A plastic-encapsulated power module and a vehicle

Abstract

The present invention provides a plastic-encapsulated power module and a vehicle. The plastic-encapsulated power module includes: a heat dissipation substrate; a lower copper layer connected to the heat dissipation substrate; an insulating liner connected to the lower copper layer, with the lower copper layer located between the insulating liner and the heat dissipation substrate; a circuit module, where the circuit module includes an upper copper layer disposed on a side of the insulating liner away from the lower copper layer, and a chip, at least one conductive connection part, a power terminal, and a signal terminal are provided on the upper copper layer, and the chip is connected to at least one of the power terminal and the signal terminal through the conductive connection part; a plastic-encapsulated housing connected to the heat dissipation substrate and enclosing a plastic-encapsulated cavity, and the plastic-encapsulated housing encapsulates the lower copper layer, the insulating liner, the upper copper layer, the chip, and at least part of the conductive connection part, at least part of the power terminal, and at least part of the signal terminal in the plastic-encapsulated cavity. By applying the technical solution of the present invention, the problems of poor heat dissipation and low performance of the power module in the prior art are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy electric drive systems, and more particularly, to a plastic-encapsulated power module and a vehicle. Background Art

[0002] With the popularization of electric vehicles, users' acceptance and recognition of electric vehicles have gradually increased, and their requirements for electric vehicles have also gradually improved. Currently, new energy vehicle owners have great concerns about the cruising range and charging time. To alleviate users' anxiety, major vehicle manufacturers have begun to improve the charging speed and cruising range by enhancing the battery charging speed and the efficiency of the electric drive system. The overall vehicle power consumption level is a core quality characteristic related to customer satisfaction, which is particularly evident in scenarios such as mobile travel services. The efficiency of the electric drive system has a crucial impact on the overall vehicle power consumption. High operating condition cycle efficiency can reduce the battery load (cost, safety), reduce range anxiety, save energy and reduce operating costs, and reduce the charging time and frequency. For every 1% increase in the operating condition efficiency of the electric drive system, the cruising range extends by more than 10 km. If the hard performance energy consumption requirements such as air resistance, rolling resistance, and mechanical braking are removed, the proportion of the electric drive system in the overall vehicle energy consumption will reach more than 80%. The loss of the inverter in the electric drive system mainly comes from the power module. The silicon-based IGBT power module has reached its theoretical limit in terms of performance, and in the prior art, the power module has poor heat dissipation and low performance.

[0003] Regarding the above problems, no effective solution has been obtained yet. Summary of the Invention

[0004] The main object of the present invention is to provide a plastic-encapsulated power module and a vehicle to solve the problems of poor heat dissipation and low performance of the power module in the prior art.

[0005] To achieve the above object, according to one aspect of the present invention, there is provided a plastic-encapsulated power module, including: a heat dissipation substrate; a lower copper layer connected to the heat dissipation substrate; an insulating liner connected to the lower copper layer, the lower copper layer being located between the insulating liner and the heat dissipation substrate; a circuit module including an upper copper layer disposed on a side of the insulating liner away from the lower copper layer, the upper copper layer being provided with a chip, at least one conductive connection portion, a power terminal, and a signal terminal, the chip being connected to at least one of the power terminal and the signal terminal through the conductive connection portion; and a plastic-encapsulated housing connected to the heat dissipation substrate and enclosing a plastic-encapsulated cavity, and the plastic-encapsulated housing encapsulates the lower copper layer, the insulating liner, the upper copper layer, the chip, and at least a part of the conductive connection portion, at least a part of the power terminal, and at least a part of the signal terminal in the plastic-encapsulated cavity.

[0006] Further, there are a plurality of circuit modules, and the conductive connection portion of one circuit module in adjacent circuit modules is connected to another circuit module.

[0007] Further, the multiple circuit modules include a first circuit module and a second circuit module. The first circuit module includes a first copper layer, a first chip, and a first conductive part. The second circuit module includes a second copper layer, a second chip, and a second conductive part. One end of the first conductive part is connected to the first chip, and the other end of the first conductive part is connected to the second copper layer, and / or one end of the second conductive part is connected to the second chip, and the other end of the second conductive part is connected to the first copper layer.

[0008] Further, at least one of the first conductive part and the second conductive part includes a copper strip. The copper strip includes: a copper strip body, the copper strip body has a plate-like structure, the middle part of the copper strip body is recessed on the side away from the insulating liner, and the connection surfaces at both ends of the copper strip body are set flush.

[0009] Further, at least one end of the copper strip body is provided with at least one connection hole, wherein the cross-section of the connection hole is circular, elliptical, regular polygon or special-shaped structure.

