Active heat dissipating ceramic substrate

Abstract

The utility model discloses an active heat dissipation type ceramic substrate, it includes ceramic body, upper circuit layer, lower circuit layer and liquid cooling pipe, the ceramic body is provided with the metal dam, the metal dam is surrounded and is formed with the package cavity, the ceramic body is set with the electrically conductive hole, and the electrically conductive hole is filled with metal and forms the electrically conductive column, the upper circuit layer sets up in the upper surface of ceramic substrate and is located in the package cavity, the lower circuit layer sets up in the lower surface of ceramic substrate and is connected with the other end of electrically conductive column and is conducted through, through setting up liquid cooling pipe on the upper surface of ceramic substrate, liquid cooling pipe surrounds the periphery of metal dam, then cooperates with the lateral surface of liquid cooling pipe and the outside surface of metal dam and sticks to contact, when the liquid inlet and liquid outlet are connected with the liquid cooling circulation mechanism of outside, the cooling liquid flows into from the liquid inlet and flows out at the liquid outlet, in this circulation, the cooling liquid can take away the heat of metal dam and ceramic body, effectively improves the heat dissipation capacity of ceramic substrate and the heat dissipation efficiency of ceramic substrate.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrates, and in particular to an active heat dissipation type ceramic substrate. Background Technology

[0002] Ceramic substrates are special process boards where copper foil is directly bonded to the surface of an alumina or aluminum nitride ceramic substrate at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure technology and interconnection technology. Ultraviolet (UV) light-emitting diodes (LEDs) offer advantages such as energy saving, environmental friendliness, long lifespan, small size, and controllable wavelength. Deep UV LEDs, with an emission wavelength less than 300nm, can be applied in sterilization, water purification, and biochemical detection. UV LEDs are typically packaged using ceramic substrates. To facilitate the packaging of the UV chip, the ceramic substrate has metal dams forming a packaging cavity to house and encapsulate the UV chip.

[0003] As a crucial carrier for integrated circuit chips, the ceramic substrate is in direct contact with the circuitry and is responsible for efficiently dissipating the heat generated by the circuitry. High-power devices generate a significant amount of heat during operation; if this heat cannot be dissipated in time, the chip temperature will rise, potentially leading to performance degradation, reduced stability, or even damage. Currently, most ceramic substrates use high thermal conductivity ceramic powder as raw material and are cooled by air. While this method can improve the heat dissipation capacity of the ceramic substrate, its efficiency is relatively low. Therefore, it is necessary to improve existing ceramic substrates. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide an active heat dissipation ceramic substrate that can effectively solve the problems of poor heat dissipation capacity and low heat dissipation efficiency of existing ceramic substrates.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An active heat dissipation ceramic substrate includes a ceramic body, an upper circuit layer, a lower circuit layer, and a liquid cooling pipe. A metal dam is disposed on the ceramic body, forming an encapsulation cavity. The ceramic body has conductive holes penetrating the surface of the ceramic substrate, and the conductive holes are filled with metal to form conductive pillars. The upper circuit layer is disposed on the upper surface of the ceramic substrate and located within the encapsulation cavity, and is connected to one end of the conductive pillar for conduction. The lower circuit layer is disposed on the lower surface of the ceramic substrate and is connected to the other end of the conductive pillar for conduction. The liquid cooling pipe is disposed on the upper surface of the ceramic substrate, surrounding the periphery of the metal dam, and its peripheral side is in contact with the outer side of the metal dam. The liquid cooling pipe has an inlet and an outlet, both extending outwards from the ceramic substrate.

[0007] As a preferred embodiment, the ceramic body is made of aluminum nitride.

[0008] As a preferred embodiment, both the inner and outer surfaces of the metal dam are covered with a first graphene layer, and the peripheral surface of the liquid cooling pipe is in contact with the first graphene layer on the outer surface of the metal dam.

[0009] As a preferred embodiment, the peripheral surface of the liquid cooling pipe is covered with a second graphene layer, which is in close contact with the first graphene layer. Graphene has excellent thermal conductivity, and the two graphene layers are in close contact with each other, which effectively improves the heat transfer between the liquid cooling pipe and the metal dam.

[0010] As a preferred embodiment, the ceramic body has an annular groove with a square cross-section. One inner wall of the annular groove is flush with the outer side of the metal dam. The liquid cooling pipe is a square pipe, which is placed in the annular groove and partially extends outward. The peripheral side of the liquid cooling pipe is in close contact with the inner wall of the annular groove. The peripheral side of the liquid cooling pipe is in close contact with both the inner wall of the annular groove and the outer side of the metal dam. This allows heat to be carried away from both the ceramic body and the metal dam simultaneously. Furthermore, the grooved design increases the contact area between the liquid cooling pipe and the ceramic body, thereby improving heat dissipation capacity.

[0011] As a preferred embodiment, a third graphene layer is disposed on the upper surface of the ceramic body, and the third graphene layer is located in the encapsulation cavity.

