bonding device and bonding method

Abstract

This invention discloses a bonding device and bonding method. The bonding device includes: a base; an adsorption component for adsorbing the product to be bonded, the adsorption component being disposed on the base; an adhesive spraying component, disposed on the base, for spraying adhesive onto opposite sides of the product to be bonded, wherein a first element to be bonded and a second element to be bonded are pre-bonded to opposite sides of the product to be bonded by the adhesive; and a roller assembly, disposed on the base, the roller assembly including a first roller assembly and a second roller assembly, the first roller assembly and the second roller assembly being used to roll and press the product to be bonded, the first element to be bonded, and the second element to be bonded from opposite sides of the product to be bonded. The bonding device according to this invention can improve the efficiency of the bonding process and can bond products of different sizes, and can bond planar and curved surfaces, thus broadening the application range of the bonding device.

Description

Technical Field

[0001] This invention relates to the field of bonding equipment technology, and in particular to a bonding device and bonding method. Background Technology

[0002] In recent years, augmented reality (AR) technology has developed rapidly, and lens bonding equipment used in AR products has also developed rapidly. Its basic process is to bond optical film materials to lenses, but the optical film materials bonded to the lenses are made by multiple films being rolled and bonded together multiple times.

[0003] Currently, the bonding devices in film bonding equipment on the market mainly consist of a roller assembly fixed on a mounting assembly. A film to be bonded is adsorbed on the lower end of the mounting assembly, and the driving assembly moves the mounting assembly horizontally, so that the roller assembly gradually bonds the film to be bonded adsorbed on the lower end of the mounting assembly to another film to be bonded.

[0004] This type of bonding equipment has low bonding efficiency, cannot adjust the size in real time according to the size of different films, and is difficult to match with films of different sizes, which narrows the applicable range of film bonding equipment. Furthermore, since the adsorption surface at the lower end of the mounting component is usually flat, the bonding surface can only be flat. Summary of the Invention

[0005] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention provides a bonding device that can bond both sides of a product to be bonded simultaneously, improving the efficiency of the bonding process, and can bond products of different sizes, including planar and curved surfaces, thus broadening the applicability of the bonding device.

[0006] The present invention also proposes a bonding method using the above-mentioned bonding device.

[0007] According to a first aspect of the present invention, the bonding device comprises:

[0008] Base;

[0009] An adsorption component is used to adsorb the product to be bonded, and the adsorption component is disposed on the base;

[0010] An adhesive spraying assembly is disposed on the base and is used to spray adhesive on the opposite sides of the product to be bonded. The first element to be bonded and the second element to be bonded are pre-bonded to the opposite sides of the product to be bonded by the adhesive.

[0011] A roller assembly is disposed on the base. The roller assembly includes a first roller assembly and a second roller assembly. The first roller assembly and the second roller assembly are used to roll and press the product to be bonded, the first element to be bonded, and the second element to be bonded from opposite sides of the product to be bonded.

[0012] In some embodiments, the adsorption assembly includes a first support column, a suction cup, and a vacuuming mechanism. The suction cup is fixed to the base via the first support column. The suction cup has a through hole, and the vacuuming mechanism is connected to the through hole so that the through hole adsorbs the product to be bonded.

[0013] In some alternative embodiments, the adsorption assembly further includes a first driving member for driving the suction cup to move, thereby adjusting the position of the suction cup relative to the adhesive spraying assembly.

[0014] In some embodiments, the adhesive spraying assembly includes an adhesive spraying head and a second driving member, the second driving member being capable of driving the adhesive spraying head to move, thereby enabling the adhesive spraying assembly to uniformly spray the adhesive onto the opposite sides of the product to be bonded.

[0015] In some optional embodiments, the glue spraying assembly further includes a second support column, the glue spraying head is fixed to the base via the second support column, and the second drive member drives the second support column to move the glue spraying head.

[0016] In some embodiments, the first roller assembly includes a first mounting frame, a first roller, and a first drive assembly. The first mounting frame is used to fix the first roller to the base, the first drive assembly is used to drive the first mounting frame to move relative to the base, and the first drive assembly is also used to drive the first roller to rotate.

[0017] The second roller assembly includes a second fixing frame, a second roller, and a second drive assembly. The second fixing frame is used to fix the second roller to the base, the second drive assembly is used to drive the second fixing frame to move relative to the base, and the second drive assembly is also used to drive the second roller to rotate.

[0018] In some embodiments, a heating element and a temperature sensor are also included, both of which are disposed on the base. The heating element is used to heat the base, thereby heating the adhesive and making it easier for the adhesive to be sprayed from the nozzle. The temperature sensor is used to measure the temperature of the base.