[0010] Further, the conductive connection parts in at least one circuit module are multiple, and the structure of at least one of the multiple conductive connection parts is set differently from the structures of the others, and / or at least two of the multiple conductive connection parts are arranged in a layered manner along the thickness direction of the heat dissipation substrate.

[0011] Further, there are multiple circuit modules, and the structure of at least one conductive connection part in the multiple circuit modules is set differently from the structures of the conductive connection parts in the other circuit modules.

[0012] Further, the conductive connection part in at least one circuit module includes multiple conductive connection parts. The multiple conductive connection parts include a lower bridge and an upper bridge, wherein at least part of the lower bridge is located below the upper bridge.

[0013] Further, the lower bridge includes: lower bridge body units, there are multiple lower bridge body units, the middle parts of the multiple lower bridge body units are connected by a lower connecting beam, and the multiple lower bridge body units are arranged at intervals along the length direction of the lower bridge body unit. Along the length direction of each lower bridge body unit, the body of each lower bridge body unit is bent to form a first bending structure. There are multiple first bending structures, and the opening directions of the multiple first bending structures are alternately arranged along the length direction of the lower bridge body unit. The opening directions of the first bending structures located on both sides of the lower connecting beam and having the largest distance from the lower connecting beam face the plastic package housing side. Among the multiple lower bridge body units, the bottom of the first bending structure with the largest distance from the lower connecting beam of one lower bridge body unit is connected to the upper copper layer, and the bottom of the first bending structure with the closest distance from the lower connecting beam of another lower bridge body unit is connected to the chip.

[0014] Further, a lower reinforcing beam is provided at each end of each lower bridge unit, and the axis of the lower reinforcing beam is arranged parallel to the axis of the lower connecting beam. Further, the upper bridge includes: upper bridge units, and there are multiple upper bridge units. The middle parts of the multiple upper bridge units are connected by an upper connecting beam, and the multiple upper bridge units are arranged at intervals along the length direction of the upper bridge units. Along the length direction of each lower bridge unit, at both ends of each upper bridge unit body, a second bending structure is formed respectively. The opening of the second bending structure is arranged towards the side of the plastic encapsulation housing. The bottom of the second bending structure of each upper bridge unit is connected to the chip. Connecting hook parts are respectively arranged at both ends of the upper connecting beam, and the connecting hook parts extend towards the side of the upper copper layer and are connected to the upper copper layer.

[0015] Further, an upper reinforcing beam is provided at each end of each upper bridge unit, and the axis of the upper reinforcing beam is arranged parallel to the axis of the upper connecting beam.

[0016] Further, the conductive connection part includes: a central beam, and multiple pin groups are arranged on the central beam. The multiple pin groups are arranged at intervals along the length direction of the central beam. Among them, the multiple pin groups include a first pin, a second pin, and a third pin. The first pin and the second pin are located on the first side of the central beam, and the third pin is located on the second side of the central beam. The first side and the second side are arranged opposite to each other. The first pin and the second pin are connected to the chip, and the third pin is connected to the upper copper layer.

[0017] Further, the distance from the farthest end of the first pin to the axis of the central beam is set differently from the distance from the farthest end of the second pin to the axis of the central beam.

[0018] According to another aspect of the present invention, a vehicle is provided, including the above-mentioned plastic encapsulated power module.

[0019] Applying the technical solution of the present invention, the plastic encapsulated power module includes a heat dissipation substrate, a lower copper layer, an insulating liner, a circuit module, and a plastic encapsulation housing. The lower copper layer is connected to the heat dissipation substrate, and the lower copper layer is located between the insulating liner and the heat dissipation substrate. The circuit module includes an upper copper layer, and the upper copper layer is arranged on the side of the insulating liner away from the lower copper layer. A chip, at least one conductive connection part, power terminals, and signal terminals are arranged on the upper copper layer. The chip is connected to at least one of the power terminals and the signal terminals through the conductive connection part. The plastic encapsulation housing is connected to the heat dissipation substrate and encloses a plastic encapsulation cavity, and the plastic encapsulation housing encapsulates the lower copper layer, the insulating liner, the upper copper layer, the chip, and at least part of the conductive connection part, at least part of the power terminals, and at least part of the signal terminals in the plastic encapsulation cavity. Such a setting simplifies the manufacturing process steps, improves the heat dissipation efficiency, improves the performance of the plastic encapsulated power module, and solves the problems of poor heat dissipation and low performance of the power module in the prior art. Description of the Drawings

[0020] The accompanying drawings of the specification, which form a part of this application, are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0021] Figure 1 Shows a schematic structural diagram of a first embodiment of a plastic-encapsulated power module according to the present invention;

[0022] Figure 2 Shows a schematic structural diagram of a second embodiment of a plastic-encapsulated power module according to the present invention;

