A method for testing the temperature characteristics of electronic components

Abstract

A method for testing the temperature characteristics of electronic components is disclosed, based on a testing device. The testing device includes a test stand, a clamping fixture, and a control mechanism. The test stand includes a test body, a test plate mounted on the test body, a fixing block mounted on the test plate for fixing the clamping fixture, and a plurality of first contact probes spaced apart on the fixing block and connected to the test plate. The clamping fixture is used to mount and fix capacitors, including a clamping assembly for mounting and fixing capacitors, a positioning block at the bottom of the clamping assembly, and a plurality of second contact probes spaced apart in the positioning block and connected to the clamping assembly. The second contact probes are in contact with the corresponding first contact probes. The control mechanism is connected to the test plate and performs temperature characteristic testing on the capacitors on the clamping assembly. This application, by defining the structure and specific operation of the testing device, clamps and fixes multiple electronic components to be tested, and then, in conjunction with the control mechanism, completes the testing of all parameters.

Description

Technical Field

[0001] This invention belongs to the field of electronic component performance testing, specifically relating to a method for testing the temperature characteristics of electronic components. Background Technology

[0002] Capacitors are widely used components in electronic devices, and their temperature characteristics are one of the important indicators for evaluating capacitor quality. During capacitor manufacturing and use, in order to determine the relative change in capacitance at different test temperatures compared to the capacitance at a reference temperature, it is necessary to test the capacitor's temperature characteristics to assess its quality and reliability.

[0003] However, existing methods for testing the temperature characteristics of capacitors rely on three devices—an LCR meter, a CTV parameter conversion device, and a small ultra-low temperature test chamber—connected by wiring and fixtures. This results in low testing efficiency, inaccurate test results, and a cumbersome testing process, among other shortcomings and defects. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a method for testing the temperature characteristics of electronic components.

[0005] The present invention adopts the following technical solution:

[0006] A method for testing the temperature characteristics of electronic components, based on a testing device, the testing device including a test stand, a clamping fixture and a control mechanism;

[0007] The test fixture includes a test fixture body, a test plate disposed on the test fixture body, a fixing block disposed on the test plate for fixing a clamping fixture, and a plurality of first contact probes disposed at intervals on the fixing block and connected to the test plate.

[0008] A clamping fixture for mounting and fixing electronic components includes a clamping assembly for mounting and fixing capacitors, a positioning block disposed at the bottom of the clamping assembly and connected to a fixing block, and a plurality of second contact probes disposed in the positioning block and connected to the clamping assembly. The clamping assembly includes a first detection circuit board and a second detection circuit board disposed opposite to each other, a mounting block disposed on the first detection circuit board, a mounting groove disposed on the mounting block extending inward for mounting electronic components, a plurality of connecting probes disposed on the second detection circuit board opposite to the mounting groove, and a locking member disposed between the first detection circuit board and the second detection circuit board.

[0009] The control mechanism, connected to the test board, performs temperature characteristic tests on the capacitors on the mounting assembly.

[0010] The testing method specifically includes the following steps:

[0011] Step 1: Place multiple electronic components to be tested into the mounting slot, then move the second testing circuit board so that multiple connection probes contact and abut against the multiple electronic components, and then fix the relative positions of the first testing circuit board and the second testing circuit board with locking components.

[0012] Step 2: Move the fixture with the installed electronic components onto the test stand. Under the action of the guide block, move the fixture downward to complete the connection between the positioning block and the fixing block, so that the second contact probe and the first contact probe can be connected.

[0013] Step 3: Start the control mechanism to test the temperature characteristics of the electronic components in the clamping fixture.

[0014] Furthermore, the clamping assembly also includes a rotating dial that is rotatably mounted on the upper end of the second detection circuit board, and the test seat also includes two guide blocks that are disposed opposite to each other on both sides of the fixed block. After the electronic components complete the test, the rotating dial is moved so that its lower end abuts against the upper end of the guide block until the clamping fixture springs up, and then the clamping fixture is moved upward and removed from the test seat.

[0015] Furthermore, the inner side of the guide block is provided with two guide grooves for the first detection circuit board and the second detection circuit board to be embedded.

[0016] Furthermore, the rotating dial includes a rotating part connected to the second detection circuit board and a toggle part perpendicularly connected to the rotating part.