[0012] As a preferred embodiment, a fourth graphene layer is disposed on the lower surface of the ceramic body, and a heat-conducting hole penetrating the ceramic body is formed on the ceramic body. The heat-conducting hole is filled with graphene to form a heat-conducting pillar. The two ends of the heat-conducting pillar are respectively in contact with the third graphene layer and the fourth graphene layer, so that the third graphene layer can transfer heat to the fourth graphene layer, and the fourth graphene layer dissipates the heat to the outside, instead of only the third graphene layer transferring heat to the ceramic body and then dissipating the heat to the outside. This changes the previous single heat dissipation path and improves the heat dissipation efficiency of the ceramic substrate.

[0013] As a preferred embodiment, the heat-conducting holes are arranged in multiple rows at intervals, and each heat-conducting hole is filled with graphene to form a heat-conducting pillar. The two ends of each heat-conducting pillar are respectively in contact with the third graphene layer and the fourth graphene layer, and each heat-conducting hole extends vertically to improve the efficiency of the third graphene layer in transferring heat to the fourth graphene layer.

[0014] As a preferred embodiment, the liquid cooling pipe is a copper pipe.

[0015] As a preferred embodiment, a fifth graphene layer is provided on the lower surface of the ceramic body to further enhance the heat dissipation capability of the ceramic substrate.

[0016] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0017] By setting liquid cooling pipes on the upper surface of the ceramic substrate, the liquid cooling pipes surround the outer perimeter of the metal dam, and the peripheral side of the liquid cooling pipes is in close contact with the outer side of the metal dam. When the inlet and outlet are connected to the external liquid cooling circulation mechanism, the coolant flows in from the inlet and flows out from the outlet. In this circulation, the coolant can carry away the heat from the metal dam and the ceramic body, effectively improving the heat dissipation capacity and efficiency of the ceramic substrate.

[0018] To more clearly illustrate the structural features and effects of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments: Attached Figure Description

[0019] Figure 1 This is a cross-sectional view of a preferred embodiment of the present invention;

[0020] Figure 2 This is a top view of a preferred embodiment of the present invention;

[0021] Figure 3 yes Figure 1 A magnified view of a portion of the image.

[0022] Explanation of reference numerals in the attached diagram:

[0023] 10. Ceramic body 101. Encapsulation cavity

[0024] 102. Conductive hole; 103. Annular groove

[0025] 104. Heat conduction hole 11. Metal dam

[0026] 12. Conductive pillar; 13. Third graphene layer

[0027] 14. Fourth graphene layer 15. Thermal conductive pillar

[0028] 16. Fifth graphene layer; 20. Upper circuit layer

[0029] 30. Lower circuit layer; 40. Liquid cooling pipe.

[0030] 41. Liquid inlet 42. Liquid outlet

[0031] 43. Second graphene layer. Detailed Implementation

[0032] Please refer to Figures 1 to 3 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, which includes a ceramic body 10, an upper circuit layer 20, a lower circuit layer 30, and a liquid cooling pipe 40.

[0033] The ceramic body 10 has a metal dam 11 forming an encapsulation cavity 101. The ceramic body 10 has a conductive hole 102 penetrating the surface of the ceramic substrate 10, and the conductive hole 102 is filled with metal to form a conductive pillar 12. In this embodiment, the ceramic body 10 is made of aluminum nitride. A first graphene layer 111 is attached to both the inner and outer surfaces of the metal dam 11. Additionally, the ceramic body 10 has an annular groove 103 with a square cross-section, and one inner wall of the annular groove 103 is flush with the outer surface of the metal dam 11. A third graphene layer 13 is disposed on the upper surface of the ceramic body 10, located within the encapsulation cavity 101. A fourth graphene layer 14 is disposed on the lower surface of the ceramic body 10, and a heat-conducting hole 104 penetrating the ceramic body 10 is disposed on the ceramic body 10, with the heat-conducting hole 104 filled with graphene to form a heat-conducting pillar 12. 5. The two ends of the heat-conducting pillar 15 are respectively connected to the third graphene layer 13 and the fourth graphene layer 14, so that the third graphene layer 13 can transfer heat to the fourth graphene layer 14, and the fourth graphene layer 14 can dissipate heat to the outside, instead of only the third graphene layer 13 transferring heat to the ceramic body 10 and then dissipating it to the outside. This changes the previous single heat dissipation path and improves the heat dissipation efficiency of the ceramic substrate. Specifically, there are multiple heat-conducting holes 104 arranged at intervals from left to right. Each heat-conducting hole 104 is filled with graphene to form a heat-conducting pillar 15. The two ends of each heat-conducting pillar 15 are respectively connected to the third graphene layer 13 and the fourth graphene layer 14, and each heat-conducting hole 104 extends vertically, which improves the efficiency of the third graphene layer 13 transferring heat to the fourth graphene layer 14. In addition, a fifth graphene layer 16 is provided on the lower surface of the ceramic body 10, which further enhances the heat dissipation capacity of the ceramic substrate.

[0034] The upper circuit layer 20 is disposed on the upper surface of the ceramic substrate 10 and located inside the encapsulation cavity 101. The upper circuit layer 20 is connected to one end of the conductive pillar 12 for conduction.

