A thick film circuit printing method and apparatus

Abstract

The application discloses a thick film circuit printing method and device. In the process of printing the circuit according to the printing path, the printing head is controlled to first perform printing processing by a conventional pneumatic direct writing technology, then a voltage signal is output between the printing head and the conductor carrier at a position where an electric field is applied to form an electric field, and the electric field traction provided by the electric field is used to assist the direct writing printing process. The structure cost of the printing device is effectively controlled, the starting point and the ending point of the circuit printing are effectively controlled by the direct writing printing mode, the needle-to-surface distance in the circuit printing process can be gradually increased under the auxiliary action of the electric field traction, and the printing effect and the precision of the circuit are ensured.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of circuit processing, and particularly relates to a thick film circuit printing method and device. BACKGROUND

[0002] With the development of the electronic industry, the integration of electronic components is higher and higher, and under the requirement of smaller and smaller size, printed circuit boards (also referred to as PCBs) will utilize limited area and space to make the circuit smaller and smaller and the number of layers more and more.

[0003] As a type of printed circuit of the printed circuit board, the thick film circuit is flexible in design, simple in process and low in cost, and is particularly suitable for small batch production of multiple varieties, and can withstand higher voltage, greater power and greater current in terms of electrical performance, and has been widely used in analog circuits of consumer and industrial electronic products.

[0004] The traditional method for printing the thick film circuit includes ink direct writing technology and electroblotting printing technology, wherein the ink direct writing printing technology has complex discharge control, is high in requirements for equipment precision and material uniformity, is easily affected by the needle face distance to cause fluctuation of the printed circuit, and further affects the printing effect and precision of the circuit; the electroblotting printing technology is easily affected by fluctuation of the electric field force, and cannot effectively control the morphology of the starting point and the ending point of the printed circuit, and further affects the printing effect and precision of the circuit. SUMMARY

[0005] To solve the technical problems that the ink direct writing printing technology has complex discharge control, is high in requirements for equipment precision and material uniformity, is easily affected by the needle face distance to cause fluctuation of the printed circuit, and further affects the printing effect and precision of the circuit; the electroblotting printing technology is easily affected by fluctuation of the electric field force, and cannot effectively control the morphology of the starting point of the printed circuit, and further affects the printing effect and precision of the circuit, the application provides a thick film circuit printing method and device, and the technical scheme is as follows.

[0006] In a first aspect, the application embodiment provides a thick film circuit printing method, comprising:

[0007] A target printing head is determined according to a circuit parameter of a substrate, and a voltage parameter is obtained from a printing material configured by the target printing head;

[0008] A printing path and an electric field application position are determined based on a circuit position and a circuit parameter of the substrate, wherein the electric field application position is between a starting point position and an ending point position;

[0009] The target print head is controlled to perform line printing according to the printing path, and a voltage signal corresponding to the voltage parameter is output to the target print head when the target print head moves to the electric field application position until the target print head moves to the end position.

[0010] In an optional implementation of the first aspect, the line parameter of the substrate includes a line width and a line material of the substrate.

[0011] The target print head is determined according to the line parameter of the substrate, including:

[0012] The target inner diameter is calculated according to the line width of the substrate and a preset first coefficient.

[0013] The print head with the needle inner diameter consistent with the target inner diameter is configured as the target print head, and the target print head is configured with the printing material consistent with the line material.

[0014] In another optional implementation of the first aspect, the voltage parameter is obtained from the printing material configured by the target print head, including:

[0015] When the printing material configured by the target print head is the first material, the frequency parameter, the duty cycle parameter and the level parameter in the preset square wave voltage signal are configured as the voltage parameter.

[0016] When the printing material configured by the target print head is the second material, the voltage value in the preset direct current voltage signal is configured as the voltage parameter.

[0017] In another optional implementation of the first aspect, the line parameter of the substrate further includes a line thickness of the substrate.

[0018] The printing path and the electric field application position are determined based on the line position and the line parameter of the substrate, including:

[0019] When the ratio between the line thickness and the line width of the substrate is lower than a preset thickness-width ratio threshold, the two end positions in the line position of the substrate are respectively configured as the start position and the end position.

[0020] The height corresponding to the start position is calculated according to the line width of the substrate and a preset second coefficient.

[0021] The height corresponding to the end position is determined according to the line packaging requirement of the substrate, and the printing path is obtained from the height corresponding to the start position, the height corresponding to the end position and the line between the start position and the end position; wherein the height corresponding to the start position of the printing path is lower than the height corresponding to the end position.

[0022] The position with a straight line distance from the start position being a preset first distance in the printing path is configured as the electric field application position.

[0023] In a further alternative of the first aspect, the height corresponding to the end position is determined according to a circuit packaging requirement of the substrate, comprising:

[0024] when the circuit packaging requirement of the substrate exists, the first preset height is set as the height corresponding to the end position; wherein the first preset height is higher than the height corresponding to the start position;

[0025] when the circuit packaging requirement of the substrate does not exist, the second preset height is set as the height corresponding to the end position; wherein the second preset height is higher than the first preset height.

[0026] In a further alternative of the first aspect, after the height corresponding to the end position is determined according to the circuit packaging requirement of the substrate, further comprising:

[0027] the position in the circuit position of the substrate with a horizontal distance of the second preset distance from the start position is set as the electric field application position;

[0028] the printing path is obtained from the height corresponding to the start position, the height corresponding to the electric field application position, the line connecting the start position and the electric field application position, the height corresponding to the end position, and the line connecting the electric field application position and the end position.

[0029] In a further alternative of the first aspect, the printing path and the electric field application position are determined based on the circuit position of the substrate and the circuit parameter, further comprising:

[0030] when the ratio between the circuit thickness of the substrate and the circuit width of the substrate is lower than the preset thickness-width ratio threshold, the position in the designated area on the extension line of one end of the circuit position of the substrate is set as the start position, the position of one end of the circuit position of the substrate is set as the transition position, and the position of the other end of the circuit position of the substrate is set as the end position;

[0031] the height corresponding to the start position is calculated according to the circuit width of the substrate and the second preset coefficient, and the height corresponding to the start position is set as the height corresponding to the transition position;

[0032] the position in the line connecting the start position and the transition position with a horizontal distance of the second preset distance from the start position is set as the electric field application position;

[0033] the printing path is obtained from the height corresponding to the start position, the height corresponding to the electric field application position, the line connecting the start position and the electric field application position, the height corresponding to the transition position, the line connecting the electric field application position and the transition position, the height corresponding to the end position, and the line connecting the electric field application position and the end position.

[0034] In a further alternative of the first aspect, the determining the printing path and the electric field application position based on the line position of the substrate and the line parameter further comprises:

[0035] when the ratio between the line thickness of the substrate and the line width of the substrate is higher than or equal to a preset thickness-width ratio threshold, determining the printing path layer number according to the line thickness of the substrate;

[0036] taking two end positions in the line position of the substrate as a start position and an end position of a bottom layer printing path respectively;

[0037] calculating a height corresponding to the start position according to the line width of the substrate and a preset second coefficient;

[0038] determining a height corresponding to the end position according to the line packaging requirement of the substrate, and obtaining the printing path from the height corresponding to the start position, the height corresponding to the end position, a line segment between the start position and the end position, and the printing path layer number;

[0039] taking a position in the bottom layer printing path of the printing path as the electric field application position, where a straight line distance between the start position and the position is a preset first distance.

[0040] In a further alternative of the first aspect, after outputting the voltage signal corresponding to the voltage parameter to the target print head until the target print head moves to the end position, the method further comprises:

[0041] performing electrostatic removal treatment on the substrate surface based on a deionization fan, and controlling the target print head to perform line printing treatment on the substrate according to a printing path adjacent to the bottom layer printing path in the printing path.

[0042] In a further alternative of the first aspect, before controlling the target print head to perform line printing treatment according to the printing path, the method further comprises:

[0043] fixing the substrate on a conductor support, and obtaining a vertical distance between the substrate surface and the target print head by a distance measuring sensor; wherein the conductor support and the target print head are connected through a power supply, the conductor support is connected with a ground end, and the distance measuring sensor is arranged on the conductor support;

[0044] when the vertical distance between the substrate surface and the target print head is inconsistent, adjusting the height of the conductor support according to the difference between different vertical distances, so that the vertical distance between the substrate surface and the target print head is consistent.

[0045] In a further alternative of the first aspect, after outputting the voltage signal corresponding to the voltage parameter to the target print head until the target print head moves to the end position, the method further comprises:

[0046] performing curing treatment on the printed line on the substrate.

[0047] In a further optional implementation of the first aspect, after obtaining the voltage parameter from the printing material configured by the target print head, the method further comprises:

[0048] When the viscosity of the printing material configured by the target print head is lower than a preset viscosity threshold, determining a printing path based on the line position of the substrate and the line parameter, wherein a starting position of the printing path corresponds to a height lower than a height corresponding to an ending position of the printing path.

