PCBA board packaging equipment, PCBA board packaging method

Abstract

The present invention discloses a PCBA board packaging device and a PCBA board packaging method, wherein the PCBA board packaging device includes: an operating table for placing the PCBA board; a spraying device for spraying the PCBA board; the spraying device has a plurality of discharging units moving together; at least one of the discharging units can spray independently; a feeding device connected to the spraying device, the feeding device can convey raw materials to the spraying device; a driving device connected to the spraying device, which can drive the spraying device to move; a control device connected to the spraying device and the driving device; the control device can control the spraying device to move and spray according to a predetermined trajectory. The PCBA board packaging device and the PCBA board packaging method disclosed in the present invention can realize the precise spraying packaging of PCBA boards.

Description

[0001] This application is a divisional application with application number "201810301516.8", application date "April 4, 2018", and invention name "PCBA board packaging equipment and PCBA board packaging method". Technical Field

[0002] The present invention relates to the field of circuit board packaging, and in particular to a PCBA board packaging device and a PCBA board packaging method. Background Art

[0003] There are many ways to package PCBA (Printed Circuit Board + Assembly) boards, such as coating the surface of the circuit board with conformal coating, potting, and low-pressure injection molding. Each of the above methods has its own advantages and disadvantages: direct spraying of conformal coating, although simple, convenient, and easy to implement, cannot truly protect the circuit board, cannot achieve waterproofing and shockproofing, and the packaging may fail over time; potting is cumbersome, inefficient, costly, and has poor reliability; low-pressure injection molding uses low-pressure injection molding equipment, special molds, and adjusts the corresponding injection pressure and time to complete the packaging of the circuit board. This method has high mold design and production costs, and the characteristics of the glue itself have a greater impact on the packaging.

[0004] In the prior art, low-pressure injection molding is generally used to encapsulate circuit boards to achieve waterproof sealing, insulation and flame retardancy. However, due to the continuous improvement of science and technology, the size of the circuit boards required to be encapsulated is getting larger and larger, and the thickness of the products is getting thinner and thinner. The existing injection molding method can no longer meet the packaging requirements of such circuit boards.

[0005] At the same time, the existing PCBA boards all use one nozzle to spray and package multiple times, which not only has poor precision control, but also brings unnecessary packaging to adjacent modules or components that do not require packaging, resulting in material waste and reducing packaging speed. In addition, due to low selectivity, it is easy to produce the phenomenon of uncovered lower parts of components, and the lower end of the pin cannot be effectively filled with packaging.

[0006] In addition, during the packaging of electronic circuit boards, the chip module is different from other components in that it has a certain height and relatively more exposed pins. If the packaging problem of the chip module can be effectively solved, the packaging requirements of other components can be more fully met. Therefore, in the packaging of electronic circuit boards, it is necessary to focus on the packaging of the chip module. During the packaging process, a large amount of glue is applied to the chip part, but due to the physical properties of the glue itself, it will flow irregularly, resulting in poor packaging effect. Summary of the invention

[0007] In view of the above-mentioned deficiencies in the prior art, the present invention provides a PCBA board packaging device and a PCBA board packaging method, so as to solve at least one of the above-mentioned problems.

[0008] The technical solution adopted by the present invention is as follows:

[0009] A PCBA board packaging device, comprising:

[0010] An operating table for placing PCBA boards;

[0011] A spraying device for spraying onto the PCBA board; the spraying device has a plurality of discharging units moving together; at least one of the discharging units can spray independently;

[0012] A feeding device connected to the spraying device, wherein the feeding device can deliver raw materials to the spraying device;

[0013] A driving device connected to the spraying device, capable of driving the spraying device to move;

[0014] A control device connected to the spraying device and the driving device; the control device can control the spraying device to move the spraying device along a predetermined trajectory.

[0015] Preferably, it also includes a curing device that moves together with the spraying device; the curing device can cure the glue sprayed by the spraying device on the PCBA board.

[0016] Preferably, the curing device performs curing while the spraying device is spraying.

[0017] Preferably, the curing device is arranged on a side of the spraying device facing away from the advancing direction.

[0018] Preferably, the curing device comprises a light irradiation source fixedly connected to the spraying device; and the feeding device can supply light-curing resin to the spraying device.

[0019] Preferably, the irradiation direction of the curing device deviates from the spraying direction of the spraying device.

[0020] Preferably, the operating table is further provided with an anti-reflection portion, and the anti-reflection portion can prevent the light emitted by the light irradiation source from being reflected.

[0021] Preferably, the anti-reflection portion includes a light-absorbing coating coated on the surface of the operating table.

[0022] Preferably, each of the discharging units can spray independently; and at least two of the discharging units can discharge different rubber materials.

[0023] Preferably, a plurality of the discharging units are arranged in an array.

[0024] Preferably, the discharging unit is provided with an electromagnetic one-way valve for controlling the discharging; and each electromagnetic one-way valve of the discharging unit is connected to the control device.

[0025] Preferably, the driving device includes a first motion mechanism for driving the spraying device to move along a first axis, and a second motion mechanism for driving the spraying device to move along a second axis; the first axis and the second axis are perpendicular to each other and parallel to the operating table.

[0026] Preferably, the driving device also includes a third motion mechanism that drives the spraying device and / or the operating table to move along a third axis; the third axis is perpendicular to the first axis and the second axis; the control device can control the distance between the spraying device and the spraying surface of the PCBA board to remain constant through the driving device.