[0017] Furthermore, the bottom of the positioning block has an upwardly extending fixing groove for the fixing block to be embedded in, and the second contact probe is disposed in the fixing groove and is in contact with the opposite first contact probe.

[0018] Furthermore, the bottom of the mounting slot is provided with a plurality of fixing holes for mounting electronic components, and a plurality of connecting probes are aligned with a plurality of fixing holes.

[0019] Furthermore, the locking component includes a first locking hole disposed on the first detection circuit board, a second locking hole disposed on the second detection circuit board opposite to the first locking hole, and a locking bolt passing through the second locking hole and engaging with the first locking hole.

[0020] Furthermore, there are two positioning blocks, with the first detection circuit board and the second detection circuit board respectively disposed on the two positioning blocks.

[0021] Furthermore, the positioning block has a connecting groove extending downward from its top surface for connecting the first detection circuit board or the second detection circuit board, the lower end of the first detection circuit board or the second detection circuit board being detachably disposed in the connecting groove via a bolt assembly.

[0022] Furthermore, the control mechanism includes a PLC controller connected to the test board and a display screen connected to the PLC controller for displaying test results.

[0023] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are as follows: By defining the structure and specific operation of the testing device, multiple electronic components to be tested are clamped and fixed, and then, in conjunction with the control mechanism, the testing of all parameters can be completed. Furthermore, by defining the structure of the clamping fixture, the electronic components and the connecting probes, the first contact probe and the second contact probe maintain good contact, ensuring that the appearance of the electronic components is not damaged, while ensuring the stability of the test results. Moreover, it is suitable for testing large batches of electronic components, and while meeting the reliability of the test results, it is easy for test personnel to operate the equipment, and at the same time meets the production capacity requirements of the components. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the testing device.

[0025] Figure 2 Schematic diagram of the clamping fixture Figure 1 ;

[0026] Figure 3 Schematic diagram of the clamping fixture Figure 2 ;

[0027] Figure 4 Schematic diagram of the clamping fixture Figure 3 ;

[0028] In the figure, 1-test seat, 2-clamping fixture, 3-control mechanism, 11-test seat body, 12-test plate, 13-fixing block, 14-first contact probe, 15-guide block, 151-guide groove, 16-connecting plate, 21-clamping assembly, 211-first detection circuit board, 212-second detection circuit board, 213-mounting block, 214-mounting groove, 2141-fixing hole, 215-connecting probe, 216-locking component, 2161-first locking hole, 2162-second locking hole, 217-rotating dial, 2171-rotating part, 2172-moving part, 22-positioning block, 221-connecting groove, 222-fixing groove, 23-second contact probe, 31-display screen. Detailed Implementation

[0029] The present invention will be further described below through specific embodiments.

[0030] Reference Figures 1 to 4 As shown, a method for testing the temperature characteristics of electronic components is based on a testing device, specifically, a capacitor.

[0031] The testing device includes a test stand 1, a clamping fixture 2, and a control mechanism 3.

[0032] The test fixture 1 includes a test fixture body 11, a test plate 12 disposed on the test fixture body 11, two fixing blocks 13 spaced apart on the test plate 12 for fixing the clamping fixture 2, a plurality of first contact probes 14 spaced apart on the fixing blocks 13 and connected to the test plate 12, two guide blocks 15 disposed opposite to each other on both sides of the two fixing blocks 13, and a connecting plate 16 disposed on the test fixture body 11 for mounting the relative guide blocks 15; specifically, four test plates 12 are provided to cooperate with four clamping fixtures 2, which is suitable for testing large batches of electronic components. Under the premise of ensuring the reliability of test results, it is easy for test personnel to operate the equipment, while meeting the production capacity requirements of the components.

[0033] The clamping fixture 2 is used to install and fix electronic components. It includes a clamping assembly 21 for installing and fixing capacitors, two positioning blocks 22 respectively connected to two fixing blocks 13 at the bottom of the clamping assembly 21, and a plurality of second contact probes 23 connected to the clamping assembly 21 in the positioning blocks 22. Specifically, the bottom of the positioning block 22 has an upwardly extending fixing groove 222 for embedding relative to the fixing block 13. The second contact probes 23 are disposed in the fixing groove 222 and can contact and connect with the relative first contact probe 14. After the clamping fixture 2 has installed and fixed the electronic components, it is moved between the two guide blocks 15 and then moved downward so that the fixing block 13 is embedded in the fixing groove 222. At this time, the first contact probe 14 and the second contact probe 23 just make contact and connect to perform temperature characteristic detection.

