A thermostatic transport protection device for semiconductor materials

Abstract

This invention discloses a constant-temperature transport protection device for semiconductor materials, specifically relating to the technical field of semiconductor material auxiliary devices. It includes a pull-out plate installed between two support plates, capable of being pushed and pulled. A placement template is installed on the top of the pull-out plate, and lifting mechanisms for raising and lowering the placement template are installed on both sides of the pull-out plate. Several fixing mechanisms and several elastic mechanisms are installed on the placement template. The fixing mechanisms, in conjunction with the lifting mechanisms, are used to expand or reduce the clamping size of the fixing mechanisms, and the fixing mechanisms, in conjunction with the elastic mechanisms, facilitate the removal and installation of wafers. The lifting mechanisms drive the placement template upwards, causing the clamping mechanisms to disengage from the holes. Disengagement of the clamping mechanisms from the holes means that the second pressing block disengages from the first pressing block, thereby allowing the clamping plates to move outwards from the limiting plate. Conversely, moving them downwards reduces the clamping size between the clamping plates, thus securing the wafer firmly and ultimately achieving the purpose of convenient wafer handling.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor material accessories, specifically a constant temperature transport protection device for semiconductor materials. Background Technology

[0002] Patent publication number CN115285203B discloses a semiconductor material logistics handling and transportation device. Its structure is simple. When placing square single-crystal silicon rods, the flat plate has no obstructions except for the handle side. Before a moving trolley, the plate's sides and top can be shielded to prevent the square single-crystal silicon rods from being bumped or falling during transportation, while also reducing the adhesion of external impurities to the surface of the square single-crystal silicon rods. The device includes a flat plate with several universal wheels, a handle on one side of the plate, a fixing plate fixed to the side of the plate near the handle, a side plate rotatably mounted on both sides of the plate, and a second side plate rotatably mounted on the first side plate. It also includes a lifting plate that can rotate and rise relative to the plate, with a pressure plate on the lifting plate.

[0003] A wafer is a basic structure made of semiconductor materials. To prevent wafers from being bumped during transportation, existing technologies often require the use of a template that matches the shape of the wafer to firmly embed the wafer in the template before placing it in a transport box for transportation. However, the above operation makes it extremely inconvenient to pick up and put down the wafer in the template, and the wafer is often affected by vibration during transportation and may fall off the template. Therefore, it is necessary to provide a temperature-controlled transportation protection device for semiconductor materials to solve the inconvenience of picking up and putting down wafers. Summary of the Invention

[0004] The purpose of this invention is to provide a constant temperature transport protection device for semiconductor materials.

[0005] The technical problem solved by this invention is that the existing technology is extremely inconvenient for the operation of picking up and placing wafers in the wafer template, and the wafers are also affected by vibration during transportation and may fall off the wafer template, thereby increasing the probability of the wafers being damaged.

[0006] This invention can be achieved through the following technical solution: a constant temperature transport protection device for semiconductor materials, including an insulated box and support plates fixedly installed on both sides of the bottom wall of its inner cavity, a pull-out plate that can be pushed and pulled between the two support plates, a placement template installed on the top of the pull-out plate, and lifting mechanisms for raising and lowering the placement template installed on both sides of the pull-out plate. Several fixing mechanisms and several elastic mechanisms are installed on the placement template. The fixing mechanisms cooperate with the lifting mechanisms to expand or reduce the clamping size of the fixing mechanisms, and the fixing mechanisms cooperate with the elastic mechanisms to facilitate the removal and installation of wafers. Through the cooperation of the lifting mechanism, fixing mechanism and elastic mechanism, the installation and removal of wafers on the placement template becomes convenient during the stages of completely pulling out the pull-out plate and completely pushing it into the insulated box.

