A wet grinding and polishing jig and polishing device

Abstract

The present application relates to the technical field of polishing equipment, in particular to a wet grinding and polishing jig and a polishing device, which comprises a base body and a textile layer, the base body is provided with a pipeline interface and a working surface, the pipeline interface is used for communicating with a negative pressure source, the working surface is provided with a work station groove for placing a polishing object, the inner wall surface of the work station groove is provided with a through hole, the through hole communicates with the pipeline interface, the textile layer is located between the polishing object and the through hole, and the thickness of the textile layer is less than the depth of the work station groove.The present application can form stable adsorption and fixation of the polishing object in a short time, and the positive circulation is realized, the adsorption and fixation capacity of the base body to the polishing object is stronger with the longer polishing time, the fixation capacity of the polishing object can be quickly reduced, and the convenience and safety of disassembling and picking up the polishing object are improved on the basis of ensuring stable and efficient adsorption and fixation capacity of the polishing object on the smooth surface.

Description

Technical Field

[0001] This invention relates to the field of polishing equipment technology, and in particular to a wet grinding and polishing fixture and polishing device. Background Technology

[0002] In the machining and production process, polishing equipment is usually used to perform planar grinding and polishing on parts to meet usage requirements. Vacuum adsorption fixation is a commonly used method for fixing the polished object during the polishing process. However, in the process of realizing this invention, the applicant discovered that when using vacuum adsorption to polish products with smooth surfaces, it is difficult to quickly remove the polished object while ensuring the vacuum adsorption fixation capability. Summary of the Invention

[0003] The purpose of this invention is to provide a wet grinding and polishing fixture and polishing apparatus to solve the above-mentioned technical problems existing in the prior art, mainly including the following two aspects:

[0004] The first aspect of the present invention provides a wet grinding and polishing fixture, comprising a substrate and a textile layer. The substrate is provided with a pipe interface and a working surface. The pipe interface is used to communicate with a negative pressure source. The working surface is provided with a work station groove for placing a workpiece to be polished. A through hole is provided on the inner wall of the work station groove, and the through hole communicates with the pipe interface. The textile layer is located between the workpiece to be polished and the through hole, and the thickness of the textile layer is less than the depth of the work station groove.

[0005] Furthermore, the inner wall of the work station slot is provided with multiple through holes, and at least some of the through holes are connected by grooves located on the inner wall of the work station slot.

[0006] Furthermore, the through holes and grooves are located within the projection area of ​​the textile layer on the inner wall of the work station groove, and the textile layer is provided with adsorption holes corresponding to the through holes.

[0007] Furthermore, the working surface is provided with multiple work station slots, which are arranged symmetrically about the rotation axis of the base, and the rotation axis of the base is located outside the work station slots.

[0008] Furthermore, the peripheral wall of the substrate is provided with a plurality of expansion grooves, which extend along the axial direction of the substrate to the working surface and are connected to the adjacent work station grooves.

[0009] Furthermore, the height of the expansion groove along the axial direction of the base is greater than the depth of the workstation groove.

[0010] Furthermore, a receiving groove is provided on the working surface. The receiving groove is located between the work station grooves, and the depth of the receiving groove is greater than the depth of the work station groove. The receiving groove is connected to the adjacent work station groove.

[0011] A second aspect of the present invention provides a polishing apparatus, including a frame and the aforementioned wet grinding and polishing fixture, wherein a polishing surface is provided on the frame, and the working surface of the substrate is correspondingly provided with the polishing surface.

[0012] Furthermore, the polishing device also includes a negative pressure source and a cleaning fluid source. The negative pressure source and the cleaning fluid source are respectively connected to a pipe interface. A delivery pump is installed on the connecting pipe between the cleaning fluid source and the pipe interface. The delivery pump is used to control the flow of cleaning fluid from the cleaning fluid source to the pipe interface. The delivery pump is interlocked with the negative pressure source.

[0013] Furthermore, a liquid collector is provided on the connecting pipe between the negative pressure source and the pipe interface. The liquid collector has an interconnected liquid collection area and a negative pressure area. The negative pressure area is located above the liquid collection area, and the port connecting the liquid collector to the negative pressure source is located in the negative pressure area.

