Semi-folded printed circuit board with uncovering opening

Abstract

This invention discloses a semi-bent printed circuit board with a retractable opening, comprising a core substrate, two metal blocking structures, an adhesive film, and a core plate. The core substrate inner side surrounds the retractable opening. The two metal blocking structures are disposed on one side surface of the core substrate and together with the core substrate surround the retractable opening. The adhesive film is adhered to this side surface of the core substrate, with a portion exposed above the retractable opening. The core plate is disposed on the side surface of the adhesive film away from the core substrate. The bottom two sides of the core substrate surrounding the retractable opening each have two laser-cut sidewalls. The sidewalls of the two metal blocking structures surrounding the retractable opening are respectively connected to the two laser-cut sidewalls and are each defined as a metal blocking sidewall. An obtuse angle is formed between the metal blocking sidewalls and the laser-cut sidewalls.

Description

Technical Field

[0001] This invention relates to a printed circuit board, and more particularly to a semi-bent printed circuit board with a retractable opening. Background Technology

[0002] In existing technologies, after the capping process in circuit board manufacturing, the edges of the capping opening may become mixed with the peelable adhesive and PP glue, making the peelable adhesive difficult to remove during cleaning. Furthermore, in existing technologies, the angle of the capping opening edge is affected by the laser, causing problems with chemical exchange and resulting in prolonged peeling time for the peelable adhesive. There is also a risk of residual peelable adhesive, which may affect the electrical characteristics of the finished circuit board. In other words, printed circuit boards with capping openings in existing technologies may suffer from reduced reliability due to residual adhesive.

[0003] Therefore, how to provide a semi-bent printed circuit board with a flip-up opening to overcome the above-mentioned defects has become one of the important issues that this project aims to solve. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a semi-bent printed circuit board with a cover opening to address the shortcomings of the prior art.

[0005] To solve the aforementioned technical problems, one technical solution adopted by the present invention is to provide a semi-bent printed circuit board with a removable opening, comprising: a core substrate, with a removable opening inside, and the removable opening penetrating two opposite side surfaces of the core substrate; two metal blocking structures disposed on one of the side surfaces of the core substrate, and together with the core substrate, surrounding the removable opening; and an adhesive film adhered to the side surface of the core substrate where the two metal blocking structures are disposed, with a portion of the adhesive film exposed above the removable opening. The core substrate and the core plate together surround the opening; and a core plate is disposed on the surface of the adhesive film away from the core substrate; wherein the core substrate has two laser-cut sidewalls on the bottom sides surrounding the opening, and the two metal blocking structures surrounding the opening are respectively connected to the two laser-cut sidewalls, and each is defined as a metal blocking sidewall; wherein, in each metal blocking sidewall and the laser-cut sidewall connected to it, there is an included angle of 120 degrees to 150 degrees between the metal blocking sidewall and the laser-cut sidewall.

[0006] The beneficial effects of the present invention are that the semi-bent printed circuit board with a retractable opening provided by the present invention can be constructed by: a core substrate, which internally surrounds a retractable opening and the retractable opening penetrates two opposite side surfaces of the core substrate; two metal blocking structures disposed on one of the side surfaces of the core substrate and together with the core substrate surround the retractable opening; an adhesive film adhered to the side surface of the core substrate where the two metal blocking structures are disposed, and a portion of the adhesive film is exposed to the retractable opening and together with the core substrate surrounds the retractable opening; and a core plate disposed on the core substrate. The adhesive film is applied to the surface of the side away from the core substrate; wherein the core substrate has two laser-cut sidewalls on each of the bottom sides surrounding the opening, and the two metal blocking structures surrounding the opening are respectively connected to the two laser-cut sidewalls, and each is defined as a metal blocking sidewall; wherein, in each metal blocking sidewall and the laser-cut sidewall connected thereis an angle of 120 degrees to 150 degrees, the technical solution is to solve the problem of difficult removal of peelable printing ink and reduce the possibility of peelable printing ink residue, thereby improving the reliability of the printed circuit board.