[0007] A further technical improvement of the present invention is that the lifting mechanism includes two symmetrical sliders that are slidably disposed at both ends of one side of the pull-out plate. The outer peripheral walls of the two sliders are rotatably connected to rotating plates. A connecting plate is installed between the two rotating plates. The two ends of the connecting plate are rotatably connected to one side of the two rotating plates respectively. The end of the rotating plate away from the slider is rotatably connected to the side of the placement template. A first fixing plate is fixedly provided at the end of one of the rotating plates away from the pull-out plate. A second fixing plate is fixedly provided at a position on the inner wall of the support plate that is parallel to the first fixing plate. The first fixing plate abuts against the second fixing plate and drives the slider to slide, thereby driving the rotating plate to rotate. During the rotation of the rotating plate, the connecting plate drives the other rotating plate to rotate simultaneously, thus enabling the placement template to be raised and lowered smoothly.

[0008] Furthermore, the elastic mechanism includes a first upright rod that is slidably disposed on the placement template. A first spring is fixedly installed between the top of the first upright rod and the top of the placement template. The contraction of the first spring can cooperate with the lifting mechanism to push the placement template and absorb the vibration that is about to be transmitted to the placement template.

[0009] Furthermore, the fixing mechanism includes a hole opened on the placement template, and a plurality of first extrusion blocks are fixedly installed on the inner wall of the hole. The fixing mechanism also includes a clamping mechanism, which cooperates with the first extrusion blocks to reduce the clamping size, and the clamping mechanism disengages from the first extrusion blocks to expand the clamping size.

[0010] Furthermore, the feature is that the number of first extrusion blocks is not less than two, and one first extrusion block can only drive one clamping plate to move inward to the limiting plate, and one clamping plate cannot clamp and fix the wafer.

[0011] Furthermore, the clamping mechanism includes a second upright rod fixedly connected to the top of the pull-out plate. A limiting plate is fixedly installed on the top of the second upright rod. The limiting plate is slidably connected to the first extrusion block. A sliding rod is slidably arranged through the limiting plate near the first extrusion block. A second extrusion block is fixedly installed at one end of the sliding rod near the first extrusion block, and a clamping plate is fixedly installed at the other end of the sliding rod. A second spring is fixedly installed between the clamping plate and the limiting plate. When the limiting plate drives the second extrusion block to press onto the first extrusion block, it can drive the clamping plate to move inward toward the limiting plate, thereby reducing the clamping size of the clamping mechanism and making the clamping size adaptable to the size of the wafer.

[0012] Furthermore, the contact surfaces of the second extrusion block and the first extrusion block are both smooth curved surfaces, and the shape of the inner wall of the clamping plate is adapted to the outer peripheral wall of the wafer. The adaptation of the inner wall of the clamping plate to the outer peripheral wall of the wafer can prevent the wafer from being damaged during clamping by the clamping plate.

[0013] Furthermore, a check rod is threadedly connected to the support plate near the bottom of the lifting mechanism, and a fixing groove adapted to the end of the check rod is opened on the side wall of the pull plate. The end of the check rod is fixed in the fixing groove to limit the state when the pull plate is fully pulled out.

[0014] Furthermore, the pull-out plate has a certain damping when it is pushed or pulled. When the restriction of the pull-out plate being fully pulled out is released, the first spring rebounds and drives the pull-out plate to move into the insulation box. This movement is limited by damping so that it is not too fast, thus avoiding the risk that the wafer will be dislodged from the clamping mechanism due to inertia.

[0015] Furthermore, the materials used for placing the template and the clamping mechanism are both anti-static lightweight materials, such as plastic. When the wafer is fixed in the clamping mechanism, the material of the clamping mechanism prevents it from generating static electricity or being forcibly released, thus reducing damage during wafer fixing.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The lifting mechanism drives the placement template to move upward, causing the clamping mechanism to disengage from the hole. When the clamping mechanism disengages from the hole, the second pressing block disengages from the first pressing block, allowing several clamping plates to move outward from the limiting plate. This expands the clamping size of the clamping mechanism, facilitating wafer mounting between the clamping plates. The placement template moves downward, causing the clamping mechanism to return to the hole. The mutual pressing of the first and second pressing blocks forces the clamping plates to clamp the outer periphery of the wafer, ultimately achieving the goal of facilitating wafer placement and removal.