[0014] Compared with the prior art, the present invention has at least the following technical effects:

[0015] This invention enables the formation of a stable adsorption and fixation of the polished object in a short time, with a positive cycle. The longer the polishing time, the stronger the adsorption and fixation ability of the substrate on the polished object becomes. Then, when it is necessary to remove the polished object from the fixture, the liquid film between the textile layer and the polished object is quickly broken through the elastic deformation recovery of the textile layer. Under the condition of no negative pressure, the liquid film inside the textile layer has almost no effect on the polished object, thereby significantly weakening the fixation ability of the substrate on the polished object. This rapidly reduces the removal resistance of the polished object in a short time, allowing the operator to easily and quickly remove the polished object from the work station slot. This achieves the goal of improving the convenience and safety of removing the polished object while ensuring a stable and efficient adsorption and fixation ability for polished objects on smooth surfaces. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the wet grinding and polishing fixture of the present invention;

[0018] Figure 2 This is a schematic diagram of the wet grinding and polishing fixture of the present invention from another perspective;

[0019] Figure 3 This is an exploded view of the wet grinding and polishing fixture of the present invention;

[0020] Figure 4This is a schematic diagram of the flow during the operation of the wet grinding and polishing fixture of the present invention;

[0021] Figure 5 This is a schematic diagram of the pressure applied to the textile layer during the polishing process of the present invention;

[0022] Figure 6 This is a schematic diagram of the pipeline connection of the wet grinding and polishing fixture of the present invention;

[0023] Figure 7 This is a schematic diagram of the polishing device of the present invention;

[0024] Figure 8 This is a schematic diagram showing the rotation direction of the substrate and the polished surface of the present invention;

[0025] Figure 9 This is a polishing trajectory diagram of region A on the polishing body of the present invention;

[0026] In the picture:

[0027] 10. Substrate; 110. Station slot; 111. Through hole; 112. Groove; 120. Pipe interface; 130. Expansion slot; 140. Receptacle slot; 151. Negative pressure source; 152. Cleaning fluid source; 153. Infusion pump; 155. Atmospheric pressure pipe; 156. Control valve; 157. Liquid collector; 20. Polished surface; 30. Polished surface driving device; 40. Substrate driving device; 50. Displacement driving device; 60. Detection unit; 70. Textile layer; 710. Adsorption hole; 80. Receiving body. Detailed Implementation

[0028] The following description provides many different embodiments or examples for implementing various features of the invention. The elements and arrangements described in the specific examples below are only for concise expression of the invention and are merely examples, not intended to limit the invention.

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0030] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance.

[0031] In this invention, unless otherwise expressly specified and limited, "above or below" a first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0032] In the machining process, polishing equipment is typically used to perform planar grinding and polishing on parts to meet usage requirements. Vacuum adsorption fixation is a common method for fixing the polished object during polishing. However, when performing planar grinding and polishing on smooth parts, such as glass back panels in mobile phone accessories, the large polishing area of ​​the glass back panel necessitates a large negative pressure to ensure stable adsorption and fixation of the back panel. After polishing, the back panel often cannot be removed due to residual vacuum surfaces or intermolecular forces. This is especially true when polishing aids are used, as residual vacuum surfaces or liquid films are more likely to form between the back panel and the fixture, further increasing the difficulty of removing the back panel. Reducing the negative pressure adsorption intensity makes it impossible to stably adhere the back panel to the fixture, making it difficult for existing polishing devices to quickly remove the polished object while maintaining vacuum adsorption fixation capabilities. Therefore, this application provides a wet grinding and polishing fixture and polishing device that reduces the difficulty of removing smooth polished objects by combining a textile layer and a wet environment, as described in the following embodiments.

[0033] Example 1:

[0034] This application provides a wet grinding and polishing fixture, such as... Figures 1-3As shown, the device includes a substrate 10 and a textile layer 70. The substrate 10 is provided with a pipe interface 120 and a working surface. The pipe interface 120 is used to connect to a negative pressure source. The working surface is provided with a work station groove 110 for placing the polishing body 80. The inner wall of the work station groove 110 is provided with a through hole 111, which connects to the pipe interface 120. The textile layer 70 is located between the polishing body 80 and the through hole 111. The thickness of the textile layer 70 is less than the depth of the work station groove 110 to limit and fix the polishing body, and at the same time improve the sealing fit between the work station groove 110 and the polishing body 80 during the polishing process.