[0007] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of a semi-bent printed circuit board according to an embodiment of the present invention;

[0009] Figure 2 for Figure 1 A magnified view of a portion of region II in the middle;

[0010] Figure 3 for Figure 1 A schematic diagram of the semi-bent state of a semi-bent printed circuit board;

[0011] Figure 4 for Figure 1 Schematic diagram of electronic components embedded in a semi-bent printed circuit board;

[0012] Figure 5A A schematic diagram of step S110 of the printed circuit board peeling method according to an embodiment of the present invention;

[0013] Figure 5B A schematic diagram of step S120 of the printed circuit board peeling method according to an embodiment of the present invention;

[0014] Figure 5C A schematic diagram of step S130 of the printed circuit board peeling method according to an embodiment of the present invention;

[0015] Figure 5D A schematic diagram of step S140 of the printed circuit board peeling method according to an embodiment of the present invention;

[0016] Figure 5E A schematic diagram of step S150 of the printed circuit board peeling method according to an embodiment of the present invention;

[0017] Figure 5F A schematic diagram of step S160 of the printed circuit board peeling method according to an embodiment of the present invention;

[0018] Figure 5G A schematic diagram of step S170 of the printed circuit board peeling method according to an embodiment of the present invention.

[0019] Symbol Explanation

[0020] 100: Printed Circuit Board

[0021] 1: Core substrate

[0022] 2: Metal barrier structure

[0023] 21: Metal barrier sidewall

[0024] 3: Laser-cut grooves

[0025] 31: Laser-cut sidewall

[0026] 4: Metal circuit pattern

[0027] 5: Laminating film

[0028] 6: Core Materials

[0029] M: Metallic coating

[0030] R: Printing area

[0031] B: Bending area

[0032] E: Electronic components

[0033] W: Width

[0034] H: Height

[0035] I: Peelable printing ink

[0036] I1: Residual ink

[0037] F: Blind end mill

[0038] F1: Blindly opening

[0039] C: Opening structure

[0040] C1: Opening the lid

[0041] α: included angle Detailed Implementation

[0042] The following specific embodiments illustrate the implementation methods disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0043] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0044] Please see Figures 1 to 4 As shown, an embodiment of the present invention provides a semi-bent printed circuit board 100 with a flip-top opening, which includes a core substrate 1, two metal blocking structures 2, a metal circuit pattern 4, an adhesive film 5, and a core board material 6.

[0045] The inner side of the core substrate 1 surrounds a cover opening C1, and the cover opening C1 penetrates two opposite side surfaces of the core substrate 1 (e.g., Figure 1 The upper and lower surfaces of the core substrate 1). The two metal blocking structures 2 and the metal circuit pattern 4 are formed on one of the side surfaces of the core substrate 1 (e.g., the upper and lower surfaces of the core substrate 1). Figure 1 The core substrate 1 has a lower surface surrounded by two metal blocking structures 2, which together with the core substrate 1 enclose the opening C1. In this embodiment, the metal circuit pattern 4 is located outside the two metal blocking structures 2, and there is a gap between the metal circuit pattern 4 and the metal blocking structures 2, but the present invention is not limited thereto.

[0046] The bonding film 5 is bonded to the side surface of the core substrate 1, which has two metal blocking structures 2 and a metal circuit pattern 4. The portion of the bonding film 5 located inside the two metal blocking structures 2 is exposed to the opening C1, and together with the core substrate 1, surrounds the opening C1. In other words, the inner side of the core substrate 1, the two metal blocking structures 2, and the portion of the bonding film 5 exposed to the opening C1 together define the opening C1.

[0047] The core plate 6 is disposed on the surface of the bonding film 5 away from the core substrate 1 (e.g., Figure 1 (Lower surface of the bonding film 5).

[0048] In this embodiment, the core substrate 1 has two laser-cut sidewalls 31 on both sides of the bottom of the opening C1, and the two metal blocking structures 2 are connected to the two laser-cut sidewalls 31, and each is defined as a metal blocking sidewall 21.

