Motherboard and computing device

Abstract

Embodiments of the present application provide a mainboard and a computing device. The mainboard comprises a control unit, a connecting unit and a device to be cooled, and the connecting unit comprises a first connector. The control unit is configured to generate a first control signal according to a received first indication signal and / or generate a second control signal according to a received second indication signal, the first indication signal and the second indication signal being different signals, the first indication signal indicating that the connecting unit is connected with a first heat sink, and the second indication signal indicating that the connecting unit is connected with a second heat sink. The connecting unit is connected with the control unit and a cooling unit, the cooling unit comprising the first heat sink and / or the second heat sink, the first heat sink and the second heat sink being different types of heat sinks. The connecting unit is configured to send the first control signal generated by the control unit to the first heat sink and / or send the second control signal generated by the control unit to the second heat sink, so as to control the first heat sink and / or the second heat sink to cool the device to be cooled.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and in particular to a mainboard and a computing device. BACKGROUND

[0002] The mainboard, also known as a control board, a main function board, etc., is used to realize the functional requirements of a terminal.

[0003] In the running process of the terminal, the heat generating components on the mainboard generate heat. In order to ensure that the temperature of the heat generating components is within a predetermined range, in the related art, a fan connector and a fan are provided on the mainboard. The fan is electrically connected to the controller on the mainboard through the fan connector, and the fan is used to dissipate heat from the heat generating components. However, the heat dissipation mode of the mainboard is single, which results in low heat dissipation capacity of some heat generating components, and cannot meet the use requirements of users.

[0004] Therefore, how to improve the heat dissipation capacity of the mainboard becomes a problem to be solved. SUMMARY

[0005] The embodiments of the present application provide a mainboard and a computer device, which can dissipate heat from the heat generating components through different types of heat sinks, and improve the heat dissipation capacity.

[0006] The embodiments of the present application provide a mainboard, which comprises a control unit, a connection unit and a heat generating component to be cooled; the control unit is connected to the connection unit; the connection unit comprises a first connector;

[0007] The connection unit is further used to connect a heat dissipation unit; the heat dissipation unit is used to dissipate heat from the heat generating component to be cooled; wherein; the heat dissipation unit comprises a first heat sink and / or a second heat sink; the first heat sink and the second heat sink are different types of heat sinks;

[0008] The control unit is used to generate a first control signal according to a received first indication signal, and / or generate a second control signal according to a received second indication signal; wherein, the first indication signal is used to indicate that the connection unit is connected to the first heat sink; the second indication signal is used to indicate that the connection unit is connected to the second heat sink; the first indication signal is different from the second indication signal;

[0009] The connection unit is used to send the first control signal to the first heat sink and / or send the second control signal to the second heat sink, so as to control the first heat sink and / or the second heat sink to dissipate heat from the heat generating component to be cooled.

[0010] The mainboard provided in the application, when the first heat sink is connected with the connecting unit, the first heat sink is used to dissipate heat from the device to be cooled, when the second heat sink is connected with the connecting unit, the second heat sink is used to dissipate heat from the device to be cooled, and the first heat sink and the second heat sink are different types of heat sinks, so that the device to be cooled can be cooled by different types of heat sinks, and the heat dissipation capacity of the mainboard is improved.

[0011] Optionally, the first connector comprises a control signal port, a multiplexing port, a power supply port and a ground port.

[0012] The control signal port is used to send a first pulse width modulation signal in the first control signal of the control unit to the first heat sink, or send the second control signal to the second heat sink.

[0013] The multiplexing port is used to send a second pulse width modulation signal in the first control signal of the control unit to the first heat sink, or send a detection signal of the second heat sink to the control unit; the power supply port and the ground port are connected with a power supply and a ground, respectively.

[0014] The mainboard provided in the embodiment comprises a first connector, a first pulse width modulation signal in a first control signal is sent to a first heat sink through a control signal port of the first connector, and a second pulse width modulation signal in the first control signal is sent to the first heat sink through a multiplexing port of the first connector, so that the first heat sink dissipates heat from a device to be cooled, and a second control signal can also be sent to the first heat sink through the control signal port of the first connector, so that the second heat sink dissipates heat from the device to be cooled.

[0015] Optionally, the first connector further comprises an indication signal port; the indication signal port is used to send a first indication signal of the first heat sink to the control unit.

[0016] The first connector in the mainboard provided in the embodiment comprises an indication signal port, the indication signal port can receive a first indication signal of the first heat sink and send the first indication signal to the control unit, so that the control unit generates a first control signal according to the first indication signal to control the first heat sink to dissipate heat.

[0017] Optionally, the mainboard further comprises a direction control unit.

[0018] The direction control unit is connected to a line connected with the multiplexing port; a first end of the direction control unit is connected with the first connector, a second end of the direction control unit is connected with the control unit; a third end of the direction control unit is used to receive the first indication signal; the direction control unit is used to change the signal transmission direction of the line according to the first indication signal.

[0019] The mainboard provided by the embodiment comprises a direction control unit, and the direction control is used for changing the signal transmission direction of a line according to a first indication signal, so that a first control signal can be sent to a first radiator and a second indication signal can be sent to the control unit through a multiplexing port of a first connector.

[0020] Optionally, the mainboard further comprises a signal controller, a first end of the signal controller is connected with the control unit, a second end of the signal controller is connected with a power module, and a third end of the signal controller is grounded; the signal controller is used for generating the first indication signal or the second indication signal.

[0021] The mainboard provided by the embodiment comprises a signal controller, the signal controller is used for generating a first indication signal when a first radiator is connected with a first connector, and generating a second indication signal when a second radiator is connected with the first connector.

[0022] Optionally, the connection unit comprises at least two first connectors; at least one first connector is connected with the first radiator, and the rest of the first connectors are connected with the second radiator.

[0023] The connection unit in the mainboard provided by the embodiment comprises at least two first connectors, and a part of the first connectors are connected with the first radiator, and the other part of the first connectors are connected with the second radiator, so that the first radiator and the second radiator can be used to simultaneously radiate a device to be radiated.

[0024] Optionally, the first indication signal is a high level, and the second indication signal is a high resistance or a low level.

[0025] The first indication signal and the second indication signal are different signals in the mainboard provided by the embodiment, so that the control unit can generate different control signals, and then different radiators can be controlled to radiate the device to be radiated.

[0026] Another mainboard is provided by the embodiment, the mainboard comprises a control unit, a connection unit and a device to be radiated; the control unit is connected with the connection unit; the connection unit comprises at least two second connectors;

[0027] The connection unit is further used for connecting a radiating unit; the radiating unit is used for radiating the device to be radiated; the radiating unit comprises a first radiator;

[0028] Two second connectors in the at least two second connectors are used for connecting the first radiator;

[0029] The control unit is configured to generate a first control signal according to a received indication signal; wherein the indication signal is generated by the first heat sink; and the indication signal is used to indicate that the first heat sink is connected with the connection unit;

[0030] The connection unit is configured to send the first control signal to the first heat sink, so as to control the first heat sink to dissipate heat for the device to be cooled.

[0031] The mainboard provided by the embodiment of the present application can connect the first heat sink through two second connectors, so that the first heat sink can dissipate heat for the device to be cooled, and the heat dissipation capacity of the mainboard is improved.

[0032] Optionally, the second connector comprises a control signal port, a multiplexing port, a power supply port and a ground port.

[0033] The control signal ports of the two second connectors are respectively configured to send a first pulse width modulation signal and a second pulse width modulation signal in the first control signal of the control unit to the first heat sink; the multiplexing ports of the two second connectors are configured to send the first indication signal of the first heat sink to the control unit; and the power supply ports and the ground ports of the two second connectors are respectively connected with a power supply and a ground terminal.

[0034] The mainboard provided by the embodiment of the present application can receive the first indication signal sent by the first heat sink through the detection signal ports of the two second connectors in the mainboard, generate a first control signal according to the first indication signal, and send the first control signal to the first heat sink through the control signal ports of the two second connectors, so that the first heat sink can dissipate heat for the device to be cooled.

[0035] Optionally, the heat dissipation unit further comprises a second heat sink; wherein the first heat sink and the second heat sink are different types of heat sinks.