[0023] Figure 3 Shows a schematic structural diagram of a third embodiment of a plastic-encapsulated power module according to the present invention;

[0024] Figure 4 Shows a schematic structural diagram of a fourth embodiment of a plastic-encapsulated power module according to the present invention;

[0025] Figure 5 Shows a schematic structural diagram of a fifth embodiment of a plastic-encapsulated power module according to the present invention;

[0026] Figure 6 Shows a schematic structural diagram of a sixth embodiment of a plastic-encapsulated power module according to the present invention;

[0027] Figure 7 Shows a schematic structural diagram of a seventh embodiment of a plastic-encapsulated power module according to the present invention;

[0028] Figure 8 Shows a schematic structural diagram of an eighth embodiment of a plastic-encapsulated power module according to the present invention.

[0029] Among them, the above-mentioned drawings include the following reference numerals:

[0030] 10. Heat dissipation substrate;

[0031] 20. Lower copper layer;

[0032] 30. Insulating liner;

[0033] 40. Circuit module; 41. Upper copper layer; 42. Chip;

[0034] 43. Conductive connection part;

[0035] 431. Copper strip; 4310. Copper strip body;

[0036] 432. Lower bridge; 4320. Lower bridge body unit; 4321. Lower connecting beam; 4322. First bending structure; 4323. Lower strengthening beam;

[0037] 433. Upper bridge; 4330. Upper bridge body unit; 4331. Upper connecting beam; 4332. Second bending structure; 4333. Connecting hook part; 4334. Upper strengthening beam;

[0038] 434. Central beam; 4341. First pin; 4342. Second pin; 4343. Third pin;

[0039] 44. Power terminal;

[0040] 45. Signal terminal;

[0041] 50. Plastic encapsulation housing. Detailed implementation manners

[0042] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0043] It should be noted that the terms used herein are only for describing specific implementation manners and are not intended to limit the exemplary implementation manners according to the present application. As used herein, unless otherwise clearly specified in the context, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "include" and / or "comprise" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0044] It should be noted that the terms "first", "second", etc. in the description, claims and drawings of the present application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances so that the implementation manners of the present application described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily limit to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0045] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many different forms and should not be construed as being limited only to the embodiments set forth herein. It should be understood that these embodiments are provided so that the disclosure of the present application is thorough and complete, and the concept of these exemplary embodiments is fully conveyed to those of ordinary skill in the art. In the drawings, for clarity, the thickness of layers and regions may be exaggerated, and the same reference numerals are used to denote the same devices, and thus their description will be omitted.

[0046] Combined with Figures 1 to 8 As shown, according to a specific embodiment of the present invention, a plastic-encapsulated power module is provided.

[0047] Specifically, the plastic-encapsulated power module includes: a heat dissipation substrate 10; a lower copper layer 20, which is connected to the heat dissipation substrate 10; an insulating liner 30, which is connected to the lower copper layer 20, and the lower copper layer 20 is located between the insulating liner 30 and the heat dissipation substrate 10; a circuit module 40, the circuit module includes an upper copper layer 41, the upper copper layer 41 is disposed on a side of the insulating liner 30 away from the lower copper layer 20, a chip 42, at least one conductive connection portion 43, a power terminal 44 and a signal terminal 45 are provided on the upper copper layer 41, and the chip 42 is connected to at least one of the power terminal 44 and the signal terminal 45 through the conductive connection portion 43; a plastic encapsulation housing 50, which is connected to the heat dissipation substrate 10 and encloses a plastic encapsulation cavity, and the plastic encapsulation housing 50 encapsulates the lower copper layer 20, the insulating liner 30, the upper copper layer 41, the chip 42, and at least part of the conductive connection portion 43, at least part of the power terminal 44 and at least part of the signal terminal 45 in the plastic encapsulation cavity.

[0048] Combined with Figure 1As shown in the figure, in this embodiment, the plastic-encapsulated power module includes a heat dissipation substrate 10, a lower copper layer 20, an insulating liner 30, a circuit module 40, and a plastic-encapsulated housing 50. Among them, the lower copper layer 20 is connected to the heat dissipation substrate 10, the insulating liner 30 is connected to the lower copper layer 20, and the lower copper layer 20 is located between the insulating liner 30 and the heat dissipation substrate 10. The circuit module 40 includes an upper copper layer 41, and the upper copper layer 41 is disposed on a side of the insulating liner 30 away from the lower copper layer 20. A chip 42, at least one conductive connection part 43, a power terminal 44, and a signal terminal 45 are arranged on the upper copper layer 41. The chip 42 is connected to at least one of the power terminal 44 and the signal terminal 45 through the conductive connection part 43. The plastic-encapsulated housing 50 is connected to the heat dissipation substrate 10 and encloses a plastic-encapsulated cavity, and the plastic-encapsulated housing 50 encapsulates the lower copper layer 20, the insulating liner 30, the upper copper layer 41, the chip 42, and at least part of the conductive connection part 43, at least part of the power terminal 44, and at least part of the signal terminal 45 in the plastic-encapsulated cavity, which simplifies the manufacturing process steps, improves the heat dissipation efficiency, improves the module voltage level, and improves the performance of the plastic-encapsulated power module.

