Pin fin heat sink
By introducing a uniform flow base plate into the needle-fin radiator, the problems of coolant distribution and temperature non-uniformity are solved, achieving uniform coolant distribution and temperature homogenization, and improving the heat dissipation uniformity and efficiency of the radiator.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MILLI ELECTROMECHANICAL (SUZHOU) CO LTD
- Filing Date
- 2023-12-15
- Publication Date
- 2026-06-23
AI Technical Summary
Existing needle-fin radiators suffer from uneven coolant distribution and temperature during the cooling process, resulting in uneven heat dissipation from the object being cooled.
A flow equalization plate is provided on the second surface of the substrate. When the coolant flows from the inlet end to the outlet end, it connects to the substrate through the flow equalization plate and the first row of pin fins. During the flow process, the coolant impacts and tumbles over the flow equalization plate, increasing the distribution and temperature uniformity of the coolant, thereby improving the heat dissipation uniformity.
The design of the uniform flow base plate ensures that the coolant is evenly distributed and its temperature is homogenized during the flow process, thereby improving the heat dissipation uniformity of the object to be cooled and enhancing the heat dissipation efficiency.
Smart Images
Figure CN117693167B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of radiators, and particularly to a needle-fin radiator. Background Technology
[0002] Finned heat sinks are characterized by large heat exchange area and high heat dissipation efficiency, and are widely used for cooling components such as chips, power modules and power devices.
[0003] However, existing needle-fin radiators often experience uneven cooling of the object being cooled during use. According to the applicant's analysis, when the coolant initially flows into the existing needle-fin radiator, the coolant itself exhibits uneven distribution and temperature. Furthermore, because the radiator's needles need to be designed according to the cooling requirements of the object being cooled, unevenness also exists. Summary of the Invention
[0004] In view of the above-mentioned problems in the prior art, the purpose of the present invention is to provide a needle-fin radiator that can improve the uniformity of heat dissipation on the object to be cooled.
[0005] To address the above problems, the present invention provides a needle-fin radiator, the needle-fin radiator comprising:
[0006] A substrate, the substrate including a first surface and a second surface opposite to each other, the first surface being for connecting with an object to be cooled, the second surface being for through which coolant flows, and including an inlet end and an outlet end;
[0007] Multiple rows of needle fins are arranged at intervals on the second surface of the substrate, and the coolant flows through each of the needle fins in turn.
[0008] A flow equalization base plate is formed in the shape of a strip and is connected between the first row of needles adjacent to the liquid inlet end and the second surface of the substrate. This row of needles is connected to the substrate through the flow equalization base plate.
[0009] Furthermore, the thickness of the uniform flow base plate is 1 / 10 to 3 / 10 of the height of the needle fin.
[0010] Furthermore, the uniform flow base plate is formed in a wavy or sawtooth shape.
[0011] Furthermore, the uniform flow base plate is formed in an "S"-shaped wave or a "V"-shaped sawtooth shape, and the first row of needles adjacent to the liquid inlet end is uniformly and spaced apart on the uniform flow base plate.
[0012] Furthermore, the needle-fin radiator also includes:
[0013] A cover plate, which is connected to the base plate to form a chamber for containing coolant, wherein the needle fins are located in the chamber and the tips of the needle fins are connected to the surface of the cover plate;
[0014] A flow equalization top plate is disposed at the top of the first row of needles adjacent to the liquid inlet end, and the needles in this row are connected to the cover plate through the flow equalization top plate.
[0015] Furthermore, the surface of the substrate is formed with multiple mounting areas for connecting multiple objects to be cooled. The coolant passes through each mounting area in sequence. In the needle fins corresponding to each mounting area, the first row of needle fins adjacent to the liquid inlet end is connected to the substrate through the uniform flow base plate.
[0016] Furthermore, in each of the mounting areas, the first row of needles adjacent to the liquid outlet end is connected to the substrate via the uniform flow base plate.
[0017] Furthermore, when the area of the mounting area is greater than the predetermined area, a row of needles in the middle of the mounting area is connected to the substrate through the uniform flow base plate.