[0049] like Figure 2 As shown, in each of the metal blocking sidewalls 21 and the laser cutting sidewalls 31 connected thereto, the metal blocking sidewalls 21 and the laser cutting sidewalls 31 have an included angle α between 120 degrees and 150 degrees, and preferably between 130 degrees and 140 degrees.

[0050] like Figure 2 As shown, the area with an angle α between the metal blocking sidewall 21 and the laser-cut sidewall 31 is defined as a rinsing space. The rinsing space can provide a chemical rinse during a capping operation so that there is no residue of peelable printing ink in the rinsing space.

[0051] In other words, in the existing technology, after the cover removal operation in the circuit board manufacturing process, the edge of the cover opening may be mixed with the peelable adhesive and PP adhesive. Therefore, during cleaning, the peelable adhesive may be difficult to remove, and the solution may be difficult to exchange, which may easily lead to residual adhesive. This problem can be effectively solved, thereby improving the reliability of the printed circuit board.

[0052] Each of the metal blocking structures 2 is approximately rectangular in shape (e.g., ...). Figure 2 (As shown) or trapezoidal (not shown in the figure), and each metal barrier structure 2 has a width W between 30 micrometers and 600 micrometers and a height H between 15 micrometers and 300 micrometers (see also) Figure 5B ).

[0053] Please continue reading. Figure 1The opening C1 is generally wider at the top and narrower at the bottom (like an inverted convex shape). The two metal blocking sidewalls 21 and the two laser-cut sidewalls 31 together define the narrower part of the opening C1.

[0054] like Figure 3 As shown, in one embodiment of the present invention, the section of the printed circuit board 100 located at the cover opening C1 is defined as a half-bending section B, and the printed circuit board 10 can be bent from the half-bending section B.

[0055] like Figure 4 As shown, in one embodiment of the present invention, the printed circuit board 100 further includes an electronic component E, which is embedded in the cover opening C1, and the electronic component E may be, for example, a resistor or a capacitor.

[0056] Please continue reading. Figure 1 As shown, one side surface of the bonding film 5 is bonded to two metal blocking structures 2 and a metal circuit pattern 4 on the core substrate 1, and further recessed into the gap between the outer side of the two metal blocking structures 2 and the metal circuit pattern 4, so as to bond to the side surface of the core substrate 1, and the other side surface of the bonding film 5 is bonded to the core plate 6, so as to bond the core substrate 1 and the core plate 6 together.

[0057] Furthermore, the metal blocking sidewalls 21 of the two metal blocking structures 2 face the opening C1 and are not adhered to by the adhesive sheet 5 (i.e., the metal blocking sidewalls 21 do not directly contact the adhesive sheet 5), and the metal blocking sidewalls 21 of the two metal blocking structures 2 are approximately perpendicular to the adhesive sheet 5. For example, the metal blocking sidewalls 21 and the adhesive sheet 5 have an angle between 80 degrees and 100 degrees.

[0058] In some embodiments of the present invention, the two metal blocking structures 2 are formed by a metal etching operation, and the two laser-cut sidewalls 31 are formed by a laser cutting operation, but the present invention is not limited thereto.

[0059] The above describes the structural features of the semi-bent printed circuit board with a cover opening according to an embodiment of the present invention. The following will describe the cover opening method of the semi-bent printed circuit board according to an embodiment of the present invention and the related material features.

[0060] Please see Figures 5A to 5GAs shown, this embodiment of the invention provides a cover-opening method for a semi-flex printed circuit board, which includes steps S110, S120, S130, S140, S150, S160, and S170. It must be noted that the order of the steps and the actual operation method described in this embodiment can be adjusted according to requirements and are not limited to those described in this embodiment.

[0061] The method for peeling off a semi-bent printed circuit board according to embodiments of the present invention may provide additional operations before, during, or after each step, and some of the described operations may be substituted, eliminated, or rearranged to achieve additional implementations of the method. The following is in conjunction with... Figures 1 to 5G Describe the method for removing the cover from a semi-bent printed circuit board.

[0062] Figure 5A This is a schematic diagram of step S110 of the printed circuit board peeling method according to an embodiment of the present invention. Step S110 includes: providing a core substrate 1 (also known as a core board), and both side surfaces of the core substrate 1 are covered with a metal cover layer M (such as copper foil).

