrode pairs; The respectively stretching the first stretchable film, the second stretchable film and the third stretchable film comprises: The first stretchable film is stretched until the spacing between two adjacent groups of the first micro-light emitting diodes is a first preset spacing, the second stretchable film is stretched until the spacing between two adjacent groups of the second micro-light emitting diodes is a second preset spacing, and the third stretchable film is stretched until the spacing between two adjacent groups of the third micro-light emitting diodes is a third preset spacing.

6. The method for mass transfer according to claim 5, wherein: The first preset distance, the second preset distance, and the third preset distance are equal.

7. The mass transfer method according to claim 1, wherein: The step of causing the plurality of first micro-LEDs, the plurality of second micro-LEDs, and the plurality of third micro-LEDs to fall off from the transfer film onto the array substrate includes: The transfer film is irradiated with ultraviolet light until the plurality of first micro-light emitting diodes, the plurality of second micro-light emitting diodes, and the plurality of third micro-light emitting diodes fall off the transfer film.

8. The mass transfer method according to claim 1, wherein: Each of the first micro-LEDs includes a first light-emitting body and a set of first pin pairs connected to the first light-emitting body; each of the second micro-LEDs includes a second light-emitting body and a set of second pin pairs connected to the second light-emitting body; and each of the third micro-LEDs includes a third light-emitting body and a set of third pin pairs connected to the third light-emitting body. The method of adhering a plurality of first micro-LEDs to a first stretchable film, adhering a plurality of second micro-LEDs to a second stretchable film, and adhering a plurality of third micro-LEDs to a third stretchable film comprises: A plurality of groups of the first pin pairs are adhered to the first stretchable film, a plurality of groups of the second pin pairs are adhered to the second stretchable film, and a plurality of groups of the third pin pairs are adhered to the third stretchable film.

9. The method for mass transfer according to claim 8, wherein: The method of respectively adhering the plurality of first micro-LEDs on the first expansion film, the plurality of second micro-LEDs on the second expansion film, and the plurality of third micro-LEDs on the third expansion film to the first surface of the transfer film comprises: A plurality of the first light emitting bodies, a plurality of the second light emitting bodies, and a plurality of the third light emitting bodies are adhered to the first surface of the transfer film.

10. The mass transfer method according to claim 8, characterized in that: The method further comprises: The plurality of first lead pairs and the plurality of first electrode pairs, the plurality of second lead pairs and the plurality of second electrode pairs, and the plurality of third lead pairs and the plurality of third electrode pairs are bonded one to one.

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