[0018] 2. By setting up a spring mechanism, the placement template can be automatically moved upward when the pull-out plate is not under force, and the wafers fixed on the placement template can be protected against vibration during transportation. Attached Figure Description

[0019] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a top sectional view of the structure of the present invention;

[0022] Figure 3 This is a schematic diagram showing the connection between the pull-out plate and the placement template of the present invention;

[0023] Figure 4 This is a bottom sectional view of the structure of the present invention;

[0024] Figure 5 This is a schematic diagram of the clamping mechanism of the present invention;

[0025] Figure 6 For the present invention Figure 1 Enlarged view of point A in the middle;

[0026] Figure 7 For the present invention Figure 2 Enlarged view at point B in the middle;

[0027] Figure 8 For the present invention Figure 7 Enlarged view of point C.

[0028] In the diagram: 1. Insulation box; 2. Support plate; 3. Telescopic rod; 4. Pull-out plate; 5. Placement template; 6. Lifting mechanism; 601. Support rod; 602. Slider; 603. Rotating plate; 604. Connecting plate; 605. First fixing plate; 606. Second fixing plate; 7. Elastic mechanism; 701. First upright; 702. First spring; 8. Hole; 9. First pressing block; 10. Clamping mechanism; 1001. Second upright; 1002. Limiting plate; 1003. Sliding rod; 1004. Second pressing block; 1005. Clamping plate; 1006. Second spring; 12. Check rod; 13. Fixing groove. Detailed Implementation

[0029] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided.

[0030] Please see Figure 1-8 As shown, this embodiment provides a constant temperature transport protection device for semiconductor materials, including an insulated box 1. A temperature control device is installed on the top of the insulated box 1. A double door is installed on one side of the insulated box 1. Support plates 2 are installed on both sides of the bottom wall of the inner cavity of the insulated box 1. A telescopic rod 3 is fixedly installed between the two support plates 2. A pull-out plate 4 is provided on the top of the telescopic rod 3. One side of the bottom of the pull-out plate 4 is fixedly connected to the output end of the telescopic rod 3. A placement template 5 is installed on the top of the pull-out plate 4. Lifting mechanisms 6 are installed on both sides of the pull-out plate 4. The pull-out plate 4 has a certain damping when it is pulled or pushed by the telescopic rod 3.

[0031] The lifting mechanism 6 includes a first adjusting component away from the double doors and a second adjusting component near the double doors. Both the first and second adjusting components include a support rod 601 fixedly connected to the pull-out plate 4. A slider 602 is slidably connected to each of the two support rods 601. A rotating plate 603 is rotatably connected to the outer peripheral wall of the slider 602. The end of the rotating plate 603 away from the slider 602 is rotatably connected to the side of the template 5. A connecting plate 604 is installed between the first and second adjusting components. Both ends of the connecting plate 604 are rotatably connected to one side of the two rotating plates 603 respectively. A first fixing plate 605 is fixedly installed at the end of the slider 602 in the first adjusting component away from the pull-out plate 4. A second fixing plate 606 is fixedly provided on one side of the support plate 2 near both ends.

[0032] When the pull plate 4 is moved to the right until the first fixed plate 605 in the first adjustment assembly abuts against the second fixed plate 606, and then the pull plate 4 is moved to the right again, the slider 602 in the first adjustment assembly tends to slide to the left on the support rod 601. The rotating plate 603 in the first adjustment assembly tends to rotate clockwise due to the slider 602. At this time, the rotating plate 603 in the second adjustment assembly has the same clockwise rotation tendency as the rotating plate 603 in the first adjustment assembly due to the action of the connecting plate 604. In this way, the template 5 is driven by the rotating plate 603 and tends to move downward.