[0049] In another embodiment of the present application, the plastic-encapsulated housing 50 can be made of, but not limited to, materials such as PPS, PEEK, LCP, etc. In this embodiment, it is specifically made of PPS material, which has excellent cold and heat resistance while also having high wear resistance, is easy to process and form, and has a high cost performance.

[0050] Further, there are multiple circuit modules, and the conductive connection part 43 of one circuit module among adjacent circuit modules is connected to another circuit module. Figure 1 As shown in the figure, the conductive connection part 43 includes directly connected and indirectly connected parts, and such a setting ensures the integrity of the circuit.

[0051] Further, the multiple circuit modules include a first circuit module and a second circuit module. The first circuit module includes a first copper layer, a first chip, and a first conductive part. The second circuit module includes a second copper layer, a second chip, and a second conductive part. One end of the first conductive part is connected to the first chip, and the other end of the first conductive part is connected to the second copper layer, and / or, one end of the second conductive part is connected to the second chip, and the other end of the second conductive part is connected to the first copper layer. Such a setting can improve the current-carrying capacity of the circuit module.

[0052] Further, at least one of the first conductive part and the second conductive part includes a copper strip 431. The copper strip 431 includes a copper strip body 4310, and the copper strip body 4310 has a plate-like structure. The middle of the copper strip body 4310 is recessed on a side away from the insulating liner 30, and the connection surfaces at both ends of the copper strip body 4310 are set flush.

[0053] As shown in Figure 1 and Figure 2As shown, in this embodiment, at least one of the first conductive part and the second conductive part includes a copper strip 431. Compared with the copper wire connection in the prior art, this connection method improves the current-carrying capacity. Because it is connected by the copper strip 431, the copper strip body 4310 has a plate-like structure, increasing the heat dissipation area and improving the heat dissipation capacity.

[0054] Furthermore, at least one end of the copper strip body 4310 is provided with at least one connection hole, wherein the cross-section of the connection hole is circular, oval, regular polygon or special-shaped structure.

[0055] Combined Figure 2 As shown, in this embodiment, at least one end of the copper strip body 4310 is provided with at least one connection hole. One end of the connection hole is welded or silver-sintered on the upper surface of the chip 42, and the other end is welded or silver-sintered on the insulating liner 30 through welding, completing the connection of the chip 42 with at least one of the power terminal 44 and the signal terminal 45. Among them, the setting of the connection hole can reduce the solder consumption, reduce the weight of the copper strip, reduce the production cost, and increase the function of exhausting gas. Further, this setting plays a role in enhancing the welding stability and reliability.

[0056] Furthermore, the conductive connection parts 43 in at least one circuit module are multiple, and at least one of the multiple conductive connection parts 43 is set with a different structure from the rest, and / or at least two of the multiple conductive connection parts 43 are arranged in a layered manner along the thickness direction of the heat dissipation substrate 10. In this embodiment, by using the conductive connection parts 43 with different structures in a cooperative setting, after the current of the chip 42 is returned together, it is output through the power terminal 44.

[0057] Furthermore, there are multiple circuit modules, and the structure of at least one conductive connection part 43 in the multiple circuit modules is set differently from the conductive connection parts 43 in the rest of the circuit modules. In this embodiment, when the chip 42 is asymmetrically designed, by setting the conductive connection parts 43 with different structures in the circuit module, a current sharing design can be made for the entire circuit as needed.

[0058] Furthermore, the conductive connection part 43 in at least one circuit module includes multiple conductive connection parts 43, and the multiple conductive connection parts 43 include a lower bridge 432 and an upper bridge 433, wherein at least part of the lower bridge 432 is located below the upper bridge 433.

[0059] Combined Figure 3 and Figure 4As shown, in this embodiment, the chip 42 is connected to at least one of the power terminal 44 and the signal terminal 45 through the lower bridge 432 and the upper bridge 433. The lower bridge 432 and the upper bridge 433 are in a plate-like structure, which can increase the heat dissipation area, improve the current flow capacity and the conductivity. In addition, both the lower bridge 432 and the upper bridge 433 are integrally formed, reducing the number of assembled parts, reducing the overall weight, and simplifying the manufacturing process steps.