[0063] Figure 5B This is a schematic diagram of step S120 of the printed circuit board peeling method according to an embodiment of the present invention. Step S120 includes: performing a metal etching operation to form two protruding metal dam structures 2 and a metal circuit pattern 4 on one side surface of the core substrate 1; and performing a laser cutting operation to form two laser cut grooves 3 recessed from the side surface of the core substrate 1.

[0064] The inner sides of the two metal barrier structures 2 surround a printed area R on the core substrate 1. The two laser-cut grooves 3 are formed by recessing from the surface of the core substrate 1 on this side. The positions of the two laser-cut grooves 3 correspond to the printed area R and are respectively formed adjacent to each other on the inner sides of the two metal barrier structures 2. That is, the core substrate 1 has a laser-cut groove 3 formed adjacent to each metal barrier structure 2 on its inner side. It is worth mentioning that... Figure 2 The two metal blocking structures 2 and the two laser-cut grooves 3 are viewed from a cross-section of the circuit board structure.

[0065] Viewed from a top view of the circuit board structure, the metal barrier structure 2 can be, for example, two elongated dams surrounding and forming the printed area R. However, the present invention is not limited to this; the metal barrier structure 2 can also be, for example, a continuous ring structure (not shown) surrounding and forming the printed area R. As long as the structural design of the metal barrier structure 2 can surround and form the printed area R, it conforms to the spirit of the present invention and falls within the scope of protection of the present invention.

[0066] More specifically, the metal etching operation is to etch (e.g., wet etching or dry etching) the metal cover layer M on the core substrate 1 to remove part of the metal cover layer M, thereby forming the two protruding metal barrier structures 2 on the core substrate 1.

[0067] It is worth mentioning that after part of the metal cover layer M is removed, the core substrate 1 further forms the metal circuit pattern 4, which is not located in the printed area R, but the present invention is not limited thereto. The metal circuit pattern 4 is used to connect electronic components together and provide the electrical characteristics required by the printed circuit board. In addition, it is worth mentioning that the metal barrier structure 2 can be a structure that simply has a barrier function, but it can also be, for example, another metal circuit pattern that also has an electrical connection function.

[0068] Furthermore, in each of the metal blocking structures 2, the material of the metal blocking structure 2 is copper, and one cross-section of the metal blocking structure 2 is approximately rectangular (e.g., Figure 2 It may be trapezoidal (not shown in the figure). The width W of the metal barrier structure 2 is preferably between 30 micrometers and 600 micrometers, more preferably between 30 micrometers and 175 micrometers, and particularly preferably between 50 micrometers and 155 micrometers. The height H of the metal barrier structure 2 is between 15 micrometers and 300 micrometers, and preferably between 17.5 micrometers and 280 micrometers.

[0069] The laser cutting operation utilizes a laser cutting machine (e.g., a PCB laser cutting machine) to laser cut the core substrate 1, removing a portion of the material from the core substrate 1. This creates two recessed laser-cut grooves 3 on the core substrate 1. In this embodiment, each laser-cut groove 3 is approximately V-shaped, but the invention is not limited to this. Furthermore, the depth of each laser-cut groove 3 can be adjusted according to the product design requirements.

[0070] Figure 5CThis is a schematic diagram of step S130 of the printed circuit board peeling method according to an embodiment of the present invention. Step S130 includes: performing a printing operation to print a peelable printing ink I in the printing area R inside the two metal barrier structures 2 on the core substrate 1, and the peelable printing ink I can be further filled into the two laser-cut grooves 3 during the printing process.

[0071] The method for removing the cover of the semi-bent printed circuit board in this embodiment of the invention can avoid the overflow of peelable printing ink I during the printing process by using the design of the metal blocking structure 2 and the laser cutting groove 3, and can also help improve the peeling efficiency and removal effect of peelable printing ink I in subsequent peeling operations.