[0027] Preferably, the control device can determine the position of the spraying device according to the packaging surface coordinates of the packaging three-dimensional model of the PCBA board.

[0028] Preferably, it also includes a glue dispensing nozzle; the control device can control the spraying device to form a dam around the predetermined component of the PCBA board; the dam encloses the predetermined component and its pins therein; the glue dispensing nozzle can fill the dam.

[0029] Preferably, the feeding device includes a glue supply cartridge and a pressure supply cartridge; one end of the glue supply cartridge is connected to the glue supply pump via a first glue supply tube, and the other end is connected to the spraying device via a second glue supply tube; one end of the pressure supply cartridge is connected to the air pressure pump via a first pressure supply tube, and the other end is connected to the glue supply cartridge via a second pressure supply tube.

[0030] A PCBA board packaging method using the PCBA board packaging device as described above comprises the following steps:

[0031] Place the PCBA board on the operating table;

[0032] Establishing a three-dimensional packaging model of the PCBA board in a three-dimensional coordinate system;

[0033] The spraying device is controlled to spray the PCBA board according to the packaging three-dimensional model of the PCBA board.

[0034] Preferably, establishing the packaging stereoscopic model of the PCBA board in the three-dimensional coordinate system includes:

[0035] By scanning the PCBA board on the operating table, a packaging three-dimensional model of the PCBA board is established in a three-dimensional coordinate system.

[0036] Preferably, controlling the spraying device to spray the PCBA board according to the packaging three-dimensional model of the PCBA board includes:

[0037] The position of the spraying device is determined according to the packaging surface coordinates of the packaging three-dimensional model of the PCBA board.

[0038] Preferably, controlling the spraying device to spray the PCBA board according to the packaging three-dimensional model of the PCBA board includes:

[0039] During the spraying process, the distance between the spraying device and the spraying surface of the PCBA board is kept constant.

[0040] Preferably, controlling the spraying device to spray the PCBA board according to the packaging three-dimensional model of the PCBA board includes:

[0041] The packaging area of ​​the PCBA board is sprayed with multiple layers, and then cured layer by layer.

[0042] Preferably, controlling the spraying device to spray the PCBA board according to the packaging three-dimensional model of the PCBA board includes:

[0043] For the same position, the relative position of the spraying device remains unchanged during multiple spraying processes.

[0044] Preferably, controlling the spraying device to spray the PCBA board according to the packaging three-dimensional model of the PCBA board includes:

[0045] Using a spraying device and a curing device to spray multiple times around the predetermined components of the PCBA board to form a dam; curing the coating formed by the spraying each time;

[0046] Spray glue to fill the inside of the dam.

[0047] Beneficial effects:

[0048] The spraying device of the PCBA board packaging equipment provided by the present invention is provided with a plurality of discharge units, and at least one of the discharge units can spray independently, so that the discharge unit can have a plurality of discharge ports for independently discharging materials, thereby having a larger spraying range, which not only improves the spraying efficiency, but also can adapt to the spraying requirements of PCBA boards of larger sizes. At the same time, since at least one discharge unit can spray independently, when the spraying device sprays the area corresponding to the PCBA board, it is only necessary to open the discharge unit corresponding to the required packaging area, and close the discharge unit corresponding to the area without spraying requirements, thereby realizing accurate spraying packaging of the PCBA board.

[0049] In addition, even if the spraying range of the spraying device of the PCBA board packaging equipment is the same as that of the existing nozzle, since the spraying device is equipped with multiple discharge units, the spraying range corresponding to each discharge unit is very small, and at least one discharge unit can spray independently, so the spraying accuracy is high, which can effectively avoid the spraying problems that may occur to adjacent modules or components that have no packaging requirements, and the discharge unit required for spraying can be controlled to spray as desired in the packaging area corresponding to the spraying device. Furthermore, the spraying device is provided with two or more discharge units that can spray independently, so that further controllable spraying can be achieved in the area covered by the spraying device, thereby achieving the purpose of refined spraying.

[0050] With reference to the following description and accompanying drawings, specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope. Within the spirit and scope of the appended claims, the embodiments of the present invention include many changes, modifications and equivalents.

[0051] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0052] It should be emphasized that the term “include / comprises” when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying creative labor.

[0054] Figure 1 It is a schematic diagram of the structure of a PCBA board packaging device provided in an embodiment of the present invention;

[0055] Figure 2 yes Figure 1 The side position structure diagram of the spraying device and the curing device;

[0056] Figure 3 yes Figure 1 Schematic diagram of the connection structure between the middle spraying device and the feeding device;

[0057] Figure 4 yes Figure 3 Bottom view of the spraying device;

[0058] Figure 5 It is a top view of the chip module package;

[0059] Figure 6 is a longitudinal cross-sectional view of a chip module package;

[0060] Figure 7 It is a schematic diagram of the packaging process of the chip module;

[0061] Figure 8 It is a schematic diagram of a PCBA board packaging method provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0062] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0063] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0064] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0065] See also Figures 1 to 4 In an embodiment of the present invention, a PCBA board packaging device is provided, comprising: an operating table 6 for placing a PCBA board; a spraying device 1 for spraying the PCBA board; a feeding device connected to the spraying device 1, the feeding device can convey raw materials to the spraying device 1; a driving device connected to the spraying device 1, which can drive the spraying device 1 to move; a control device connected to the spraying device 1 and the driving device; the control device can control the spraying device 1 to move and spray according to a predetermined trajectory.