[0035] During the work process, such as Figure 3 As shown, the textile layer 70 is first placed into the work station groove 110, and then the polishing body 80 (in this embodiment, the mobile phone glass back panel is used as the polishing body 80) is placed into the work station groove 110. Polishing aid is added to the working surface for wet polishing. During the polishing process, because the textile layer 70 has a large number of pores and a certain degree of elasticity, when the pipe interface 120 is connected to the negative pressure source, such as... Figure 4 As shown, air enters the workstation 110 from outside the substrate 10 through the gap between the workstation 110 and the polishing body 80, passes through the textile layer 70 and enters the through hole 111, and flows to the negative pressure source through the pipe interface 120. In the initial stage of polishing, due to the numerous pores in the textile layer 70, and the gaps between the textile layer 70 and the inner wall of the workstation 110, and between the textile layer 70 and the polishing body 80, the airflow is high. This allows the polishing aid to enter the workstation 110 with the airflow, flowing into the pores in the textile layer 70, the textile layer 70, and the workstation. A liquid film forms between the inner walls of the groove 110 and between the textile layer 70 and the object to be struck, at the openings, between the textile layer 70 and the inner walls of the groove 110, and between the textile layer 70 and the object to be struck. This liquid film, on the one hand, enhances the adsorption and fixation capacity of the substrate 10 on the object to be struck through intermolecular forces; on the other hand, it improves the sealing performance between the groove 110 and the object to be struck, reducing the porosity between the object to be struck and the inner walls of the groove 110, thereby enhancing the negative pressure adsorption and fixation effect. Then, as the adsorption and fixation capacity of the substrate 10 on the object to be struck increases, such as... Figure 5As shown, a pressure difference will be formed on both sides of the projectile 80 (the pressure on the side of the projectile 80 closer to the inner wall of the work station 110 is less than the pressure on the side of the projectile 80 farther from the inner wall of the work station 110). Under the action of the pressure difference, the projectile 80 is pushed to move closer to the inner wall of the work station 110, compressing the textile layer 70 and shortening the distance between the projectile 80 and the work station 110. The smaller the distance between the projectile 80 and the work station 110, the greater the fixation energy of the liquid film on the projectile 80 by the matrix 10 through the intermolecular force amplification. The stronger the force, the more the porosity between the polished body 80 and the inner wall of the work station 110 decreases (the gap between the polished body 80, the textile layer 70 and the inner wall of the work station 110, and the volume of the pores in the textile layer 70 will all decrease), thereby further enhancing the adsorption and fixation capacity of the substrate 10 on the polished body 80, forming a stable adsorption and fixation of the polished body 80 in a short time, and a positive cycle. As the polishing time is longer, the adsorption and fixation capacity of the substrate 10 on the polished body 80 is also stronger. After the polishing body 80 completes its polishing work, when it needs to be removed from the fixture, disconnect the connection between the pipe interface 120 and the negative pressure source, preferably allowing the pipe interface 120 to return to normal pressure. At this time, the pressure difference on both sides of the polishing body 80 is significantly reduced or disappears. Correspondingly, the pressure on the textile layer 70 is significantly reduced or disappears. The textile layer 70 recovers its compression deformation due to its own elasticity, pushing the polishing body 80 away from the inner wall of the work station groove 110, increasing the distance between the polishing body 80 and the inner wall of the work station groove 110. As the distance between the polishing body 80 and the inner wall of the work station groove 110 increases, the porosity between the polishing body 80 and the inner wall of the work station groove 110 increases accordingly (the gap between the polishing body 80, the textile layer 70, and the inner wall of the work station groove 110). (The volume of pores in the textile layer 70 will increase). During this process, since no liquid film is directly formed between the object to be thrown 80 and the inner wall of the work station 110, the liquid film between the textile layer 70 and the object to be thrown 80 can be quickly broken as the deformation of the textile layer 70 recovers. Under the condition of no negative pressure, the liquid film inside the textile layer 70 has almost no effect on the object to be thrown 80. As a result, the fixing ability of the substrate 10 on the object to be thrown 80 is significantly weakened, and the removal resistance of the object to be thrown 80 is quickly reduced in a short time. This allows the operator to easily and quickly remove the object to be thrown 80 from the work station 110, thereby improving the convenience and safety of removing the object to be thrown 80 while ensuring a stable and efficient adsorption and fixing ability for objects to be thrown with smooth surfaces.

[0036] To quickly remove the polished object 80 from the substrate 10 after polishing, multiple through holes 111 can be provided on the inner wall of the work station groove 110. At least some of the through holes 111 are connected by grooves 112 located on the inner wall of the work station groove 110. When the pipe interface 120 returns to normal pressure, the textile layer 70 can quickly restore the pressure difference at the corresponding parts of the through holes 111 and grooves 112, realize deformation recovery, and thus shorten the time for the substrate 10 to weaken its fixing ability on the polished object 80.