[0019] In some embodiments, an infrared ranging sensor is also included, which is used to measure the thickness of the adhesive layer.

[0020] In some embodiments, the adhesive is a UV-curable adhesive, and the bonding device further includes a curing component, which includes a UV lamp. The UV lamp irradiates the adhesive to cure it and complete the bonding.

[0021] According to the bonding device of the present invention, the side surface of the product to be bonded is adsorbed by the adsorption component, and adhesive is sprayed on the first bonding surface and the second bonding surface on opposite sides of the product to be bonded, thereby enabling bonding on opposite sides of the product to be bonded simultaneously, improving bonding efficiency. Since the adsorption component only adsorbs the side surface of the product to be bonded and does not restrict the first bonding surface or the second bonding surface, the bonding device of the present invention can bond products of different sizes, expanding the application range of the bonding device. Furthermore, since the bonding device of the present invention uses a roller assembly for bonding, it can achieve planar bonding, curved surface bonding, or spherical surface bonding, further broadening the application range of the bonding device.

[0022] According to a bonding method of a second aspect of the present invention, the above-described bonding apparatus is used to bond products to be bonded, the method comprising:

[0023] The product to be bonded is adsorbed onto the adsorption component;

[0024] Open the adhesive spraying assembly and spray the adhesive onto both sides of the products to be bonded.

[0025] Place the first component to be bonded and the second component to be bonded on opposite sides of the product to be bonded;

[0026] The roller assembly is used to roll and press the product to be bonded, the first element to be bonded, and the second element to be bonded.

[0027] The adhesive is cured to complete the bonding process.

[0028] According to the bonding method of the present invention, by using the bonding device described in the first aspect, the efficiency of the bonding process is improved.

[0029] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0030] Figure 1 This is a perspective view of a bonding device according to an embodiment of the present invention;

[0031] Figure 2 This is a front view of a bonding device according to an embodiment of the present invention;

[0032] Figure 3This is a perspective view of a bonding device according to another embodiment of the present invention;

[0033] Figure 4 This is a schematic flowchart of a bonding method according to an embodiment of the present invention.

[0034] Figure label:

[0035] 1000 Bonding device; 100 Base; 200 Adsorption assembly; 210 First support column; 220 Suction cup; 230 Vacuuming mechanism; 240 First driving component; 300 Adhesive spraying assembly; 310 Adhesive spraying head; 320 Second driving component; 330 Second support column; 400 Roller assembly; 410 First roller assembly; 411 First roller; 412 First fixing frame; 413 First driving assembly; 420 Second roller assembly; 421 Second roller; 422 Second fixing frame; 423 Second driving assembly; 500 Heating element; 600 Temperature sensor; 700 Infrared ranging sensor;

[0036] 10 Product to be bonded; 11 First bonding surface; 12 Second bonding surface; 20 First component to be bonded; 30 Second component to be bonded. Detailed Implementation

[0037] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0038] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. Additionally, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0039] The following is for reference. Figures 1-3A bonding apparatus 1000 according to an embodiment of the present invention is described. The bonding apparatus 1000 is used for bonding rigid products to multiple rigid or flexible substrates. The bonding apparatus 1000 includes a base 100, an adsorption assembly 200, an adhesive spraying assembly 300, and a roller assembly 400. The base 100 is the base of the bonding apparatus 1000. The adsorption assembly 200, the adhesive spraying assembly 300, and the roller assembly 400 are all disposed on the base 100. The base 100 can be solid or hollow. A hollow base 100 has a receiving cavity in which adhesive can be disposed.

[0040] Please continue to refer to Figures 1-3 Furthermore, the adsorption component 200 is used to adsorb the product 10 to be bonded, and the adsorption component 200 is disposed on the base 100. It is understood that the product 10 to be bonded can be a rigid product, so the product 10 to be bonded can be adsorbed onto the adsorption component 200 by means of vacuum adsorption or the like. Specifically, the product 10 to be bonded may include a first bonding surface 11 and a second bonding surface 12 oppositely disposed, and a side surface connecting the first bonding surface 11 and the second bonding surface 12. The adsorption component 200 can be adsorbed onto the side surface of the product 10 to be bonded, thereby fixing the product 10 to be bonded.

[0041] Furthermore, the adhesive spraying assembly 300 is disposed on the base 100. The adhesive spraying assembly 300 is used to spray adhesive on the opposite sides of the product 10 to be bonded. The first element to be bonded 20 and the second element to be bonded 30 are pre-bonded to the opposite sides of the product 10 to be bonded by the adhesive. Specifically, the adhesive spraying assembly 300 can be disposed opposite to the adsorption assembly 200 on the base 100. After the adsorption assembly 200 fixes the product 10 to be bonded by adsorption, the adhesive spraying assembly 300 sprays adhesive on the first bonding surface 11 and the second bonding surface 12 on the opposite sides of the product 10 to be bonded, and places the first element to be bonded 20 on the first bonding surface 11 and the second element to be bonded 30 on the second bonding surface 12, so that the first element to be bonded 20 and the second element to be bonded 30 are pre-bonded to the product 10 to be bonded.