[0066] The PCBA board packaging device can package the PCBA board, and is not limited to the spraying of three-proof paint. It can also seal the PCBA board with glue to play the role of waterproofing, heat conduction, or insulation on the PCBA board. When the PCBA board packaging device is used to spray and package the PCBA board, the PCBA board is placed on the operating table 6. Then, under the control of the control device, the driving device drives the spray device 1 to spray and package the PCBA board. The control device controls the spray device 1 to spray the PCBA board according to the preset path until the spray packaging of the required packaging area is completed.

[0067] In this embodiment, the spraying device 1 sprays the package onto the PCBA board. In a specific embodiment, the spraying device 1 may have a plurality of discharging units 18 that move together; at least one of the discharging units 18 can spray independently. Accordingly, each discharging unit 18 may have one or more discharging ports 19, through which the PCBA board is sprayed. At least one discharging unit 18 can discharge and spray independently, and the discharging and spraying of the discharging unit 18 can be controlled by a control device, and accordingly, the discharging of other discharging units 18 can also be controlled by a control device.

[0068] Preferably, each of the discharging units 18 can spray independently. The opening and closing of each discharging unit 18 can be controlled by a control device. In order to have a better spraying range and facilitate fine spraying, a plurality of the discharging units 18 are arranged in an array. Each discharging unit 18 arranged in an array can be controlled to discharge by a control device, so that the discharging unit 18 required for spraying can be controlled to spray as desired in the corresponding packaging area. The spraying device 1 is provided with two or more discharging units 18 that can spray independently, so that further controllable spraying can be achieved in the area covered by the spraying device 1, thereby achieving the purpose of fine spraying.

[0069] In this embodiment, at least two of the discharging units can discharge different adhesives. The feeding device can simultaneously supply different adhesives to the discharging units. At least two of the discharging units can discharge different adhesives, thereby achieving simultaneous spraying of multiple packaging materials under a single spraying device.

[0070] The plurality of discharging units 18 are arranged in parallel in a plurality of columns and rows. Figure 4 As shown, the plurality of discharging units 18 on the spraying device 1 are arranged to form 6 columns and 5 rows. Specifically, the discharging unit 18 is provided with an electromagnetic one-way valve for controlling the discharging. The electromagnetic one-way valve of each discharging unit 18 can be connected to the control device. The control device realizes the discharging control of the discharging unit 18 by controlling the opening and closing of the electromagnetic one-way valve.

[0071] The spraying device 1 of the PCBA board packaging equipment provided in this embodiment is provided with a plurality of discharge units 18, and at least one of the discharge units 18 can spray independently, so that the discharge unit 18 can have a plurality of discharge ports 19 for independent discharge, so that a larger spraying range can be provided, which not only improves the spraying efficiency, but also can adapt to the spraying requirements of larger-sized PCBA boards. At the same time, since at least one discharge unit 18 can spray independently, when the spraying device 1 sprays the area corresponding to the PCBA board, it only needs to open the discharge unit 18 corresponding to the required packaging area, and close the discharge unit 18 corresponding to the area that does not require spraying, so as to achieve precise spraying packaging.

[0072] In addition, even if the spraying range of the spraying device 1 of the PCBA board packaging equipment is the same as that of the existing nozzle, since the spraying device 1 is configured with multiple discharge units 18, the spraying range corresponding to each discharge unit 18 is very small, and at least one discharge unit 18 can spray independently, so the spraying accuracy is high, which can effectively avoid possible spraying problems for adjacent modules or components that have no packaging requirements.

[0073] In the present embodiment, the operating table 6 is used to receive and place the PCBA board, and the operating table 6 has a placement area, which can correspond to the three-dimensional coordinate system of the control device, and the spraying and packaging operation starts when the PCBA board is located in the placement area. The placement area can be a receiving surface or space of the workbench, or it can be a partial surface of the workbench, and its shape can be a rectangular area, a square area or other regular shapes. Of course, irregular shapes can also be applicable, and this application is not limited. The shape of the placement area can also match the shape of the PCBA board, and then the PCBA board is placed in the placement area and just matches and fits, which is convenient for the nozzle spraying operation. The same spraying area can place a single PCBA board at a time, or multiple PCBA boards can be placed. When multiple PCBA boards are placed at the same time, they can be placed in the placement area in a tiled form.

[0074] In this embodiment, the PCBA board can be transferred by a manipulator or a conveyor belt of the sealing equipment. For example, the PCBA board can be transferred to the workbench by the conveyor belt in the form of a production line, or the conveyor belt carries the PCBA board to a predetermined position for glue spraying (in this case, the conveyor belt also serves as a workbench). Of course, in this step, the PCBA board can also be placed manually in the placement area.

[0075] In a specific embodiment, in order to avoid the influence of irregular movement caused by the colloid spraying onto the PCBA board, the PCBA board packaging equipment includes: an operating table 6 for placing the PCBA board; a spraying device 1 for spraying onto the PCBA board; a feeding device connected to the spraying device 1, the feeding device can convey raw materials to the spraying device 1; a driving device connected to the spraying device 1, which can drive the spraying device 1 to move; and a curing device 3 moving together with the spraying device 1. The curing device 3 can cure the colloid sprayed onto the PCBA board by the spraying device 1.