[0018] Furthermore, the needle fin includes a flow equalizing fin and a conventional fin. The flow equalizing fin is disposed on the flow equalizing base plate, and the others are conventional fins. A row of flow equalizing fins is evenly spaced apart, and a row of flow equalizing fins and an adjacent row of conventional fins are staggered. The cross-section of the flow equalizing fin is formed as a circle or a square.
[0019] Furthermore, the vertical distance between two adjacent uniform flow wings in a row of uniform flow wings is less than the vertical distance between two conventional wings in a row of conventional wings, and the number of uniform flow wings in a row is greater than or equal to the number of conventional wings in a row.
[0020] Due to the above technical solution, the present invention has the following beneficial effects:
[0021] According to the needle-fin radiator of the present invention, the mounting area on the first surface of the substrate can be provided with an object to be cooled. Coolant flows from the inlet end to the outlet end on the second surface of the substrate, flowing into each needle fin in a row. A uniform flow base plate is provided between the first row of needle fins near the inlet end and the second surface of the substrate. As the coolant flows toward the needle fins, it will first impact and tumble over the uniform flow base plate. During the impact and tumble of the coolant on the uniform flow base plate, the coolant will disperse in all directions, increasing the fusion of coolant in each area, increasing the uniformity of coolant distribution and temperature, thereby enabling the coolant with a more uniform distribution and temperature to dissipate heat to the subsequent needle fins, thereby increasing the uniformity of heat dissipation for the object to be cooled. Attached Figure Description
[0022] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.
[0023] Figure 1 This is a structural diagram of the first existing pin-fin radiator;
[0024] Figure 2 yes Figure 1 A schematic diagram of the installation area corresponding to the needle-fin radiator in the diagram;
[0025] Figure 3 Is Figure 1 A structural diagram of the first embodiment of the pin-fin radiator based on this design;
[0026] Figure 4 Is Figure 1 A structural diagram of the pin-fin radiator of the second embodiment based on this;
[0027] Figure 5 Is Figure 1 A structural diagram of the needle-fin radiator of the third embodiment based on this;
[0028] Figure 6 This is a structural diagram of the existing second needle-fin radiator;
[0029] Figure 7 yes Figure 6 A schematic diagram of the installation area corresponding to the needle-fin radiator in the diagram;
[0030] Figure 8 Is Figure 6 A structural diagram of a pin-fin radiator based on an embodiment of the above;
[0031] Figure 9 This is a structural diagram of the existing third needle-fin radiator;
[0032] Figure 10 yes Figure 9 A schematic diagram of the installation area corresponding to the needle-fin radiator in the diagram;
[0033] Figure 11 Is Figure 9 A structural diagram of a pin-fin radiator based on an embodiment.
[0034] Figure label:
[0035] 100, substrate; 200, needle fin; 210, conventional fin; 220, flow equalization fin; 300, mounting area; 410, flow equalization bottom plate; 420, flow equalization top plate. Detailed Implementation
[0036] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0037] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.
[0038] The following describes a pin-fin radiator according to an embodiment of the present invention.
[0039] like Figures 1 to 11 As shown, the needle-fin heat sink of this embodiment of the invention includes a substrate 100, multiple rows of needles 200 and a uniform flow base plate 410.
[0040] First, the substrate 100 will be described. The substrate 100 includes a first surface and a second surface facing away from each other. The first surface is used to connect with the object to be cooled, and the second surface is used for the flow of coolant, and it includes an inlet end and an outlet end. The substrate 100 can be a metal plate such as an aluminum plate, a copper plate, or a stainless steel plate.
[0041] Coolant flows from the inlet end of the second surface of the substrate 100 to the outlet end, and uses the thermal conductivity of the substrate 100 to dissipate heat from the object to be cooled, which is mounted on the mounting area 300.
[0042] Next, the multi-row needle fins 200 will be described. The multi-row needle fins 200 are arranged at intervals on the second surface of the substrate 100, and the coolant flows through each needle fin 200 in turn.
[0043] like Figure 1 As shown, the coolant flows into the needle fins 200 row by row. The needle fins 200 can increase the contact area with the coolant, thereby increasing the heat exchange efficiency.