[0060] Further, the lower bridge 432 includes: a lower bridge body unit 4320. There are multiple lower bridge body units 4320. The middle parts of the multiple lower bridge body units 4320 are connected by a lower connecting beam 4321. Moreover, the multiple lower bridge body units 4320 are arranged at intervals along the length direction of the lower bridge body unit 4320. Along the length direction of each lower bridge body unit 4320, the body of each lower bridge body unit 4320 is bent to form a first bending structure 4322. There are multiple first bending structures 4322. The opening directions of the multiple first bending structures 4322 are alternately arranged along the length direction of the lower bridge body unit 4320. Located on both sides of the lower connecting beam 4321, and the opening direction of the first bending structure 4322 with the largest distance from the lower connecting beam 4321 faces the side of the plastic package housing 50. Among the multiple lower bridge body units 4320, the bottom of the first bending structure 4322 with the largest distance from the lower connecting beam 4321 of one lower bridge body unit 4320 is connected to the upper copper layer 41, and the bottom of the first bending structure 4322 with the closest distance from the lower connecting beam 4321 of another lower bridge body unit 4320 is connected to the chip 42.

[0061] Combined with Figure 3 As shown, the bottom of the first bending structure 4322 with the largest distance from the lower connecting beam 4321 of the lower bridge body unit 4320 is used to connect to the upper copper layer 41, and the bottom of the first bending structure 4322 with the closest distance from the lower connecting beam 4321 of another lower bridge body unit 4320 is used to connect to the chip 42. Such a setting realizes the connection of the chip 42 to the upper copper layer 41 through the lower bridge 432, facilitating the current of the chip 42 to flow to the power terminal 44 for output through the lower bridge 432.

[0062] Further, a lower reinforcing beam 4323 is provided at each end of each lower bridge body unit 4320. The axis of the lower reinforcing beam 4323 is arranged parallel to the axis of the lower connecting beam 4321. Combined with Figure 3 As shown, the setting of the lower reinforcing beam 4323 strengthens the strength of the lower bridge 432.

[0063] Further, the upper bridge 433 includes: an upper bridge body unit 4330, there are multiple upper bridge body units 4330, the middle parts of the multiple upper bridge body units 4330 are connected by an upper connecting beam 4331, and the multiple upper bridge body units 4330 are arranged at intervals along the length direction of the upper bridge body unit 4330. Along the length direction of each lower bridge body unit 4320, at both ends of each upper bridge body unit 4330 body, a second bending structure 4332 is formed respectively. The opening of the second bending structure 4332 faces the side of the plastic package housing 50. The bottom of the second bending structure 4332 of each upper bridge body unit 4330 is connected to the chip 42. A connecting hook portion 4333 is arranged at both ends of the upper connecting beam 4331 respectively. The connecting hook portion 4333 extends towards the upper copper layer 41 side and is connected to the upper copper layer 41.

[0064] Combined with Figure 4 As shown, the bottom of the second bending structure 4332 of the upper bridge body unit 4330 is used to connect to the chip 42. The connecting hook portion 4333 extends towards the upper copper layer 41 side and is connected to the upper copper layer 41. Such a setting realizes the connection of the chip 42 to the upper copper layer 41 through the upper bridge 433 and the lower bridge 432, facilitating the current of the chip 42 to flow to the power terminal 44 for output through the upper bridge 433 and the lower bridge 432.

[0065] Further, an upper strengthening beam 4334 is arranged at the end of each upper bridge body unit 4330. The axis of the upper strengthening beam 4334 is arranged parallel to the axis of the upper connecting beam 4331. Combined with Figure 4 As shown, the setting of the lower strengthening beam 4323 strengthens the strength of the lower bridge 432.

[0066] Further, the conductive connection portion 43 includes: a central beam 434. Multiple pin groups are arranged on the central beam 434. The multiple pin groups are arranged at intervals along the length direction of the central beam 434. Among them, the multiple pin groups include a first pin 4341, a second pin 4342, and a third pin 4343. The first pin 4341 and the second pin 4342 are located on the first side of the central beam 434, and the third pin 4343 is located on the second side of the central beam 434. The first side and the second side are arranged opposite to each other. The first pin 4341 and the second pin 4342 are connected to the chip 42, and the third pin 4343 is connected to the upper copper layer 41.

[0067] Combined with Figure 5 As shown, in this embodiment, the first pin 4341 and the second pin 4342 are connected to the chip 42, and the third pin 4343 is connected to the upper copper layer 41. The central beam 434 is used to realize the connection of multiple circuit modules, facilitating the current of the chip 42 to flow to the power terminal 44 for output through the multiple pin groups and the central beam 434.