[0076] The curing device 3 can be fixed on the spraying device 1 so as to move together with the spraying device 1. Specifically, the curing device 3 can be fixed to the spraying device 1 through the connecting shaft 2. The curing device 3 is cured while the spraying device 1 is spraying. When the spraying device 1 moves over the spraying surface of the PCBA board, a spraying thin layer is formed on the spraying surface. At the same time, the curing device 3 solidifies the spraying thin layer to avoid the influence of the flow of the spraying thin layer.

[0077] In order to allow the curing device 3 to cure the adhesive (or conformal coating) sprayed by the spraying device 1, the curing device 3 is arranged on the side of the spraying device 1 that is not facing the forward direction. That is, the curing device 3 is fixed to the rear side of the spraying device 1. Accordingly, the spraying device 1 discharges and sprays in the front, and the curing device 3 at the rear moves and cures the adhesive on the PCBA board to avoid irregular flow affecting the packaging quality.

[0078] In this embodiment, the curing device 3 may include a light irradiation source fixedly connected to the spraying device 1. The feeding device can supply light-curing resin to the spraying device 1. The light-curing resin may be UV glue. The light irradiation source may be an ultraviolet light source, an infrared light source, etc., and the present invention is not limited thereto. The corresponding light irradiation source may be selected according to the UV glue used in the use case.

[0079] Furthermore, the irradiation direction of the curing device 3 deviates from the spraying direction of the spraying device 1. Figure 1 , Figure 2 As shown, the spraying device 1 and the curing device 3 connected at both ends of the connecting shaft 2 have a certain tilt angle, and the curing device 3 is (may be slightly) tilted in the vertical direction, so that the ultraviolet light (or other curing light) cannot irradiate the spraying device 1, and prevent the glue from being cured at the discharge port 19 of the spraying device 1. In this embodiment, the curing device 3 can also be (may be slightly) lower than the spraying device 1 to reduce the diffusion of the curing light near the spraying device 1, which also plays a role in protecting the spraying device 1 from discharging smoothly.

[0080] In this embodiment, in order to prevent the reflected light from solidifying the glue of the spraying device 1 and solve the problem that the reflected light prevents the spraying device 1 from discharging smoothly, an anti-reflection part can be provided on the operating table 6, and the anti-reflection part can prevent the light emitted by the light irradiation source from forming a reflection. The anti-reflection part includes a light-absorbing coating coated on the surface of the operating table 6. The light-absorbing coating reduces the amount of reflected light to a minimum, so as to prevent the spraying device 1 from being blocked by the curing of the glue to the greatest extent, and ensure smooth discharging and spraying.

[0081] Please continue reading Figure 1 In the embodiment, the driving device drives the spraying device 1 to move according to the control of the control device. Specifically, the driving device includes a first motion mechanism 5 for driving the spraying device 1 to move along a first axis, and a second motion mechanism 4 for driving the spraying device 1 to move along a second axis; the first axis and the second axis are perpendicular to each other and are parallel to the operating table 6. The first axis can be regarded as the X-axis and the second axis as the Y-axis, that is, the first motion mechanism 5 and the second motion mechanism 4 can make the spraying device 1 move in a direction parallel to the horizontal plane (the operating table 6 is generally parallel to the horizontal plane).

[0082] Specifically, the first motion mechanism 5 can be placed on the second motion mechanism 4, and the spraying device 1 and the curing device 3 can be driven by the first motion mechanism 5 to complete free movement in the second axis direction according to the spraying requirements on the second motion mechanism 4. The first motion mechanism 5 and the second motion mechanism 4 can be provided with corresponding X-axis guide rails and Y-axis guide rails to achieve corresponding axial movement.

[0083] Furthermore, the driving device further comprises a third motion mechanism (not shown) for driving the spraying device 1 and / or the operating platform 6 to move along a third axis; the third axis is perpendicular to the first axis and the second axis. The control device can control the distance between the spraying device 1 and the spraying surface of the PCBA board to remain constant through the driving device.

[0084] In this embodiment, the third axis can be along the vertical direction, and the third motion mechanism can realize the movement of the spraying device 1 along the vertical direction. The third motion mechanism can be provided with a guide rail mechanism, which can drive the operating table 6 to move up and down, thereby making the PCBA board move up and down relative to the spraying device 1, or can directly act on the spraying device 1, so that the spraying device 1 moves up and down relative to the PCBA board.

[0085] In this embodiment, the control device (not shown) can control the moving path of the spray device 1 through the driving device, so as to spray and package the desired packaging area in the PCBA board. Among them, the control device can have hardware, such as a CPU, a controller, a single-chip microcomputer, a PLC, a programmable circuit board, etc., or it can be a combination of software and hardware, and this application does not impose any restrictions. The control device can control the moving speed of the spray device 1 when it moves. Among them, in order to improve the spraying efficiency, the moving speed of the spray device in the working mode and the non-working mode is different. Specifically, the control device can control the moving speed of the spray device 1 when performing spraying to be less than the moving speed of the spray device 1 when not performing spraying. For example, when the spray device resets the spray device 1 after the spraying is completed, the spray device is reset and retracted at a faster speed.