[0044] Finally, the flow equalization base plate 410 is described. The flow equalization base plate 410 is formed in the shape of a strip and is connected between the first row of needle fins 200 adjacent to the liquid inlet end and the second surface of the substrate 100. This row of needle fins 200 is connected to the substrate 100 through the flow equalization base plate 410.
[0045] like Figure 3 and Figure 4 As shown, the uniform flow base plate 410 is disposed between the first row of needle fins 200 and the base plate 100 near the liquid inlet end.
[0046] As the coolant flows toward the needle fins 200, it will first impact and roll over the uniform flow base plate 410. During the impact and roll of the coolant onto the uniform flow base plate 410, the coolant will disperse in all directions, increasing the fusion of coolant in different areas and increasing the uniformity of coolant distribution and temperature.
[0047] In the above-described pin-fin radiator, the mounting area 300 on the first surface of the substrate 100 can be used to place the object to be cooled. Coolant flows from the inlet end to the outlet end on the second surface of the substrate 100, and flows into each pin fin 200 in a row. A uniform flow base plate 410 is provided between the first row of pin fins 200 near the inlet end and the second surface of the substrate 100. As the coolant flows toward the pin fins 200, it will first hit and roll over the uniform flow base plate 410. During the process of the coolant hitting and rolling over the uniform flow base plate 410, the coolant will disperse in all directions, increasing the fusion of coolant in each area, increasing the uniformity of coolant distribution and temperature, so that the coolant with a more uniform distribution and temperature can dissipate heat to the subsequent pin fins 200, thereby increasing the uniformity of heat dissipation to the object to be cooled.
[0048] In some embodiments of the present invention, the thickness of the uniform flow base plate 410 is 1 / 10 to 3 / 10 of the height of the needle fin 200.
[0049] For example, the height of the uniform flow base plate 410 is 1 / 10, 1 / 9, 1 / 8, 2 / 10, 3 / 10 of the height of the needle fin 200.
[0050] After multiple verifications and calculations, the uniform flow base plate 410, with a height of 1 / 10 to 3 / 10 of the height of the needle fin 200, can better integrate the coolant and has relatively low flow resistance.
[0051] In some embodiments of the present invention, the uniform flow base plate 410 is formed in a wavy or sawtooth shape.
[0052] like Figure 4 and Figure 8 As shown, the wavy or serrated flow equalization plate 410, compared to the cuboid flow equalization plate 410, can increase the contact area with the coolant, thereby increasing the amount of coolant flowing over the flow equalization plate 410 and increasing the uniformity of coolant mixing.
[0053] Furthermore, some of the coolant gathers and merges at the notch of the wavy or serrated bottom plate 410 before crossing it, and then disperses in all directions after crossing the notch, distributing the merged coolant in various areas, further increasing the temperature uniformity of the coolant.
[0054] Furthermore, the uniform flow base plate 410 is formed in an "S" shaped wave or a "V" shaped sawtooth shape, and the first row of needle fins 200 adjacent to the liquid inlet end is uniformly and spaced apart on the uniform flow base plate 410.
[0055] like Figure 4 As shown, the “S”-shaped, wavy, uniform flow base plate 410 has arc-shaped notches on both the front and rear sides, which can further increase the mixing of coolant.
[0056] like Figure 8 As shown, the "V"-shaped serrated uniform flow base plate 410 has the same triangular notch on both the front and rear sides, which can also increase the fusion of coolant, and the overall width is relatively narrow.
[0057] In some embodiments of the present invention, the finned radiator further includes a cover plate and a flow-regulating top plate 420. The cover plate and the base plate 100 are connected to form a chamber for containing coolant, and the fins 200 are located in the chamber, with the top ends of the fins 200 connected to the surface of the cover plate. The flow-regulating top plate 420 is disposed at the top end of the first row of fins 200 adjacent to the liquid inlet end, and this row of fins 200 is connected to the cover plate through the flow-regulating top plate 420.