[0049] Outputting a voltage signal corresponding to the voltage parameter to the target print head, and controlling the target print head to move according to the printing path until the target print head moves from the starting position to the ending position.

[0050] In a second aspect, an embodiment of the present application provides a thick film line printing device, comprising:

[0051] A parameter determination module configured to determine a target print head according to a line parameter of a substrate, and obtain a voltage parameter from a printing material configured by the target print head.

[0052] A path determination module configured to determine a printing path and an electric field application position based on a line position of the substrate and the line parameter, wherein the electric field application position is between a starting position and an ending position.

[0053] A line printing module configured to control the target print head to perform line printing processing according to the printing path, and output a voltage signal corresponding to the voltage parameter to the target print head when the target print head moves to the electric field application position, until the target print head moves to the ending position.

[0054] In a third aspect, an embodiment of the present application further provides a thick film line printing device, comprising a processor and a memory.

[0055] The processor is connected to the memory.

[0056] The memory is configured to store executable program codes.

[0057] The processor runs a program corresponding to the executable program codes by reading the executable program codes stored in the memory, so as to implement the thick film line printing method provided by the first aspect of the present application or any one of the implementation manners of the first aspect.

[0058] In a fourth aspect, an embodiment of the present application provides a computer storage medium, which stores a computer program, and the computer program comprises program instructions. When the program instructions are executed by a processor, the thick film line printing method provided by the first aspect of the present application or any one of the implementation manners of the first aspect can be implemented.

[0059] As above, the thick film circuit printing method and device provided by the embodiments of the present application have the following beneficial effects:

[0060] When printing the thick film circuit on the surface of the substrate, the target printing head can be determined according to the circuit parameters of the substrate, and the voltage parameter can be obtained from the printing material configured by the target printing head; the printing path and the electric field application position can be determined based on the circuit position and the circuit parameters of the substrate; the electric field application position is between the starting position and the ending position; the target printing head is controlled to perform the circuit printing process according to the printing path, and when the target printing head moves to the electric field application position, the voltage signal corresponding to the voltage parameter is output to the target printing head until the target printing head moves to the ending position. By controlling the printing head to output the voltage signal between the printing head and the conductor carrier to form an electric field at the electric field application position during the circuit printing process according to the printing path, the electric field traction provided by the electric field is used to assist the direct writing printing process, which not only effectively controls the structural cost of the printing device, but also effectively controls the printing starting point morphology of the circuit by the direct writing printing method, and gradually increases the needle-to-surface distance during the circuit printing process under the auxiliary action of the electric field traction, thereby ensuring the printing effect and precision of the circuit. BRIEF DESCRIPTION OF DRAWINGS

[0061] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0062] Figure 1 The overall flowchart of the thick film circuit printing method provided by the embodiments of the present application;

[0063] Figure 2 The structural schematic diagram of the thick film circuit printing device provided by the embodiments of the present application;

[0064] Figure 3 The effect schematic diagram of the thick film circuit printing method provided by the embodiments of the present application;

[0065] Figure 4 The effect schematic diagram of another thick film circuit printing method provided by the embodiments of the present application;

[0066] Figure 5 The effect schematic diagram of the needle-to-surface distance provided by the embodiments of the present application;

[0067] Figure 6 The structural schematic diagram of another thick film circuit printing device provided by the embodiments of the present application;

[0068] Figure 7 A charge distribution schematic diagram of a thick film circuit printing device provided by an embodiment of the present application;

[0069] Figure 8 A structure schematic diagram of a thick film circuit printing device provided by an embodiment of the present application;

[0070] Figure 9 A structure schematic diagram of a thick film circuit printing device provided by an embodiment of the present application. DETAILED DESCRIPTION

[0071] In order to make the inventive objectives, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the embodiments described below are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0072] In the introduction of the embodiments of the present application, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. The following introduction provides a plurality of embodiments of the present application, which can be replaced or combined between different embodiments, so the present application can also be considered to include all possible combinations of the same and / or different embodiments described. Therefore, if one embodiment includes features A, B and C, and another embodiment includes features B and D, the present application should also be considered to include one or more embodiments of all other possible combinations of A, B, C and D, although the embodiment may not be explicitly described in the following content.

[0073] The following description provides examples and does not limit the scope, applicability or examples set forth in the claims. Changes can be made to the functions and arrangements of described elements without departing from the scope of the present application. Various examples can appropriately omit, replace or add various processes or components. For example, the described methods can be executed in different order from the described order, and various steps can be added, omitted or combined. In addition, features described with respect to some examples can be combined into other examples.

[0074] Please refer to Figure 1 , Figure 1 A thick film circuit printing method provided by an embodiment of the present application is shown in a whole flowchart.

[0075] As Figure 1 shown, the thick film circuit printing method can at least include the following steps:

[0076] Step 102: Determine the target printhead based on the circuit parameters of the substrate, and obtain the voltage parameters from the printing material configured for the target printhead.

[0077] In this embodiment, the thick-film circuit printing method can be applied to, but is not limited to, a control terminal. This control terminal can control a thick-film circuit printing device to achieve thick-film circuit printing on the substrate surface. The thick-film circuit printing device can include at least a high-precision electronic 3D printer stage and a power supply that provides an electric field. The high-precision electronic 3D printer stage is equipped with a conductive print head that can be controlled to move and print, and a conductive stage for supporting the substrate. A potential difference is generated between the conductive print head and the conductive stage through the power supply, and this potential difference forms an electric field that provides electric force. Here, when the positive terminal of the power supply is connected to the conductive print head and the negative terminal is connected to the conductive stage, the conductive stage also needs to be connected to a ground terminal to create a potential difference between the conductive print head and the conductive stage. When the positive terminal of the power supply is connected to the conductive stage and the negative terminal is connected to the conductive print head, the conductive print head needs to be connected to a ground terminal to create a potential difference between the conductive print head and the conductive stage.

[0078] It is understood that the inner diameter of the conductive printhead mentioned above can be determined, but is not limited to, based on the line width of the substrate, and the printing material configured thereon can be determined, but is not limited to, based on the line material of the substrate, in order to effectively ensure the accuracy and efficiency of line printing. The type of printing material can be conductive material or ordinary insulating material, and is not limited thereto. The conductor stage mentioned above can be provided with a suction cup for fixing the substrate, so as to fix the substrate in a designated position by adsorption. After fixing the substrate, the conductor stage can also be, but is not limited to, performing a correction process on the substrate to make the side of the substrate parallel to the side of the conductor stage, so as to improve the printing efficiency of the conductive printhead.

[0079] See here. Figure 2 The schematic diagram shown is of a thick film circuit printing apparatus provided in an embodiment of this application. Figure 2 As shown, the thick-film circuit printing apparatus may include a high-precision electronic 3D printer stage and a power supply. The conductive print head of the high-precision electronic 3D printer stage is connected to the positive terminal of the power supply, and the conductive stage of the high-precision electronic 3D printer stage is connected to the negative terminal and ground terminal of the power supply. A substrate is placed on the conductive stage, and circuit printing is achieved on the substrate by controlling the movement of the conductive print head. Compared with printing apparatuses used in traditional ink-to-paper technologies (such as piezoelectric printing and thermal inkjet printing), the thick-film circuit printing apparatus mentioned in this application embodiment not only has a lower overall equipment structure cost and a simpler control method, but also adapts to a wider range of printing material viscosities.

[0080] In the process of implementing the thick film circuit printing process of the substrate surface by the control terminal through the control of the thick film circuit printing device, in order to avoid poor appearance of the starting point of the printed circuit, the control terminal can but not limited to first control the conductive print head to perform the air pressure printing process (which can also be other printing process, not limited to this), and after a period of time or a distance, start to output the electrical signal between the conductive print head and the conductor carrier, to provide auxiliary traction to the printing material output by the conductive print head through the electric field formed by the potential difference, and this way can effectively prevent the material solidification caused by the initial too large voltage of the needle from not discharging and other influences. Then, a period of time or a distance can be passed until the air pressure and voltage signal of the conductive print head are stable, and then the circuit printing process is performed along the printing path, at this time, since the printing material output by the conductive print head is also assisted by the electric field force, the printing height of the conductive print head can be gradually increased, while increasing the needle face distance, the influence of the needle head scraping of the conductive print head and the slight fluctuation of the needle face distance on the line shape and the subsequent heating performance can be effectively avoided. Of course, the conductive print head can but not limited to first perform the conventional air direct writing printing, and then provide the electric field traction through the potential difference formed by the voltage signal to assist the air direct writing printing, which can also effectively avoid poor appearance of the starting point of the printed circuit, and while increasing the needle face distance, the influence of the needle head scraping of the conductive print head and the slight fluctuation of the needle face distance on the line shape and the subsequent heating performance can be effectively avoided.

[0081] Herein Figure 3 The effect schematic diagram of the thick film circuit printing method provided by the embodiment of the application is shown as follows. Figure 3 As shown in the process of performing the circuit printing of the substrate along the printing path, the air pressure printing process is performed by controlling the conductive print head, and then the electrical signal is output between the conductive print head and the conductor carrier to provide auxiliary traction to the printing material output by the conductive print head through the electric field formed by the potential difference, thereby realizing the circuit printing process of the substrate.