[0086] In this embodiment, the control device can be introduced with a geometric physical parameter model (specifically, a package three-dimensional model) of the object to be sprayed (PCBA board), and can control the spray device 1 to spray the object according to the predetermined spray parameters according to the model. The spray parameters may include at least one of the spray speed, spray direction, glue supply pressure, and moving speed.

[0087] The control device constructs a three-dimensional coordinate system with a mapping relationship with the operating table 6, and establishes a three-dimensional packaging model of the PCBA board in the three-dimensional coordinate system. The control device can determine the position of the spraying device 1 according to the packaging surface coordinates of the three-dimensional packaging model of the PCBA board.

[0088] In this embodiment, the packaging area or packaging surface can be selected or specified according to the packaging three-dimensional model of the PCBA board, and corresponds to the real packaging area of ​​the PCBA board in the real coordinate system on the operating table 6. The spraying device 1 has mapping coordinates in the three-dimensional coordinate system according to the above mapping relationship, and the position of the spraying device 1 is determined according to the positional relationship between the mapping coordinates and the packaging surface coordinates of the packaging three-dimensional model. Furthermore, in order to achieve fine spraying, each discharging unit 18 can also have corresponding mapping coordinates in the three-dimensional coordinate system, so as to control the discharging of each discharging unit 18 according to the spraying conditions of the corresponding coordinate points.

[0089] like Figure 5 , Figure 6 , Figure 7 As shown, the chip module 13 and other patch components on the PCBA board 14 have a large area, and there is a certain height difference between the patch component and other components, and there are a large number of exposed pins 13b distributed around it. In order to effectively package and protect the predetermined components such as the chip module 13, a dam 15 is built to surround it, and then filled to complete the effective packaging. The dam 15 encloses the predetermined component and its pins 13b.

[0090] Considering that the amount of glue required to encapsulate the chip module 13 and other predetermined components is large, in order to avoid redundant irregular flow of glue at one time, the dam 15 is first constructed and then filled to avoid irregular flow caused by the physical properties of the colloid itself. The dam 15 can adapt to the shape of the components.

[0091] The dam 15 of the predetermined components such as the chip module 13 can be constructed and filled by the above-mentioned spraying device 1. In another embodiment, the PCBA board packaging equipment may also include a glue dispensing nozzle (not shown). The control device can control the spraying device 1 to form a dam 15 around the predetermined components of the PCBA board 14. The glue dispensing nozzle can fill the dam 15. The glue dispensing nozzle can have a single discharge port 19, which can be aligned with the internal area 17 of the dam 15 and then glue can be supplied until it is filled. After filling, the packaging effect formed by the glue 16 Figure 6 shown.

[0092] Please continue reading Figure 1 In this embodiment, the feeding device can supply glue (or conformal coating raw materials and ink) to the spraying device in real time and continuously. The feeding device includes a glue supply ink cartridge 8 and a pressure supply ink cartridge 11. One end of the glue supply ink cartridge 8 is connected to the glue supply pump 7 through a first glue supply pipe, and the other end is connected to the spraying device 1 through a second glue supply pipe 9b. One end of the pressure supply ink cartridge 11 is connected to the air pressure pump 10 through a first pressure supply pipe 12a, and the other end is connected to the glue supply ink cartridge 8 through a second pressure supply pipe 12b.

[0093] Among them, the glue supply pump 7 provides raw materials (UV glue, three-proof paint, etc.) to the glue supply ink cartridge 8 through the glue supply hose, the air pressure pump 10 provides air pressure to the pressure supply ink cartridge 11 through the pressure supply pipe, and the pressure supply ink cartridge 11 then transmits the air pressure to the glue supply ink cartridge 8 through the pressure supply pipe, and squeezes the raw materials in the glue supply ink cartridge 8 into the discharge unit 18 of the spray device 1 through the glue supply hose, providing the raw materials required for spraying to the discharge unit 18 of the spray device 1.

[0094] In the spraying device 1, multiple discharging units 18 can share the same discharging port 19, and the independent discharging of a single discharging unit 18 can be achieved by opening and closing the electromagnetic one-way valve. In addition, multiple discharging units 18 can also be connected to the glue supply ink cartridge 8 through a glue supply hose, and the feeding device can achieve independent discharging of each discharging unit 18 by controlling the opening and closing of the glue supply hose. The feeding device can be connected to the control device to achieve feeding control of the feeding device.

[0095] like Figure 8 See Figure 5 , Figure 6 , Figure 7In the embodiment of the present application, a PCBA board packaging method is also provided, which can use but is not limited to the PCBA board packaging device in the above embodiment. Specifically, the PCBA board packaging method includes the following steps:

[0096] S1, placing the PCBA board 14 on the operating table 6;

[0097] In this step S1, the operating table 6 is used to receive and place the PCBA board 14. The operating table 6 has a placement area, which can correspond to the three-dimensional coordinate system of the control device. When the PCBA board 14 is located in the placement area, the spraying and packaging operation starts. The placement area can be a receiving surface or space of the workbench, or it can be a partial surface of the workbench. Its shape can be a rectangular area, a square area or other regular shapes. Of course, irregular shapes can also be applicable, and this application is not limited. The shape of the placement area can also match the shape of the PCBA board 14, and then the PCBA board 14 is placed in the placement area and just matches and snaps together, which is convenient for the nozzle to spray glue. The same spray glue area can place a single PCBA board 14 at a time, or it can place multiple PCBA boards 14. When multiple PCBA boards 14 are placed at the same time, they can be placed in the placement area in a tiled form.