[0042] It should be noted that the adhesive retains a certain degree of stickiness even before it has cured. Therefore, when the first component to be bonded 20 is placed on the first bonding surface 11 and the second component to be bonded 30 is placed on the second bonding surface 12, the first component to be bonded 20 and the second component to be bonded 30 will not detach from the product to be bonded 10. The first component to be bonded 20 and the second component to be bonded 30 can be rigid substrates or flexible substrates, or one of the first component to be bonded 20 and the other of the second component to be bonded 30 can be a rigid substrate and the other a flexible substrate. This embodiment of the invention does not impose any limitations on this.

[0043] Furthermore, the roller assembly 400 is disposed on the base 100. The roller assembly 400 includes a first roller assembly 410 and a second roller assembly 420. The first roller assembly 410 and the second roller assembly 420 are used to roll and press the product to be bonded 10, the first element to be bonded 20 and the second element to be bonded 30 from opposite sides of the product to be bonded 10. Understandably, when adhesive is sprayed onto the first bonding surface 11 and the second bonding surface 12 of the product 10 to be bonded, and the first bonding element 20 is placed on the first bonding surface 11 and the second bonding element 30 is placed on the second bonding surface 12, air bubbles may exist between the first bonding element 20 and the first bonding surface 11, and between the second bonding element 30 and the second bonding surface 12, and the adhesive thickness may be uneven. Using the first roller assembly 410 to roll and press the first bonding element 20 and the product 10 from the first bonding surface 11 side, and using the second roller assembly 420 to roll and press the second bonding element 30 and the product 10 from the second bonding surface 12 side, air bubbles can be expelled. Furthermore, by controlling the pressing force of the first roller assembly 410 and the second roller assembly 420, the adhesive thickness can be controlled. This results in a more secure bond and improved stability of the bonded product.

[0044] It should be noted that on the side of the first element to be bonded 20 away from the product to be bonded 10, glue can be sprayed again using the glue spraying assembly 300, and the third element to be bonded can be placed on the first element to be bonded 20, thereby achieving multi-layer bonding. Of course, glue can also be sprayed again on the side of the second element to be bonded 30 away from the product to be bonded 10, and a fourth element to be bonded can be placed. This embodiment of the invention does not limit this.

[0045] Furthermore, the first bonding surface 11 and the second bonding surface 12 can be either a plane or a curved surface. The surface of the first bonding element 20 facing away from the product 10 can also be either a plane or a curved surface. The surface of the second bonding element 30 facing away from the product 10 can also be either a plane or a curved surface. This embodiment of the invention does not impose any restrictions on these aspects.

[0046] Understandably, after the first roller assembly 410 and the second roller assembly 420 roll and press the product 10 to be bonded, the first element to be bonded 20 and the second element to be bonded 30, the adhesive can be allowed to cure naturally at room temperature, or it can be cured by ultraviolet light. The curing method can be selected according to the type of adhesive, and the embodiments of the present invention do not limit this.

[0047] The inventors discovered in their actual research that existing bonding devices can only bond on one side, resulting in low bonding efficiency. Furthermore, the bonding devices cannot adjust their size in real time according to the size of the film to be bonded, making it difficult to match films of different sizes and thus limiting the application range of the bonding devices.

[0048] In view of this, the bonding device 1000 according to the embodiment of the present invention adsorbs the side surface of the product 10 to be bonded by the adsorption component 200, and sprays adhesive on the first bonding surface 11 and the second bonding surface 12 on opposite sides of the product 10 to be bonded, thereby enabling bonding on opposite sides of the product 10 to be bonded simultaneously, improving bonding efficiency. Since the adsorption component 200 only adsorbs the side surface of the product 10 to be bonded, and does not restrict the first bonding surface 11 or the second bonding surface 12, the bonding device 1000 of the embodiment of the present invention can bond products 10 of different sizes, expanding the application range of the bonding device 1000. Furthermore, since the bonding device 1000 of the embodiment of the present invention uses the roller assembly 400 for bonding, it can realize planar bonding, curved surface bonding, or spherical surface bonding, further expanding the application range of the bonding device 1000.