[0072] More specifically, the metal blocking structure 2 prevents the peelable printing ink I from overflowing during the printing process. Furthermore, the peelable printing ink I is filled into the laser-cut groove 3 during printing, which also helps prevent the peelable printing ink I from overflowing from the metal blocking structure 2. Moreover, the laser-cut groove 3 improves the subsequent peeling efficiency and removal effect of the peelable printing ink I.

[0073] Regarding the type of material, the peelable printing ink I can be, for example, commonly used peelable inks for PCBs, gold finger protective inks, anti-plating inks, PI or PFG, etc., but not limited to materials that can assist in separation. Furthermore, step S130 further includes: air-drying or baking the peelable printing ink I to make the peelable printing ink I present a cured state, so as to facilitate subsequent peeling operations.

[0074] Figure 5D This is a schematic diagram of step S140 of the printed circuit board peeling method according to an embodiment of the present invention. Step S140 includes: performing a pressing operation to press an additive board structure onto the side surface of the core substrate 1 on which the metal barrier structure 2 is provided; and performing a blind-finding operation to blind-find the other side surface of the core substrate 1 using a blind-finding forming machine.

[0075] The added-layer structure includes an adhesive sheet 5 (e.g., PP adhesive, also known as a prepreg) and a core board 6 (e.g., another core board). The adhesive sheet 5 is bonded between the core substrate 1 and the core board 6 to adhere the core substrate 1 and the core board 6 together.

[0076] More specifically, one side surface of the bonding film 5 is bonded to the peelable printing ink I, the metal barrier structure 2, and the metal circuit pattern 4, and the bonding film 5 is embedded in the gap between the metal barrier structure 2 and the metal circuit pattern 4 (the portion not located in the printing area R) to further bond to the core substrate 1. Furthermore, the other side surface of the bonding film 5 is bonded to the core plate 6.

[0077] Furthermore, the blind cleaning operation involves using two blind cleaning cutters F, each aligned with one of the two laser-cut grooves 3, to blindly clean from the other side surface of the core substrate 1. Each blind cleaning cutter F cleans from the other side surface of the core substrate 1 toward the laser-cut groove 3, and the cleaning range of each blind cleaning cutter F partially overlaps with the laser-cut groove 3, in order to remove a portion of the peelable printing ink I filled in the laser-cut groove 3.

[0078] Furthermore, the blind-fishing depth of each blind-fishing cutter F is less than the thickness of the core substrate 1, meaning that each blind-fishing cutter F does not penetrate the core substrate 1 after the blind-fishing operation is completed.

[0079] Please continue reading. Figure 5D As shown, in this embodiment, each blind milling cutter F is not aligned with the center line of its corresponding laser-cut groove 3 for blind milling. Instead, each blind milling cutter F performs blind milling with its corresponding laser-cut groove 3 slightly off-center from the printing area R, in order to facilitate subsequent capping operations. However, the present invention is not limited to this.

[0080] Figure 5E This is a schematic diagram of step S150 of the printed circuit board peeling method according to an embodiment of the present invention. Step S150 includes: removing the two blind milling cutters F to form two blind milling openings F1 on the core substrate 1. More specifically, the two blind milling openings F1 are formed by recesses from the other side surface of the core substrate 1 toward the two metal blocking structures 2, and are complementary in shape to the blind milling cutters. The blind milling range of the two blind milling openings F1 partially overlaps with the two laser-cut grooves 3 to partially remove the peelable printing ink I filled in the laser-cut grooves 3. Furthermore, the blind milling range of the two blind milling openings F1 does not cover the metal blocking structures 2.

[0081] Figure 5F This is a schematic diagram of step S160 of the printed circuit board peeling method according to an embodiment of the present invention. Step S160 includes: performing a peeling operation to remove a peeling structure C located between two blind openings F1 on the core substrate 1, thereby forming a peeling opening C1.

[0082] During the capping operation, the capping structure C located between the two blind fishing openings F1 separates from the laminated sheet structure (including the bonding film 5 and the core sheet 6) from the positions of the two laser-cut grooves 3. The capping structure C generally presents an "inverted convex" shape that is wider at the top and narrower at the bottom, but the present invention is not limited to this.