[0098] In this embodiment, the PCBA board 14 can be transferred by a manipulator or a conveyor belt of the sealing equipment. For example, the PCBA board 14 can be transferred to a workbench by a conveyor belt in the form of a production line, or the conveyor belt carries the PCBA board 14 to a predetermined position for glue spraying (in this case, the conveyor belt also serves as a workbench). Of course, in this step, the PCBA board 14 can also be placed manually in the placement area.

[0099] S2, establishing a packaging three-dimensional model of the PCBA board 14 in a three-dimensional coordinate system;

[0100] The sealing device itself can have a virtual three-dimensional coordinate system, which corresponds to the real coordinate system (also called the real coordinate system) where the spray device 1 is located. The spray device 1 has corresponding mapping coordinates in the three-dimensional coordinate system. Through the mapping coordinates and the correspondence between the three-dimensional coordinate system and the real coordinate system, the position of the spray device 1 can be adjusted by moving, and then the PCBA board 14 can be sprayed according to the preset trajectory.

[0101] The spraying device 1 sprays glue on the PCBA board 14 according to a predetermined spraying route (preset trajectory). The predetermined spraying route can be an "S" or "N" shaped route, or it can be a circular trajectory route in the center of the PCBA board 14 and gradually increase the radius of the circular trajectory. Of course, it can also be sprayed in a broken line form. It can be seen that the predetermined spraying route can have a variety of forms, as long as it can complete the sealing in this embodiment. Of course, in order to improve the packaging efficiency, the spraying device 1 can select the optimal spraying path according to the principle of shortest time.

[0102] In step S2 , a packaging three-dimensional model of the PCBA board 14 is established in a three-dimensional coordinate system by scanning the PCBA board 14 on the operating table 6 .

[0103] The PCBA board packaging equipment can also be equipped with a scanning camera or other scanning equipment to obtain a 3D packaging model of the PCBA board 14 by scanning the PCBA board 14. The packaging surface (packaging area) of the packaging three-dimensional model has respective coordinates in the three-dimensional coordinate system and has corresponding real mapping coordinates in the real coordinate system. In this step S2, the establishment of the packaging three-dimensional model can also be in the form of drawing input by three-dimensional software.

[0104] The PCBA board packaging method encapsulates the PCBA board 14 with a 3D packaging model as the reference object, rather than a plane model program. Through the packaging three-dimensional model of the PCBA board 14, the electronic components with a three-dimensional structure on the three-dimensional PCBA board 14 are corresponding to complete the coating packaging.

[0105] S3, controlling the spraying device 1 to spray the PCBA board 14 according to the packaging three-dimensional model of the PCBA board 14.

[0106] According to the above description, the spraying device 1 has corresponding mapping coordinates in the three-dimensional coordinate system. The position of the spraying device 1 can be adjusted by moving through the mapping coordinates and the correspondence between the three-dimensional coordinate system and the real coordinate system, and then the PCBA board 14 can be sprayed according to the preset trajectory.

[0107] In step S3, the position of the spraying device 1 is determined according to the package surface coordinates of the package three-dimensional model of the PCBA board 14. In the spraying process, the distance between the spraying device 1 and the spraying surface of the PCBA board 14 is kept constant. For example, the heights of two adjacent patch components on the PCBA board 14 are different. When spraying the two patch components, the distance between the spraying device 1 and the top surface of the two patch components remains unchanged, thereby obtaining a better spraying packaging effect.

[0108] In step S3, each time the package is sprayed, the same starting point is used for resetting, and then the position of the target coordinate point is located. The reset point can be the origin of the imported package three-dimensional model, and the reset point can also be the starting point. At the same time, for packaging different electronic components, the position and angle of the spray device 1 also change accordingly. Considering that the packaging material requires a certain thickness to obtain a better packaging effect, if the amount of glue reaching the required thickness is reached at one time, irregular flow is likely to occur, resulting in a poor packaging effect. To avoid this problem, in step S3, the spray device 1 performs multiple spraying on the same position; curing is performed while each spraying.

[0109] In order to make the spraying device 1 perform multiple spraying on the same position, the spraying device 1 can move multiple times along the preset path in the packaging area. Each time it moves along the preset path, the spraying device 1 completes one spraying of the packaging area, and correspondingly performs a layer of packaging on the packaging area, and the layer of packaging is solidified; then, the spraying device 1 moves along the preset path once again, and the spraying device 1 completes the secondary spraying of the packaging area, and correspondingly completes two layers of packaging on the packaging area, and the layer of packaging is solidified until the target thickness of the packaging is obtained. In this way, not only can the problem of poor packaging effect caused by irregular flow of the glue be prevented, but also the spraying thickness can be finely controlled to ensure the target packaging effect. In this step S3, the packaging area of ​​the PCBA board 14 is sprayed with multiple layers and solidified layer by layer.

[0110] Considering that the overall thickness of the package is relatively small, it is sufficient to reach the required package thickness. Therefore, in step S3, for the same position, the relative position of the spray device 1 during multiple spraying processes remains unchanged. That is, for the same position, the mapping coordinates of the spray device 1 during multiple spraying processes do not change. During the multiple spraying processes of the spray device 1, the height of the package surface at the same position may change. For example, after the spray device 1 performs a layer of spray coating, the height of the spray device 1 is raised when performing the next spraying, and the raised height may be the height of a layer of coating.