[0082] Specifically, when performing the thick film circuit printing process on the substrate surface, the target print head used for the circuit printing process can be determined according to the circuit parameters of the substrate input by the user, which can but not limited to include the circuit width, circuit material and circuit thickness of the substrate and other parameters, so as to determine the conductive print head with higher printing efficiency, and configure the printing material that can meet the circuit material demand. It can be understood that the printing efficiency of the conductive print head with different needle inner diameters is different, and the viscosity of the printing material also affects the printing efficiency of the conductive print head.

[0083] In the embodiments of the present application, before the line printing process is performed on the substrate surface, the substrate surface can be wiped by alcohol and cleaned by plasma or oxygen to effectively remove impurities on the substrate surface.

[0084] Further, after the printing material configured for the target print head is determined, a corresponding voltage parameter can be determined according to the type of the printing material, so as to guarantee the effectiveness and rationality of the voltage signal output between the target print head and the conductor carrier during the line printing process of the target print head.

[0085] As an option of the embodiments of the present application, the line parameter of the substrate includes a line width and a line material of the substrate.

[0086] The target print head is determined according to the line parameter of the substrate, including:

[0087] The target inner diameter is calculated according to the line width of the substrate and a preset first coefficient.

[0088] The print head with the needle inner diameter consistent with the target inner diameter is taken as the target print head, and the target print head is configured with the printing material consistent with the line material.

[0089] Specifically, during the determination of the target print head, the corresponding target inner diameter can be calculated according to the line width of the substrate and a preset first coefficient, and the print head with the needle inner diameter consistent with the target inner diameter can be taken as the target print head. The preset first coefficient can be but is not limited to 2. For example, when the line width of the substrate is in the range of 1-10 um, the corresponding needle inner diameter can be in the range of 2-20 um.

[0090] Then, after the target print head is determined, the target print head can be configured with the printing material consistent with the line material of the substrate, but is not limited to this. For example, when the line material of the substrate is metal material, the printing material configured for the target print head can be metal copper or other metal material. The line material of the substrate can be ordinary insulating material in addition to the above-mentioned metal material, but is not limited to this.

[0091] It should be noted that in order to effectively guarantee that the target print head is assisted by the electric field force in the process of line printing, the print material configured by the target print head can be but is not limited to a high-viscosity print material, so as to utilize the good shape retention of the high-viscosity print material (the high-viscosity material is in a filamentous state after being extruded from the needle, and is not prone to breakage when being pulled by the electric field force), and in the process of normal pneumatic printing of the target print head, the electric field force is used to assist in pulling the print material by outputting an electric signal to the target print head, so as to improve the overall efficiency of the line printing process. It can be understood that when the print material configured by the target print head is a high-viscosity print material, the corresponding moving speed can be but is not limited to controlled in the range of 1-10 mm / s, and the corresponding air pressure parameter can be but is not limited to controlled in the range of 40-60 Pa, so as to guarantee that the target print head can normally perform pneumatic printing. Here, the high-viscosity print material can be understood as a print material with a viscosity in the range of 20w-40w cps, and is not limited thereto.

[0092] Of course, the print material configured by the target print head can also be a low-viscosity print material, but due to the good fluidity of the low-viscosity print material, the target print head cannot normally perform pneumatic printing, and here the line printing process can be directly realized by using the electric field force by outputting a voltage signal to the target print head. It can be understood that when the print material configured by the target print head is a low-viscosity print material, the corresponding moving speed will be faster than that of the high-viscosity print material, for example, can be controlled in the range of greater than 10 mm / s; and the corresponding air pressure parameter will be lower than that of the high-viscosity print material, for example, can be controlled in the range of 0-40 Pa, so as to guarantee that the target print head can normally perform printing by using the electric field force.

[0093] As another optional embodiment of the present application, the print material configured by the target print head obtains a voltage parameter, which includes:

[0094] When the print material configured by the target print head is a first material, the frequency parameter, the duty cycle parameter and the level parameter in the preset square wave voltage signal are taken as the voltage parameter;

[0095] When the print material configured by the target print head is a second material, the voltage value in the preset direct current voltage signal is taken as the voltage parameter.

[0096] Specifically, in the process of determining the voltage parameter according to the printing material, the frequency parameter, the duty cycle parameter and the level parameter in the preset square wave voltage signal can be taken as the voltage parameter to achieve better conductive traction effect and guarantee the stability of the electric field force, but not limited to, when the printing material is the first material for representing the metal material. When it is needed to output the voltage signal to the target print head, the voltage signal output by the power supply is converted to obtain the voltage signal consistent with the frequency parameter, the duty cycle parameter and the level parameter. Here, the frequency parameter in the preset square wave voltage signal can be a frequency value in the range of 800-1000HZ, the duty cycle can be 50%, and the level parameter can be a high and low level in the range of ±300-1000v. It should be noted that the stability of the square wave voltage signal is higher than that of the direct current voltage signal.

[0097] It can be understood that, in order to realize the conversion processing of the power supply, a signal generator and a signal amplifier can be sequentially arranged between the power supply and the target print head, so that the signal generator converts the voltage signal output by the power supply according to the above-mentioned frequency parameter, duty cycle parameter and level parameter, and the signal amplifier amplifies the converted voltage signal. At this time, the voltage signal output to the target print head is the amplified square wave voltage signal.

[0098] When the printing material is the second material for representing the ordinary insulating material, the voltage value in the preset direct current voltage signal can be taken as the voltage parameter to achieve better conductive traction effect, so that the voltage signal output by the power supply is converted to obtain the voltage signal consistent with the voltage parameter when it is needed to output the voltage signal to the target print head. Here, the voltage value in the preset direct current voltage signal can be a voltage value in the range of 300-2000v.

[0099] It can be understood that, in order to realize the conversion processing of the power supply, the signal amplifier mentioned above can directly amplify the voltage signal output by the power supply, and at this time, the voltage signal output between the target print head and the conductor platform is the amplified square wave voltage signal.

[0100] Step 104, based on the line position and the line parameter of the substrate, the printing path and the electric field application position are determined.

[0101] Specifically, after the target print head and the corresponding voltage parameter are determined, the printing mode can be determined as the single-layer printing or the stacked-layer printing according to the line parameter of the substrate, and the printing path corresponding to the single-layer printing or the printing path corresponding to the stacked-layer printing can be determined according to the line position of the substrate. It can be understood that when the printing path is determined as the printing path corresponding to the single-layer printing, the electric field application position can be found on the printing path in combination with the preset distance parameter; and when the printing path is determined as the printing path corresponding to the stacked-layer printing, the electric field application position can be found on the bottom layer of the printing path in combination with the preset distance parameter, so as to effectively guarantee the normal auxiliary traction of the electric field force.

[0102] As another optional embodiment of the present application, the line parameter of the substrate further includes the line thickness of the substrate.

[0103] Based on the line position and the line parameter of the substrate, the printing path and the electric field application position are determined, including:

[0104] When the ratio between the line thickness of the substrate and the line width of the substrate is lower than the preset thickness-width ratio threshold, the two end positions in the line position of the substrate are respectively taken as the start position and the end position;

[0105] The height corresponding to the start position is calculated according to the line width of the substrate and the preset second coefficient;

[0106] The height corresponding to the end position is determined according to the packaging requirement of the line of the substrate, and the printing path is obtained from the height corresponding to the start position, the height corresponding to the end position and the line connecting the start position and the end position;

[0107] The position with a straight-line distance of the preset first distance from the start position in the printing path is taken as the electric field application position.

[0108] Specifically, in the process of determining the printing path and the electric field application position, when the ratio between the line thickness of the substrate and the line width of the substrate is lower than the preset thickness-width ratio threshold, it indicates that the printing mode of the line of the substrate can be the single-layer printing, that is, the line printing process can be realized by controlling the target print head to move in one direction, and then the two end positions in the line position of the substrate can be respectively taken as the start position and the end position. Here, the line position of the substrate can be understood as the reserved line area on the surface of the substrate to be filled, for example, but not limited to, when the line position of the substrate is a straight line reserved on the surface of the substrate, the two end positions in the line position are the positions corresponding to the two end points of the straight line, at this time, the two end positions corresponding to the two end points can be respectively taken as the start position and the end position, and the initial heights corresponding to the start position and the end position are consistent (that is, the start position and the end position are both on the surface of the substrate).

[0109] Next, the target height corresponding to the starting position can be obtained by calculating the product of the line width of the substrate and a preset second coefficient, that is, the printing height corresponding to the target printhead when it is at the starting position. Here, the preset second coefficient can be, but is not limited to, 0.4. It is understood that the target height corresponding to the starting position can also be, but is not limited to, determined by the inner diameter of the needle of the target printhead. For example, it can also be 0.4-0.8 times the inner diameter of the needle of the target printhead, and is not limited to this.