[0033] A plurality of elastic mechanisms 7 are installed between the pull-out plate 4 and the placement template 5. The elastic mechanism 7 includes a first upright 701 that is slidably disposed inside the placement template 5. The bottom end of the first upright 701 is fixedly connected to the top of the pull-out plate 4. A first spring 702 is fixedly installed between the top of the first upright 701 and the top of the placement template 5. When the placement template 5 moves downward, it stretches the first spring 702, so that the first spring 702 is in a stressed state. When the tension on the pull-out plate 4 is released, the stressed state of the first spring 702 is released and it rebounds to its natural state. During the process of the first spring 702 rebounding to its natural state, it drives the placement template 5 to move upward.

[0034] A plurality of holes 8 are evenly provided on the placement template 5. Four first extrusion blocks 9 are evenly fixedly installed on the inner wall of the holes 8. A clamping mechanism 10 is installed in the holes 8. The clamping mechanism 10 includes a second upright 1001 fixedly connected to the top of the pull plate 4. A limiting plate 1002 adapted to the holes 8 is fixedly installed on the top of the second upright 1001. The limiting plate 1002 is slidably connected to the four first extrusion blocks 9. A sliding rod 1003 is slidably provided through the side wall of the limiting plate 1002 near the first extrusion block 9. A second extrusion block 1004 is fixedly installed at one end of the sliding rod 1003 near the first extrusion block 9. A clamping plate 1005 is fixedly installed at the other end of the sliding rod 1003. The inner side wall of the clamping plate 1005 is adapted to the outer peripheral wall of the wafer. A second spring 1006 is fixedly installed between the clamping plate 1005 and the limiting plate 1002.

[0035] When the template 5 moves upward, the limiting plate 1002 is supported by the second upright 1001, which drives the second pressing block 1004 to move downward along the first pressing block 9. This causes the first pressing block 9 to press the second pressing block 1004 towards the inside of the limiting plate 1002. The pressed second pressing block 1004, through the slide rod 1003, drives the clamping plate 1005 to press the second spring 1006, and causes the clamping plate 1005 to move towards the inside of the limiting plate 1002, thereby reducing the distance between the four clamping plates 1005. When the pull plate 4 is completely pulled out from the heat preservation box 1, the limiting plate 1002 is supported by the second upright 1001 and completely detaches from the hole 8. At this time, the compressed second spring 1006 rebounds and pushes the clamping plate 1005 towards the outside of the limiting plate 1002, thereby expanding the distance between the four clamping plates 1005.

[0036] A check rod 12 is threadedly connected to the support plate 2 near the side wall of the pull-out plate 4, and a fixing groove 13 is provided on the side wall of the pull-out plate 4 near the first adjustment component.

[0037] In use, the pull-out plate 4 is completely pulled out of the insulation box 1, and the end of the check rod 12 is fixed in the fixing groove 13 by rotating the check rod 12 clockwise, thus fixing the pull-out plate 4 in the pulled-out state. At this time, the clamping device is completely disengaged from the hole 8. Then, the distance between the four clamping plates 1005 in the clamping device is increased, and the wafer is placed on the four clamping plates 1005. After the wafer is placed, the check rod 12 is rotated counterclockwise to rotate the end of the check rod 12 out of the fixing groove 13. At this time, the placement template 5 is automatically moved upward by the rebound action of the first spring 702, thereby... The clamping mechanism is returned to the hole 8. At this time, the first pressing block 9 presses the second pressing block 1004 to reduce the distance between the four clamping plates 1005, thereby fixing the wafer securely. When the first spring 702 rebounds and drives the pull plate 4 to move to the left, the speed of the pull plate 4 moving to the left is not too fast due to the extension and contraction damping of the telescopic rod 3, so that the wafer will not be affected by inertia and fall off the clamping mechanism 10. Finally, the pull plate 4 is completely pushed into the insulation box 1 and the double door is closed. Then, the temperature in the insulation box 1 is controlled within the range suitable for the wafer by the temperature control device, and the installed wafer can be transported.