[0036] The connection unit comprises three second connectors; wherein one second connector is configured to be connected with the second heat sink; the control signal port is configured to send a second control signal of the control unit to the second heat sink; the multiplexing port is configured to send a detection signal of the second heat sink to the control unit; and the power supply port and the ground port are respectively connected with a power supply and a ground terminal.

[0037] The mainboard provided by the embodiment of the present application can connect the first heat sink through two second connectors in the mainboard, and connect the second heat sink through the remaining second connectors, so that the first heat sink and the second heat sink can dissipate heat for the device to be cooled.

[0038] The embodiment of the present application further provides a computing device comprising the mainboard and the heat dissipation unit; the heat dissipation unit comprises the first heat dissipator and / or the second heat dissipator; the mainboard is connected with the heat dissipation unit; and the heat dissipation unit is used for dissipating heat for the device to be cooled on the mainboard.

[0039] Optionally, the first heat dissipator comprises a semiconductor refrigerator control unit and a semiconductor refrigerator; the semiconductor refrigerator control unit comprises a first indication signal output port, a first pulse width modulation signal input port, a second pulse width modulation signal input port, a power supply port, a grounding port, a first output port and a second output port.

[0040] The first pulse width modulation signal input port is connected with a control signal port; and the first pulse width modulation signal input port is used for receiving a first pulse width modulation signal.

[0041] The second pulse width modulation signal input port is connected with a second pulse width modulation signal port; and the second pulse width modulation signal input port is used for receiving a second pulse width modulation signal.

[0042] The power supply port is used for connecting a power supply.

[0043] The grounding port is used for grounding.

[0044] The first output port and the second output port are connected with the semiconductor refrigerator; and the first output port and the second output port are used for outputting signals for controlling the semiconductor refrigerator.

[0045] Optionally, the first indication signal output port is connected with an indication signal port of the first connector; and the first indication signal output port is used for sending the first indication signal.

[0046] The embodiment of the present application further provides a computing device comprising the mainboard and the heat dissipation unit; the heat dissipation unit comprises the first heat dissipator; the mainboard is connected with the heat dissipation unit; and the heat dissipation unit is used for dissipating heat for the device to be cooled on the mainboard.

[0047] Optionally, the first heat dissipator comprises a semiconductor refrigerator control unit and a semiconductor refrigerator; the semiconductor refrigerator control unit comprises a first indication signal output port, a first pulse width modulation signal input port, a second pulse width modulation signal input port, a power supply port, a grounding port, a first output port and a second output port.

[0048] The first indication signal output port is connected with a multiplexing port of two second connectors respectively; and the first indication signal output port is used for sending the first indication signal.

[0049] The first pulse width modulation signal input port is connected with a control signal port of a second connector; the first pulse width modulation signal input port is used for receiving a first pulse width modulation signal;

[0050] The second pulse width modulation signal input port is connected with a control signal port of another second connector; the second pulse width modulation signal input port is used for receiving a second pulse width modulation signal;

[0051] The power supply port is used for connecting a power supply;

[0052] The ground port is used for grounding;

[0053] The first output port and the second output port are connected with the semiconductor refrigerator; the first output port and the second output port are used for outputting signals for controlling the semiconductor refrigerator.

[0054] The mainboard provided in the application comprises a control unit, a connecting unit and a device to be cooled, and the connecting unit comprises a first connector. The control unit is used for generating a first control signal according to a received first indication signal and / or generating a second control signal according to a received second indication signal, the first indication signal and the second indication signal are different indication signals, the first indication signal is used for indicating that the connecting unit is connected with a first heat sink, and the second indication signal is used for indicating that the connecting unit is connected with a second heat sink. The connecting unit is connected with the control unit and a heat dissipation unit, the heat dissipation unit comprises the first heat sink and / or the second heat sink, and the first heat sink and the second heat sink are different kinds of heat sinks. The connecting unit is used for sending the first control signal generated by the control unit to the first heat sink and / or sending the second control signal generated by the control unit to the second heat sink, so as to control the first heat sink and / or the second heat sink to cool the device to be cooled. BRIEF DESCRIPTION OF DRAWINGS

[0055] Figure 1 is a schematic diagram of a computing device provided by an embodiment of the application;

[0056] Figure 2 is a schematic diagram of a computing device provided by an embodiment of the application;

[0057] Figure 3 is a schematic diagram of a computing device provided by an embodiment of the application;

[0058] Figure 4 is a schematic diagram of a computing device provided by an embodiment of the application;

[0059] Figure 5 is a schematic diagram of a computing device provided by an embodiment of the application;

[0060] Figure 6is a schematic diagram of a computing device provided by an embodiment of the present application;

[0061] Figure 7 is a schematic diagram of another computing device provided by an embodiment of the present application;

[0062] Figure 8 is a schematic diagram of another computing device provided by an embodiment of the present application;

[0063] Figure 9 is a schematic diagram of another computing device provided by an embodiment of the present application.

[0064] These and other aspects, implementations, and advantages of the example embodiments will become apparent from the detailed description and accompanying drawings, which follow below. It should be understood, however, that the description and drawings are intended to illustrate and not define the application. The other aspects and advantages of the application will become apparent from the following description, which, taken in conjunction with the accompanying drawings, will show that various embodiments of the application can be implemented and carried out in various ways. DETAILED DESCRIPTION

[0065] The terms used in the implementation part of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application.

[0066] For ease of understanding, first, the related technical terms involved in the embodiments of the present application are explained and described.

[0067] A semiconductor refrigeration sheet (Thermo Electric Cooler, TEC), also known as a semiconductor refrigerator, is made of semiconductor materials using the Peltier effect. Among them, the Peltier effect refers to the phenomenon that one end absorbs heat and the other end releases heat when a direct current passes through an electric couple composed of two kinds of semiconductor materials.

[0068] Pulse Width Modulation (PWM): A pulse train with equal pulse width is used as a PWM waveform. By modulating the period of the pulse train or changing the pulse width or duty cycle, etc., the function of the target body is modulated.

[0069] Pulse Width Modulation voltage regulator (PWM Voltage Regulator): It is an analog control method. According to the change of the corresponding load, through the input PWM wave, the bias of the transistor base or MOS tube gate is modulated, so as to realize the change of the conduction time of the transistor or MOS tube, and realize the change of the output of the switching power supply.

[0070] PWM fan speed regulation: through PWM pulse width duty cycle, control fan voltage in 0-100% adjustment, so as to adjust the purpose of fan speed.

[0071] VCC, is the abbreviation of Volt Current Condenser, is the power supply voltage of the circuit.

[0072] For the terminal such as server, test equipment, computer or industrial control device, the terminal is built-in mainboard, and the mainboard is used to realize the corresponding requirements, for example, for the server, the mainboard can realize the corresponding computing requirements, or for the computer, the user's use requirements can be executed, or for the test equipment, the corresponding test requirements can be executed, or for the industrial control device, the equipment with the industrial control device can work normally.

[0073] Among them, for different types of terminals, the mainboard can also be called control board, temperature control board or main function board, server mainboard and the like. The mainboard generates heat during work, and a heat dissipation member is usually arranged on the mainboard for heat dissipation. In the related technology, the connector connected with the heat dissipation member can only connect one type of heat dissipation member, for example, the connector is specially used for connecting the fan, or the connector is specially used for connecting the semiconductor refrigeration assembly. At this time, only one type of heat dissipation member exists on the mainboard, and the heat dissipation amount of each heat dissipation device is different, and the heat dissipation requirement is also different. Since the type of heat dissipation member that can be connected by the connector on the mainboard is fixed, the heat dissipation capacity of each heat dissipation device is basically the same, for the heat dissipation device with small heat dissipation amount, there is the problem of excessive heat dissipation, and for the heat dissipation device with high heat dissipation amount, the heat dissipation requirement cannot be met. Therefore, the heat dissipation mode of the mainboard is single, which leads to low heat dissipation capacity of the mainboard, and further limits the application range of the mainboard, which cannot meet different use requirements.

[0074] In addition, since the type of heat dissipation member that can be connected by the connector is fixed, for different heat dissipation requirements, the mainboard needs to be redesigned, which leads to the increase of the cost of the server.