[0034] The clamping assembly 21 includes a first detection circuit board 211 and a second detection circuit board 212 disposed opposite to each other on two positioning blocks 22, a mounting block 213 disposed on the first detection circuit board 211, a mounting groove 214 extending inward on the mounting block 213 for mounting electronic components, a plurality of connecting probes 215 disposed on the second detection circuit board 212 opposite to the mounting groove 214, a locking member 216 disposed between the first detection circuit board 211 and the second detection circuit board 212, and a rotating dial 217 rotatably disposed on the upper end of the second detection circuit board 212. Specifically, the bottom of the mounting groove 214 is provided with a plurality of fixing holes for mounting electronic components at intervals. 2141, multiple connecting probes 215 are aligned with multiple fixing holes 2141 one by one; further, the positioning block 22 has a connecting groove 221 extending downward from its top surface for connecting the first detection circuit board 211 or the second detection circuit board 212, the lower end of the first detection circuit board 211 or the second detection circuit board 212 is detachably disposed in the connecting groove 221 by a bolt assembly; the inner side of the guide block 15 has guide grooves 151 formed at intervals for the first detection circuit board 211 and the second detection circuit board 212 to be embedded, and the guiding effect of the guide grooves 151 ensures that the first contact probe 14 and the second contact probe 23 can be contacted and connected, ensuring the stable performance of the temperature characteristic test.

[0035] The locking component 216 includes a first locking hole 2161 disposed on the first detection circuit board 211, a second locking hole 2162 disposed on the second detection circuit board 212 opposite to the first locking hole 2161, and a locking bolt that passes through the second locking hole 2162 and engages with the first locking hole 2161. After the electronic components are installed, the locking bolt passes through the second locking hole 2162 and engages with the first locking hole 2161, so that the connecting probe 215 maintains stable contact with the corresponding electronic components.

[0036] The rotating dial 217 includes a rotating part 2171 connected to the second detection circuit board 212 and a toggle part 2172 connected perpendicularly to the rotating part 2171. When the rotating part 2171 is parallel to the side of the second detection circuit board 212, its lower end is located below the top surface of the second detection circuit board 212. After the electronic components have completed the test, the rotating dial 217 is toggle so that its lower end abuts against the upper end of the guide block 15 and the clamping fixture 2 springs upward so as to facilitate the removal of the clamping fixture 2 from the test seat 1.

[0037] The control mechanism 3, connected to the test board 12, performs temperature characteristic tests on the electronic components on the clamping assembly 21, including a PLC controller connected to the test board 12 and a display screen 31 connected to the PLC controller for displaying test results.

[0038] In summary, the testing method includes the following steps:

[0039] Step 1: Place multiple electronic components to be tested one by one into the fixing hole 2141, then move the second detection circuit board 212 so that multiple connecting probes 215 contact and abut against multiple electronic components, and then fix the relative positions of the first detection circuit board 211 and the second detection circuit board 212 by the locking member 216.

[0040] Step 2: Move the clamping fixture 2 with the installed electronic components onto the test base 1, so that the first detection circuit board 211 and the second detection circuit board 212 are respectively aligned with the two guide grooves 151. Under the action of the guide grooves 151, move the clamping fixture 2 downward until the fixing block 13 is embedded in the fixing groove 222, thus completing the installation of the clamping fixture 2 and ensuring the contact connection between the second contact probe 23 and the first contact probe 14.

[0041] Step 3: Start the control mechanism 3 to test the temperature characteristics of the electronic components in the clamping fixture 2;

[0042] Step 4: After the electronic components have completed the test, rotate the dial 217 so that its lower end abuts against the upper end of the guide block 15 until the clamping fixture 2 springs upward. Then move the clamping fixture 2 upward and remove it from the test seat 1.