[0049] Specifically, when the bonding device 1000 is applied to lens bonding in AR technology, the product to be bonded 10 can be a polarization beamsplitter (PBS), the first element to be bonded 20 can be a functional film such as a quarter-wave plate or a half-wave plate, used to change the polarization state of light, and the second element to be bonded 30 can be an optical lens, thereby improving the production efficiency of AR devices by bonding simultaneously on both sides of the PBS. Of course, the product to be bonded 10, the first element to be bonded 20, and the second element to be bonded 30 can also be other elements, and the bonding device 1000 can also be applied to other technical fields; this embodiment of the invention does not limit this application.

[0050] In some embodiments, the adsorption assembly 200 includes a first support column 210, a suction cup 220, and a vacuum mechanism 230. The suction cup 220 is fixed to the base 100 via the first support column 210. The suction cup 220 has through holes, and the vacuum mechanism 230 is connected to the through holes to adsorb the product 10 to be bonded. The suction cup 220 may have multiple through holes arranged in an array. When the product 10 to be bonded covers the through holes on the suction cup 220, the vacuum mechanism 230 can adsorb the product 10 onto the suction cup 220, thereby fixing the position of the product 10.

[0051] Understandably, the first support column 210 and the suction cup 220 can be connected by threads, thereby fixing the suction cup 220 to the first support column 210. Alternatively, the first support column 210 and the suction cup 220 can be integrally formed, with the first support column 210 fixed to the base 100 by threads. The installation position of the first support column 210 on the base 100 can be adjusted, thereby adjusting the position of the suction cup 220 relative to the base 100, and thus adjusting the position of the suction cup 220 relative to the adsorption assembly 200.

[0052] Therefore, by setting the first support column 210, the suction cup 220 and the vacuum mechanism 230, the product 10 to be bonded can be fixed on the adsorption component 200, thereby improving the bonding stability of the bonding device 1000. Furthermore, by connecting the suction cup 220 to the base 100 through the first support column 210, the position of the suction cup 220 can be adjusted, which helps to simplify the bonding process.

[0053] like Figures 1-3 As shown, in some optional embodiments, the adsorption assembly 200 further includes a first driving member 240, which drives the suction cup 220 to move, thereby adjusting the position of the suction cup 220 relative to the adhesive spraying assembly 300. Specifically, the first driving member 240 can be a motor, thereby enabling the suction cup 220 to move relative to the first support column 210. Figure 1 As shown, the first driving member 240 can drive the suction cup 220 to move relative to the first support member along the Z direction, thereby enabling the adhesive spraying assembly 300 to spray adhesive onto the first bonding surface 11 and the second bonding surface 12 of the product 10 to be bonded; or, the first driving member 240 can drive the first support column 210 to move relative to the base 100 along the Z direction, thereby driving the suction cup 220 to move along the Z direction via the first support column 210. Thus, by driving the suction cup 220 to move via the first driving member 240, the position of the suction cup 220 can be easily adjusted, thereby simplifying the bonding process.

[0054] Please continue to refer to Figures 1-3In some embodiments, the adhesive spraying assembly 300 includes an adhesive spraying head 310 and a second driving member 320. The second driving member 320 can drive the adhesive spraying head 310 to move, thereby enabling the adhesive spraying assembly 300 to uniformly spray adhesive onto the opposite sides of the product 10 to be bonded. It should be noted that the first bonding surface 11 and the second bonding surface 12 of the product 10 to be bonded have a certain area. If the adhesive spraying assembly 300 sprays adhesive only at one position on the first bonding surface 11 or the second bonding surface 12, it is easy to cause uneven adhesive thickness, affecting the quality of the final bonded product. Therefore, by setting the second driving member 320, as shown in Figure 1, the second driving member 320 can drive the adhesive spraying head 310 to move in the X direction, thereby enabling the adhesive to be uniformly sprayed onto the first bonding surface 11 and the second bonding surface 12, which can further simplify the bonding process and improve the yield of the bonding process.

[0055] Please continue to refer to Figures 1-3 In some optional embodiments, the glue spraying assembly 300 further includes a second support column 330, the glue spraying head 310 is fixed to the base 100 via the second support column 330, and the second drive member 320 drives the second support column 330 to move the glue spraying head 310. Understandably, the second support column 330 can be fixedly connected to the spray head 310. The second support column 330 is disposed on the base 100. By using the second driving member 320 to drive the second support column 330, the second support column 330 can move relative to the base 100, so that the spray head 310 can move relative to the base 100. Thus, by using the second driver to drive the second support column 330, the position of the spray head 310 can be moved, thereby adjusting the position of the spray head 310 relative to the adsorption component 200. When the second support column 330 moves relative to the adsorption component 200 in the X direction, the adhesive can be evenly sprayed onto the first bonding surface 11 and the second bonding surface 12, which can further simplify the bonding process and improve the yield of the bonding process.