[0075] Therefore, the mainboard provided in the embodiments of the present application can be cooled by different types of heat sinks, meet the cooling requirements of different devices to be cooled, improve the cooling capacity of the mainboard and the application range of the mainboard.

[0076] Therefore, the mainboard provided in the embodiments of the present application can be cooled by different types of heat sinks, meet the cooling requirements of different devices to be cooled, improve the cooling capacity of the mainboard and the application range of the mainboard.

[0077] It should be noted that in the embodiments of the present application, the first indication signal and the second indication signal are different, the first indication signal can be a high level, and the second indication signal can be a high resistance or a low level, which is not limited in the present application. The first heat sink can be a Thermo Electric Cooler (TEC), and the second heat sink can be a fan.

[0078] The mainboard provided in the embodiments of the present application will be described in detail below through specific implementation manners.

[0079] Figure 1 The structure schematic diagram of the computing device provided in the embodiments of the present application is shown in FIG. 1. As shown in FIG. 1, the computing device provided in the embodiments of the present application includes a mainboard 10 and a cooling unit 130. The mainboard includes a connection unit 111, a control unit 110 connected with the connection unit 111, and a device to be cooled 120 connected with the control unit 110. Figure 1 The connection unit 111 is connected with the control unit 110 and the cooling unit 130. The cooling unit 130 includes a first heat sink and / or a second heat sink, and the first heat sink and the second heat sink are different types of heat sinks. The connection unit 111 is configured to send the first control signal generated by the control unit 110 to the first heat sink and / or send the second control signal generated by the control unit 110 to the second heat sink, so as to control the first heat sink and / or the second heat sink to cool the device to be cooled 120. Figure 1The control unit 110 sends the first control signal when receiving the first indication signal, and sends the second control signal when receiving the second indication signal. The first indication signal and the second indication signal are different, the first indication signal is used to indicate that the first heat sink 131 is connected with the connecting unit 111, and the first indication signal can also be understood as an in-place indication signal of the first heat sink 131. The second indication signal is used to indicate that the second heat sink 132 is connected with the connecting unit 111, and the second indication signal can also be understood as an out-of-place indication signal of the first heat sink 131. The connecting unit 111 sends the first indication signal and / or the second indication signal sent by the heat dissipation unit 130 to the control unit 110 when receiving the first indication signal and / or the second indication signal, and sends the first control signal and / or the second control signal sent by the control unit 110 to the heat dissipation unit 130 when receiving the first control signal and / or the second control signal. The heat dissipation unit 130 dissipates heat from the device to be cooled by the first heat sink 131 when receiving the first control signal, and dissipates heat from the device to be cooled by the second heat sink 132 when receiving the second control signal. The first heat sink 131 and the second heat sink 132 are different types of heat sinks, so that one or more heat sinks can be used to dissipate heat from the device to be cooled according to the heat dissipation requirement of the device to be cooled, thereby improving the application range of the heat dissipation circuit.

[0080] It should be noted that, since the first indication signal is used to indicate that the first heat sink 131 is connected with the connecting unit 111, and the second indication signal is used to indicate that the second heat sink 132 is connected with the connecting unit 111, the connecting unit 111 can send the first control signal sent by the control unit 110 to the first heat sink 131 when receiving the in-place indication signal, and the first heat sink 131 dissipates heat from the device to be cooled under the action of the first control signal. The connecting unit 111 can send the second control signal sent by the control unit 110 to the second heat sink 132 when receiving the second indication signal, and the second heat sink 132 dissipates heat from the device to be cooled under the action of the second control signal.

[0081] The heat dissipation unit 130 can send the first indication signal or the second indication signal, or send the first indication signal and the second indication signal simultaneously. When the heat dissipation unit 130 sends the first indication signal, it indicates that the first heat dissipator 131 is connected to the connection unit 111, and then the connection unit 111 can send the first control signal to the first heat dissipator 131 in the heat dissipation unit 130, and then use the first heat dissipator 131 to dissipate heat from the device to be cooled. When the heat dissipation unit 130 sends the second indication signal, it indicates that the second heat dissipator 132 is connected to the connection unit 111, and then the connection unit 111 can send the second control signal to the second heat dissipator 132 in the heat dissipation unit 130, and then use the second heat dissipator 132 to dissipate heat from the device to be cooled. When the heat dissipation unit 130 sends the first indication signal and the second indication signal simultaneously, it indicates that the first heat dissipator 131 and the second heat dissipator 132 are both connected to the connection unit 111, and then the connection unit 111 can send the first control signal to the first heat dissipator 131 in the heat dissipation unit 130, and simultaneously send the second control signal to the second heat dissipator 132 in the heat dissipation unit 130, and then use the first heat dissipator 131 and the second heat dissipator 132 to dissipate heat from the device to be cooled.

[0082] In the embodiments of the present application, the control unit 110 can include a controller, which can be a microcontroller unit (MCU), a programmable logic controller (PLC), or the like. The specific type of the controller can be determined according to the functional requirements of the terminal, and is not limited here.

[0083] In the embodiments of the present application, the first heat dissipator 131 can be a Thermo Electric Cooler (TEC), and the second heat dissipator 132 can be a fan. The first indication signal can be an in-place indication signal of the Thermo Electric Cooler, and the second indication signal can be an in-place indication signal of the fan. When the first heat dissipator 131 is connected to the connection unit 111, the control unit 110 generates the first control signal according to the collected ambient temperature and the temperature of the device to be cooled. When the second heat dissipator 132 is connected to the connection unit 111, the detection signal of the second heat dissipator 132 can also be received, which can include a fan test signal, so that the control unit 110 can generate the second control signal according to the second indication signal, the fan test signal, and the ambient temperature and the temperature of the device to be cooled collected by itself. The second control signal includes the speed of the fan, which affects the cooling speed of the device to be cooled.

[0084] In the embodiments of the present application, the device to be cooled refers to a heat generating device on the mainboard, for example, the device to be cooled can be a processor, a memory, a network card, a power supply, a heat dissipator, etc.

[0085] To facilitate understanding of the technical solution of this application, Figure 1 Based on the technical solutions shown, the technical solutions of this application will be described in detail below with reference to four embodiments.

[0086] Example 1

[0087] like Figure 2 As shown, the connection unit 111 includes at least one first connector 120. Each first connector 120 can be connected to a first heat sink 131 or a second heat sink 132. Different types of first heat sinks 131 or second heat sinks 132 can be used to dissipate heat from the heat sink device, while reducing the number of first connectors 120 and saving costs.

[0088] Each first connector 120 can, upon receiving a first indication signal, send the first indication signal to the control unit 110, and then the control unit 110 sends a first control signal to the heat dissipation unit 130, so that the heat dissipation unit 130 dissipates heat from the device to be scald under the action of the first control signal through the corresponding first heat sink 131. Each first connector 120 can also, if it does not receive the first indication signal, send a received second indication signal to the control unit 110, and then the control unit 110 sends a second control signal to the heat dissipation unit 130, so that the heat dissipation unit 130 dissipates heat from the device to be scald under the action of the second control signal through the corresponding second heat sink 132.

[0089] In one implementation, each first connector 120 can send a first control signal to the corresponding first heat sink 131, and the first heat sink 131 dissipates heat from the device to be cooled under the action of the first control signal. Each first connector 120 can also send a second control signal to the corresponding second heat sink 132, and the second heat sink 132 dissipates heat from the device to be cooled under the action of the second control signal.

[0090] The mainboard can further include a direction control unit 152 connected to the line on which the multiplexing port is located, and provided with a first end, a second end and a third end. The first end of the direction control unit 152 is connected to the first connector 120, the second end of the direction control unit 152 is connected to the control unit 110, and the third end of the direction control unit 152 is connected to the indication signal end 121. The direction control unit 152 changes the signal transmission direction of the line according to the first indication signal. When the first indication signal is received, the signal transmission direction is from the second end to the first end. Specifically, the control unit 110 sends the first control signal to the corresponding first connector 120, and when the second indication signal is received, the signal transmission direction is from the first end to the second end. Specifically, the first connector 120 sends the second indication signal to the control unit 110.