[0111] In a feasible embodiment, the PCBA board packaging method provided in the embodiment of the present application includes the following steps: using a spraying device 1 and a curing device 3 to spray multiple times around the predetermined components of the PCBA board 14 to form a dam 15; curing the coating formed by the spraying at the same time each time; and then spraying glue to fill the inside of the dam 15.

[0112] In this embodiment, the inside 17 of the dam 15 can be filled with glue by the spraying device 1, or the glue filling can be performed by the glue dispensing nozzle. In addition, when performing the filling, the inside 17 of the dam 15 can also be filled with multiple layers of spraying, and the curing device 3 can be used to cure while spraying.

[0113] The following describes in detail the dam 15 and the filling operation for a chip module 13 packaging method in a specific embodiment, so as to better understand the present application:

[0114] (1) The electronic circuit board 14 (i.e., PCBA board 14) is placed at room temperature, and a three-dimensional packaging model is imported through a control device (such as a host computer). The control device controls the spraying device 1 to move along the spraying route under the coordinated action of the second axis motion mechanism and the first axis motion mechanism according to the spraying requirements.

[0115] like Figure 3 As shown, a first layer of UV glue dam 15 is sprayed around the chip module 13 on the PCBA board 14 (also called the electronic circuit board 14). During the spraying process, the curing device 3 is in an open state, that is, the layer is sprayed and immediately cured to prevent the irregular flow of UV glue. The spraying height of each layer is about 0.008m, and the spraying width is adjustable and not fixed according to the size and shape of the packaged components to meet the arbitrariness of the chip 13a. Because it is sprayed and cured at the same time, the spraying time and curing time of each layer are controlled within 10s-50s according to the complexity of the required package pattern. The height of the dam 15 is not lower than the height of the chip 13a itself, and is generally slightly higher than the chip by 0.5mm-1mm.

[0116] (2) After the first layer is sprayed and cured, the third motion mechanism can accurately lower the thickness of the molding layer to about 0.008 mm.

[0117] (3) According to the method of step (1), on the basis of the cured first layer of UV adhesive dam 15 pattern, a second layer of UV adhesive dam 15 pattern is sprayed. During the spraying process, the curing device 3 is still in the open state, so that the cured second layer of UV adhesive dam 15 pattern is firmly attached and stacked on the previous layer.

[0118] (3) Repeat steps (1) to (3), spraying and curing layer by layer, and each new layer of dam 15 is attached and stacked on the previous layer, until a three-dimensional solid glue dam 15 with a height slightly higher than the chip 13a is sprayed around the chip module 13 to be packaged, and all chip pins 13b and chip 13a are enclosed therein, and then the curing device 3 is turned off to stop the formation of the dam 15.

[0119] (4) After the dam 15 is completed, the UV curing device 3 is turned off, and the inside of the UV glue dam 15 is sprayed again. The physical property of the uncured UV glue material itself has fluidity, and the space between the chip module 13 and the dam 15 is effectively filled, and the chip 13a and the chip pins 13b are completely immersed in the uncured UV glue;

[0120] (5) After step (4) is completed, the UV curing device 3 is turned on, and the PCBA board 14 and the chip module 13 filled thereon are cured again under the curing device 3, and the curing time is about 0.5s-3s.

[0121] In the above steps (1) to (3), the UV curing device 3 is in a normally open state; in step (4), the curing device 3 can be in a normally closed state; in the above process, the chip module 13 and the PCBA board 14 can be in a room temperature state.

[0122] In summary,

[0123] 1. The dam-fill packaging method in the PCBA board packaging method provided in the embodiment of the present application effectively packages the chip 13a and the pin 13b inside the UV glue, effectively solving the problem that the lower part of the components is not covered easily during the three-conformal paint spraying, and the lower end of the pin 13b cannot be effectively packaged and exposed; at the same time, the layers are tightly printed and stacked together, overcoming the defects of air being easily entrained during the three-conformal paint spraying packaging process, causing bubbles inside the package, uneven thickness, etc.

[0124] This implementation has good packaging consistency, clear packaging interface, and distinct packaging layers. It effectively solves the problems of material waste and poor packaging effect caused by low selectivity and precision caused by wide-range irregular spraying in the three-proof paint spraying method, reduces production costs, and improves product quality.

[0125] 2. The PCBA board packaging method provided in the embodiment of the present application uses UV glue for packaging, which has a fast curing speed, overcomes the characteristics of complicated curing process and slow curing of three-proof paint materials, further improves packaging efficiency and shortens packaging cycle.

[0126] 3. In the PCBA board packaging method provided in the embodiment of the present application, in the packaging dam 15 step, a method of spraying and stacking layer by layer is adopted according to the packaging three-dimensional model. The dam 15 has a clear interface and good line consistency, and has the advantage of curing while printing. The bottom layer is cured after printing is completed, and is more firmly bonded to the substrate, thereby overcoming the disadvantage that air is easily entrained during the bonding process between the bottom layer of the existing dam 15 and the circuit board substrate, resulting in low bonding strength.

[0127] The method of spraying and curing at the same time can effectively avoid the shortcomings of glue overflow, intermittent glue dispensing, and wire drawing that occur during the glue dispensing dam 15. After the filling step is completed, the curing device 3 connected to the nozzle is opened, and the final curing package can be completed on the packaging platform. It is superior to the existing dam 15 method in which the chip module 13 needs to be placed in a special curing furnace to complete the curing after the filling step is completed. It reduces equipment investment costs, shortens the production cycle, and improves production quality.