[0058] For example, a cover plate with a groove covers the substrate 100, and the groove opening corresponds to the pin fin 200. The pin fin 200 can be connected to the bottom of the groove of the cover plate by vacuum brazing.
[0059] like Figure 5 As shown, the first row of needles 200 on the second surface of the substrate 100, near the liquid inlet end, is connected to the surface of the cover plate via the uniform flow top plate 420. As the coolant flows from the liquid inlet end to the needles 200, it also collides with and overturns the uniform flow top plate 420, that is, it simultaneously collides with both the uniform flow top plate 420 and the uniform flow bottom plate 410, further increasing the uniformity of coolant distribution and temperature.
[0060] In some embodiments of the present invention, a plurality of mounting areas 300 are formed on the surface of the substrate 100. The plurality of mounting areas 300 are used to connect a plurality of objects to be cooled. The coolant passes through each mounting area 300 in sequence. In the needle fins 200 corresponding to each mounting area 300, the first row of needle fins 200 near the liquid inlet end is connected to the substrate 100 through the uniform flow base plate 410.
[0061] like Figures 3 to 5 ,like Figure 11As shown, multiple mounting areas 300 can accommodate multiple objects to be cooled, thereby enabling the cooling of multiple objects. In each mounting area 300, the first row of needle fins 200 adjacent to the liquid inlet end is connected to the base plate 100 via a flow equalization plate 410. This improves the distribution and temperature uniformity of the coolant before cooling each mounting area 300, increasing the cooling effect on the objects to be cooled in each mounting area 300. In particular, because the heat-generating areas of the objects to be cooled differ, the temperature uniformity of the coolant after passing through one mounting area 300 can be significantly different. The flow equalization plate 410 can promptly improve the temperature uniformity of the coolant, increasing the cooling uniformity for the next mounting area 300.
[0062] Furthermore, in each mounting area 300, the first row of needles 200 adjacent to the liquid outlet end is connected to the substrate 100 via the uniform flow base plate 410.
[0063] like Figures 3 to 5 By providing a flow-equalizing base plate 410 between the first row of pins 200 of the pins 200 corresponding to each mounting area 300 adjacent to the liquid outlet and the second surface of the substrate 100, the distribution and temperature uniformity of the coolant flowing out of each mounting area 300 can be increased, thereby increasing the overall temperature and distribution uniformity of the coolant. Furthermore, the liquid inlet and outlet ends of the substrate 100 can be interchanged, increasing the applicability of the pin-fin radiator.
[0064] In some embodiments of the present invention, when the area of the mounting area 300 is greater than a predetermined area, a row of needles 200 in the middle of the mounting area 300 is connected to the substrate 100 through the uniform flow base plate 410.
[0065] like Figure 7 and Figure 8 As shown, the area of the mounting area 300 within the dashed frame is larger than the predetermined area. A row of needles 200 in the middle of the mounting area 300 is connected to the substrate 100 via the uniform flow base plate 410.
[0066] When the installation area 300 is larger than the predetermined area, the temperature unevenness of the corresponding pins 200 is already relatively large because the coolant does not completely pass through the installation area 300. At this time, a row of pins 200 in the middle is connected to the base plate 100 through the uniform flow base plate 410, which can improve the temperature of the coolant in time, thereby increasing the uniformity of heat dissipation for the larger installation area 300, that is, increasing the uniformity of heat dissipation for the larger object to be cooled.
[0067] In some embodiments of the present invention, the needle fin 200 includes a flow equalization fin 220 and a conventional fin 210. The flow equalization fin 220 is disposed on the flow equalization base plate 410, and the others are conventional fins 210. A row of flow equalization fins is evenly spaced apart, and a row of flow equalization fins 220 and an adjacent row of conventional fins 210 are staggered. The cross-section of the flow equalization fin 220 is formed as a circle or a square.
[0068] like Figure 3 , Figure 4 , Figure 5 , Figure 8 and Figure 11 As shown, flow equalization fins 220 are provided on the flow equalization base plate 410, and conventional fins 210 are provided elsewhere. The flow equalization fins 220 are evenly spaced, which can evenly distribute the coolant and increase the uniformity of coolant distribution and temperature.