[0091] The direction control unit 152 can include a plurality of direction controllers, each of which is connected to a first connector 120, for changing the signal transmission direction of the multiplexed signal line between the control unit 110 and the first connector 120 according to the indication signal. Specifically, the first control signal generated by the control unit 110 can be sent to the corresponding first connector 120 on the signal line when the first indication signal is present; the corresponding first connector 120 sends the second indication signal to the control unit 110 when the second indication signal is present.

[0092] The direction control unit 152 can also include a direction controller connected to all first connectors 120, for changing the signal transmission direction of the multiplexed signal line between the control unit 110 and the first connector 120 according to the indication signal. Specifically, the first control signal generated by the control unit 110 can be sent to the corresponding first connector 120 on the signal line when the first indication signal is present; the corresponding first connector 120 sends the second indication signal to the control unit 110 when the second indication signal is present.

[0093] The following will be described in detail with the connection unit 111 including one first connector 120, as shown in Figure 2 and Figure 3 The first connector 120 is connected to the first heat sink 131 or the second heat sink 132.

[0094] In some embodiments, as shown in Figure 2 The first connector 120 includes at least one indication signal port 121, which is connected to the third end of the direction control unit 152 and the control unit 110, for receiving the first indication signal sent by the heat dissipation unit 130, and sending the first indication signal to the control unit 110 and the direction control unit 152.

[0095] In other embodiments, referring to Figure 3 As shown in FIG. 1, the main board comprises a signal controller 150, which is provided with a first end, a second end and a third end. The first end of the signal controller 150 is connected with the control unit 110, the second end of the signal controller 150 is connected with the power supply unit 160, and the third end of the signal controller 150 is grounded. When the first heat sink 131 is connected with the connecting unit 111, the first end and the second end of the signal controller 150 are connected, so as to send a high-level signal to the control unit 110 under the action of the voltage provided by the power supply unit 160, i.e. to send the first indication signal to the control unit 110. When the second heat sink 132 is connected with the connecting unit 111, the first end and the third end of the signal controller 150 are connected, so as to send a low-level signal to the control unit 110, i.e. to send the second indication signal to the control unit 110. The number of the signal controller 150 can be one or more. One signal controller 150 can correspond to one first heat sink 131, or can correspond to multiple first heat sinks 131. The signal controller 150 can be, for example, a jumper cap or a dial switch. The first end of the signal controller 150 can also be connected with the third end of the direction control unit 152, for sending the first indication signal or the second indication signal to the direction control unit 152.

[0096] Referring to Figure 2 and Figure 3 As shown in FIG. 1, the first connector 120 comprises at least one control signal port 122 and one multiplexing port 123.

[0097] When the first heat sink 131 is connected with the first connector 120, the control signal port 122 sends the pulse width modulation positive signal in the first control signal sent by the control unit 110 to the heat dissipation unit 130; specifically, to the semiconductor refrigerator control unit 133 in the heat dissipation unit 131. When the second heat sink 132 is connected with the first connector 120, the control signal port 122 is used to send the pulse width modulation positive signal in the second control signal sent by the control unit 110 to the heat dissipation unit 130, for example, to the second heat sink 132 in the heat dissipation unit 130. It can be understood that the pulse width modulation positive signal can be different signals for the first heat sink and the second heat sink.

[0098] The multiplex port 123 is a multiplex port of the second pulse width modulation signal port and the detection signal port. When the first connector 120 is connected to the first heat sink 131, the multiplex port 123 serves as the second pulse width modulation signal port, and is used to transmit the pulse width modulation negative signal in the first control signal transmitted by the control unit 110 to the heat dissipation unit 130. When the first connector 120 is connected to the second heat sink 132, the multiplex port 123 serves as the detection signal port, and is used to transmit the detection signal transmitted by the heat dissipation unit 130 to the control unit 110. The first connector 120 further includes a power supply (VCC) port 124 and a ground port 125. The power supply port 124 is used to receive the voltage provided by the power supply unit 160, and the ground port 125 is used for grounding.

[0099] It should be noted that, after the control unit 110 receives the first indication signal, the first control signal generated by the control unit 110 includes a first pulse width modulation signal and a second pulse width modulation signal. The first pulse width modulation signal can be a pulse width modulation positive signal, and the second pulse width modulation signal can be a pulse width modulation negative signal. The pulse width modulation positive signal is transmitted to the heat dissipation unit 130 through the control signal port 122 of the first connector 120, and the pulse width modulation negative signal is transmitted to the heat dissipation unit 130 through the multiplex port (which is the second pulse width modulation signal port at this time) 123 of the first connector 120. For example, the pulse width modulation positive signal and the pulse width modulation negative signal are transmitted to the first heat sink 131, and the first heat sink 131 can determine the working mode as the heating mode or the refrigeration mode according to the polarity and the duty cycle of the pulse width modulation positive signal and the pulse width modulation negative signal.

[0100] Reference is made to FIG. 1, which shows a schematic diagram of a heat dissipation system 100. The heat dissipation system 100 includes a control unit 110, a first connector 120, a second connector 140, a heat dissipation unit 130, a power supply unit 160, and a signal controller 150. Figure 2 As shown in FIG. 1, the first heat sink 131 includes a semiconductor refrigerator (TEC) control unit 133 and a semiconductor refrigerator 134 coupled to each other. The semiconductor refrigerator control unit 133 is used to control the working mode of the semiconductor refrigerator 134. The semiconductor refrigerator control unit 133 includes a first indication signal output port 135, a first pulse width modulation signal input port 136, a second pulse width modulation signal input port 137, a power supply port 138, and a ground port 139. The first indication signal output port 135 is connected to the indication signal port 121 of the first connector 120, the first pulse width modulation signal input port 136 is connected to the control signal port 122 of the first connector 120, and is used to receive the first pulse width modulation signal. The second pulse width modulation signal input port 137 is connected to the multiplex port 123 (i.e., connected to the second pulse width modulation signal port), and is used to receive the second pulse width modulation signal. The power supply port 138 is connected to the power supply port 124 of the first connector 120, and the ground port 139 is connected to the ground port 125 of the first connector 120. The connections between the various ports can be achieved by cables. It should be noted that, when the signal controller 150 transmits the first indication signal to the control unit 110, reference is made to FIG. 1. Figure 3As shown, the first indication signal output port 135 of the semiconductor refrigerator control unit 133 is suspended.

[0101] The first indication signal output port 135 is used to send the first indication signal to the first connector 120, the first pulse width modulation signal input port 136 receives the first pulse width modulation signal sent by the control unit 110 through the control signal port 122 of the first connector 120, the second pulse width modulation signal input port 137 receives the second pulse width modulation signal sent by the control unit 110 through the multiplexing port 123 of the first connector 120, the power supply port 138 receives the voltage provided by the power supply unit through the power supply port 124 of the first connector 120, and the grounding port 139 is grounded through the grounding port 125 of the first connector 120.

[0102] The semiconductor refrigerator control unit 133 further includes a first output port 140 and a second output port 141, which are connected to the semiconductor refrigerator 134. After receiving the pulse width modulation positive signal and the pulse width modulation negative signal, the semiconductor refrigerator control unit 133 generates a first output voltage and a second output voltage according to the polarity and duty cycle of the pulse width modulation positive signal and the pulse width modulation negative signal, and sends the first output voltage to the semiconductor refrigerator 134 through the first output port 140 and the second output voltage to the semiconductor refrigerator 134 through the second output port 141. The semiconductor refrigerator 134 determines the working mode to be heating mode or refrigeration mode according to the polarity of the first output voltage and the second output voltage, and the semiconductor refrigerator 134 can also determine the current size according to the difference between the first output voltage and the second output voltage to determine the heating amount or the refrigeration amount.

[0103] The semiconductor refrigerator control unit 133 can include a pulse width modulation voltage regulator, which generates a first output voltage according to the pulse width modulation positive signal and a second output voltage according to the pulse width modulation negative signal. And send the first output voltage to the semiconductor refrigerator 134 through the first output port 140 and the second output voltage to the semiconductor refrigerator 134 through the second output port 141.