[0083] More specifically, the cover structure C includes a portion of the core substrate 1 material and a portion of the peelable printable ink I material, and the cover structure C is separated from the laminate structure from the position of the two laser-cut grooves 3 by the peelable printable ink I, thereby forming a cover opening C1 that is complementary in shape to the cover structure C.

[0084] After the capping operation is completed, the bottom of the capping opening C1, located on the side wall of the adhesive film 5, the metal blocking structure 2, and the laser-cut groove 3, contains residual ink I1 left by the peelable printing ink I, which needs to be further removed by subsequent steps.

[0085] Figure 5G This is a schematic diagram of step S170 of the printed circuit board peeling method according to an embodiment of the present invention. Step S170 includes: performing a cleaning operation to remove residual ink I1 located at the bottom of the peeling opening C1.

[0086] The cleaning operation involves using chemical agents to clean the residual ink I1 located at the bottom of the opening C1 of the cap, thereby removing the residual ink I1. The chemical agent may be, for example, a chemical agent containing modified alcohol ethers, but the invention is not limited thereto.

[0087] Please refer to the following: Figure 2 As shown, the sidewall facing the opening C1 of each metal blocking structure 2 is defined as a metal blocking sidewall 21, and the sidewall facing the opening C1 of each laser-cut groove 3 is defined as a laser-cutting sidewall 31. An angle α is formed between the metal blocking sidewall 21 and the laser-cutting sidewall 31, and the angle α is preferably between 120 degrees and 150 degrees, and more preferably between 130 degrees and 140 degrees. For example, the angle α can be, for instance, 135 degrees.

[0088] Because there is an included angle α between the metal blocking sidewall 21 and the laser cutting sidewall 31, a rinsing space can be formed between them. Therefore, the chemical agent can undergo sufficient chemical exchange within the rinsing space between the metal blocking sidewall 21 and the laser cutting sidewall 31 to thoroughly remove residual ink I1 located between them.

[0089] In existing technologies, during the circuit board manufacturing process, after the unpacking operation, the edges of the unpacking opening may become mixed with the peelable adhesive and PP glue, making the peelable adhesive difficult to remove during cleaning. According to the circuit board unpacking method provided in this embodiment of the invention, the peelable printing ink I (i.e., peelable adhesive) no longer contacts the edge of the bonding film 5 (i.e., PP glue), and the blind-feeding opening F1 directly aligns with the laser-cut groove 3, thus solving the aforementioned problem of difficult peelable adhesive removal.

[0090] Furthermore, in existing technologies, the angle of the opening edge of the peel-off panel is affected by the laser, causing problems with the exchange of chemicals. This results in a long peeling time for the peelable adhesive and a risk of adhesive residue, which may affect the electrical characteristics of the finished circuit board. According to the printed circuit board peeling method provided in this embodiment of the invention, the side of the peelable printed ink I (i.e., the peelable adhesive) is connected to the metal blocking structure 2 (i.e., the metal circuit). The copper surface of the metal makes it relatively easy to remove the peelable printed ink I, thereby reducing the possibility of peelable printed ink I residue.

[0091] Furthermore, the method for removing the cover of the semi-bent printed circuit board in this embodiment of the invention, through the design of the metal blocking structure 2 and the laser-cut groove 3, can prevent the peelable printing ink I from overflowing during the printing process, and can also help improve the peeling efficiency and removal effect of the peelable printing ink I in subsequent peeling operations. More specifically, the metal blocking structure 2 can prevent the peelable printing ink I from overflowing during the printing process, and the peelable printing ink I is filled into the laser-cut groove 3 during the printing process, which can also help prevent the peelable printing ink I from overflowing from the position of the metal blocking structure 2. Moreover, the laser-cut groove 3 can help improve the subsequent peeling efficiency and removal effect of the peelable printing ink I.