[0069] A row of uniform flow fins 220 and an adjacent row of conventional fins 210 are staggered. Coolant that does not contact the first row of uniform flow fins 220 (coolant that passes through the gaps between the first row of uniform flow fins 220 and does not contact the uniform flow fins 220) will be directly blocked by the second row of conventional fins 210 and absorb heat. This reduces the amount of coolant that does not contact the first row of uniform flow fins 220 and the second row of conventional fins 210 and flows out directly without heat exchange, thereby increasing the uniformity of coolant temperature.
[0070] Optionally, the cross-section of the flow equalizer fin 220 is formed as a circle or a square. The relatively regularity of the flow equalizer fin itself allows for more uniform distribution of the coolant.
[0071] Furthermore, the vertical distance between two adjacent uniform flow wings 220 in a row of uniform flow wings 220 is less than the vertical distance between two conventional wings 210 in a row of conventional wings 210, and the number of uniform flow wings 220 in a row is greater than or equal to the number of conventional wings 210 in a row.
[0072] The number of uniform flow fins 220 in a row is greater than or equal to the number of conventional fins 210 in a row, thereby enabling the coolant to be divided into more uniform and narrow branches, further increasing the temperature uniformity and distribution uniformity of the coolant.
[0073] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A needle-fin radiator, characterized in that, The needle-fin radiator includes: A substrate, the substrate including a first surface and a second surface opposite to each other, the first surface being for connecting with an object to be cooled, the second surface being for through which coolant flows, and including an inlet end and an outlet end; Multiple rows of needle fins are arranged at intervals on the second surface of the substrate, and the coolant flows through each of the needle fins in turn. A flow equalization base plate is formed in the shape of a strip and is connected between the first row of needles adjacent to the liquid inlet end and the second surface of the substrate. This row of needles is connected to the substrate through the flow equalization base plate. A cover plate, which is connected to the substrate to form a chamber for containing the coolant, wherein the needle fins are located in the chamber and the tips of the needle fins are connected to the surface of the cover plate; A flow equalization top plate is disposed at the top of the first row of needles adjacent to the liquid inlet end, and the needles in this row are connected to the cover plate through the flow equalization top plate.
2. The needle-fin radiator according to claim 1, characterized in that, The thickness of the uniform flow base plate is 1 / 10 to 3 / 10 of the height of the needle fin.
3. The needle-fin radiator according to claim 1, characterized in that, The uniform flow base plate is formed in a wavy or sawtooth shape.
4. The needle-fin radiator according to claim 3, characterized in that, The uniform flow base plate is formed in an "S" shaped wave or a "V" shaped sawtooth shape, and the first row of needles adjacent to the liquid inlet end is uniformly and spaced apart on the uniform flow base plate.
5. The needle-fin radiator according to claim 1, characterized in that, The substrate has multiple mounting areas on its surface, which are used to connect multiple objects to be cooled. The coolant passes through each mounting area in sequence. In the needle fins corresponding to each mounting area, the first row of needle fins adjacent to the liquid inlet end is connected to the substrate through the uniform flow base plate.
6. The needle-fin radiator according to claim 5, characterized in that, In each of the mounting areas, the first row of needles adjacent to the liquid outlet end is connected to the substrate via the uniform flow base plate.
7. The needle-fin radiator according to claim 6, characterized in that, When the area of the installation area is greater than the predetermined area, a row of needles in the middle of the installation area is connected to the substrate through the uniform flow base plate.
8. The needle-fin radiator according to any one of claims 1 to 7, characterized in that, The needle fins include flow equalization fins and conventional fins. The flow equalization fins are disposed on the flow equalization base plate, and the others are conventional fins. A row of flow equalization fins is evenly spaced apart, and a row of flow equalization fins and an adjacent row of conventional fins are staggered. The cross-section of the flow equalization fins is formed as a circle or a square.
9. The needle-fin radiator according to claim 8, characterized in that, The vertical distance between two adjacent uniform flow wings in a row is less than the vertical distance between two conventional wings in a row, and the number of uniform flow wings in a row is greater than or equal to the number of conventional wings in a row.