[0056] In other embodiments of the present invention, the second driving member 320 may also drive the spray nozzle 310 to move relative to the suction cup 220 in the Z direction, so that the spray nozzle 310 can spray adhesive onto the first bonding surface 11 and the second bonding surface 12. The first driving member 240 may also drive the suction cup 220 to move relative to the spray nozzle 310 in the X direction, so that the adhesive can be uniformly sprayed onto the first bonding surface 11 and the second bonding surface 12. Alternatively, the first driving member 240 may drive the suction cup 220 to move relative to the spray nozzle 310 in the Z direction. Simultaneously, the first driving member 240 may... The suction cup 220 is driven to move relative to the spray nozzle 310 in the X direction, so that the adhesive on the first bonding surface 11 and the second bonding surface 12 can be uniformly sprayed by simply moving the suction cup 220. Of course, the second driving member 320 can also drive the spray nozzle 310 to move relative to the suction cup 220 in the Z direction. At the same time, the second driving member 320 can also drive the spray nozzle 310 to move relative to the suction cup 220 in the X direction, so that the adhesive on the first bonding surface 11 and the second bonding surface 12 can be uniformly sprayed by simply moving the spray nozzle 310. The embodiments of the present invention do not limit this.

[0057] Please continue to refer to Figures 1-3 In some embodiments, the first roller assembly 410 includes a first fixing frame 412, a first roller 411, and a first drive assembly 413. The first fixing frame 412 is used to fix the first roller 411 to the base 100. The first drive assembly 413 is used to drive the first fixing frame 412 to move relative to the base 100. Furthermore, the first drive assembly 413 is also used to drive the first roller 411 to rotate. Understandably, the first roller 411 is connected to the first fixing frame 412. The first drive assembly 413 can drive the first fixing frame 412 to move relative to the base 100 in the X direction, thereby driving the first roller 411 to move in the X direction. In addition, the first drive assembly 413 can also drive the first roller 411 to rotate. When the first drive assembly 413 is activated, the first drive assembly 413 drives the first fixed frame 412 to move along the X direction, so that the first roller 411 can move along the X direction and the first roller 411 can also rotate, so that the first roller 411 can roll and press the product 10 to be bonded and the first element 20 to be bonded.

[0058] The second roller assembly 420 includes a second fixing frame 422, a second roller 421, and a second drive assembly 423. The second fixing frame 422 is used to fix the second roller 421 to the base 100. The second drive assembly 423 is used to drive the second fixing frame 422 to move relative to the base 100, and also to drive the second roller 421 to rotate. Understandably, the second roller 421 is connected to the second fixing frame 422. The second drive assembly 423 can drive the second fixing frame 422 to move relative to the base 100 in the X direction, thereby causing the second roller 421 to move in the X direction. Furthermore, the second drive assembly 423 can also drive the second roller 421 to rotate. When the second drive assembly 423 is activated, it drives the second fixing frame 422 to move in the X direction, allowing the second roller 421 to move in the X direction and rotate, thus enabling the second roller 421 to roll and press the product 10 to be bonded and the element 30 to be bonded.

[0059] Thus, the first drive assembly 413 drives the first fixing frame 412, which in turn drives the first roller 411 to move along the X direction. The first drive assembly 413 also drives the first roller 411 to rotate. At the same time, the second drive assembly 423 drives the second fixing frame 422, which in turn drives the second roller 421 to move along the X direction. The second drive assembly 423 also drives the second roller 421 to rotate. This enables rolling pressing of the product 10 to be bonded, the first element to be bonded 20, and the second element to be bonded 30. In other words, bonding can be performed simultaneously on opposite sides of the product 10 to be bonded, improving bonding efficiency.

[0060] It should be noted that the first drive assembly 413 may include two motors, one of which is used to drive the first fixed frame 412 to move along the X direction, and the other motor is used to drive the first roller 411 to rotate. Of course, the first drive assembly 413 may also have other structures, as long as it can simultaneously drive the first fixed frame 412 to move along the X direction and drive the first roller 411 to rotate. Similarly, the second drive assembly 423 may also include two motors, which will not be elaborated again.

[0061] In some embodiments, the bonding device 1000 further includes a heating element 500 and a temperature sensor 600. Both the heating element 500 and the temperature sensor 600 are disposed on the base 100. The heating element 500 heats the base 100, thereby heating the adhesive and making it easier for the adhesive to be sprayed from the nozzle 310. The temperature sensor 600 measures the temperature of the base 100. Understandably, because the adhesive has a certain viscosity, i.e., poor flowability, the nozzle 310 does not easily spray the adhesive evenly. Therefore, in this embodiment, a heating element 500 is disposed on the base 100, and the base 100 may also have a receiving cavity in which the adhesive is disposed. Thus, when the heating element 500 heats the base 100, the temperature of the adhesive in the receiving cavity also rises, improving the flowability of the adhesive and making it easier for the adhesive to be sprayed evenly from the nozzle 310. This further improves the efficiency and yield of the bonding process.