[0038] When the transport protection device vibrates during the transport of the wafer, the vibration force is transmitted through the pull plate 4 to several second uprights 1001, and then through several second uprights 1001 to several first springs 702. Through the vibration-resistant treatment of several first springs 702, the impact of the vibration force on the wafer mounted on the placement template 5 can be reduced.

[0039] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A constant temperature transport protection device for semiconductor materials, comprising an insulated box (1) and support plates (2) fixedly provided on both sides of the bottom wall of its inner cavity, characterized in that: A pull-out plate (4) capable of being pushed and pulled is installed between the two support plates (2). A placement template (5) is installed on the top of the pull-out plate (4). Lifting mechanisms (6) for raising and lowering the placement template (5) are installed on both sides of the pull-out plate (4). Several fixing mechanisms and several elastic mechanisms (7) are installed on the placement template (5). The fixing mechanisms work with the lifting mechanisms (6) to expand or reduce the clamping size of the fixing mechanisms. The fixing mechanisms work with the elastic mechanisms (7) to facilitate the removal and installation of wafers. The lifting mechanism (6) includes two symmetrical sliders (602) that are slidably disposed at both ends of one side of the pull-out plate (4). The outer peripheral walls of the two sliders (602) are rotatably connected to rotating plates (603). A connecting plate (604) is installed between the two rotating plates (603). The two ends of the connecting plate (604) are rotatably connected to one side of the two rotating plates (603). The end of the rotating plate (603) away from the sliders (602) is rotatably connected to the side of the template (5). A first fixing plate (605) is fixedly provided at the end of one of the rotating plates (603) away from the pull-out plate (4). A second fixing plate (606) is fixedly provided at the position where the inner wall of the support plate (2) is parallel to the first fixing plate (605) on the left and right. The elastic mechanism (7) includes a first upright (701) that is slidably disposed on the placement template (5), and a first spring (702) is fixedly installed between the top of the first upright (701) and the top of the placement template (5). The fixing mechanism includes a hole (8) opened on the placement template (5), and a plurality of first extrusion blocks (9) are fixedly installed on the inner wall of the hole (8). The fixing mechanism also includes a clamping mechanism (10), which cooperates with the first extrusion blocks (9) to reduce the clamping size, and the clamping mechanism (10) disengages from the first extrusion blocks (9) to expand the clamping size. The clamping mechanism (10) includes a second upright (1001) fixedly connected to the top of the pull-out plate (4). A limiting plate (1002) is fixedly installed on the top of the second upright (1001). The limiting plate (1002) is slidably connected to the first pressing block (9). A sliding rod (1003) is slidably provided through the limiting plate (1002) near the position of the first pressing block (9). A second pressing block (1004) is fixedly installed at one end of the sliding rod (1003) near the first pressing block (9). A clamping plate (1005) is fixedly installed at the other end of the sliding rod (1003). A second spring (1006) is fixedly installed between the clamping plate (1005) and the limiting plate (1002). The contact surfaces of the second extrusion block (1004) and the first extrusion block (9) are both smooth curved surfaces, and the shape of the inner wall of the clamping plate (1005) is adapted to the outer peripheral wall of the wafer.

2. The constant temperature transport protection device for semiconductor materials according to claim 1, characterized in that, The number of the first extrusion block (9) is not less than two.

3. The constant temperature transport protection device for semiconductor materials according to claim 1, characterized in that, A check rod (12) is threadedly connected to the support plate (2) near the bottom of the lifting mechanism (6), and a fixing groove (13) adapted to the end of the check rod (12) is provided on the side wall of the pull plate (4).

4. The constant temperature transport protection device for semiconductor materials according to claim 1, characterized in that, The pull-out plate (4) has a certain damping when it is pushed or pulled.

5. A constant-temperature transport protection device for semiconductor materials according to claim 1, characterized in that, The materials of the placement template (5) and the clamping mechanism (10) are both anti-static lightweight materials.

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