[0037] In some embodiments, the textile layer 70 may be made of cotton or linen.

[0038] To quickly remove the polished object 80 from the substrate 10 after polishing, the through hole 111 and the groove 112 can be located within the projection area of ​​the textile layer 70 on the inner wall of the work station groove 110. The textile layer 70 is provided with an adsorption hole 710 corresponding to the through hole 111. When the polishing is completed and the pipe interface 120 returns to normal pressure, the effect of normal pressure is directly guided to the contact surface between the textile layer 70 and the polished object 80 through the adsorption hole 710. This breaks the liquid film between the textile layer 70 and the polished object 80 around the adsorption hole 710, thereby improving the deformation recovery efficiency of the textile layer 70 and accelerating the weakening of the substrate 10's fixing ability on the polished object 80. This allows the operator to remove the polished object 80 from the substrate 10 in a short time.

[0039] To improve the polishing effect, multiple work station slots 110 can be provided on the working surface. These work station slots 110 are arranged symmetrically about the rotation axis of the substrate 10, which is located outside the work station slots 110. Figure 7 As shown, when employing a working method that combines the rotation of the projectile 80 and the relative revolution of the polishing surface 20, based on the structural design that places the rotation axis of the base 10 outside the work station slot 110, the force axis of the projectile 80 is placed outside the projectile 80, increasing the rotation radius of the projectile 80. For multiple projectiles 80 on the base 10, such as... Figure 8 As shown, the polishing trajectories of different polished objects 80 on the polishing surface 20 are the same; they all proceed in a spiral shape along the same annular path under the same pressure (under high-frequency rotation, the spiral linear trajectory becomes an annular surface trajectory, and the annular surface trajectory of the substrate 10 includes the annular surface trajectory of the polished object 80), thus achieving the same polishing effect for each polished object 80; for a single polished object 80, such as Figure 9As shown, each region of each receiving body 80 can be polished in a spiral motion along the corresponding circumference, and the polishing trajectories of each region on the receiving body 80 relative to the polishing surface 20 have a high degree of overlap, making the polishing effect of different regions on a single receiving body 80 similar, thereby improving the uniformity of polishing removal amount. Under the same polishing effect requirements, compared with the prior art, this embodiment can achieve the expected polishing effect with a smaller polishing removal amount, which can reduce the requirements for polishing pressure, thereby reducing component wear and maintenance frequency, and improving equipment lifespan and ease of use.

[0040] To improve the polishing effect, multiple expansion grooves 130 can be provided on the peripheral wall of the substrate 10. The expansion grooves 130 extend along the axial direction of the substrate 10 to the working surface and are connected to the adjacent station grooves 110. Under the influence of negative pressure adsorption, the polishing aid can flow to the negative pressure source sequentially through the expansion grooves 130, the gap between the station grooves 110 and the polished body 80, the textile layer 70, the through hole 111 / groove 112, and the pipe interface 120. On the one hand, this not only guides the polishing aid to be close to the polished body 80, significantly improving the utilization rate of the polishing aid, but also shortens the time for the substrate 10 to achieve stable adsorption of the polished body 80, improving polishing efficiency and effect. On the other hand, the polishing aid carrying impurities after polishing can be extracted through the expansion grooves 130, preventing impurities from remaining on the polishing surface 20 or the working surface, further improving polishing quality and efficiency.

[0041] To further enhance the guiding effect of the expansion groove 130 on the polishing aid, the height of the expansion groove 130 along the axial direction of the substrate 10 can be greater than the depth of the station groove 110, allowing more polishing aid to accumulate in the expansion groove 130. This not only improves the utilization rate of the polishing aid, but also enhances the adsorption and fixation capacity of the polished body 80 by strengthening the sealing performance between the station groove 110 and the polished body 80 during the polishing process.

[0042] To improve the utilization rate of polishing aids, a receiving groove 140 can be provided on the working surface. The receiving groove 140 is located between the work station grooves 110, and the depth of the receiving groove 140 is greater than the depth of the work station groove 110. The receiving groove 140 is connected to the adjacent work station groove 110. The receiving groove 140 is used to contain polishing aids. During polishing, the polishing aids in the receiving groove 140 can enhance the polishing effect and the adsorption and fixation ability of the polished object 80. After polishing is completed, the receiving groove 140 can be used to collect the polishing aids flowing out of the work station groove 110. This facilitates the rapid formation of a wet environment around the polished object 80 when polishing the next polished object 80. This, combined with the negative pressure source, forms a stable adsorption and fixation of the polished object 80, thereby improving the utilization rate of polishing aids, the polishing effect, and the polishing efficiency.