[0104] The computing device further includes a power supply unit 160 connected to the power supply port 124 of the first connector 120 to provide voltage to the first heat sink 131 or the second heat sink 132 through the first connector 120. The power supply unit 160 can also be connected to the device to be cooled to provide operating voltage to the device to be cooled.

[0105] It can be understood that the connecting unit 111 can include two first connectors 120, three first connectors 120, etc., each of which can be connected with at least one first heat sink 131 or at least one second heat sink 132, when the first connector 120 is connected with the first heat sink 131, the first control signal received from the control unit 110 is sent to the first heat sink 131 and the first indication signal sent by the first heat sink 131 is sent to the control unit 110, when the first connector 120 is connected with the second heat sink 132, the second control signal received from the control unit 110 is sent to the second heat sink 132, and the second indication signal received from the second heat sink 132 is sent to the control unit 110.

[0106] Embodiment two

[0107] Reference Figure 4 As shown, the connecting unit 111 includes at least two first connectors, at least one of which is connected with the first heat sink 131, and the remaining first connectors are connected with the second heat sink 132, so that the first heat sink 131 and the second heat sink 132 can be used to dissipate heat from the device to be cooled, improving the heat dissipation efficiency.

[0108] The connecting unit 111 includes two or more first connectors, at least one of which is connected with the first heat sink 131, and the remaining first connectors are connected with the second heat sink 132.

[0109] Each of the at least two first connectors includes an indication signal port connected with the control unit 110. The indication signal port of the first connector connected with the first heat sink 131 is connected with the control unit 110 and the first heat sink 131, and the indication signal port of the first connector connected with the second heat sink 132 is only connected with the control unit 110. The indication signal port in the first connector connected with the first heat sink 131 receives the first indication signal sent by the first heat sink 131 and sends the first indication signal to the control unit 110.

[0110] Each first connector at least includes a control signal port and a multiplex port, the multiplex port being a compatible port of the second pulse width modulation signal port or the detection signal port. The control signal port and the multiplex port are connected with the control unit 110, and the control signal port sends the pulse width modulation positive signal in the first control signal or the second control signal to the heat dissipation unit 130, for example, sends the pulse width modulation positive signal in the first control signal to the first heat sink 131 in the heat dissipation unit 130, and sends the second control signal to the second heat sink 132 in the heat dissipation unit 130. The multiplex port in the first connector connected with the first heat sink 131 is the second pulse width modulation signal port, which is used to send the pulse width modulation negative signal in the first control signal to the heat dissipation unit 130. The multiplex port in the first connector connected with the second heat sink 132 is the detection signal port, which is used to send the detection signal to the control unit 110.

[0111] It is described that the connection unit 111 includes two first connectors, and it is shown in Figure 4 and Figure 5 that one first connector 1202 is connected with the first heat sink 131, and the other first connector 1201 is connected with the second heat sink 132. For the convenience of description, the first connector 1202 connected with the first heat sink 131 is referred to as a first sub-connector 1202, and the first connector 1201 connected with the second heat sink 132 is referred to as a second sub-connector 1201.

[0112] In some embodiments, it is shown in Figure 4 that the first sub-connector 1202 and the second sub-connector 1201 both include an indication signal port, and the indication signal ports of the first sub-connector 1202 and the second sub-connector 1201 are both connected with the control unit 110. The indication signal port 1211 of the first sub-connector 1202 is also connected with the first heat sink 131, and is used to send the first indication signal to the control unit 110.

[0113] In other embodiments, it is shown in Figure 5 that the heat dissipation circuit includes a signal controller 150, a first end of the signal controller 150 is connected with the control unit 110, a second end of the signal controller 150 is connected with the power supply unit 160, and a third end of the signal controller 150 is grounded. When the first heat sink 131 is connected with the connection unit 111, the first end and the second end of the signal controller 150 are connected, so as to send a high-level signal to the control unit 110 under the action of the voltage provided by the power supply unit 160, that is, send the in-place indication signal to the control unit 110. The number of the signal controller 150 can be one or more, and one signal controller 150 can correspond to one first heat sink 131. It is shown in Figure 4 and Figure 5As shown, the first sub-connector 1202 includes at least a control signal port 1221 and a second pulse width modulation signal port 1231. The control signal port 1221 of the first sub-connector 1202 is connected with the control unit 110 and the first heat sink 131, for transmitting the pulse width modulation positive signal in the first control signal generated by the control unit 110 to the first heat sink 131. The second pulse width modulation signal port 1231 of the first sub-connector 1202 is connected with the control unit 110 and the first heat sink 131, for transmitting the pulse width modulation negative signal in the first control signal to the first heat sink 131. It should be noted that, when the signal controller 150 is connected with the power unit 160, a high level signal can be transmitted to the control unit 110, which is an in-place indication signal, indicating that the first heat sink 131 is connected with the first sub-connector 1202, at this time, the in-place signal port 135 of the unit semiconductor cooler control unit 133 in the first heat sink 131 can be suspended.

[0114] It should be noted that the first control signal includes a pulse width modulation positive signal and a pulse width modulation negative signal, the control signal port 1221 of the first sub-connector 1202 is used for transmitting the pulse width modulation positive signal to the first heat sink 131, and the second pulse width modulation signal port 1231 of the first sub-connector 1202 is used for transmitting the pulse width modulation negative signal to the first heat sink 131.

[0115] The second sub-connector 1201 includes at least a control signal port 1220 and a detection signal port 1230. The control signal port 1220 of the second sub-connector 1201 is connected with the control unit 110 and the first heat sink 131, for transmitting the second control signal generated by the control unit 110 to the second heat sink 132. The detection signal port 1230 of the second sub-connector 1201 is connected with the control unit 110 and the second heat sink 132, for transmitting the detection signal generated by the second heat sink 132 to the control unit 110.

[0116] The first sub-connector 1202 and the second sub-connector 1201 both include a power supply port 1241 / 1240 and a grounding port 1251 / 1250, the power supply port 1241 / 1240 is connected with the power unit 160, for receiving the voltage provided by the power unit 160, and the grounding port 1251 / 1250 is used for grounding.

[0117] The first heat sink 131 comprises a semiconductor refrigerator control unit 133 and a semiconductor refrigerator 134 connected with each other, and the semiconductor refrigerator control unit 133 comprises a first indication signal output port 135, a first pulse width modulation signal input port 136, a second pulse width modulation signal input port 137, a power supply port 138 and a grounding port 139. The first indication signal output port 135 is connected with the indication signal port 1211 of the first sub-connector 1202, the first pulse width modulation signal input port 136 is connected with the control signal port 1221 of the first sub-connector 1202, the second pulse width modulation signal input port 137 is connected with the second pulse width modulation signal port 1231 of the first sub-connector 1202, the power supply port 138 is connected with the power supply port 1241 of the first connector 120, and the grounding port 139 is connected with the grounding port 1251 of the first connector 120.

[0118] The first indication signal output port 135 is used to send a first indication signal to the first sub-connector 1202 or the signal controller 150, the first pulse width modulation signal input port 136 receives a pulse width modulation positive signal sent by the control unit 110 through the control signal port 1221 of the first sub-connector 1202, the second pulse width modulation signal input port 137 receives a pulse width modulation negative signal sent by the control unit 110 through the second pulse width modulation signal port 1231 of the first sub-connector 1202, the power supply port 138 receives a voltage provided by the power supply unit 160 through the power supply port 1341 of the first sub-connector 1202, and the grounding port 139 is grounded through the grounding port 1251 of the first sub-connector 1202.

[0119] The semiconductor refrigerator control unit 133 further comprises a first output port 140 and a second output port 141, and the first output port 140 and the second output port 141 are connected with the semiconductor refrigerator 134. After receiving the pulse width modulation positive signal and the pulse width modulation negative signal, the semiconductor refrigerator control unit 133 generates a first output voltage and a second output voltage according to the polarity and duty cycle of the pulse width modulation positive signal and the pulse width modulation negative signal, and sends the first output voltage to the semiconductor refrigerator 134 through the first output port 140 and sends the second output voltage to the semiconductor refrigerator 134 through the second output port 141. The semiconductor refrigerator 134 determines the working mode as a heating mode or a refrigeration mode according to the polarity of the first output voltage and the second output voltage, and the semiconductor refrigerator 134 can also determine the current size according to the difference between the first output voltage and the second output voltage to decide the heating amount or the refrigeration amount.