[0092] The beneficial effects of the present invention are that the semi-bent printed circuit board with a retractable opening provided by the present invention can be constructed by: a core substrate, which internally surrounds a retractable opening and the retractable opening penetrates two opposite side surfaces of the core substrate; two metal blocking structures disposed on one of the side surfaces of the core substrate and together with the core substrate surround the retractable opening; an adhesive film adhered to the side surface of the core substrate where the two metal blocking structures are disposed, and a portion of the adhesive film is exposed to the retractable opening and together with the core substrate surrounds the retractable opening; and a core plate disposed on the core substrate. The adhesive film is applied to the surface of the side away from the core substrate; wherein the core substrate has two laser-cut sidewalls on each of the bottom sides surrounding the opening, and the two metal blocking structures surrounding the opening are respectively connected to the two laser-cut sidewalls, and each is defined as a metal blocking sidewall; wherein, in each metal blocking sidewall and the laser-cut sidewall connected thereis an angle of 120 degrees to 150 degrees, the technical solution is to solve the problem of difficult removal of peelable printing ink and reduce the possibility of peelable printing ink residue, thereby improving the reliability of the printed circuit board.

[0093] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of the claims of the present invention.

Claims

1. A semi-bent printed circuit board with a flip-top opening, comprising: A core substrate, with an inner surrounding opening for opening, and the opening for opening penetrating two opposite side surfaces of the core substrate; Two metal blocking structures are disposed on one of the side surfaces of the core substrate and together with the core substrate surround the opening for opening; An adhesive film is attached to the side surface of the core substrate having two metal blocking structures, and a portion of the adhesive film is exposed to the opening for opening, while the opening for opening is surrounded by the core substrate. and A core plate is disposed on the side surface of the bonding film away from the core substrate; The core substrate has two laser-cut sidewalls on each of the bottom sides surrounding the opening. The two metal blocking structures surrounding the opening are connected to the two laser-cut sidewalls and are each defined as a metal blocking sidewall. In each metal blocking sidewall and the laser-cut sidewall connected to it, there is an angle of 120 to 150 degrees between the metal blocking sidewall and the laser-cut sidewall.

2. The semi-bent printed circuit board with a flip-top opening as claimed in claim 1, wherein the included angle is between 130 degrees and 140 degrees.

3. The semi-bent printed circuit board with a cap opening as claimed in claim 1, wherein the area with an angle between the metal blocking sidewall and the laser-cut sidewall is defined as a rinsing space, which provides chemical rinsing during the capping operation to ensure that there is no residue of peelable printing ink.

4. The semi-bent printed circuit board with a flip-top opening as claimed in claim 1, wherein each of the metal blocking structures is rectangular or trapezoidal in shape, and the width of each of the metal blocking structures is between 30 micrometers and 600 micrometers, and the height is between 15 micrometers and 300 micrometers.

5. The semi-bent printed circuit board with a retractable opening as claimed in claim 1, wherein the retractable opening has a shape that is wider at the top and narrower at the bottom, and the two metal blocking sidewalls and the two laser-cut sidewalls together define the narrower portion of the retractable opening.

6. The semi-bent printed circuit board with a cover opening as claimed in claim 1, wherein the section of the printed circuit board located at the cover opening is defined as a semi-bent section, and the printed circuit board is bendable from the semi-bent section.

7. The semi-bent printed circuit board with a hinged opening as claimed in claim 1, wherein the printed circuit board further comprises electronic components embedded in the hinged opening, and the electronic components are resistors or capacitors.

8. The semi-bent printed circuit board with a retractable opening as claimed in claim 1, wherein the side surface of the bonding film is bonded to the two metal blocking structures on the core substrate and further recessed into the gap outside the two metal blocking structures to bond to the side surface of the core substrate, and the other side surface of the bonding film is bonded to the core plate to bond the core substrate and the core plate together.

9. The semi-bent printed circuit board with a retractable opening as claimed in claim 8, wherein the metal blocking sidewalls of the two metal blocking structures face the retractable opening and are not bonded by the adhesive film, and the metal blocking sidewalls of the two metal blocking structures are substantially perpendicular to the adhesive film.

10. The semi-bent printed circuit board with a flip-up opening as claimed in claim 1, wherein the two metal blocking structures are formed by a metal etching operation, and the two laser-cut sidewalls are formed by a laser cutting operation.

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