[0043] In some embodiments, the textile layer 70 is connected to the inner wall of the work station trough 110 to save the operation of placing the textile layer 70 into the work station trough 110 and improve the working efficiency of the equipment.

[0044] Example 2

[0045] This application provides a polishing apparatus, such as... Figure 7 As shown, it includes a frame and the wet grinding and polishing fixture in Embodiment 1. The frame is provided with a polishing surface 20, and the working surface of the substrate 10 is correspondingly provided with the polishing surface 20.

[0046] In some embodiments, the polished surface 20 may have a ring-shaped structure, such as... Figures 7-9 As shown, during operation, the polishing surface driving device 30 drives the annular polishing surface 20 to rotate, while simultaneously controlling the base driving device 40 to drive the base 10 and the polishing body 80 on the base 10 to rotate on the polishing surface 20. This achieves a working mode that combines the rotation of the polishing body 80 with its relative revolution with the polishing surface 20. While the polishing body 80 rotates around the rotation axis of the base 10, it also rotates relative to the polishing surface 20 around its rotation axis, allowing the polishing body 80 to advance and polish along the same annulus in a spiral shape. This not only effectively avoids the generation of lines on the polishing body 80, but also reduces the requirements for the operating environment and installation space of the polishing device, making it easier to confine the working environment of the polishing device to a small, fixed, isolated environment for protection. At the same time, it can achieve the expected polishing effect with a smaller amount of polishing removal, which can reduce the requirements for polishing pressure, reduce component wear and maintenance frequency, and improve the service life and ease of use of the equipment.

[0047] To avoid blockage of pipe interface 120 and the corresponding channel, such as Figure 6As shown, the polishing device may also include a negative pressure source 151 and a cleaning fluid source 152. The negative pressure source 151 and the cleaning fluid source 152 are respectively connected to a pipe interface 120. The negative pressure source 151 is used to achieve negative pressure adsorption and fixation of the substrate 10 onto the polished object 80. A delivery pump 153 is installed on the connecting pipe between the cleaning fluid source 152 and the pipe interface 120. The delivery pump 153 is used to control the flow of cleaning fluid from the cleaning fluid source 152 to the pipe interface 120. After completing the polishing of one or a preset number of polished objects 80, the connection between the negative pressure source 151 and the pipe interface 120 can be disconnected, and the cleaning fluid source 152 can be connected to the pipe interface 120. The delivery pump 153 then operates to deliver the cleaning fluid from the cleaning fluid source 152 into the substrate 10, polishing the pipe interface 120. 20. The through hole 111, textile layer 70 and work station 110 are flushed to remove impurities from the pipe interface 120, through hole 111, textile layer 70 and work station 110, avoiding the retention of polishing aids and impurities polished off the polished body 80 in the substrate 10, reducing the risk of channel blockage between the wet grinding and polishing fixture and the negative pressure source 151, reducing equipment maintenance frequency, increasing equipment lifespan and enhancing polishing effect; preferably, the infusion pump 153 and the negative pressure source 151 can be interlocked, that is, when the infusion pump 153 is working, the negative pressure source 151 is in the off state, and when the negative pressure source 151 is connected and working, the infusion pump 153 is in the de-energized state, the infusion pump 153 and the negative pressure source 151 do not work at the same time, the infusion pump 153 and the negative pressure source 151 can be not working at the same time.

[0048] In some embodiments, such as Figure 6 As shown, a pipe interface 120 can be connected to an atmospheric pressure pipe 155, and a control valve 156 is provided on the atmospheric pressure pipe 155 to quickly restore the interior of the substrate 10 to atmospheric pressure.

[0049] To improve the stability of the equipment, a liquid collector 157 can be installed on the connecting pipe between the negative pressure source 151 and the pipe interface 120. The liquid collector 157 has an interconnected liquid collection area and a negative pressure area. The negative pressure area is located above the liquid collection area. The port connecting the liquid collector 157 and the negative pressure source 151 is located in the negative pressure area. During polishing, the pipe interface 120 is connected to the negative pressure source 151. Under the action of pressure difference, air or polishing aid enters the work station 110 from the gap between the work station 110 and the polished body 80 from outside the substrate 10, passes through the textile layer 70 and enters the through hole 111, and flows to the liquid collector 157 through the pipe interface 120. The liquid collector 157 collects the polishing aid and the impurities it carries into the liquid collection area, while the negative pressure source 151 is continuously connected to the pipe interface 120 through the negative pressure area.