[0120] The second heat sink 132 includes a detection signal port, an input port, a third power supply port and a fourth power supply port. The detection signal port of the second heat sink 132 is connected with the detection signal port 1230 of the second sub-connector 1201, the input port is connected with the control signal port 1220 of the second sub-connector 1201, the third power supply port is connected with the power supply port 1240 of the second sub-connector 1201, and the fourth power supply port is connected with the grounding port 1250 of the second sub-connector 1201. The detection signal port of the second heat sink 132 is used to send a detection signal to the second sub-connector 1201, the input port is used to receive a second control signal sent by the control unit 110 through the control signal port 1220 of the second sub-connector 1201, the third power supply port receives a voltage provided by the power supply unit through the power supply port 1240 of the second sub-connector 1201, and the fourth power supply port is grounded through the grounding port 1250 of the second sub-connector 1201. It should be noted that, since the signal controller 150 is grounded, a low-level signal can be sent to the control unit 110, and the low-level signal indicates an out-of-position indication signal, indicating that the second heat sink 132 is connected with the second sub-connector 1201.

[0121] Referring to Figure 4 and Figure 5 As shown in FIG. 13, the first heat sink 131 and the second heat sink 132 can be used to dissipate heat from the device to be cooled 170 at the same time. After receiving the in-position indication signal sent by the first sub-connector 1202 or the signal controller 150, the control unit 110 sends a first control signal to the first sub-connector 1202, so that the first sub-connector 1202 sends the first control signal to the first heat sink 131. When receiving the second indication signal, the control unit 110 sends a second control signal to the second sub-connector 1201, so that the second sub-connector 1201 sends the second control signal to the second heat sink 132, thereby dissipating heat from the device to be cooled using the first heat sink 131 and the second heat sink 132. As shown in FIG. 14, the device to be cooled can also be cooled only by the first heat sink 131, or only by the second heat sink 132, thereby saving power consumption. Figure 6

[0122] ​It can be understood that the number of the first connectors 120 included in the connecting unit is greater than or equal to two, which is not limited herein. At least one of the first connectors 120 included in the connecting unit is connected with the first heat sink 131 or the second heat sink 132, and then when the at least one of the first connectors 120 is connected with the first heat sink 131, the remaining first connectors 120 can be connected with the second heat sink 132, and when the at least one of the first connectors 120 is connected with the second heat sink 132, the remaining first connectors 120 can be connected with the first heat sink 131. For example, three first connectors 120 can be included, one of the three first connectors 120 is connected with the first heat sink 131, and the other two first connectors 120 are connected with the second heat sink 132. Four first connectors 120 can also be included, one of the four first connectors 120 is connected with the first heat sink 131, and the other three first connectors 120 are connected with the first heat sink 131.

[0123] Embodiment Three

[0124] The connecting unit includes two second connectors, both of which are connected with the first heat sink, so that the first heat sink can be connected to the existing connector to dissipate heat from the device to be cooled.

[0125] Reference Figure 7 As shown in FIG. 2, the two second connectors are connected with the first heat sink 131. For ease of description, the two second connectors are referred to as a third sub-connector 202 and a fourth sub-connector 203, respectively.

[0126] Both the third sub-connector 202 and the fourth sub-connector 203 include at least a control signal port and a detection signal port. The control signal ports of the third sub-connector 202 and the fourth sub-connector 203 are connected with the first heat sink 131 and the control unit 110, for receiving a first control signal sent by the control unit 110 and sending the first control signal to the first heat sink 131, and the detection signal ports of the third sub-connector 202 and the fourth sub-connector 203 are connected with the first heat sink 131 and the control unit 110, for receiving a first indication signal sent by the first heat sink 131 and sending the first indication signal to the control unit 110.

[0127] The first control signal includes a first pulse width modulation signal and a second pulse width modulation signal, the first pulse width modulation signal can be a pulse width modulation positive signal, and the second pulse width modulation signal can be a pulse width modulation negative signal, the pulse width modulation positive signal is sent to the first heat sink 131 through the control signal port 231 of the third sub-connector 202, and the pulse width modulation negative signal is sent to the first heat sink 131 through the control signal port 221 of the fourth sub-connector 203.

[0128] The first heat sink 131 comprises a semiconductor refrigerator control unit 133 and a semiconductor refrigerator 134 connected with each other, and the semiconductor refrigerator control unit 110 comprises a first indication signal output port 135, a first pulse width modulation signal input port 136, a second pulse width modulation signal input port 137, a power supply port 138 and a grounding port 139.

[0129] The first indication signal output port 135 of the first heat sink 131 can be connected with the detection signal port 232 of the third sub connector 202 or the detection signal port 222 of the fourth sub connector 203, or can be connected with the detection signal port 232 of the third sub connector 202 and the detection signal port 222 of the fourth sub connector 203. If the third sub connector 202 receives the first indication signal, it indicates that the third sub connector 202 is in communication with the first heat sink 131, and if the fourth sub connector 203 receives the first indication signal, it indicates that the fourth sub connector 203 is in communication with the first heat sink 131. Therefore, the first indication signal output port 135 of the first heat sink 131 can be connected with the detection signal port 232 of the third sub connector 202, and the first control signal is sent to the first heat sink 131 through the third sub connector 202 when it is ensured that the first heat sink 131 is in communication with the third sub connector 202, and at the same time, the detection signal port 222 of the fourth sub connector 203 is connected with the first indication signal output port of the first heat sink 131, so as to send the first control signal to the first heat sink 131 through the fourth sub connector 203 when it is ensured that the first heat sink 131 is in communication with the fourth sub connector 203.

[0130] The first pulse width modulation signal input port 136 of the first heat sink 131 is connected with the control signal port 231 of the third sub connector 202, the second pulse width modulation signal input port is connected with the control signal port 221 of the fourth sub connector 203, the power supply port 138 is connected with the power supply port 233 of the third sub connector 202 and the power supply port 223 of the fourth sub connector 203, and the grounding port 139 is connected with the grounding port 234 of the third sub connector 202 and the grounding port 224 of the fourth sub connector 203.

[0131] The first pulse width modulation signal input port 136 receives the pulse width modulation positive signal sent by the control unit 110 through the control signal port 221 of the third sub connector 202, the second pulse width modulation signal input port 137 receives the pulse width modulation negative signal sent by the control unit 110 through the control signal port 231 of the fourth sub connector 203, the power supply port 138 receives the voltage provided by the power supply unit 160 through the power supply port 233 of the third sub connector 202 and the power supply port 223 of the fourth sub connector 203, and the grounding port 139 is grounded through the grounding port 234 of the third sub connector 202 and the grounding port 224 of the fourth sub connector 203.

[0132] The semiconductor refrigerator control unit 110 further comprises a first output port 140 and a second output port 141, which are connected with the semiconductor refrigerator 134. After receiving the pulse width modulation positive signal and the pulse width modulation negative signal, the semiconductor refrigerator control unit 110 generates a first output voltage and a second output voltage according to the polarity and duty cycle of the pulse width modulation positive signal and the pulse width modulation negative signal, and sends the first output voltage to the semiconductor refrigerator 134 through the first output port 140 and sends the second output voltage to the semiconductor refrigerator 134 through the second output port 141. The semiconductor refrigerator 134 determines the working mode as heating mode or refrigeration mode according to the polarity of the first output voltage and the second output voltage, and the semiconductor refrigerator 134 can also determine the current size according to the difference between the first output voltage and the second output voltage to determine the heating amount or the refrigeration amount.

[0133] Embodiment four

[0134] The connection unit comprises at least three second connectors, N second connectors in the at least three second connectors are connected with the first heat sink, M second connectors in the at least three second connectors are connected with the second heat sink, N is an even number greater than 0, and M is an integer greater than 0, so that different types of heat sinks can be used to dissipate heat from the device to be cooled based on the existing connectors without changing the connectors.