[0062] It should be noted that when the temperature is too high, the properties of the adhesive may change, which may cause the adhesive to fail. Therefore, in this embodiment of the invention, a temperature sensor 600 is also provided on the base 100 to detect the temperature of the base 100 and prevent the temperature of the base 100 from being too high, which could cause the adhesive to fail.

[0063] In some embodiments, two temperature sensors 600 may be provided, and the two temperature sensors 600 are symmetrically arranged on opposite sides of the base 100, so that the data measured by the temperature sensors 600 is more accurate. Of course, one or more temperature sensors 600 may also be provided in the embodiments of the present invention, and multiple sensors are evenly distributed on the base 100, thereby further improving the accuracy of temperature detection and further improving the stability of the bonding process.

[0064] In some embodiments, the bonding device 1000 further includes an infrared ranging sensor 700, which is used to measure the thickness of the adhesive layer. Understandably, the infrared ranging sensor 700 can be disposed on the base 100. The infrared ranging sensor 700 includes an infrared light emitter and an infrared light receiver. The infrared light emitter emits infrared light. When the infrared light is emitted to the adhesive layer, the adhesive layer reflects the infrared light back. The infrared light reflected from the two surfaces of the adhesive layer arrives at the infrared light receiver at different times. By calculating the time difference between the infrared light emitted by the emitter and the infrared light received by the receiver, and based on the speed of light, the thickness of the adhesive layer can be calculated. Of course, the infrared ranging sensor 700 can also measure the thickness of the adhesive layer using other principles; this embodiment of the invention does not limit this.

[0065] Furthermore, the bonding device 1000 can be equipped with multiple infrared ranging sensors 700, which can measure the adhesive layer thickness at multiple locations, thereby monitoring whether the adhesive layer thickness is uniform and further improving the quality of the final bonded product.

[0066] In some embodiments, the adhesive is a UV-curable adhesive, and the bonding device 1000 further includes a curing component (not shown). The curing component includes a UV lamp, which irradiates the adhesive to cure it and complete the bonding. Understandably, the curing component can also be disposed on the base 100. After the roller assembly 400 rolls and presses the product 10 to be bonded, the first element to be bonded 20, and the second element to be bonded 30, the UV lamp is turned on. The adhesive between the product 10 and the first element to be bonded 20, and between the product 10 and the second element to be bonded 30, is cured under the UV lamp, thereby causing the first element to be bonded 20 to be bonded onto the first bonding surface 11 of the product 10, and the second element to be bonded 30 to be bonded onto the second bonding surface 12 of the product 10, thus completing the bonding of the product 10.

[0067] Therefore, UV-curable adhesives are low in cost and have a simple curing method, which further improves the efficiency of the bonding process and reduces its cost.

[0068] Please refer to the above as well. Figure 4 According to the bonding method of the second aspect of the present invention, the bonding device 1000 described above is used to bond the product 10 to be bonded, and the bonding method includes:

[0069] S10: Adsorb the product 10 to be bonded onto the adsorption component 200;

[0070] Understandably, the product to be bonded 10 can be a rigid product such as PBS, and the adsorption component 200 can adsorb the product to be bonded 10 by vacuum adsorption to fix it.

[0071] Specifically, the adsorption component 200 may include a suction cup 220 and a vacuum mechanism 230. The suction cup 220 is provided with a through hole that connects to the vacuum mechanism 230. When the vacuum mechanism 230 is opened to perform a vacuuming operation, the suction cup 220 generates an adsorption force because the vacuum mechanism 230 is connected to the through hole, thereby adsorbing the product 10 to be bonded.

[0072] It should be noted that the product to be bonded 10 includes a first bonding surface 11 and a second bonding surface 12 arranged opposite to each other, as well as a side surface connecting the first bonding surface 11 and the second bonding surface 12. The adsorption component 200 can be adsorbed onto the side surface of the component to be bonded, so that the first bonding surface 11 and the second bonding surface 12 can be simultaneously sprayed with adhesive for bonding.

[0073] S20: Open the glue spraying assembly 300 and spray glue on both sides of the product 10 to be bonded;

[0074] Understandably, adhesive is sprayed onto the first bonding surface 11 and the second bonding surface 12 of the product 10 to be bonded using the adhesive spraying assembly 300.