[0050] In some embodiments, to achieve adjustment of the gap between the polished body 80 and the polished surface 20 and / or adjustment of the polishing pressure, such as Figure 7As shown, the polishing device may also include a displacement driving device 50. The output end of the displacement driving device 50 is connected to the polishing surface driving device 30 or the substrate driving device 40. The displacement driving device 50 is used to control the polishing surface 20 or the substrate 10 to reciprocate along a first direction. The first direction is perpendicular to the polishing surface 20, and the working surface is parallel to the polishing surface 20. The displacement driving device 50 drives the polishing surface 20 or the substrate 10 to reciprocate along the first direction, adjusts the position of the polishing body 80 on the polishing surface 20 or the substrate 10 in the first direction, and thereby changes the distance adjustment or polishing pressure between the polishing body 80 and the polishing surface 20.

[0051] When adjusting the polishing pressure between the object to be polished 80 and the polishing surface 20 using the displacement drive device 50, the planar polishing fixture may also include a detection unit 60. The detection unit 60 is used to detect the contact pressure of the object to be polished 80. The detection signal of the detection unit 60 is used to determine whether the adjustment of the polishing pressure by the displacement drive device 50 meets the requirements, thereby realizing the automated operation of the equipment.

[0052] It should be noted that the detection unit 60 may specifically be a pressure gauge, pressure sensor, pressure calibrator, pressure standard pump, etc., and is not specifically limited here.

[0053] In some embodiments, when the output end of the displacement driving device 50 is connected to the polishing surface driving device 30, the detection unit 60 is located between the output end of the displacement driving device 50 and the polishing surface driving device 30.

[0054] In some embodiments, the output terminal of the displacement driving device 50 is connected to the base driving device 40, and the detection unit 60 is located between the output terminal of the displacement driving device 50 and the base driving device 40. In this embodiment, it is preferable to connect the output terminal of the displacement driving device 50 to the base driving device 40.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wet grinding and polishing fixture, characterized in that, The device includes a base and a textile layer. The base has a pipe interface and a working surface. The pipe interface is used to connect to a negative pressure source. The working surface has a work station slot for placing a projectile. The inner wall of the work station slot has a through hole that connects to the pipe interface. The textile layer is located between the projectile and the through hole, and the thickness of the textile layer is less than the depth of the work station slot. The working surface has multiple work station slots, which are arranged symmetrically about the rotation axis of the base. The rotation axis of the base is located outside the work station slots. The peripheral wall of the base has multiple expansion slots that extend axially to the working surface and connect with adjacent work station slots.

2. The wet grinding and polishing fixture as described in claim 1, characterized in that, The inner wall of the work station slot is provided with multiple through holes, and at least some of the through holes are connected by grooves located on the inner wall of the work station slot.

3. The wet grinding and polishing fixture as described in claim 2, characterized in that, The through holes and grooves are located within the projection area of ​​the textile layer on the inner wall of the work station groove, and the textile layer is provided with adsorption holes corresponding to the through holes.

4. The wet grinding and polishing fixture as described in any one of claims 1 to 3, characterized in that, The height of the expansion groove along the axial direction of the base is greater than the depth of the work station groove.

5. The wet grinding and polishing fixture as described in claim 4, characterized in that, A receiving groove is provided on the working surface. The receiving groove is located between the work station grooves. The depth of the receiving groove is greater than the depth of the work station groove. The receiving groove is connected to the adjacent work station groove.

6. A polishing apparatus, characterized in that, The fixture includes a frame and a wet grinding and polishing jig as described in any one of claims 1 to 5, wherein a polishing surface is provided on the frame and the working surface of the substrate is provided corresponding to the polishing surface.

7. The polishing apparatus as described in claim 6, characterized in that, The polishing device also includes a negative pressure source and a cleaning fluid source. The negative pressure source and the cleaning fluid source are respectively connected to a pipe interface. A delivery pump is installed on the connecting pipe between the cleaning fluid source and the pipe interface. The delivery pump is used to control the flow of cleaning fluid from the cleaning fluid source to the pipe interface. The delivery pump is interlocked with the negative pressure source.

8. The polishing apparatus as described in claim 7, characterized in that, A liquid collector is installed on the connecting pipe between the negative pressure source and the pipe interface. The liquid collector has an interconnected liquid collection area and a negative pressure area. The negative pressure area is located above the liquid collection area, and the port connecting the liquid collector to the negative pressure source is located in the negative pressure area.

Images