[0135] Each of the at least three second connectors comprises at least a control signal port and a detection signal port, the control signal port is connected with the control unit 110 and the heat dissipation unit 130, and the detection signal port is connected with the control unit 110 and the heat dissipation unit 130.

[0136] The control signal port in the second connector connected with the first heat sink 131 is used to send the first control signal generated by the control unit 110 to the heat dissipation unit 130, for example, to the corresponding first heat sink 131. The control signal port in the second connector connected with the second heat sink 132 is used to send the second control signal generated by the control unit 110 to the heat dissipation unit 130, for example, to the corresponding second heat sink 132. The detection signal port in the second connector connected with the first heat sink 131 is used to send the first indication signal to the control unit 110, and the detection signal port in the second connector connected with the second heat sink 132 is used to send the detection signal to the control unit 110.

[0137] The connection unit comprises three second connectors, which are described as follows: Figure 8 and Figure 9As shown, two second connectors are connected with the first heat sink 131, and another second connector is connected with the second heat sink 132. For the convenience of description, the two second connectors connected with the first heat sink 131 are respectively referred to as a third sub-connector 202 and a fourth sub-connector 203, and the second connector connected with the second heat sink 132 is referred to as a fifth sub-connector 201.

[0138] The third sub-connector 202, the fourth sub-connector 203, and the fifth sub-connector 201 each include at least a control signal port and a detection signal port. The control signal port 231 of the third sub-connector 202 is connected with the first heat sink 131 and the control unit 110, and is used to send a pulse width modulation positive signal in the first control signal to the first heat sink 131. The control signal port 221 of the fourth sub-connector 203 is connected with the first heat sink 131 and the control unit 110, and is used to send a pulse width modulation negative signal in the first control signal to the first heat sink 131. The control signal port 211 of the fifth sub-connector 201 is connected with the second heat sink 132 and the control unit 110, and is used to send the second control signal to the second heat sink 132.

[0139] It should be noted that the first control signal includes a pulse width modulation positive signal and a pulse width modulation negative signal, the pulse width modulation positive signal is sent to the first heat sink 131 through the control signal port 231 of the third sub-connector 202, and the pulse width modulation negative signal is sent to the first heat sink 131 through the control signal port 221 of the fourth sub-connector 203.

[0140] The detection signal port 232 of the third sub-connector 202 is connected with the first heat sink 131 and the control unit 110, and is used to send the first indication signal to the control unit 110. The detection signal port 222 of the fourth sub-connector 203 is connected with the first heat sink 131 and the control unit 110, and is used to send the second indication signal to the control unit 110.

[0141] The first heat sink 131 includes a semiconductor refrigerator control unit 133 and a semiconductor refrigerator 134 connected with each other, and the unit semiconductor refrigerator control unit 110 includes a first indication signal output port 135, a first pulse width modulation signal input port 136, a second pulse width modulation signal input port 137, a power supply port 138, and a ground port 139.

[0142] The first indicator signal output port 135 of the first heat sink 131 can be connected with the detection signal port 232 of the third sub-connector 202 or the detection signal port 222 of the fourth sub-connector 203, or can be connected with the detection signal port 232 of the third sub-connector 202 and the detection signal port 222 of the fourth sub-connector 203. If the third sub-connector 202 receives the first indicator signal, it indicates that the third sub-connector 202 is in communication with the first heat sink 131, and if the fourth sub-connector 203 receives the first indicator signal, it indicates that the fourth sub-connector 203 is in communication with the first heat sink 131. Therefore, the first indicator signal output port 135 of the first heat sink 131 can be connected with the detection signal port 232 of the third sub-connector 202, and the first control signal is sent to the first heat sink 131 through the third sub-connector 202 while ensuring that the first heat sink 131 is in communication with the third sub-connector 202, and the detection signal port 222 of the fourth sub-connector 203 is connected with the first heat sink 131 to send the first control signal to the first heat sink 131 through the fourth sub-connector 203 while ensuring that the first heat sink 131 is in communication with the fourth sub-connector 203.

[0143] The first pulse width modulation signal input port 136 of the first heat sink 131 is connected with the control signal port 231 of the third sub-connector 202, the second pulse width modulation signal input port is connected with the control signal port 221 of the fourth sub-connector 203, the power supply port 138 is connected with the power supply port 233 of the third sub-connector 202 and the power supply port 223 of the fourth sub-connector 203, and the ground port 139 is connected with the ground port 234 of the third sub-connector 202 and the ground port 224 of the fourth sub-connector 203.

[0144] The first pulse width modulation signal input port 136 receives the pulse width modulation positive signal sent by the control unit 110 through the control signal port 221 of the third sub-connector 202, the second pulse width modulation signal input port 137 receives the pulse width modulation negative signal sent by the control unit 110 through the control signal port 231 of the fourth sub-connector 203, the power supply port 138 receives the voltage provided by the power supply unit 160 through the power supply port 233 of the third sub-connector 202 and the power supply port 223 of the fourth sub-connector 203, and the ground port 139 is grounded through the ground port 234 of the third sub-connector 202 and the ground port 224 of the fourth sub-connector 203.

[0145] The semiconductor refrigerator control unit 110 further comprises a first output port 140 and a second output port 141, which are connected with the semiconductor refrigerator 134. After receiving the pulse width modulation positive signal and the pulse width modulation negative signal, the semiconductor refrigerator control unit 110 generates a first output voltage and a second output voltage according to the polarity and duty cycle of the pulse width modulation positive signal and the pulse width modulation negative signal, and sends the first output voltage to the semiconductor refrigerator 134 through the first output port 140 and sends the second output voltage to the semiconductor refrigerator 134 through the second output port 141. The semiconductor refrigerator 134 determines the working mode as heating mode or refrigeration mode according to the polarity of the first output voltage and the second output voltage, and can also determine the current size according to the difference between the first output voltage and the second output voltage to determine the heating amount or the refrigeration amount.

[0146] The second heat sink 132 comprises a detection signal port, an input port, a third power port and a fourth power port. The detection signal port of the second heat sink 132 is connected with the detection signal port 212 of the fifth sub-connector 201, the input port is connected with the control signal port 211 of the fifth sub-connector 201, the third power port is connected with the power port 213 of the fifth sub-connector 201, and the fourth power port is connected with the ground port 214 of the fifth sub-connector 201. The detection signal port 212 of the second heat sink 132 is used to send a detection signal to the fifth sub-connector 201, the input port is used to receive the second control signal sent by the control unit 110 through the control signal port 211 of the fifth sub-connector 201, the third power port receives the voltage provided by the power supply unit 160 through the power port 213 of the fifth sub-connector 201, and the fourth power port is grounded through the ground port 214 of the fifth sub-connector 201. Reference Figure 8 As shown, the first heat sink 131 and the second heat sink 132 can be used to dissipate heat from the device to be cooled 170 at the same time. After receiving the first indication signal sent by the third sub-connector 202 and / or the fourth sub-connector 203, the control unit 110 sends a first control signal to the third sub-connector 202 and the fourth sub-connector 203, so that the third sub-connector 202 and the fourth sub-connector 203 send the first control signal to the first heat sink 131. After receiving the second indication signal sent by the fifth sub-connector 201, the control unit 110 sends a second control signal to the fifth sub-connector 201, so that the fifth sub-connector 201 sends the second control signal to the second heat sink 132, thereby dissipating heat from the device to be cooled using the first heat sink 131 and the second heat sink 132. As shown, Figure 9 As shown, the first heat sink 131 and the second heat sink 132 can be used to dissipate heat from the device to be cooled 170 at the same time. After receiving the first indication signal sent by the third sub-connector 202 and / or the fourth sub-connector 203, the control unit 110 sends a first control signal to the third sub-connector 202 and the fourth sub-connector 203, so that the third sub-connector 202 and the fourth sub-connector 203 send the first control signal to the first heat sink 131. After receiving the second indication signal sent by the fifth sub-connector 201, the control unit 110 sends a second control signal to the fifth sub-connector 201, so that the fifth sub-connector 201 sends the second control signal to the second heat sink 132, thereby dissipating heat from the device to be cooled using the first heat sink 131 and the second heat sink 132. As shown,

[0147] It can be understood that the number of the second connectors included in the connecting unit is greater than or equal to three, which is not limited herein. An even number of the first connectors among the second connectors included in the connecting unit are connected with the first heat sink 131. For example, three second connectors can be included, two first connectors among the three second connectors are connected with the first heat sink 131, and the other second connector can be connected with or not connected with the second heat sink 132.