[0068] In another embodiment of the present application, when the chip 42 is symmetrically arranged, only one central beam 434 is used, and multiplexing between each bridge arm can meet the connection requirements. At the same time, the connection width of the central beam 434 can be increased to enhance the freewheeling capacity and heat dissipation capacity.

[0069] In another embodiment of the present application, when the chip 42 is asymmetrically arranged, according to the position of the chip 42, the dimensions of each part of the central beam 434 and multiple pin groups can be changed to meet the connection requirements. At the same time, a current sharing design can be made for the entire circuit as needed.

[0070] Further, the distance from the farthest end of the first pin 4341 to the axis of the central beam 434 is set differently from the distance from the farthest end of the second pin 4342 to the axis of the central beam 434. As shown in combination Figure 5 to enable the connection of multiple circuit modules.

[0071] In another embodiment of the present application, the power terminal 44 includes an AC terminal and a DC terminal. The power terminal 44 is externally connected by laser welding instead of bolt connection, reducing parasitic inductance, reducing assembly parts, reducing the overall weight, reducing costs, and improving the efficiency and power density of the plastic-encapsulated power module.

[0072] In another embodiment of the present application, silver sintering technology is used on the upper and lower surfaces of the chip 42, increasing the reliability of the operation of the plastic-encapsulated power module.

[0073] As shown in combination Figure 7 and Figure 8 in another embodiment of the present application, first, the chip 42 is fixed on the insulating substrate 30 by welding or silver sintering. One end of the copper strip 431 with a special-shaped hole is welded or silver sintered on the upper surface of the chip 42, and the other end of the copper strip 431 with a special-shaped hole is welded or silver sintered on the insulating substrate 30 through welding to complete the connection of the chip 42. Then, the lead frames of the power terminal 44 and the signal terminal 45 are welded to the insulating substrate 30 (as shown in combination Figure 7 ). Next, the insulating substrate 30, the chip 42, the copper strip 431, the lead frames of the power terminal 44 and the signal terminal 45 are integrally plastic-encapsulated, the three-phase full bridge of the circuit module is integrally plastic-encapsulated, the plastic-encapsulated circuit module is welded to the heat dissipation substrate 10 with PINFIN, the lead frames in the plastic-encapsulated and cured circuit module are cut, and the power terminal 44 and the signal terminal 45 are formed (as shown in combination Figure 8As shown in the figure. Finally, the potted power module is fixed to the main housing of the inverter by bolt connection. The power terminals 44 are completed by laser welding or bolt connection with the capacitors and busbars. When the power terminals are bolt-connected, through holes need to be machined on the module power terminals. The potted power module adopts an overall potting method and is welded to the heat dissipation substrate 10 after curing and forming, which simplifies the manufacturing process steps.

[0074] In another embodiment of the present invention, a vehicle is provided, including the above-mentioned potted power module.

[0075] Specifically, the potted power module includes: a heat dissipation substrate 10; a lower copper layer 20, which is connected to the heat dissipation substrate 10; an insulating liner 30, which is connected to the lower copper layer 20, and the lower copper layer 20 is located between the insulating liner 30 and the heat dissipation substrate 10; a circuit module 40, the circuit module includes an upper copper layer 41, the upper copper layer 41 is arranged on the side of the insulating liner 30 away from the lower copper layer 20, and a chip 42, at least one conductive connection part 43, a power terminal 44 and a signal terminal 45 are arranged on the upper copper layer 41, and the chip 42 is connected to at least one of the power terminal 44 and the signal terminal 45 through the conductive connection part 43; a potted housing 50, the potted housing 50 is connected to the heat dissipation substrate 10 and encloses a potted cavity, and the potted housing 50 pots the lower copper layer 20, the insulating liner 30, the upper copper layer 41, the chip 42, and at least part of the conductive connection part 43, at least part of the power terminal 44 and at least part of the signal terminal 45 in the potted cavity.

[0076] Combined with Figure 1 As shown in the figure, in this embodiment, the potted power module includes a heat dissipation substrate 10, a lower copper layer 20, an insulating liner 30, a circuit module 40 and a potted housing 50. Among them, the lower copper layer 20 is connected to the heat dissipation substrate 10, the insulating liner 30 is connected to the lower copper layer 20, the lower copper layer 20 is located between the insulating liner 30 and the heat dissipation substrate 10, the circuit module 40 includes an upper copper layer 41, the upper copper layer 41 is arranged on the side of the insulating liner 30 away from the lower copper layer 20, and a chip 42, at least one conductive connection part 43, a power terminal 44 and a signal terminal 45 are arranged on the upper copper layer 41, the chip 42 is connected to at least one of the power terminal 44 and the signal terminal 45 through the conductive connection part 43, the potted housing 50 is connected to the heat dissipation substrate 10 and encloses a potted cavity, and the potted housing 50 pots the lower copper layer 20, the insulating liner 30, the upper copper layer 41, the chip 42, and at least part of the conductive connection part 43, at least part of the power terminal 44 and at least part of the signal terminal 45 in the potted cavity, which simplifies the manufacturing process steps. Such a setting improves the heat dissipation efficiency, improves the module voltage level, and improves the performance of the potted power module.