[0035] The lower circuit layer 30 is disposed on the lower surface of the ceramic substrate 10 and is connected to the other end of the conductive post 12 for conduction.

[0036] The liquid cooling pipe 40 is disposed on the upper surface of the ceramic substrate 10. The liquid cooling pipe 40 surrounds the periphery of the metal dam 11, and its peripheral side is in contact with the outer side of the metal dam 11. The liquid cooling pipe 40 has an inlet 41 and an outlet 42, both of which extend outward from the ceramic substrate 10. In this embodiment, the peripheral side of the liquid cooling pipe 40 is in contact with the first graphene layer 111 on the outer side of the metal dam 11. Specifically, a second graphene layer 43 is coated on the peripheral side of the liquid cooling pipe 40, and this second graphene layer 43 is in contact with the first graphene layer 111. Graphene has excellent thermal conductivity. The graphene layers are in close contact with each other, effectively improving heat transfer between the liquid cooling pipe 40 and the metal dam 11. Furthermore, the liquid cooling pipe 40 is a square pipe, positioned within the annular groove 103 and partially extending outwards. The peripheral side of the liquid cooling pipe 40 is in close contact with the inner wall of the annular groove 103, and simultaneously contacts both the inner wall of the annular groove 103 and the outer side of the metal dam 11. This allows for the simultaneous removal of heat from both the ceramic body 10 and the metal dam 11. The slotted design also increases the contact area between the liquid cooling pipe 40 and the ceramic body 10, enhancing heat dissipation. Finally, the liquid cooling pipe 40 is made of copper.

[0037] The key design feature of this invention is that by setting a liquid cooling pipe on the upper surface of the ceramic substrate, the liquid cooling pipe surrounds the outer perimeter of the metal dam, and the peripheral side of the liquid cooling pipe is in close contact with the outer side of the metal dam. When the inlet and outlet are connected to an external liquid cooling circulation mechanism, the coolant flows in from the inlet and flows out from the outlet. In this circulation, the coolant can carry away the heat from the metal dam and the ceramic body, effectively improving the heat dissipation capacity and efficiency of the ceramic substrate.

[0038] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. An active heat dissipation ceramic substrate, characterized in that: The device includes a ceramic body, an upper circuit layer, a lower circuit layer, and a liquid cooling pipe. A metal dam is provided on the ceramic body, forming an encapsulation cavity. The ceramic body has conductive holes penetrating the surface of a ceramic substrate, and these holes are filled with metal to form conductive pillars. The upper circuit layer is disposed on the upper surface of the ceramic substrate and located within the encapsulation cavity, and is connected to one end of the conductive pillar for conduction. The lower circuit layer is disposed on the lower surface of the ceramic substrate and is connected to the other end of the conductive pillar for conduction. The liquid cooling pipe is disposed on the upper surface of the ceramic substrate, surrounding the metal dam, and its peripheral side is in contact with the outer side of the metal dam. The liquid cooling pipe has an inlet and an outlet, both extending outwards from the ceramic substrate.

2. The active heat dissipation ceramic substrate according to claim 1, characterized in that: The ceramic body is made of aluminum nitride.

3. The active heat dissipation ceramic substrate according to claim 1, characterized in that: The inner and outer surfaces of the metal dam are covered with a first graphene layer, and the peripheral surface of the liquid cooling pipe is in contact with the first graphene layer on the outer surface of the metal dam.

4. The active heat dissipation ceramic substrate according to claim 3, characterized in that: The peripheral surface of the liquid cooling pipe is covered with a second graphene layer, which is in contact with the first graphene layer.

5. The active heat dissipation ceramic substrate according to claim 1, characterized in that: The ceramic body has an annular groove with a square cross-section. One inner wall of the annular groove is flush with the outer side of the metal dam. The liquid cooling pipe is a square pipe. The liquid cooling pipe is set in the annular groove and partially extends outward from the annular groove. The peripheral side of the liquid cooling pipe is in contact with the inner wall of the annular groove.

6. The active heat dissipation ceramic substrate according to claim 1, characterized in that: A third graphene layer is disposed on the upper surface of the ceramic body, and the third graphene layer is located in the encapsulation cavity.

7. The active heat dissipation ceramic substrate according to claim 6, characterized in that: The lower surface of the ceramic body is provided with a fourth graphene layer, and a heat-conducting hole is opened on the ceramic body, which is filled with graphene to form a heat-conducting column. The two ends of the heat-conducting column are respectively in contact with the third graphene layer and the fourth graphene layer.

8. The active heat dissipation ceramic substrate according to claim 7, characterized in that: The heat-conducting holes are arranged in multiple rows at intervals from left to right. Each heat-conducting hole is filled with graphene to form a heat-conducting pillar. The two ends of each heat-conducting pillar are respectively in contact with the third graphene layer and the fourth graphene layer, and each heat-conducting hole extends vertically.

9. The active heat dissipation ceramic substrate according to claim 1, characterized in that: The liquid cooling pipe is a copper pipe.

10. The active heat dissipation ceramic substrate according to claim 1, characterized in that: A fifth graphene layer is provided on the lower surface of the ceramic body.

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