[0148] The heat dissipation circuit provided by the embodiment of the present application is described in detail above, and an embodiment of the present application further provides a computing device, which comprises the mainboard and further comprises a heat dissipation unit.

[0149] The computer device can be, for example, a mobile phone, a tablet computer, a notebook computer, a palm computer, a personal digital assistant (PDA), a server, and the like.

[0150] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms “mounting”, “connection”, and “linking” should be understood in a broad sense, for example, can be fixed connection, can be indirect connection through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0151] In the present application or the implied device or element must have a specific orientation, and therefore cannot be understood as a limitation of the present application. In the description of the present application, the meaning of “a plurality of” is two or more, unless otherwise specified.

[0152] The terms “first”, “second”, “third”, “fourth” and the like (if any) in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms “include” and “have” and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0153] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A motherboard, characterized in that, The motherboard includes a control unit, a connection unit, and a device to be cooled; the control unit and the connection unit are connected; the connection unit includes a first connector; The connecting unit is also used to connect to the heat dissipation unit; the heat dissipation unit is used to dissipate heat from the device to be cooled; wherein; the heat dissipation unit includes a first heat sink and / or a second heat sink; the first heat sink and the second heat sink are different types of heat sinks; The control unit is configured to generate a first control signal based on a received first indication signal; and / or generate a second control signal based on a received second indication signal; wherein the first indication signal is configured to indicate that the connection unit is connected to the first heat sink; the second indication signal is configured to indicate that the connection unit is connected to the second heat sink; and the first indication signal and the second indication signal are different. The connection unit is used to send the first control signal to the first heat sink and / or send the second control signal to the second heat sink, so as to control the first heat sink and / or the second heat sink to dissipate heat from the device to be cooled; The first connector includes a control signal port and a multiplexing port. When the first heat sink is connected to the first connector, the control signal port is used to send a first pulse width modulation signal from the first control signal of the control unit to the first heat sink, and the multiplexing port is used to send a second pulse width modulation signal from the first control signal of the control unit to the first heat sink. When the second heat sink is connected to the first connector, the control signal port is used to send the second control signal to the second heat sink, and the multiplexing port is used to send a detection signal from the second heat sink to the control unit.

2. The motherboard according to claim 1, characterized in that, The first connector further includes: a power port and a ground port; The power port and the ground port are respectively connected to the power supply and the ground.

3. The motherboard according to claim 2, characterized in that, The first connector further includes an indicator signal port; the indicator signal port is used to send a first indicator signal of the first heat sink to the control unit.

4. The motherboard according to claim 2 or 3, characterized in that, The motherboard also includes: a direction control unit; The direction control unit is connected to the line where the multiplexing port is located; the first end of the direction control unit is connected to the first connector, and the second end of the direction control unit is connected to the control unit; the third end of the direction control unit is used to receive the first indication signal; the direction control unit is used to change the signal transmission direction of the line according to the first indication signal.

5. The motherboard according to claim 1 or 2, characterized in that, The motherboard also includes a signal controller, a first terminal of which is connected to the control unit; a second terminal of which is connected to the power module; and a third terminal of which is grounded. The signal controller is used to generate the first indication signal or the second indication signal.

6. The motherboard according to any one of claims 1-3, characterized in that, The connection unit includes at least two of the first connectors; wherein at least one of the first connectors is connected to the first heat sink, and the remaining first connectors are connected to the second heat sink.

7. The motherboard according to any one of claims 1-3, characterized in that, The first indication signal is high level; the second indication signal is high impedance or low level.

8. A motherboard, characterized in that, The motherboard includes a control unit, a connection unit, and a device to be cooled; the control unit and the connection unit are connected; the connection unit includes at least three second connectors. The connecting unit is also used to connect to the heat dissipation unit; the heat dissipation unit is used to dissipate heat from the device to be cooled; the heat dissipation unit includes a first heat sink and a second heat sink; the first heat sink and the second heat sink are different types of heat sinks; N of the at least three second connectors are used to connect to the first heat sink, where N is an even number greater than 0, and at least one second connector is used to connect to the second heat sink. The control unit is configured to generate a first control signal based on a received first indication signal; wherein the first indication signal is generated by the first heat sink; the first indication signal is used to indicate that the first heat sink is connected to the connection unit; the control unit is configured to generate a second control signal based on a received second indication signal; wherein the second indication signal is generated by the second heat sink; the second indication signal is used to indicate that the second heat sink is connected to the connection unit; the first indication signal and the second indication signal are different. The connection unit is used to send the first control signal to the first heat sink to control the first heat sink to dissipate heat on the device to be cooled; the connection unit is used to send the second control signal to the second heat sink to control the second heat sink to dissipate heat on the device to be cooled. The second connector includes: a control signal port and a multiplexing port; The multiplexed ports of the two second connectors connected to the first heat sink are used to send the first indication signal of the first heat sink to the control unit, and the control signal ports of the two second connectors connected to the first heat sink are respectively used to send the first pulse width modulation signal and the second pulse width modulation signal in the first control signal of the control unit to the first heat sink. The control signal port of the second connector connected to the second heat sink is used to send the second control signal to the second heat sink, and the multiplexing port of the second connector connected to the second heat sink is used to send the detection signal of the second heat sink to the control unit.

9. The motherboard according to claim 8, characterized in that, The second connector also includes: a power port and a ground port; The power port and the ground port are respectively connected to the power supply and the ground.

10. A computing device, characterized in that, The device includes a motherboard and a heat dissipation unit as described in any one of claims 1-7; the heat dissipation unit includes a first heat sink and / or a second heat sink; the motherboard is connected to the heat dissipation unit; the heat dissipation unit is used to dissipate heat for the heat-dissipating device on the motherboard.

11. The computing device according to claim 10, characterized in that, The first heat sink includes a semiconductor cooler control unit and a semiconductor cooler; the semiconductor cooler control unit includes a first indicator signal output port, a first pulse width modulation signal input port, a second pulse width modulation signal input port, a power supply port, a ground port, a first output port, and a second output port; The first pulse width modulation signal input port is connected to the control signal port; the first pulse width modulation signal input port is used to receive the first pulse width modulation signal. The second pulse width modulation signal input port is connected to the second pulse width modulation signal port; the second pulse width modulation signal input port is used to receive the second pulse width modulation signal. The power port is used to connect a power source; The grounding port is used for grounding; The first output port and the second output port are connected to the semiconductor cooler; The first output port and the second output port are used to output signals that control the semiconductor cooler.

12. The computing device according to claim 11, characterized in that, The first indicator signal output port is connected to the indicator signal port of the first connector; the first indicator signal output port is used to send the first indicator signal.

13. A computing device, characterized in that, It includes a motherboard and a heat dissipation unit as described in claim 8 or 9; the heat dissipation unit includes a first heat sink; the motherboard is connected to the heat dissipation unit; the heat dissipation unit is used to dissipate heat for the heat-dissipating device on the motherboard.

14. The computing device according to claim 13, characterized in that, The first heat sink includes a semiconductor cooler control unit and a semiconductor cooler; the semiconductor cooler control unit includes a first indicator signal output port, a first pulse width modulation signal input port, a second pulse width modulation signal input port, a power supply port, a ground port, a first output port, and a second output port; The first indication signal output port is connected to the multiplexed port of the two second connectors respectively; the first indication signal output port is used to send the first indication signal; The first pulse width modulation signal input port is connected to the control signal port of a second connector; the first pulse width modulation signal input port is used to receive the first pulse width modulation signal. The second pulse width modulation signal input port is connected to the control signal port of another second connector; the second pulse width modulation signal input port is used to receive the second pulse width modulation signal. The power port is used to connect a power source; The grounding port is used for grounding; The first output port and the second output port are connected to the semiconductor cooler; The first output port and the second output port are used to output signals that control the semiconductor cooler.

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