[0110] It should be noted that in this embodiment, the target printhead can directly print lines on the circuit location of the substrate. Furthermore, since the target printhead uses pneumatic printing in the initial stage of printing, without utilizing electric field force for auxiliary traction, it effectively avoids the technical defect of poor starting point morphology in traditional electric field printing. Of course, the target printhead may experience unstable printed lines due to instability in pneumatic control during this initial stage, but since this stage is short-lived, it will not substantially affect the final printed lines.

[0111] Next, the target height corresponding to the endpoint position can be determined according to the circuit packaging requirements of the substrate. This can also be understood as the printing height at which the target printhead stops after completing the circuit printing process. Under the influence of the electric field-assisted traction of the target printhead during circuit printing, this target height at the endpoint position can be greater than the target height corresponding to the starting position (i.e., increasing the pin distance between the target printhead and the substrate surface). This effectively avoids pin scratching and the impact of slight fluctuations in pin distance on the linear shape and subsequent heating performance. Furthermore, it can be, but is not limited to, 2-10 times the inner diameter of the pins of the target printhead. Here, the circuit packaging requirements of the substrate can be understood as whether there is a need for circuit packaging printing after the circuit printing process is completed. This can be, but is not limited to, determined by manual input or by a preset automatic control program. Different circuit packaging requirements will result in different target heights corresponding to the endpoint positions.

[0112] See here. Figure 4 The diagram shown illustrates the effect of another thick film circuit printing method provided in this application embodiment. Figure 4 As shown, the distance between the left printhead on the substrate and the substrate surface is d1, which is the target height corresponding to the starting position. The distance between the right printhead on the substrate and the substrate surface is d2, which is the target height corresponding to the ending position. It can be clearly seen that d1 is less than d2, which means that the printing height gradually increases during the line printing process to avoid the influence of needle scratching and slight fluctuations in needle distance on the line shape and subsequent heating performance.

[0113] Then, after the target height corresponding to the start position and the target height corresponding to the end position are determined respectively, the printing path used for controlling the target print head to move can be obtained according to the target height corresponding to the start position, the target height corresponding to the end position, and the line connecting the start position and the end position. During the movement of the target print head according to the printing path, the printing height gradually increases from the target height corresponding to the start position to the target height corresponding to the end position, and the movement speed remains consistent.

[0114] Then, in order to ensure that the electric field force can assist in pulling the target print head to perform normal line printing processing, the position with a linear distance of a preset first distance from the start position in the above-mentioned printing path can be used as the electric field application position. In other words, when the target print head moves to the position with a linear distance of a preset first distance from the start position according to the printing path, the pneumatic control state of the target print head has become stable, and then the electric field force can be introduced to assist in pulling the line printing process of the target print head, so that the pneumatic control and the electric field force assisted pulling can work together, and the problem that the material cannot be discharged due to the needle electrification caused by the too large initial voltage can be effectively prevented.

[0115] Of course, when the time for the target print head to move according to the printing path is a preset time threshold, the position of the target print head at this time can also be used as the electric field application position. The preset time threshold can be but is not limited to 50 milliseconds. That is, the time for the target print head to perform line printing processing under the pneumatic control is relatively short, so that the electric field force can be introduced to assist in pulling quickly, and the influence of needle scratching and slight needle face distance fluctuation on linearity and subsequent heating performance can be maximally avoided.

[0116] As another alternative of the embodiment of the present application, the height corresponding to the end position is determined according to the line packaging requirement of the substrate, and the method comprises the following steps.

[0117] When the line packaging requirement of the substrate exists, the preset first height is used as the height corresponding to the end position; wherein the preset first height is higher than the height corresponding to the start position.

[0118] When the line packaging requirement of the substrate does not exist, the preset second height is used as the height corresponding to the end position; wherein the preset second height is higher than the preset first height.

[0119] Specifically, in the process of determining the target height corresponding to the end position according to the circuit packaging requirement of the substrate, when the circuit packaging requirement of the substrate exists, it indicates that the packaging printing process needs to be further performed after the circuit printing process of the substrate is completed, and the printing height of the target print head cannot be too high, and thus the preset first height can be taken as the height corresponding to the end position. Here, the preset first height can be understood as that the needle-to-surface distance between the target print head and the surface of the substrate is a low needle-to-surface distance or a medium needle-to-surface distance, and the low needle-to-surface distance or the medium needle-to-surface distance is higher than the target height corresponding to the start position. It can be understood that when the circuit packaging requirement of the substrate does not exist, it indicates that the packaging printing process does not need to be further performed after the circuit printing process of the substrate is completed, and in order to further avoid the influence of needle head scratching and slight needle-to-surface distance fluctuation on the line shape and subsequent heating performance, the preset second height can be taken as the height corresponding to the end position. Here, the preset second height can be understood as that the needle-to-surface distance between the target print head and the surface of the substrate is a high needle-to-surface distance, and the high needle-to-surface distance is higher than the preset first height.

[0120] Here, refer to Figure 5 The effect diagram of the needle-to-surface distance provided by the embodiment of the application is shown as follows, Figure 5 as shown, Figure 5 The needle-to-surface distance shown in a is a low needle-to-surface distance, that is, the distance between the print head and the surface of the substrate is relatively close; Figure 5 The needle-to-surface distance shown in b is a medium needle-to-surface distance, and the distance between the print head and the surface of the substrate is slightly higher than that of the low needle-to-surface distance; Figure 5 The needle-to-surface distance shown in c is a high needle-to-surface distance, and the distance between the print head and the surface of the substrate is slightly higher than that of the medium needle-to-surface distance. As can be seen, the line printing width corresponding to the low needle-to-surface distance is slightly thicker than that of the medium needle-to-surface distance, and the line printing width corresponding to the medium needle-to-surface distance is slightly thicker than that of the high needle-to-surface distance, that is, the larger the needle-to-surface distance, the smaller the line printing width.

[0121] As another option of the embodiment of the application, after the height corresponding to the end position is determined according to the circuit packaging requirement of the substrate, the method further includes:

[0122] Taking the position with a preset second distance from the start position in the circuit position of the substrate as the electric field application position;

[0123] obtaining the printing path from the height corresponding to the start position, the height corresponding to the electric field application position, the line connecting the start position and the electric field application position, the height corresponding to the end position, and the line connecting the electric field application position and the end position.

[0124] In the process of the target print head performing the line printing process according to the printing path from the start position to the end position, in addition to gradually lifting the printing height of the target print head, the printing height of the target print head is also gradually lifted after the target print head reaches the electric field application position, that is, after the electric field force auxiliary traction is introduced, so as to guarantee the line printing effect of the target print head under the pneumatic control.

[0125] Specifically, in the process of determining the printing path and the electric field application position, the position in the line position of the substrate and the start position with a horizontal distance of a preset second distance can be but not limited to be taken as the electric field application position, in other words, the printing height is kept unchanged in the process of controlling the target print head to move from the start position to the electric field application position. Here, when the time for the target print head to move from the start position to the electric field application position is a preset time threshold, the position of the target print head at this time can also be taken as the electric field application position, and the preset time threshold can be but not limited to 50 ms, that is, the time for the target print head to perform the line printing process under the pneumatic control is short, so as to quickly introduce the electric field force for auxiliary traction, and to maximize the influence of the needle scraping and the slight fluctuation of the needle face distance on the line shape and the subsequent heating performance.

[0126] Then, the printing path can be obtained according to the height corresponding to the start position, the height corresponding to the electric field application position, the line between the start position and the electric field application position, the height corresponding to the end position, and the line between the electric field application position and the end position, that is, in the process of the target print head performing the line printing process according to the printing path, the conventional pneumatic printing process is performed in the initial printing stage, and the printing height is kept unchanged; and after moving to the electric field application position, the line printing process of the target print head is assisted by introducing the electric field force, so as to realize the joint action of the pneumatic control and the electric field force auxiliary traction, and the printing height is gradually lifted to the target height corresponding to the end position.

[0127] As another optional embodiment of the present application, based on the line position of the substrate and the line parameter, the printing path and the electric field application position are determined, and the method further includes:

[0128] When the ratio between the line thickness of the substrate and the line width of the substrate is lower than a preset thickness-width ratio threshold, the position in the specified area and on the extension line of one end of the line position of the substrate is taken as the start position, one end of the line position of the substrate is taken as the transition position, and the other end of the line position of the substrate is taken as the end position;

[0129] The height corresponding to the start position is calculated according to the line width of the substrate and a preset second coefficient, and the height corresponding to the start position is taken as the height corresponding to the transition position;

[0130] a position in the line segment between the starting position and the transition position, which has a horizontal distance from the starting position of the preset second distance, as the electric field application position;

[0131] a height corresponding to the starting position, a height corresponding to the electric field application position, a line segment between the starting position and the electric field application position, a height corresponding to the transition position, a line segment between the electric field application position and the transition position, a height corresponding to the ending position, and a line segment between the electric field application position and the ending position, to obtain the printing path.