[0043] This application defines the structure and specific operation of the testing device, clamps and fixes multiple electronic components to be tested, and then, in conjunction with the control mechanism 3, completes the testing of all parameters. Furthermore, it defines the structure of the clamping fixture 2 to ensure good contact between the electronic components and the connecting probe 215, the first contact probe 14 and the second contact probe 23, ensuring that the appearance of the electronic components is not damaged while ensuring the stability of the test results. It is also suitable for testing large batches of electronic components, and while meeting the reliability of the test results, it is easy for test personnel to operate the equipment and meets the production capacity requirements of the components.

[0044] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A method for testing the temperature characteristics of electronic components, characterized in that: The test is performed based on a testing device, which includes a test stand, a clamping fixture, and a control mechanism. The test fixture includes a test fixture body, a test plate disposed on the test fixture body, a fixing block disposed on the test plate for fixing a clamping fixture, and a plurality of first contact probes disposed at intervals on the fixing block and connected to the test plate. A clamping fixture for mounting and fixing electronic components includes a clamping assembly for mounting and fixing capacitors, a positioning block disposed at the bottom of the clamping assembly and connected to a fixing block, and a plurality of second contact probes disposed in the positioning block and connected to the clamping assembly. The clamping assembly includes a first detection circuit board and a second detection circuit board disposed opposite to each other, a mounting block disposed on the first detection circuit board, a mounting groove disposed on the mounting block extending inward for mounting electronic components, a plurality of connecting probes disposed on the second detection circuit board opposite to the mounting groove, and a locking member disposed between the first detection circuit board and the second detection circuit board. The control mechanism, connected to the test board, performs temperature characteristic tests on the capacitors on the mounting assembly. The testing method specifically includes the following steps: Step 1: Place multiple electronic components to be tested into the mounting slot, then move the second testing circuit board so that multiple connection probes contact and abut against the multiple electronic components, and then fix the relative positions of the first testing circuit board and the second testing circuit board with locking components. Step 2: Move the fixture with the installed electronic components onto the test stand. Under the action of the guide block, move the fixture downward to complete the connection between the positioning block and the fixing block, so that the second contact probe and the first contact probe can be connected. Step 3: Activate the control mechanism to test the temperature characteristics of the electronic components in the clamping fixture; The clamping assembly also includes a rotating dial that is rotatably mounted on the upper end of the second detection circuit board. The test fixture also includes two guide blocks that are disposed opposite to each other on both sides of the fixed block. After the electronic components complete the test, the rotating dial is moved so that its lower end abuts against the upper end of the guide block until the clamping fixture springs up. Then the clamping fixture is moved upward and removed from the test fixture.

2. The method for testing the temperature characteristics of electronic components according to claim 1, characterized in that: The inner side of the guide block is provided with two guide grooves for embedding the first detection circuit board and the second detection circuit board.

3. The method for testing the temperature characteristics of electronic components according to claim 1, characterized in that: The rotating dial includes a rotating part connected to the second detection circuit board and a toggle part perpendicularly connected to the rotating part.

4. The method for testing the temperature characteristics of electronic components according to claim 1, characterized in that: The bottom of the positioning block has an upwardly extending fixing groove for the fixing block to be embedded in, and the second contact probe is disposed in the fixing groove and is in contact with the opposite first contact probe.

5. The method for testing the temperature characteristics of electronic components according to claim 1, characterized in that: The bottom of the mounting slot is provided with multiple fixing holes for mounting electronic components, and multiple connecting probes are aligned with the multiple fixing holes one by one.

6. The method for testing the temperature characteristics of electronic components according to claim 1, characterized in that: The locking component includes a first locking hole on a first detection circuit board, a second locking hole on a second detection circuit board opposite to the first locking hole, and a locking bolt that passes through the second locking hole and engages with the first locking hole.

7. The method for testing the temperature characteristics of electronic components according to claim 1, characterized in that: Two positioning blocks are provided, with the first detection circuit board and the second detection circuit board respectively installed on the two positioning blocks.

8. The method for testing the temperature characteristics of electronic components according to claim 7, characterized in that: The positioning block has a connecting groove extending downward from its top surface for connecting the first detection circuit board or the second detection circuit board. The lower end of the first detection circuit board or the second detection circuit board is detachably disposed in the connecting groove by a bolt assembly.

9. The method for testing the temperature characteristics of electronic components according to claim 1, characterized in that: The control mechanism includes a PLC controller connected to the test board and a display screen connected to the PLC controller for displaying test results.

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