[0128] 4. The packaging method of this embodiment is superior to the existing chip module 13 packaging method. The packaging procedure has no special temperature requirements, and the temperature does not need to be repeatedly changed during the process. It has the advantage of not requiring refrigeration and heating devices, reducing equipment investment costs and increasing benefits.

[0129] Any numerical value cited herein includes all values ​​of lower and upper values ​​that increase by one unit from the lower limit to the upper limit, and there is at least a two-unit interval between any lower value and any higher value. For example, if the value of the quantity of a component or a process variable (such as temperature, pressure, time, etc.) is set forth to be from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, the purpose is to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly listed in the specification. For values ​​less than 1, one unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples that are intended to be clearly expressed, and it can be considered that all possible combinations of numerical values ​​listed between the lowest value and the highest value are clearly set forth in the specification in a similar manner.

[0130] Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. "About" or "approximately" used with a range applies to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30", including at least the specified endpoints.

[0131] All articles and references disclosed, including patent applications and publications, are incorporated herein by reference for all purposes. The term "consisting essentially of..." to describe a combination should include the identified elements, ingredients, parts or steps and other elements, ingredients, parts or steps that do not substantially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe a combination of elements, ingredients, parts or steps herein also contemplates embodiments that consist essentially of these elements, ingredients, parts or steps. By using the term "may", it is intended to indicate that any attribute described that "may" include is optional.

[0132] Multiple elements, ingredients, parts or steps can be provided by a single integrated element, ingredient, part or step. Alternatively, a single integrated element, ingredient, part or step can be divided into separate multiple elements, ingredients, parts or steps. The disclosure "one" or "an" used to describe an element, ingredient, part or step is not intended to exclude other elements, ingredients, parts or steps.

[0133] It should be understood that the above description is for illustration and not for limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but should be determined with reference to the appended claims and the full scope of equivalents possessed by such claims. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to be a waiver of the subject matter, nor should it be considered that the inventors did not consider the subject matter to be part of the disclosed inventive subject matter.

Claims

1. A PCBA board packaging device, characterized in that: include: An operating table for placing PCBA boards; A spraying device for spraying onto the PCBA board; The spraying device has a plurality of discharging units that move together; each of the discharging units can spray independently; the plurality of discharging units are arranged in an array; A feeding device connected to the spraying device, wherein the feeding device can deliver raw materials to the spraying device; A curing device moving together with the spraying device; the curing device can cure the glue sprayed on the PCBA board by the spraying device; A driving device connected to the spraying device, which can drive the spraying device to move; the operating platform is a conveyor belt; The conveyor belt carries the PCBA board to the predetermined position for glue spraying; A control device connected to the spraying device and the driving device; the control device can control the spraying device to spray multiple times around the predetermined component of the PCBA board to form a dam, and control the curing device to cure the coating formed by the spraying each time.

2. The PCBA board packaging device according to claim 1, characterized in that: The control device can control the spraying device to perform multi-layer spraying on the packaging area of ​​the PCBA board and solidify layer by layer.

3. A PCBA board packaging method using the PCBA board packaging device according to claim 1 or 2, characterized in that: The following steps are involved: Place the PCBA board on the operating table; The spraying device is controlled to spray the PCBA board; and the spraying device is used to spray around the predetermined components of the PCBA board for multiple times to form a dam.

4. The PCBA board packaging method according to claim 3, characterized in that: The PCBA board packaging equipment has a curing device that moves together with the spraying device; wherein the PCBA board packaging method includes: curing the coating formed by the spraying each time the dam is sprayed.

5. The PCBA board packaging method according to claim 4, characterized in that: Each newly formed layer of dam pattern is attached and stacked on the previous layer until a three-dimensional solid plastic dam with a height slightly higher than the predetermined component is sprayed around the predetermined component to be packaged.

6. The PCBA board packaging method according to claim 5, characterized in that: In the PCBA board packaging method, multi-layer spraying is performed on the packaging area of ​​the PCBA board, and then cured layer by layer.

7. The PCBA board packaging method according to claim 5, characterized in that: The step of spraying the dam includes: spraying a first layer of UV glue dam pattern around a predetermined component of the PCBA board; during the process of spraying the first layer of UV glue dam pattern, the curing device is in an open state.

8. The PCBA board packaging method according to claim 5, characterized in that: The height of the dam is not lower than the height of the predetermined element itself.

9. The PCBA board packaging method according to claim 8, characterized in that: The height of the dam is 0.5mm-1mm higher than the predetermined element; the spraying time of each layer plus the curing time is 10s-50s.

10. The PCBA board packaging method according to claim 5, characterized in that: After the spraying of the dam is completed, the UV curing device is turned off and the inside of the UV glue dam is sprayed again; during the step of filling the inside of the dam, the curing device is in a normally closed state.

11. The PCBA board packaging method according to claim 10, characterized in that: After the inside of the dam is filled, the UV curing device is turned on, and the PCBA board and the predetermined components filled thereon are cured again under the curing device, and the curing time is 0.5s-3s.

12. The PCBA board packaging method according to claim 10, characterized in that: The above-mentioned spraying, curing and filling steps of the PCBA board are performed at room temperature.

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