[0132] In addition to the above-mentioned embodiments, the printing height of the target print head in the specified area can be determined, and the line printing process can be performed on the line position of the substrate based on the printing height, and the printing height can be kept unchanged during the movement.

[0133] Specifically, in the process of determining the printing path, when the ratio between the line thickness of the substrate and the line width of the substrate is lower than the preset thickness-width ratio threshold, it indicates that the line printing mode of the substrate can be single-layer printing, that is, the line printing process can be realized by controlling the target print head to move in one direction, and then a position on an extension line of one end of the line position of the substrate in the specified area can be taken as the starting position. The specified area can be but is not limited to a pre-printing area on the conductor carrier, so as to ensure the printing effect of the target print head through the specified area before controlling the target print head to perform the line printing process, and avoid the influence of unstable air pressure or unstable voltage signal during the line printing process.

[0134] Then, the other end position in the line position of the substrate can be taken as the ending position, that is, the position where the target print head stops after completing the line printing process, and a position on the line segment between the starting position and the ending position, which coincides with the one end position in the line position of the substrate, can be taken as the transition position. The transition position can be understood as the initial printing position of the target print head based on the line position of the substrate for line printing process, and the target print head can gradually ensure the stability of air pressure control and the stability of voltage signal output during the movement from the starting position to the transition position, thereby effectively ensuring the effect of the printed line.

[0135] It can be understood that the target height corresponding to the starting position can refer to the above-mentioned embodiments, and will not be described in detail again. The target height corresponding to the starting position can be but not limited to the target height corresponding to the transition position, that is, the printing height is kept unchanged during the process of controlling the target printing head to move from the starting position to the transition position. Of course, the target height corresponding to the transition position can also be determined by the inner diameter of the needle of the target printing head, and the target height corresponding to the transition position is greater than the target height corresponding to the starting position, so as to realize the joint action of the pneumatic control and the electric field force auxiliary traction in advance during the process of controlling the target printing head to move from the starting position to the transition position. Here, it is not limited to this.

[0136] Then, in the connecting path between the starting position and the transition position, the position with a horizontal distance of a preset second distance from the starting position can be taken as the electric field application position. In other words, when the target printing head moves to the position with a straight line distance of a preset second distance from the starting position, the pneumatic control state of the target printing head has tended to be stable, and then the electric field force can be introduced to assist the traction of the line printing process of the target printing head. It can be understood that during the process of moving the target printing head from the electric field application position to the transition position, the stability of the output voltage signal to the target printing head can be gradually ensured, and then the pneumatic control and the voltage signal output have both tended to be stable when the target printing head moves to the transition position.

[0137] Of course, after the target printing head moves from the electric field application position to the transition position, a certain time can be waited for, and then the target printing head can be controlled to move from the transition position to the end position, so as to further ensure the stability in the line printing process.

[0138] As another optional embodiment of the present application, based on the line position of the substrate and the line parameter, the printing path and the electric field application position are determined, and further comprising:

[0139] When the ratio between the line thickness of the substrate and the line width of the substrate is higher than or equal to a preset thickness-width ratio threshold, the printing path layer number is determined according to the line thickness of the substrate;

[0140] The two end positions in the line position of the substrate are respectively taken as the starting position and the end position of the bottom layer printing path;

[0141] The height corresponding to the starting position is calculated according to the line width of the substrate and a preset second coefficient;

[0142] The height corresponding to the end position is determined according to the line packaging requirement of the substrate, and the printing path is obtained from the height corresponding to the starting position, the height corresponding to the end position, the connecting line between the starting position and the end position, and the printing path layer number.

[0143] The position in the bottom print path of the print path, which has a straight-line distance from the start position of a preset first distance, is taken as the electric field application position.

[0144] Specifically, in the process of determining the print path, when the ratio between the line thickness of the substrate and the line width of the substrate is higher than or equal to a preset thickness-width ratio threshold, it indicates that the line printing mode of the substrate can be stack printing, that is, the line printing process is realized by controlling the target print head to move in a single direction multiple times, and the print path corresponding to each single direction movement can be consistent.

[0145] Then, the two end positions in the line position of the substrate can be taken as the start position and the end position of the bottom print path respectively. The bottom print path can be understood as the first layer print path in the stack printing process. Each subsequent layer print path has a parallel relationship with the first layer print path, and the path distance in each subsequent layer print path is consistent with the path distance of the first layer print path. It can be understood that the distance between the adjacent two layer print paths can be a preset distance, that is, the distance between the target height corresponding to the start position and the end position of the previous layer print path in the adjacent two layer print paths and the target height corresponding to the start position and the end position of the subsequent layer print path is the preset distance, and after controlling the target print head to move to the end position of the previous layer print path, the target print head needs to be controlled to move from the end position of the previous layer print path to the start position of the subsequent layer print path first, and then the target print head is controlled to print according to the subsequent layer print path.

[0146] Here, the way to determine the bottom print path can but not limited to refer to one or more of the above embodiments, and the way to determine the electric field application position can also refer to the corresponding embodiments, which will not be described in detail.

[0147] It should be noted that in the embodiments of the present application, stack printing can also realize line printing by controlling the target print head to move in a back-and-forth manner multiple times, that is, after controlling the target print head to move to the end position of the previous layer print path, the printing height of the target print head can be lifted by a preset distance, so that the printing height of the target print head is the target height corresponding to the start position of the subsequent layer print path, and then the target print head is controlled to print according to the subsequent layer print path, and the moving direction of the previous layer print path is completely opposite to the moving direction of the subsequent layer print path, and the path distance in the previous layer print path is consistent with the path distance of the subsequent layer print path.

[0148] As another option of the embodiments of the present application, after outputting the voltage signal corresponding to the voltage parameter to the target print head until the target print head moves to the end position, it further includes:

[0149] The substrate surface is destaticated by a deionizing fan, and the target print head is controlled to print lines according to the print path adjacent to the bottom print path.

[0150] Because the circuitry on the substrate easily carries unremoved charges during the layer printing process, to avoid the impact of these unremoved charges on the circuit printing process, a deionizing fan can be used to remove static electricity from the substrate surface after each layer of the target printing path has been completed. After the deionizing fan completes the static removal process, the target printhead can be raised to a preset distance (or the printing height corresponding to a single layer of the printing path) before continuing the circuit printing process according to the next layer. Here, the deionizing fan can be connected to the power supply mentioned above, but is not limited to this connection, and can be placed on a conductor stage with its airflow directed towards the substrate surface.

[0151] It is understood that the stacking height corresponding to the stacking printing in the embodiments of this application may be set in the range of 80-100 layers, and the aspect ratio corresponding to the stacking printing may be set in the range of 50-60, but is not limited to 50-60.

[0152] See also: Figure 6 The schematic diagram shown is of another thick film circuit printing apparatus provided in the embodiments of this application, as follows: Figure 6 As shown, the thick film circuit printing device may include a high-precision electronic 3D printer stage, a power supply, and a deionizing fan. The conductive print head of the high-precision electronic 3D printer stage may be connected to, but is not limited to, the positive terminal of the power supply. The conductive stage of the high-precision electronic 3D printer stage is connected to the negative terminal and the ground terminal of the power supply. A substrate is placed on the conductive stage to perform circuit printing on the substrate by controlling the movement of the conductive print head. A deionizing fan connected to the power supply may also be placed on the conductive stage for removing static electricity from the surface of the substrate.

[0153] For details on the connection method between the power supply and the conductive printhead and conductor stage, please refer to [link to relevant documentation]. Figure 7 The diagram shown illustrates the charge distribution of a thick-film circuit printing apparatus according to an embodiment of this application. Figure 7 As shown, when the positive terminal of the power supply is connected to the conductive printhead and the negative terminal is connected to the conductor stage (which is also connected to the ground terminal), multiple positive charges are distributed on the bottom of the conductive printhead; when the positive terminal of the power supply is connected to the conductor stage and the negative terminal is connected to the conductive printhead (which is also connected to the ground terminal), multiple positive charges are distributed on the surface of the conductor stage and the surface of the substrate fixed on the conductor stage.

[0154] In step 106, the target print head is controlled to perform line printing according to the printing path, and when the target print head moves to the electric field application position, a voltage signal corresponding to the voltage parameter is output to the target print head until the target print head moves to the end position.

[0155] Specifically, after the printing path and the corresponding electric field application position are determined, the target print head is controlled to perform line printing according to the printing path, and the target print head is controlled by the pneumatic to perform line printing in the initial stage; when the target print head moves to the electric field application position, a corresponding voltage signal is output to the target print head by the power supply, so that the needle-to-surface distance in the line printing process is gradually increased under the action of electric field assisted traction until the target print head moves to the target height corresponding to the end position.

[0156] It can be understood that after the target print head completes the line printing process, the voltage signal output to the target print head can be stopped first, and then the air pressure signal output to the target print head can be stopped, but not limited to this, so as to avoid additional power consumption.