[0075] Specifically, the adsorption component 200 may also be provided with a first driving component 240, which can drive the suction cup 220 to move along the Z direction, thereby adjusting the position of the suction cup 220 so that the adhesive spraying component 300 can spray adhesive on the first bonding surface 11 and the second bonding surface 12 of the product 10 to be bonded.

[0076] Furthermore, the adhesive spraying assembly 300 may include a second drive member 320 and an adhesive spraying head 310. The second drive member 320 may drive the adhesive spraying head 310 to move in the X direction, thereby uniformly spraying adhesive onto the first bonding surface 11 and the second bonding surface 12.

[0077] Furthermore, the base 100 may also be equipped with a heating element 500 and a temperature sensor 600, and the base 100 also has a receiving cavity in which the adhesive is disposed. Prior to step S20, the bonding method further includes:

[0078] S21: Turn on the heating element 500 so that the heating element 500 heats the base 100, thereby heating the adhesive.

[0079] Understandably, the temperature sensor 600 installed on the base 100 can monitor the temperature of the base 100 to prevent the adhesive from failing due to excessive heating temperature.

[0080] S30: Place the first element to be bonded 20 and the second element to be bonded 30 on opposite sides of the product to be bonded 10;

[0081] Specifically, after applying adhesive to the first bonding surface 11 and the second bonding surface 12 of the components to be bonded, the first component to be bonded 20 can be placed on the first bonding surface 11, and the second component to be bonded 30 can be placed on the second bonding surface 12. Since the adhesive has a certain degree of stickiness, the first component to be bonded 20, the product to be bonded 10, and the second component to be bonded 30 can be pre-bonded. At this time, the first component to be bonded 20 and the second component to be bonded 30 will not fall off the product to be bonded 10.

[0082] S40: The roller assembly 400 is used to roll and press the product 10 to be bonded, the first element to be bonded 20, and the second element to be bonded 30.

[0083] Understandably, the roller assembly 400 may include a first roller assembly 410 and a second roller assembly 420. By using the first roller assembly 410 and the second roller assembly 420 to roll and press the product 10 to be bonded, the first element to be bonded 20 and the second element to be bonded 30, the adhesive layer between the product 10 to be bonded and the first element to be bonded 20, and between the product 10 to be bonded and the second element to be bonded 30, can be more uniform, and air bubbles in the adhesive can be expelled, thereby improving the stability of the final bonded product.

[0084] Specifically, the first roller assembly 410 and the second roller assembly 420 can simultaneously roll and press the product 10 to be bonded, the first element to be bonded 20 and the second element to be bonded 30. The first roller assembly 410 bondes the product 10 to be bonded and the first element to be bonded 20 from the first bonding surface 11 side, and the second roller assembly 420 bondes the product 10 to be bonded and the second element to be bonded 30 from the second bonding surface 12 side.

[0085] Furthermore, the first roller assembly 410 may include a first drive assembly 413 and a first roller 411. The first drive assembly 413 can drive the first roller 411 to move in the X direction, and the first drive member 240 can also drive the first roller 411 to rotate. The second roller assembly 420 may include a second drive member 320 and a second roller 421. The second drive assembly 423 can drive the second roller 421 to move in the X direction, and the second drive member 320 can also drive the second roller 421 to rotate.

[0086] Furthermore, the bonding device 1000 also includes an infrared ranging sensor 700. The bonding method of this embodiment can use the infrared ranging sensor 700 to measure the adhesive layer thickness to determine whether the adhesive layer thickness is appropriate. Specifically, for example, the adhesive layer thickness can be measured by infrared measurement. When the adhesive layer thickness is greater than 5 micrometers, the product to be bonded 10, the first element to be bonded 20, and the second element to be bonded 30 are rolled and pressed again using rollers. When the adhesive layer thickness is less than 5 micrometers, it is determined that the film layer thickness meets the bonding requirements. Of course, the required range of adhesive layer thickness can also be determined according to specific needs, and this embodiment of the invention does not limit this.

[0087] S50: Curing adhesive to complete the bonding.

[0088] Understandably, the adhesive can be a UV-curable adhesive, and the bonding device 1000 may also include a curing component, which includes a UV lamp, thereby using the UV lamp to cure the adhesive and complete the bonding. Of course, the adhesive can also be allowed to cure naturally by leaving it to stand; this embodiment of the invention does not limit this.

[0089] According to the bonding method of the present invention, the adsorption component 200 adsorbs the side surface of the product 10 to be bonded, and adhesive is sprayed on the first bonding surface 11 and the second bonding surface 12 on opposite sides of the product 10 to be bonded, so that bonding can be performed on opposite sides of the product 10 to be bonded at the same time, thereby improving the bonding efficiency. Since the adsorption component 200 only adsorbs the side surface of the product 10 to be bonded, and does not restrict the first bonding surface 11 or the second bonding surface 12, the bonding device 1000 of the present invention can bond products 10 of different sizes, thereby expanding the application range of the bonding device 1000. Furthermore, since the bonding device 1000 of the present invention uses the roller assembly 400 for bonding, it can realize planar bonding, curved surface bonding or spherical bonding, further expanding the application range of the bonding device 1000.