[0077] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0078] The plastic package housing 50 is connected to the heat dissipation substrate 10 and encloses a plastic package cavity. The plastic package housing 50 encapsulates the lower copper layer 20, the insulating liner 30, the upper copper layer 41, the chip 42, at least part of the conductive connection portion 43, at least part of the power terminals 44, and at least part of the signal terminals 45 in the plastic package cavity, simplifying the manufacturing process steps.

[0079] The chip 42 is connected to at least one of the power terminals 44 and the signal terminals 45 through the lower bridge 432 and the upper bridge 433. The lower bridge 432 and the upper bridge 433 are in a plate-like structure, which can increase the heat dissipation area, improve the current flow capacity and the conductive capacity. In addition, both the lower bridge 432 and the upper bridge 433 are integrally formed, reducing the number of assembled parts and the overall weight.

[0080] When the chips 42 are symmetrically arranged, only one kind of center beam 434 is used and can be reused between the bridge arms to meet the connection requirements. At the same time, the connection width of the center beam 434 can be increased to enhance the freewheeling capacity and the heat dissipation capacity. When the chips 42 are asymmetrically arranged, according to the positions of the chips 42, by changing the dimensions of various parts of the center beam 434 and the multiple pin groups, the connection requirements can be met. At the same time, a current sharing design can be made for the entire circuit as needed.

[0081] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper" etc. can be used here to describe the spatial position relationship of a device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation shown in the figure of the device. For example, if the device in the drawing is inverted, the device described as "above" or "over" other devices or structures will be positioned "below" or "beneath" other devices or structures afterwards. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations are made for the spatial relative descriptions used here.

[0082] In addition to the above, it should also be noted that in this specification, "one embodiment", "another embodiment", "embodiment", etc. refer to the specific features, structures or characteristics described in connection with that embodiment being included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in connection with any one embodiment, it is intended that the implementation of such feature, structure or characteristic in combination with other embodiments also falls within the scope of the present invention.

[0083] In the above embodiments, the descriptions of the respective embodiments have their own focuses. For the parts not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0084] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A plastic-encapsulated power module, characterized in that, it comprises: a heat dissipation substrate (10); a lower copper layer (20), the lower copper layer (20) being connected to the heat dissipation substrate (10); an insulating liner (30), the insulating liner (30) being connected to the lower copper layer (20), the lower copper layer (20) being located between the insulating liner (30) and the heat dissipation substrate (10); a circuit module (40), the circuit module (40) comprising an upper copper layer (41), the upper copper layer (41) being disposed on a side of the insulating liner (30) away from the lower copper layer (20), a chip (42), at least one conductive connection part (43), a power terminal (44) and a signal terminal (45) being disposed on the upper copper layer (41), the chip (42) being connected to at least one of the power terminal (44) and the signal terminal (45) through the conductive connection part (43); the conductive connection part (43) comprises a central beam (434), a plurality of pin groups being disposed on the central beam (434), the plurality of pin groups being spaced apart along the length direction of the central beam (434), wherein, the plurality of pin groups comprise a first pin (4341), a second pin (4342) and a third pin (4343), the first pin (4341) and the second pin (4342) being located on a first side of the central beam (434), the third pin (4343) being located on a second side of the central beam (434), the first side and the second side being oppositely disposed, the first pin (4341) and the second pin (4342) being connected to the chip (42), the third pin (4343) being connected to the upper copper layer (41); a plastic-encapsulated housing (50), the plastic-encapsulated housing (50) being connected to the heat dissipation substrate (10) and enclosing a plastic-encapsulated cavity, and the plastic-encapsulated housing (50) encapsulating the lower copper layer (20), the insulating liner (30), the upper copper layer (41), the chip (42), and at least part of the conductive connection part (43), at least part of the power terminal (44) and at least part of the signal terminal (45) in the plastic-encapsulated cavity.

2. The plastic-encapsulated power module according to claim 1, characterized in that, there are a plurality of the circuit modules, and the conductive connection part (43) of one of the adjacent circuit modules is connected to another circuit module.

3. The plastic-encapsulated power module according to claim 2, characterized in that, the plurality of circuit modules include a first circuit module and a second circuit module, the first circuit module includes a first copper layer, a first chip and a first conductive part, the second circuit module includes a second copper layer, a second chip and a second conductive part, one end of the first conductive part is connected to the first chip, the other end of the first conductive part is connected to the second copper layer, and / or, one end of the second conductive part is connected to the second chip, the other end of the second conductive part is connected to the first copper layer.