[0157] In the embodiment of the present application, the line printing process is mainly controlled by the air pressure of the target print head, and the air pressure output has a greater influence on the line width of the line, and the introduced electric field force is only used to assist in pulling the printing material to the line position of the substrate, and the size of the voltage signal corresponding to the electric field force has a smaller influence on the line width of the line.

[0158] As another optional embodiment of the present application, before the target print head is controlled to perform line printing according to the printing path, the method further comprises:

[0159] The substrate is fixed on the conductor support, and the vertical distance between the surface of the substrate and the target print head is obtained by the distance measuring sensor; wherein the conductor support is connected with the target print head through the power supply, the conductor support is connected with the ground, and the distance measuring sensor is arranged on the conductor support;

[0160] When the vertical distance between the surface of the substrate and the target print head is inconsistent, the height of the conductor support is adjusted according to the difference between different vertical distances, so that the vertical distance between the surface of the substrate and the target print head is consistent.

[0161] In order to avoid the influence of the unevenness of the substrate on the printing precision and printing effect of the line, before the target print head is controlled to perform line printing according to the printing path, the vertical distance between the surface of the substrate and the target print head at multiple positions can be obtained by the distance measuring sensor. The distance measuring sensor can be arranged outside the target print head, or arranged on the plane where the target print head is located.

[0162] It can be understood that when the vertical distance between the substrate surface and the target print head is detected to be inconsistent, it indicates that the substrate is in an inclined state at this time, and then the height of the conductor carrier can be adjusted according to the difference between different vertical distances, for example, but not limited to, vertically lifting the substrate position corresponding to the larger vertical distance by a certain distance, which can be the difference between the larger vertical distance and the vertical distance corresponding to the adjacent substrate position, and is not limited thereto.

[0163] In addition, the real-time polar distance of the target print head in the line printing process can also be obtained through the distance measuring sensor, so as to effectively guarantee the stability of the introduced electric field force, and then the final printing effect of the line can be guaranteed.

[0164] As another optional embodiment of the present application, after outputting the voltage signal corresponding to the voltage parameter to the target print head until the target print head moves to the end position, the method further comprises:

[0165] Curing the printed line on the substrate.

[0166] Specifically, after the target print head completes the line printing process, the printed line can also be cured, and the curing method can be, but is not limited to, sintering the printed line by infrared laser, so as to effectively reduce the curing time of the oven.

[0167] Of course, after the printed line on the substrate is cured, in order to meet the subsequent packaging line requirements, the target print head can also be controlled to package the printed line after curing, and the width of the packaging line can be greater than the width of the printed line after curing, for example, the width of the packaging line can be controlled to be 5um.

[0168] Please refer to Figure 8 , Figure 8 A structure schematic diagram of a thick film line printing device provided by an embodiment of the present application is shown.

[0169] As Figure 8 shown, the thick film line printing device can at least include a parameter determination module 801, a path determination module 802, and a line printing module 803, wherein:

[0170] The parameter determination module 801 is configured to determine a target print head according to the line parameters of the substrate, and obtain a voltage parameter from the printing material configured by the target print head;

[0171] The path determination module 802 is configured to determine a printing path and an electric field application position based on the line position and the line parameters of the substrate; wherein the electric field application position is between the start position and the end position;

[0172] The line printing module 803 is configured to control the target printing head to perform line printing according to the printing path, and output a voltage signal corresponding to the voltage parameter to the target printing head when the target printing head moves to the electric field application position until the target printing head moves to the end position.

[0173] In some possible embodiments, the line parameter of the substrate includes a line width and a line material of the substrate.

[0174] The target printing head is determined according to the line parameter of the substrate, including:

[0175] The target inner diameter is calculated according to the line width of the substrate and a preset first coefficient.

[0176] The printing head with the needle inner diameter consistent with the target inner diameter is configured as the target printing head, and the target printing head is configured with the printing material consistent with the line material.

[0177] In some possible embodiments, the voltage parameter is obtained by the printing material configured by the target printing head, including:

[0178] When the printing material configured by the target printing head is the first material, the frequency parameter, the duty cycle parameter and the level parameter in the preset square wave voltage signal are configured as the voltage parameter.

[0179] When the printing material configured by the target printing head is the second material, the voltage value in the preset direct current voltage signal is configured as the voltage parameter.

[0180] In some possible embodiments, the line parameter of the substrate further includes a line thickness of the substrate.

[0181] The printing path and the electric field application position are determined based on the line position and the line parameter of the substrate, including:

[0182] When the ratio between the line thickness and the line width of the substrate is lower than a preset thickness-width ratio threshold, the two end positions in the line position of the substrate are respectively configured as the start position and the end position.

[0183] The height corresponding to the start position is calculated according to the line width of the substrate and a preset second coefficient.

[0184] The height corresponding to the end position is determined according to the line packaging requirement of the substrate, and the printing path is obtained by the height corresponding to the start position, the height corresponding to the end position and the line between the start position and the end position; wherein the height corresponding to the start position of the printing path is lower than the height corresponding to the end position.

[0185] The position with a straight line distance from the start position being a preset first distance in the printing path is configured as the electric field application position.

[0186] In some possible embodiments, the height corresponding to the end position is determined according to a circuit packaging requirement of the substrate, including:

[0187] When there is a circuit packaging requirement of the substrate, a preset first height is taken as the height corresponding to the end position; wherein the preset first height is higher than the height corresponding to the start position;

[0188] When there is no circuit packaging requirement of the substrate, a preset second height is taken as the height corresponding to the end position; wherein the preset second height is higher than the preset first height.

[0189] In some possible embodiments, after the height corresponding to the end position is determined according to the circuit packaging requirement of the substrate, further including:

[0190] A position in the circuit position of the substrate, which has a horizontal distance of a preset second distance from the start position, is taken as the electric field application position;

[0191] The printing path is obtained from the height corresponding to the start position, the height corresponding to the electric field application position, the line connecting the start position and the electric field application position, the height corresponding to the end position, and the line connecting the electric field application position and the end position.

[0192] In some possible embodiments, the printing path and the electric field application position are determined based on the circuit position of the substrate and the circuit parameter, further including:

[0193] When the ratio between the circuit thickness of the substrate and the circuit width of the substrate is lower than a preset thickness-width ratio threshold, a position in the specified area, which is on an extension line of one end of the circuit position of the substrate, is taken as the start position, one end of the circuit position of the substrate is taken as the transition position, and the other end of the circuit position of the substrate is taken as the end position;

[0194] The height corresponding to the start position is calculated according to the circuit width of the substrate and a preset second coefficient, and the height corresponding to the start position is taken as the height corresponding to the transition position;

[0195] A position in the line connecting the start position and the transition position, which has a horizontal distance of a preset second distance from the start position, is taken as the electric field application position;

[0196] The printing path is obtained from the height corresponding to the start position, the height corresponding to the electric field application position, the line connecting the start position and the electric field application position, the height corresponding to the transition position, the line connecting the electric field application position and the transition position, the height corresponding to the end position, and the line connecting the electric field application position and the end position.

[0197] In some possible embodiments, the determining the printing path and the electric field application position based on the line position of the substrate and the line parameter further comprises:

[0198] When the ratio between the line thickness of the substrate and the line width of the substrate is higher than or equal to a preset thickness-width ratio threshold, the printing path layer number is determined according to the line thickness of the substrate;

[0199] The two end positions in the line position of the substrate are respectively taken as the start position and the end position of the bottom layer printing path;

[0200] The height corresponding to the start position is calculated according to the line width of the substrate and a preset second coefficient;

[0201] The height corresponding to the end position is determined according to the line packaging requirement of the substrate, and the printing path is obtained from the height corresponding to the start position, the height corresponding to the end position, the line segment between the start position and the end position, and the printing path layer number;

[0202] The position in the bottom layer printing path of the printing path, which has a linear distance of a preset first distance from the start position, is taken as the electric field application position.

[0203] In some possible embodiments, after the voltage signal corresponding to the voltage parameter is output to the target print head until the target print head moves to the end position, the method further comprises:

[0204] The surface of the substrate is subjected to static electricity removal treatment based on a deionization fan, and the target print head is controlled to perform line printing treatment according to the printing path adjacent to the bottom layer printing path in the printing path.

[0205] In some possible embodiments, before the target print head is controlled to perform line printing treatment according to the printing path, the method further comprises:

[0206] The substrate is fixed on a conductor support, and the vertical distance between the surface of the substrate and the target print head is obtained by a distance measuring sensor; wherein the conductor support and the target print head are connected through a power supply, the conductor support is connected with a ground end, and the distance measuring sensor is arranged on the conductor support;

[0207] When the vertical distances between the surface of the substrate and the target print head are inconsistent, the height of the conductor support is adjusted according to the difference between the different vertical distances, so that the vertical distances between the surface of the substrate and the target print head are consistent.

[0208] In some possible embodiments, after the voltage signal corresponding to the voltage parameter is output to the target print head until the target print head moves to the end position, the method further comprises:

[0209] The printed line on the substrate is subjected to curing treatment.