[0090] Other configurations and operations of the bonding device 1000 and bonding method according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0091] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0092] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0093] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0094] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0095] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0096] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A bonding method, characterized in that, The bonding method is used to bond products to be bonded, and the method includes: S10: The product to be bonded is adsorbed onto the adsorption component. The product to be bonded includes a first bonding surface and a second bonding surface that are disposed opposite to each other, and a side surface that connects the first bonding surface and the second bonding surface. The adsorption component is adsorbed onto the side surface of the product to be bonded. S20: Open the adhesive spraying assembly and spray adhesive onto the first bonding surface and the second bonding surface of the product to be bonded; S30: Place the first component to be bonded on the first bonding surface, and place the second component to be bonded on the second bonding surface; S40: The roller assembly is used to roll and press the product to be bonded, the first element to be bonded, and the second element to be bonded. The roller assembly includes a first roller assembly and a second roller assembly. The first roller assembly bonds the product to be bonded and the first element to be bonded from the first bonding surface side, and the second roller assembly bonds the product to be bonded and the second element to be bonded from the second bonding surface side. S50: Cure the adhesive to complete the bonding.

2. A bonding device for implementing the bonding method as described in claim 1, characterized in that, include: Base; An adsorption component is used to adsorb the product to be bonded. The adsorption component is disposed on the base. The product to be bonded includes a first bonding surface and a second bonding surface disposed opposite to each other, and a side surface connecting the first bonding surface and the second bonding surface. The adsorption component adsorbs onto the side surface of the product to be bonded. An adhesive spraying assembly is disposed on the base. The adhesive spraying assembly is used to spray adhesive onto the first bonding surface and the second bonding surface of the product to be bonded. The first component to be bonded is pre-bonded to the first bonding surface by the adhesive, and the second component to be bonded is pre-bonded to the second bonding surface by the adhesive. A roller assembly is disposed on the base. The roller assembly includes a first roller assembly and a second roller assembly. The first roller assembly is used to bond the product to be bonded and the first element to be bonded from the first bonding surface side, and the second roller assembly is used to bond the product to be bonded and the second element to be bonded from the second bonding surface side.

3. The bonding device according to claim 2, characterized in that, The adsorption assembly includes a first support column, a suction cup, and a vacuuming mechanism. The suction cup is fixed to the base via the first support column. The suction cup has a through hole, and the vacuuming mechanism is connected to the through hole so that the through hole adsorbs the product to be bonded.

4. The bonding device according to claim 3, characterized in that, The adsorption assembly further includes a first driving member, which is used to drive the suction cup to move in order to adjust the position of the suction cup relative to the adhesive spraying assembly.

5. The bonding device according to claim 2, characterized in that, The adhesive spraying assembly includes an adhesive spraying head and a second driving member. The second driving member can drive the adhesive spraying head to move, so that the adhesive spraying assembly can spray the adhesive onto the first bonding surface and the second bonding surface of the product to be bonded.

6. The bonding device according to claim 5, characterized in that, The glue spraying assembly also includes a second support column, and the glue spraying head is fixed to the base via the second support column. The second driving member drives the second support column to move the glue spraying head.

7. The bonding device according to claim 2, characterized in that, The first roller assembly includes a first fixing frame, a first roller, and a first drive assembly. The first fixing frame is used to fix the first roller to the base. The first drive assembly is used to drive the first fixing frame to move relative to the base. The first drive assembly is also used to drive the first roller to rotate. The second roller assembly includes a second fixing frame, a second roller, and a second drive assembly. The second fixing frame is used to fix the second roller to the base, the second drive assembly is used to drive the second fixing frame to move relative to the base, and the second drive assembly is also used to drive the second roller to rotate.

8. The bonding device according to claim 2, characterized in that, It also includes a heating element and a temperature sensor, both of which are disposed on the base. The heating element is used to heat the base, thereby heating the adhesive and causing the adhesive to be sprayed out from the spray nozzle. The temperature sensor is used to measure the temperature of the base.

9. The bonding device according to claim 2, characterized in that, It also includes an infrared ranging sensor, which is used to measure the thickness of the adhesive layer.

10. The bonding device according to claim 2, characterized in that, The adhesive is a UV-curable adhesive, and the bonding device further includes a curing component, which includes a UV lamp. The UV lamp irradiates the adhesive to cure it and complete the bonding process.

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