4. The plastic-encapsulated power module according to claim 3, wherein, at least one of the first conductive part and the second conductive part includes a copper strip (431), and the copper strip (431) includes: a copper strip body (4310), the copper strip body (4310) has a plate-like structure, the middle of the copper strip body (4310) is recessed on the side away from the insulating lining plate (30), and the connecting surfaces at both ends of the copper strip body (4310) are arranged flush.

5. The plastic-encapsulated power module according to claim 4, wherein, at least one end of the copper strip body (4310) is provided with at least one connecting hole, wherein the cross-section of the connecting hole is circular, elliptical, regular polygon or special-shaped structure.

6. The plastic-encapsulated power module according to claim 1, wherein, the conductive connecting parts (43) in at least one of the circuit modules are multiple, and the structure of at least one of the multiple conductive connecting parts (43) is set differently from the structures of the others, and / or, at least two of the multiple conductive connecting parts (43) are arranged in a layered manner along the thickness direction of the heat dissipation substrate (10).

7. The plastic-encapsulated power module according to claim 1 or 6, wherein, the circuit modules are multiple, and the structure of the conductive connecting part (43) in at least one of the multiple circuit modules is set differently from the structure of the conductive connecting part (43) in the other circuit modules.

8. The plastic-encapsulated power module according to claim 6, wherein, the conductive connecting part (43) in at least one of the circuit modules includes multiple conductive connecting parts (43), the multiple conductive connecting parts (43) include a lower bridge (432) and an upper bridge (433), wherein at least part of the lower bridge (432) is located below the upper bridge (433).

9. The plastic-encapsulated power module according to claim 8, wherein, the lower bridge (432) includes: Lower bridge body units (4320), with multiple of the lower bridge body units (4320). The middle parts of the multiple lower bridge body units (4320) are connected by a lower connecting beam (4321). Moreover, the multiple lower bridge body units (4320) are arranged at intervals along the length direction of the lower bridge body units (4320). Along the length direction of each lower bridge body unit (4320), the body of each lower bridge body unit (4320) is bent to form a first bending structure (4322). There are multiple of the first bending structures (4322), and the opening directions of the multiple first bending structures (4322) are arranged alternately along the length direction of the lower bridge body units (4320). Located on both sides of the lower connecting beam (4321), and the opening direction of the first bending structure (4322) with the largest distance from the lower connecting beam (4321) is set towards the side of the plastic package housing (50). Among the multiple lower bridge body units (4320), the bottom of the first bending structure (4322) with the largest distance from the lower connecting beam (4321) of one of the lower bridge body units (4320) is connected to the upper copper layer (41), and the bottom of the first bending structure (4322) with the closest distance from the lower connecting beam (4321) of another lower bridge body unit (4320) is connected to the chip (42).

10. The plastic package power module according to claim 9, wherein, Each end of each lower bridge body unit (4320) is provided with a lower strengthening beam (4323), and the axis of the lower strengthening beam (4323) is arranged parallel to the axis of the lower connecting beam (4321).

11. The plastic package power module according to claim 9, wherein, The upper bridge (433) includes: Upper bridge body units (4330), with multiple of the upper bridge body units (4330). The middle parts of the multiple upper bridge body units (4330) are connected by an upper connecting beam (4331). Moreover, the multiple upper bridge body units (4330) are arranged at intervals along the length direction of the upper bridge body units (4330). Along the length direction of each lower bridge body unit (4320), two second bending structures (4332) are formed at both ends of the body of each upper bridge body unit (4330). The openings of the second bending structures (4332) are set towards the side of the plastic package housing (50). The bottoms of the second bending structures (4332) of each upper bridge body unit (4330) are connected to the chip (42). At both ends of the upper connecting beam (4331), a connecting hook part (4333) is respectively provided, and the connecting hook part (4333) extends towards the side of the upper copper layer (41) and is connected to the upper copper layer (41).

12. The plastic package power module according to claim 11, wherein, Each end of each upper bridge body unit (4330) is provided with an upper strengthening beam (4334), and the axis of the upper strengthening beam (4334) is arranged parallel to the axis of the upper connecting beam (4331).

13. The plastic-encapsulated power module according to claim 1, characterized in that, the distance from the farthest end of the first pin (4341) to the axis of the central beam (434) is set differently from the distance from the farthest end of the second pin (4342) to the axis of the central beam (434).

14. A vehicle, comprising a plastic-encapsulated power module, characterized in that, the plastic-encapsulated power module is the plastic-encapsulated power module according to any one of claims 1 to 13.

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