[0210] In some possible embodiments, after obtaining the voltage parameter of the printing material configured by the target print head, the method further comprises:

[0211] When the viscosity of the printing material configured by the target print head is lower than a preset viscosity threshold, determining a printing path based on the line position of the substrate and the line parameter, wherein a starting position of the printing path corresponds to a height lower than a height corresponding to an ending position.

[0212] Outputting a voltage signal corresponding to the voltage parameter to the target print head, and controlling the target print head to move according to the printing path until the target print head moves from the starting position to the ending position.

[0213] Referring to Figure 9 , Figure 9 a structure schematic diagram of another thick film line printing device is shown.

[0214] As Figure 9 shown, the thick film line printing device 900 can include at least one processor 901, at least one network interface 904, a user interface 903, a memory 905, and at least one communication bus 902.

[0215] The communication bus 902 can be used to realize the connection and communication of the above-mentioned components.

[0216] The user interface 903 can include a key, and the optional user interface can further include a standard wired interface, a wireless interface.

[0217] The network interface 904 can include, but is not limited to, a Bluetooth module, an NFC module, a Wi-Fi module, etc.

[0218] The processor 901 can include one or more processing cores. The processor 901 connects various parts in the thick film line printing device 900 through various interfaces and lines, executes instructions, programs, code sets or instruction sets stored in the memory 905, and calls data stored in the memory 905, to perform various functions of the thick film line printing device 900 and process data. Optionally, the processor 901 can be implemented in at least one of the hardware forms of DSP, FPGA, and PLA. The processor 901 can integrate one or several combinations of CPU, GPU, and modem. The CPU is mainly used to process the operating system, user interface, and application programs, etc.; the GPU is used to render and draw the content to be displayed on the display screen; and the modem is used to process wireless communication. It can be understood that the above-mentioned modem can also not be integrated into the processor 901, but can be realized by a separate chip.

[0219] The memory 905 can include a RAM and can also include a ROM. Optionally, the memory 905 includes a non-transitory computer-readable medium. The memory 905 can be used to store instructions, programs, codes, code sets, or instruction sets. The memory 905 can include a program storage area and a data storage area, where the program storage area can store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playing function, an image playing function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area can store data involved in the above-mentioned various method embodiments, etc. The memory 905 can also be at least one storage device located away from the aforementioned processor 901. As shown in Figure 9 The memory 905 as a computer storage medium can include an operating system, a network communication module, a user interface module, and a thick film circuit printing application program.

[0220] Specifically, the processor 901 can be used to invoke the thick film circuit printing application program stored in the memory 905, and specifically perform the following operations:

[0221] According to the line parameters of the substrate, a target print head is determined, and a voltage parameter is obtained from the printing material configured by the target print head;

[0222] Based on the line position and the line parameters of the substrate, a printing path and an electric field application position are determined; the electric field application position is between a starting position and an ending position;

[0223] The target print head is controlled to perform line printing processing according to the printing path, and when the target print head moves to the electric field application position, a voltage signal corresponding to the voltage parameter is output to the target print head until the target print head moves to the ending position.

[0224] In some possible embodiments, the line parameters of the substrate include a line width and a line material of the substrate;

[0225] According to the line parameters of the substrate, a target print head is determined, including:

[0226] According to the line width of the substrate and a preset first coefficient, a target inner diameter is calculated;

[0227] The print head with the needle inner diameter consistent with the target inner diameter is taken as the target print head, and the target print head is configured with the printing material consistent with the line material.

[0228] In some possible embodiments, the voltage parameter is obtained from the printing material configured by the target print head, including:

[0229] When the printing material configured by the target print head is the first material, the frequency parameter, the duty cycle parameter and the level parameter in the preset square wave voltage signal are taken as the voltage parameter;

[0230] When the printing material configured by the target print head is the second material, the voltage value in the preset direct current voltage signal is taken as the voltage parameter.

[0231] In some possible embodiments, the line parameter of the substrate further includes a line thickness of the substrate;

[0232] Based on the line position and the line parameter of the substrate, a printing path and an electric field application position are determined, including:

[0233] When the ratio between the line thickness of the substrate and the line width of the substrate is lower than a preset thickness-width ratio threshold, two end positions in the line position of the substrate are respectively taken as a start position and an end position;

[0234] According to the line width of the substrate and a preset second coefficient, a height corresponding to the start position is calculated;

[0235] According to a line packaging requirement of the substrate, a height corresponding to the end position is determined, and a printing path is obtained from the height corresponding to the start position, the height corresponding to the end position and a line segment between the start position and the end position; wherein the height corresponding to the start position of the printing path is lower than the height corresponding to the end position.

[0236] A position in the printing path with a straight line distance from the start position being a preset first distance is taken as the electric field application position.

[0237] In some possible embodiments, according to the line packaging requirement of the substrate, the height corresponding to the end position is determined, including:

[0238] When the line packaging requirement of the substrate exists, a preset first height is taken as the height corresponding to the end position; wherein the preset first height is higher than the height corresponding to the start position.

[0239] When the line packaging requirement of the substrate does not exist, a preset second height is taken as the height corresponding to the end position; wherein the preset second height is higher than the preset first height.

[0240] In some possible embodiments, after the height corresponding to the end position is determined according to the line packaging requirement of the substrate, the method further includes:

[0241] A position in the line position of the substrate with a horizontal distance from the start position being a preset second distance is taken as the electric field application position.

[0242] The printing path is obtained according to the height corresponding to the starting point position, the height corresponding to the electric field application position, the line connecting the starting point position and the electric field application position, the height corresponding to the ending point position, and the line connecting the electric field application position and the ending point position.

[0243] In some possible embodiments, the printing path and the electric field application position are determined based on the line position of the substrate and the line parameter, and the method further includes:

[0244] When the ratio between the line thickness of the substrate and the line width of the substrate is lower than a preset thickness-width ratio threshold, a position on an extension line of one end of the line position of the substrate is taken as the starting point position, one end of the line position of the substrate is taken as the transition position, and the other end of the line position of the substrate is taken as the ending point position;

[0245] The height corresponding to the starting point position is calculated according to the line width of the substrate and a preset second coefficient, and the height corresponding to the starting point position is taken as the height corresponding to the transition position;

[0246] A position in the line connecting the starting point position and the transition position, which has a horizontal distance of a preset second distance from the starting point position, is taken as the electric field application position;

[0247] The printing path is obtained according to the height corresponding to the starting point position, the height corresponding to the electric field application position, the line connecting the starting point position and the electric field application position, the height corresponding to the transition position, the line connecting the electric field application position and the transition position, the height corresponding to the ending point position, and the line connecting the electric field application position and the ending point position.

[0248] In some possible embodiments, the printing path and the electric field application position are determined based on the line position of the substrate and the line parameter, and the method further includes:

[0249] When the ratio between the line thickness of the substrate and the line width of the substrate is higher than or equal to a preset thickness-width ratio threshold, the number of layers of the printing path is determined according to the line thickness of the substrate;

[0250] Two end positions in the line position of the substrate are respectively taken as the starting point position and the ending point position of the bottom layer printing path;

[0251] The height corresponding to the starting point position is calculated according to the line width of the substrate and a preset second coefficient;

[0252] The height corresponding to the ending point position is determined according to the line packaging requirement of the substrate, and the printing path is obtained according to the height corresponding to the starting point position, the height corresponding to the ending point position, the line connecting the starting point position and the ending point position, and the number of layers of the printing path;

[0253] The position in the bottom print path of the print path, which has a straight-line distance from the start position to the position of a preset first distance, is taken as the electric field application position.

[0254] In some possible embodiments, after outputting the voltage signal corresponding to the voltage parameter to the target print head until the target print head moves to the end position, the method further includes:

[0255] The substrate surface is subjected to static electricity removal treatment based on a deionization fan, and the target print head is controlled to perform line printing treatment according to a print path adjacent to the bottom print path in the print path.

[0256] In some possible embodiments, before controlling the target print head to perform line printing treatment according to the print path, the method further includes:

[0257] The substrate is fixed on a conductor support, and a vertical distance between the substrate surface and the target print head is obtained by a distance measuring sensor; wherein the conductor support is connected to a power supply between the conductor support and the target print head, the conductor support is connected to a ground terminal, and the distance measuring sensor is arranged on the conductor support.

[0258] When the vertical distance between the substrate surface and the target print head is inconsistent, the height of the conductor support is adjusted according to the difference between different vertical distances, so that the vertical distance between the substrate surface and the target print head is consistent.

[0259] In some possible embodiments, after outputting the voltage signal corresponding to the voltage parameter to the target print head until the target print head moves to the end position, the method further includes:

[0260] The printed line on the substrate is subjected to curing treatment.

[0261] In some possible embodiments, after obtaining the voltage parameter from the print material configured by the target print head, the method further includes:

[0262] When the viscosity of the print material configured by the target print head is lower than a preset viscosity threshold, a print path is determined based on the line position of the substrate and the line parameter; wherein the start position of the print path corresponds to a height lower than the height corresponding to the end position.

[0263] The voltage signal corresponding to the voltage parameter is output to the target print head, and the target print head is controlled to move according to the print path until the target print head moves from the start position to the end position.

[0264] The application further provides a computer readable storage medium, which stores a computer program. The computer program is executed by a processor to implement the steps of the method. The computer readable storage medium can include, but is not limited to, any type of disk, including a floppy disk, an optical disk, a DVD, a CD-ROM, a micro drive, and a magneto-optical disk, a ROM, a RAM, an EPROM, an EEPROM, a DRAM, a VRAM, a flash memory device, a magnetic card or an optical card, a nano system (including a molecular memory IC), or any type of medium or device suitable for storing instructions and / or data.

[0265] It should be noted that, for the foregoing method embodiments, in order to simply describe, they are all described as a combination of a series of actions, but those skilled in the art should know that the present application is not limited to the order of the actions described, because according to the present application, certain steps can be performed in other order or simultaneously. Secondly, those skilled in the art should know that the embodiments described in the specification all belong to preferred embodiments, and the actions and modules involved are not necessarily necessary for the present application.

[0266] In the above embodiments, the description of each embodiment is focused on, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0267] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented by other means. For example, the device embodiments described above are only illustrative, and the division of units is only a logical function division, and actual implementation can have another division manner, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some service interface, device or unit, which can be electrical or other forms.

[0268] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.

[0269] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can exist physically, or two or more units can be integrated in one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

Claims

1. A method for printing thick-film circuits, characterized in that, include: The target printhead is determined based on the circuit parameters of the substrate, and the voltage parameters are obtained from the printing material configured for the target printhead. The target printhead uses pneumatic printing. Based on the circuit positions and circuit parameters of the substrate, the printing path and the electric field application position are determined; wherein, the electric field application position is located between the start position and the end position of the printing path, and the height corresponding to the start position is lower than the height corresponding to the end position; The target print head is controlled to perform line printing according to the printing path, and when the target print head moves to the position where the electric field is applied, a voltage signal corresponding to the voltage parameter is output to the target print head until the target print head moves to the endpoint position.

2. The method according to claim 1, characterized in that, The circuit parameters of the substrate include the circuit width and circuit material. Determining the target printhead based on the circuit parameters of the substrate includes: The target inner diameter is calculated based on the line width of the substrate and a preset first coefficient. A print head with the same inner diameter as the target inner diameter is used as the target print head, and the target print head is equipped with printing material that is the same as the circuit material.

3. The method according to claim 1, characterized in that, The voltage parameters obtained from the printing material configured by the target printhead include: When the printing material configured for the target printhead is the first material, the frequency parameter, duty cycle parameter, and level parameter in the preset square wave voltage signal are used as the voltage parameter. When the printing material configured for the target printhead is the second material, the voltage parameter in the preset DC voltage signal is used as the voltage parameter.

4. The method according to claim 2, characterized in that, The circuit parameters of the substrate also include the circuit thickness of the substrate. The determination of the printing path and electric field application location based on the circuit positions and parameters of the substrate includes: When the ratio between the line thickness and the line width of the substrate is lower than a preset thickness-to-width ratio threshold, the two ends of the line position on the substrate are respectively taken as the start position and the end position. The height corresponding to the starting position is calculated based on the line width of the substrate and a preset second coefficient. The height corresponding to the endpoint position is determined according to the circuit packaging requirements of the substrate, and the printing path is obtained from the height corresponding to the starting position, the height corresponding to the endpoint position, and the line connecting the starting position and the endpoint position. The position in the printing path that is a preset first distance from the starting position is taken as the position where the electric field is applied.

5. The method according to claim 4, characterized in that, Determining the height corresponding to the endpoint position based on the circuit packaging requirements of the substrate includes: When there is a circuit packaging requirement for the substrate, a preset first height is used as the height corresponding to the endpoint position; wherein, the preset first height is higher than the height corresponding to the starting position. When there is no circuit packaging requirement for the substrate, a preset second height is used as the height corresponding to the endpoint position; wherein, the preset second height is higher than the preset first height.

6. The method according to claim 2, characterized in that, The circuit parameters of the substrate also include the circuit thickness of the substrate. The determination of the printing path and electric field application location based on the circuit positions and parameters of the substrate includes: When the ratio between the line thickness and the line width of the substrate is lower than a preset thickness-to-width ratio threshold, the two ends of the line position on the substrate are respectively taken as the start position and the end position. The height corresponding to the starting position is calculated based on the line width of the substrate and a preset second coefficient. The height corresponding to the endpoint position is determined according to the circuit packaging requirements of the substrate, and the position in the circuit position of the substrate with a horizontal distance of a preset second distance from the starting position is taken as the electric field application position. The printing path is obtained from the height corresponding to the starting position, the height corresponding to the electric field application position, the line connecting the starting position and the electric field application position, the height corresponding to the ending position, and the line connecting the electric field application position and the ending position.

7. The method according to claim 2, characterized in that, The circuit parameters of the substrate also include the circuit thickness of the substrate. The determination of the printing path and electric field application location based on the circuit positions and parameters of the substrate includes: When the ratio between the line thickness and the line width of the substrate is lower than a preset thickness-to-width ratio threshold, the position on the extension line of one end of the line position of the substrate in the specified area is taken as the starting position, the position of one end of the line position of the substrate is taken as the transition position, and the position of the other end of the line position of the substrate is taken as the ending position. Based on the line width of the substrate and a preset second coefficient, the height corresponding to the starting position is calculated, and the height corresponding to the starting position is used as the height corresponding to the transition position. The position where the horizontal distance between the starting position and the transition position and the starting position is a preset second distance is taken as the electric field application position. The printing path is obtained from the height corresponding to the starting position, the height corresponding to the electric field application position, the line connecting the starting position and the electric field application position, the height corresponding to the transition position, the line connecting the electric field application position and the transition position, the height corresponding to the ending position, and the line connecting the electric field application position and the ending position.

8. The method according to claim 4, characterized in that, The step of determining the printing path and electric field application location based on the line positions and line parameters of the substrate further includes: When the ratio between the line thickness and the line width of the substrate is higher than or equal to the preset thickness-to-width ratio threshold, the number of printing path layers is determined based on the line thickness of the substrate. The two ends of the circuit positions on the substrate are respectively used as the start and end points of the bottom layer printing path. The height corresponding to the starting position is calculated based on the line width of the substrate and the preset second coefficient. The height corresponding to the endpoint position is determined according to the circuit packaging requirements of the substrate, and the printing path is obtained from the height corresponding to the starting position, the height corresponding to the endpoint position, the line connecting the starting position and the endpoint position, and the number of printing path layers. The position in the bottom layer of the printing path that is a straight-line distance from the starting position to the position of the electric field is taken as the position where the electric field is applied.

9. The method according to claim 8, characterized in that, After outputting a voltage signal corresponding to the voltage parameter to the target printhead until the target printhead moves to the endpoint position, the method further includes: The substrate surface is destaticated by a deionizing fan, and the target print head is controlled to perform line printing according to the printing path adjacent to the bottom layer printing path.

10. The method according to claim 1, characterized in that, Before controlling the target printhead to perform line printing according to the printing path, the method further includes: The substrate is fixed on a conductor platform, and the vertical distance between the substrate surface and the target printhead is obtained by a ranging sensor; wherein, an electric field is formed between the conductor platform and the target printhead through a power supply, the conductor platform is connected to a ground terminal, and the ranging sensor is disposed on the conductor platform; When the vertical distance between the substrate surface and the target printhead is inconsistent, the height of the conductor stage is adjusted according to the difference between the different vertical distances so that the vertical distance between the substrate surface and the target printhead is consistent.

11. The method according to claim 1, characterized in that, After outputting a voltage signal corresponding to the voltage parameter to the target printhead until the target printhead moves to the endpoint position, the method further includes: The printed lines on the substrate are then cured.

12. The method according to claim 1, characterized in that, After the printing material configured by the target printhead obtains the voltage parameters, the process further includes: When the viscosity of the printing material configured on the target printhead is lower than a preset viscosity threshold, a printing path is determined based on the circuit position of the substrate and the circuit parameters; wherein the height corresponding to the starting position of the printing path is lower than the height corresponding to the ending position. A voltage signal corresponding to the voltage parameter is output to the target print head, and the target print head is controlled to move along the printing path until the target print head moves from the starting position to the ending position.

13. A thick-film circuit printing apparatus, characterized in that, include: The parameter determination module is used to determine the target printhead based on the circuit parameters of the substrate, and to obtain the voltage parameters from the printing material configured for the target printhead. The target printhead uses pneumatic printing. The path determination module is used to determine the printing path and the electric field application position based on the line position and the line parameters of the substrate; wherein the electric field application position is located between the start position and the end position of the printing path, and the height corresponding to the start position is lower than the height corresponding to the end position. The line printing module is used to control the target print head to perform line printing processing according to the printing path, and when the target print head moves to the electric field application position, it outputs a voltage signal corresponding to the voltage parameter to the target print head until the target print head moves to the endpoint position.

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